Device for optimizing hidden crack of punch forming characteristic of polar plate

Abstract

The utility model relates to a device for optimizing hidden cracks of punch forming characteristics of a polar plate, and the device is characterized in that in the punch forming process, a base material is placed on the surface of a matching assembly; then, the first die plate is driven to move towards the matching assembly, due to the fact that one of the first male die and the second male die is supported by the elastic piece, the first die plate can be preferentially matched with the one supported by the elastic piece, and the base material is stamped to form an intermediate plate; then, the first die plate is continuously driven to move, the elastic piece is compressed, and the first die plate, the first male die and the second male die are subjected to press fitting. And at the moment, the stamping convex part is in stamping fit with the matching concave part, and the stamping concave part is in stamping fit with the matching convex part, so that the middle plate is molded into the polar plate. Therefore, the device is divided into two-step pressure-bearing forming, the shearing force of one-time forming is reduced, the flowing range and the degree of freedom of the edge of the polar plate in the material forming process are enlarged, materials needed by middle forming of the polar plate are effectively supplemented, and the forming defect probability of hidden cracks and uneven runners is reduced.

Description

Technical Field

[0001] This application relates to the field of electrode stamping technology, and in particular to an apparatus for optimizing the latent dark cracks in electrode stamping characteristics. Background Technology

[0002] A fuel cell is a device that directly converts the chemical energy of fuel into electrical energy, and it consists of multiple stacked cells. Each cell includes plates and a membrane electrode assembly (MEA). The plates are divided into anode and cathode plates. Hydrogen gas is introduced into the anode plate as fuel, and air is introduced into the cathode plate as an oxidant. Under load conditions, hydrogen and oxygen react to generate electricity. The plates have several important functions, including collecting and conducting current, supporting the MEA, uniformly transporting and isolating reactant gases, facilitating coolant flow, and providing rapid heat dissipation.

[0003] To optimize fuel cell performance, the surface of the electrode plates is typically designed with concave or wavy flow channels. Electrode plate forming usually involves stamping using a stamping device, for example, by using an upper and lower die to press the electrode plate together to create different flow channel shapes on the plate surface. However, the structural design of traditional stamping devices results in numerous forming defects such as hidden cracks and uneven flow channels, leading to low product yield. Utility Model Content

[0004] Therefore, it is necessary to provide a device for optimizing the hidden cracks in the stamping process of electrode plates, reducing the probability of forming defects such as hidden cracks and uneven flow channels, and improving product yield.

[0005] An apparatus for optimizing the latent dark cracks in electrode stamping features includes: a support component; a first template located above the support component, with a plurality of alternating stamping protrusions and stamping recesses arranged sequentially on its surface facing the support component; and a mating component located between the support component and the first template; wherein the mating component includes an elastic element, a plurality of first punches and a plurality of second punches, each of the first punches being spaced apart along a first direction, and each of the first punches having an embedding gap on at least one side along the first direction, and each of the second punches being embedded in a corresponding embedding gap; one end of each of the first punches having a mating protrusion that mates with the stamping recess, and one end of each of the second punches having a mating recess that mates with the stamping protrusion; the elastic element being supported between the support component and each of the first punches or each of the second punches, such that one of the first punches and the second punches is stamped into the first template before the other.

[0006] The aforementioned apparatus for optimizing the characteristics of hidden cracks in electrode stamping involves placing a substrate on the surface of the mating component during the stamping process. Next, the first template is driven to move towards the mating component. Since one of the first and second punches is supported by an elastic element, the first template preferentially mates with the one supported by the elastic element, stamping the substrate to form an intermediate plate. Then, the first template continues to move, compressing the elastic element, so that the first template is pressed into both the first and second punches. At this point, the stamping protrusion and the mating recess are stamped together, and the stamping recess and the mating protrusion are stamped together, forming the intermediate plate into an electrode. Therefore, this apparatus performs two-step pressure forming, reducing the shear force of the first forming and increasing the flow range and freedom of the material at the edge of the electrode during forming, effectively supplementing the material required for the intermediate forming of the electrode. This reduces the single forming height and forming thinning rate, thereby reducing the probability of hidden cracks and uneven flow channels, and improving product yield.

[0007] In some embodiments, the mating assembly further includes an inner mold and an outer mold sleeved outside the inner mold. The inner mold and the outer mold are both disposed on the bearing assembly. Each of the first punches is spaced apart along the first direction on the surface of the inner mold facing the first template. Each of the second punches is connected to the outer mold at both ends along a second direction intersecting the first direction. The elastic element is supported between the outer mold and the bearing assembly.

[0008] In some embodiments, the elastic element is configured to drive the mating recess beyond the mating protrusion along the third direction when the first template and the mating assembly are separated in a third direction, wherein the first direction, the second direction, and the third direction intersect each other and are not coplanar.

[0009] In some embodiments, the mating assembly further includes a first pad, which is disposed on the bearing assembly. The inner mold and the outer mold are both disposed on the first pad. The first pad has a through hole, through which the elastic element passes and abuts against the outer mold and the bearing assembly.

[0010] In some embodiments, the outer mold includes a first part and a second part connected to each other, the first part and the second part being located on opposite sides of the inner mold along the first direction, the first part and / or the second part being supported on the load-bearing assembly by the elastic element.

[0011] In some embodiments, the first portion and / or the second portion are provided with mounting holes facing the surface of the carrier component, and one end of the elastic member is inserted into the mounting holes.

[0012] In some embodiments, each of the stamping protrusions includes arc-shaped concave walls at both ends along the first direction, and each of the mating protrusions includes arc-shaped convex walls at both ends along the first direction, with the arc-shaped convex walls and the arc-shaped concave walls corresponding to each other.

[0013] In some embodiments, one of the first punches is a first allowance punch, the size of the mating recess of the first allowance punch along the first direction is larger than the size of the other mating recesses, and one of the second punches is a second allowance punch, the size of the mating protrusion of the second allowance punch along the first direction is larger than the size of the other mating protrusions, and at least one first punch and at least one second punch are distributed between the first allowance punch and the second allowance punch.

[0014] In some embodiments, a second template and a guide are also included. The second template is sleeved outside the mating assembly and disposed on the bearing assembly. The guide is disposed between the first template and the second template and is used to guide the movement between the first template and the second template.

[0015] A method for optimizing the latent dark cracks in electrode stamping features, employing any of the above-described apparatuses for optimizing latent dark cracks in electrode stamping features, the method comprising the following steps: placing a substrate on the surface of a mating component facing a first template; driving the first template toward the mating component such that a stamping protrusion engages with a mating recess, or a stamping recess engages with a mating protrusion, to stamp the substrate to form an intermediate plate; driving the first template to continue moving such that the stamping protrusion engages with the mating recess and the stamping recess engages with the mating protrusion, to stamp the intermediate plate to form an electrode; and after holding pressure for a preset time, separating the first template from the mating component.

[0016] The aforementioned method for optimizing the latent crack characteristics of electrode stamping uses the aforementioned apparatus for optimizing latent crack characteristics of electrode stamping. During the stamping process, a substrate is placed on the surface of the mating component. Then, the first template is driven to move towards the mating component. Since one of the first and second punches is supported by an elastic element, the first template can preferentially mate with the one supported by the elastic element, stamping the substrate to form an intermediate plate. Then, the first template continues to move, compressing the elastic element, so that the first template is pressed into both the first and second punches. At this time, the stamping protrusion and the mating recess are stamped together, and the stamping recess and the mating protrusion are stamped together, forming the intermediate plate into an electrode. Therefore, this apparatus performs two-step pressure forming, reducing the shear force of the first forming and increasing the flow range and freedom of the material at the edge of the electrode during forming, effectively supplementing the material required for the intermediate forming of the electrode. This reduces the single forming height and forming thinning rate, thereby reducing the probability of latent cracks and uneven flow channels, and improving product yield.

[0017] In some embodiments, in the step of moving the first template toward the mating assembly, the stamping protrusion and the mating recess cooperate to stamp the substrate to form the intermediate plate, wherein the flow channel height of the intermediate plate is denoted as h1, the ridge width of the flow channel of the intermediate plate is denoted as W1, the flow channel height of the electrode plate is denoted as h2, the ridge width of the corresponding flow channel on the electrode plate and the intermediate plate is denoted as W2, h2≥1.2h1, W1≥1.4W2. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the device described in some embodiments of this application.

[0019] Figure 2 This is a structural cross-sectional view of the device described in some embodiments of this application.

[0020] Figure 3 for Figure 2 Enlarged view of the structure at point A in the middle circle.

[0021] Figure 4 This is a cross-sectional view of the first template and mating component mating structure described in some embodiments of this application.

[0022] Figure 5 for Figure 4 Enlarged view of the structure at point B in the middle circle.

[0023] Figure 6 for Figure 4 Enlarged view of the structure at point C in the middle circle.

[0024] Figure 7 for Figure 4 Enlarged view of the structure at point D in the middle circle.

[0025] Figure 8 for Figure 4 Enlarged view of the structure at point E in the middle circle.

[0026] Figure 9 This is a schematic diagram of the structure of the substrate described in some embodiments of this application.

[0027] Figure 10 This is a schematic diagram of the structure of the intermediate plate described in some embodiments of this application.

[0028] Figure 11 This is a schematic diagram of the structure of the electrode plate described in some embodiments of this application.

[0029] Figure 12 This is a flowchart illustrating the methods described in some embodiments of this application.

[0030] 10. First template; 11. Stamping protrusion; 111. Arc-shaped concave wall; 12. Stamping concave part; 13. First protrusion; 14. Second protrusion; 20. Mating assembly; 21. First punch; 211. Mating protrusion; 21a. Arc-shaped protrusion; 22. Second punch; 221. Mating concave part; 22a. Bottom wall; 22b. Protrusion; 23. Embedding gap; 24. First allowance punch; 25. Second allowance punch; 26. Inner mold; 27. Outer mold; 271. First part; 272. Second part; 273. 1. Mounting hole; 274. First recess; 275. Second recess; 28. Elastic element; 29. ​​First pad; 291. Through hole; 30. Bearing component; 31. Third pad; 32. Second mold base; 33. Mold frame; 34. Support plate; 35. Base; 40. Second template; 41. Guide element; 50. First mold base; 51. Second pad; 52. Height limiting post; X, First direction; Y, Second direction; Z, Third direction; 100. Base material; 200. Intermediate plate; 300. Electrode plate; 400. Flow channel. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] In some embodiments, please refer to Figures 1 to 4 This application provides an apparatus for optimizing the hidden cracks in the stamping process of electrode plates, comprising: a support assembly 30, a first template 10, and a mating assembly 20. The first template 10 is located above the support assembly 30, and its surface facing the support assembly 30 is provided with a plurality of stamping protrusions 11 and stamping recesses arranged alternately in sequence. The mating assembly 20 is located between the support assembly 30 and the first template 10. The mating assembly 20 includes an elastic element 28, a plurality of first punches 21, and a plurality of second punches 22. Each first punch 21 is spaced apart along a first direction X, and each first punch 21 has an embedding gap 23 formed on at least one side along the first direction X. Each second punch 22 is embedded in the corresponding embedding gap 23. Each first punch 21 has a mating protrusion 211 at one end that mates with the stamping recess 12, and each second punch 22 has a mating recess 221 at one end that mates with the stamping protrusion 11. The elastic member 28 is supported between the bearing assembly 30 and each first punch 21 or each second punch 22, so that one of the first punch 21 and the second punch 22 is stamped into the first template 10 before the other.

[0038] The aforementioned apparatus for optimizing the hidden cracks in electrode stamping involves placing a substrate 100 on the surface of the mating component 20 during the stamping process. Next, the first template 10 is driven to move towards the mating component 20. Since one of the first punch 21 and the second punch 22 is supported by the elastic member 28, the first template 10 preferentially mates with the one supported by the elastic member 28, stamping the substrate 100 to form an intermediate plate 200. Then, the first template 10 continues to move, compressing the elastic member 28, so that the first template 10 is pressed into both the first punch 21 and the second punch 22. At this time, the stamping protrusion 11 is stamped into the mating recess 221, and the stamping recess 12 is stamped into the mating protrusion 211, forming the intermediate plate 200 into an electrode 300. Thus, this apparatus performs two-step pressure forming, reducing the shear force of the first forming and increasing the flow range and freedom of the material at the edge of the electrode 300 during the forming process, effectively supplementing the material required for the intermediate forming of the electrode 300. This reduces the single-batch molding height and molding thinning rate, thereby reducing the probability of molding defects such as hidden cracks and uneven flow channels, and improving product yield.

[0039] It should be noted that during the stamping process, the fluidity of the substrate 100 decreases with increasing distance from the edge. This results in greater plastic deformation of the flow channel 400 in the middle of the substrate 100 at the same stamping depth compared to the flow channel 400 at the edge, leading to higher internal stress in the middle of the electrode plate 300. After unloading, the springback deformation of the flow channel 400 in the middle is greater than that at the edge, resulting in a greater depth of the flow channel 400 at the edge than in the middle, thus causing uneven flow channels 400 in the electrode plate 300. Furthermore, the different internal stresses and springback deformations experienced by the substrate 100 during stamping make it prone to developing latent cracks. Latent cracks refer to minute cracks that are not obvious and difficult to observe directly with the naked eye on the surface or interior of the material after forming. They can be detected through methods such as fluorescent penetrant testing, ultrasonic testing, and metallographic analysis.

[0040] Therefore, in this embodiment, the elastic element 28 is used to press one of the first punch 21 and the second punch 22 against the first template 10, thereby forming the intermediate plate 200 from the substrate 100. Then, it is pressed further down to form the final electrode plate 300 from the intermediate plate 200. This reduces the shear force generated by one-time molding; at the same time, it also helps to increase the flow range and freedom of the material at the edge, supplementing the material required for molding in the middle, thereby reducing the plastic deformation generated by the flow channel 400 in the middle of the substrate 100 and reducing the accumulation of internal stress. In this way, by using a step-by-step stamping method, the single molding height of the flow channel 400 and the thinning rate of the electrode plate 300 are reduced, which helps to reduce the probability of hidden cracks and uneven molding defects in the flow channel 400, and improves the product yield.

[0041] Please refer to the following: Figures 9 to 11 The substrate 100 refers to a sheet material structure whose surface has not yet been stamped to form the flow channels 400. The intermediate plate 200 refers to an intermediate structure formed by the substrate 100 through the first stamping step, where the flow channels 400 on the surface of the intermediate plate 200 have not yet reached the required dimensions. The flow channel 400 refers to the uneven structure formed on the surface of the substrate 100 by the stamping engagement of the stamping protrusion 11 and the mating recess 221, and the stamping recess 12 and the mating protrusion 211. The number and size of the flow channels 400 can be determined according to actual needs. Furthermore, the shape of the flow channels 400 can also be designed in various ways, such as a straight flow channel 400 extending along the second direction Y. In addition, the shapes of the stamping protrusion 11, stamping recess 12, mating protrusion 211, and mating recess 221 can be designed according to the shape of the flow channel 400.

[0042] It should also be noted that the elastic element 28 is supported between the bearing component 30 and the first punch 21 or the second punch 22, so that the first punch 21 or the second punch 22 can be pressed into the first template 10 more preferentially to complete the first stamping of the substrate 100. For example, the elastic element 28 is supported between the first punch 21 and the bearing component 30, so that the mating protrusion 211 of the first punch 21 cooperates with the stamping recess 12 to preferentially stamp the substrate 100; or, the elastic element 28 is supported between the second punch 22 and the bearing component 30, so that the mating recess 221 of the second punch 22 cooperates with the stamping protrusion 11 to preferentially stamp the substrate 100.

[0043] When the first punch 21 or the second punch 22 is supported on the carrier assembly 30 by the elastic member 28, the position of the one supported by the elastic member 28 will be raised before stamping. For example, when the elastic member 28 supports the second punch 22 and the carrier assembly 30, the position of the mating recess 221 of the second punch 22 will be elastically raised before stamping. At this time, the mating recess 221 of the second punch 22 can be flush with or exceed the mating protrusion 211 of the first punch 21. Of course, in some examples, the mating recess 221 of the second punch 22 is still lower than the mating protrusion 211 of the first punch 21. When the mating recess 221 of the second punch 22 exceeds the mating protrusion 211 of the first punch 21 under the action of the elastic member 28, during the stamping process, the stamping protrusion 11 and the mating recess 221 engage, and the substrate 100 is stamped preferentially. At this time, the stamping recess 12 and the mating protrusion 211 have not yet engaged, and the substrate 100 cannot be stamped. As the first template 10 continues to move downward, the second punch 22 compresses the elastic element 28, causing the stamping recess 12 to engage with the mating protrusion 211, and stamping the intermediate plate 200.

[0044] Furthermore, the second punch 22 is embedded in the insertion gap 23, allowing relative movement between the first punch 21 and the second punch 22 under the action of the elastic member 28. The second punch 22 can be embedded between two adjacent first punches 21, or it can be embedded on one side of the outermost first punch 21 in the first direction X. Specifically, in some examples, an insertion gap 23 is formed between each pair of adjacent first punches 21.

[0045] In the elastic support, each of the first punches 21 or second punches 22 is connected together in sequence and supported on the bearing assembly 30 by an elastic element 28; alternatively, each of the first punches 21 or second punches 22 is supported on the bearing assembly 30 by an independent elastic element 28. The structure of the elastic element 28 can have various designs, such as springs, elastic metal sheets, etc. In addition, the elastic element 28 can directly support the first punches 21 or second punches 22, such as one end of the elastic element 28 directly abutting against the first punches 21 or second punches 22; or it can indirectly support them, such as the first punches 21 or second punches 22 being connected to an intermediate structure, with one end of the elastic element 28 abutting against the intermediate structure.

[0046] When the elastic element 28 is a spring, its parameters can be adjusted according to the stamping effect; of course, they can also be calculated using relevant formulas. For example: the total stamping load is T, the number of springs is n, and the force that each spring needs to bear is: F = T / n. The spring deformation is X (after the spring deformation X, the first template 10 mates with the first punch 21 and the second punch 22), the spring mean diameter is D, and the number of spring coils is N. At this time, the spring stiffness is k = F / x, k = Gd. 4 / 8D 3 N, then the diameter of the spring wire d = (8D) 3 Nk / G) 1 / 4 .

[0047] Further, please refer to Figure 4 The component 20 also includes an inner mold 26 and an outer mold 27 fitted over the inner mold 26. Both the inner mold 26 and the outer mold 27 are located on the support component 30. Each first punch 21 is spaced along the first direction X on the surface of the inner mold 26 facing the first template 10. Each second punch 22 is connected to the outer mold 27 at both ends along the second direction Y, which intersects the first direction X. An elastic member 28 supports the outer mold 27 between the support component 30 and the support component 30. It can be seen that by fitting the outer mold 27 over the inner mold 26 and extending each second punch 22 along the second direction Y to connect with the outer mold 27, the outer mold 27 and each second punch 22 form a whole. Since the elastic member 28 supports the outer mold 27 between the support component 30 and the support component 30, the elastic member 28 can indirectly support the second punches 22, allowing the second punches 22 to preferentially cooperate with the second template 40 compared to the first punches 21, in order to stamp the base material 100 of the electrode plate 300, achieving effective step-by-step stamping.

[0048] It is easy to understand that the outer mold 27 is fitted over the inner mold 26, indicating that the outer mold 27 has a ring-shaped structure surrounding the outer periphery of the inner mold 26. The second punch 22, embedded between two adjacent first punches 21, extends at both ends along the second direction Y into the embedding gap 23 and connects to the inner wall of the outer mold 27. To improve the stamping effect, the inner wall of the outer mold 27 can fit against the outer wall of the inner mold 26, and the second punch 22 fits against the first punches 21 on both sides.

[0049] Furthermore, the elastic element 28 provides elastic support to the second punch 22, so that the second punch 22 is moderately raised before stamping, allowing the stamping protrusion 11 to engage with the mating recess 221, prioritizing the stamping of the base material 100. Since the mating recess 221 of the second punch 22 is generally lower than the mating protrusion 211 of the first punch 21, even though the mating recess 221 is elastically supported by the elastic element 28, the height difference between the location of the mating recess 221 and the location of the mating protrusion 211 is not large. This not only satisfies the need for effective step-by-step stamping, but also ensures that the surfaces of the first punch 21 and the second punch 22 are more even, making it easier for the base material 100 to be stably placed on the mating assembly 20, avoiding the risk of the base material 100 being easily punched off-center due to uneven surfaces, and further improving the stamping effect.

[0050] In some embodiments, please refer to Figure 2 The elastic element 28 is configured to drive the mating recess 221 beyond the mating protrusion 211 along the third direction Z when the first template 10 and the mating assembly 20 are separated in the third direction Z. The first direction X, the second direction Y, and the third direction Z intersect each other and are not coplanar. Therefore, before stamping, the mating recess 221 of the second punch 22 extends beyond the mating protrusion 211 under the action of the elastic element 28. This ensures that the second punch 22 has sufficient downward movement space before the first template 10 mates with it, thereby guaranteeing that the stamping protrusion 11 and the mating recess 221 have adequate time to stamp the substrate 100 to obtain a structurally stable intermediate plate 200, which is beneficial for improving the quality of the first stamping step.

[0051] It should be noted that the first template 10 and the mating component 20 are in a separated state in the third direction Z, indicating that the first template 10 has not yet moved downward toward the mating component 20, which can also be understood as the first template 10 and the mating component 20 not undergoing a stamping operation.

[0052] Meanwhile, since the mating recess 221 extends beyond the mating protrusion 211, it should be understood that the most protruding part of the mating recess 221 is higher than the most protruding part of the mating protrusion 211. In some examples, the inner wall of the mating recess 221 includes a bottom wall 22a and protrusions 22b respectively provided at both ends of the bottom wall 22a along the first direction X. When the first template 10 and the mating assembly 20 are separated in the third direction Z, one end of the protrusion 22b is higher than one end of the mating protrusion 211 in the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0053] Furthermore, under the action of the elastic member 28, the mating recess 221 extends beyond the mating protrusion 211 in the third direction Z by 5mm to 30mm, for example, but not limited to 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, etc. Therefore, controlling the extension of the mating recess 221 beyond the mating protrusion 211 to 5mm to 30mm ensures sufficient stroke for the primary stamping between the second punch 22 and the first template 10, thus completing the stamping forming of the intermediate plate 200; and also avoids a large surface height difference between the first punch 21 and the second punch 22, which could prevent the substrate 100 from being placed stably.

[0054] In some specific examples, the inner wall of the mating recess 221 includes a bottom wall 22a and protrusions 22b respectively provided at both ends of the bottom wall 22a along the first direction X. The protrusions 22b extend beyond the outer dimension of the mating protrusion 211 by 5mm to 30mm along the third direction Z.

[0055] In some embodiments, please refer to Figure 4 The supporting component 20 also includes a first pad 29, which is disposed on the supporting component 30. Both the inner mold 26 and the outer mold 27 are disposed on the first pad 29. The first pad 29 has a through hole 291, through which an elastic element 28 passes and abuts against the outer mold 27 and the supporting component 30. Thus, by placing the elastic element 28 through the through hole 291, the elastic element 28 is limited, preventing structural failure due to compression during stamping, thereby ensuring stable support of the outer mold 27 by the elastic element 28. Simultaneously, the through hole 291 on the first pad 29 allows the second punch 22 to move down onto the first pad 29 during the second stamping step of the first template 10, and together with the second punch 22, stamp the substrate 100 of the electrode plate 300.

[0056] In some embodiments, please refer to Figure 4 The outer mold 27 includes a first part 271 and a second part 272 connected to each other. The first part 271 and the second part 272 are located on opposite sides of the inner mold 26 along the first direction X. The first part 271 and / or the second part 272 are supported on the bearing assembly 30 by an elastic member 28. It can be seen that the elastic member 28, through the elastic support of the first part 271 or the second part 272, enables the second punch 22 to be preferentially pressed into the first template 10, thereby achieving the first step of stamping on the substrate 100 of the electrode plate 300.

[0057] It should be noted that during the first stamping step, the first part 271 and the second part 272 can also be press-fitted with the first template 10 to stamp the substrate 100. For example, a first recess 274 is provided on the surface of the first part 271, and a first protrusion 13 that mates with the first recess 274 is provided on the first template 10; a number of spaced second recesses 275 are provided on the surface of the second part 272, and a number of spaced second protrusions 14 are provided on the first template 10. The number of first recesses 274 and second recesses 275 can be determined according to the number of flow channels 400 on the electrode plate 300.

[0058] In addition, when both the first part 271 and the second part 272 are supported on the bearing assembly 30 by the elastic member 28, the elastic force on the outer mold 27 is more balanced, making the stamping of the base material 100 by the second punch 22 more stable and further improving the stamping effect.

[0059] In some embodiments, please refer to Figure 4 The first part 271 and / or the second part 272 are provided with mounting holes 273 facing the surface of the supporting component 30, and one end of the elastic member 28 is inserted into the mounting hole 273. It can be seen that inserting the elastic member 28 into the mounting hole 273 makes the elastic member 28 stably engaged with the first part 271 or the second part 272, avoiding compression during the stamping process and causing the elastic member 28 to detach from the first part 271 or the second part 272, thus ensuring stable stamping.

[0060] It should be noted that the mounting hole 273 can be located at the bottom of the first part 271 or the second part 272, or both can be located at the bottom of the first part 271 and the second part 272. When both the first part 271 and the second part 272 are provided with mounting holes 273, both the first part 271 and the second part 272 can be supported by the elastic element 28, making the force on the outer mold 27 more balanced.

[0061] Meanwhile, the number of mounting holes 273 on the first part 271 or the second part 272 can be one or more. When there are multiple mounting holes 273, an elastic element 28 can be inserted into each mounting hole 273.

[0062] Additionally, please refer to Figure 4 When the bottom of the outer mold 27 and the inner mold 26 is provided with a first pad 29 having a through hole 291, the mounting hole 273 can be connected with the through hole 291. In this way, the elastic member 28 passing through the through hole 291 can be easily inserted into the mounting hole 273, which not only makes the elastic member 28 stably installed, but also facilitates the elastic member 28 to shrink in the mounting hole 273 and the through hole 291 during the stamping process.

[0063] In some embodiments, please refer to Figure 5 and Figure 6Each stamping protrusion 11 has arc-shaped concave walls 111 at both ends along the first direction X, and each mating protrusion 211 has arc-shaped convex walls 21a at both ends along the first direction X. The arc-shaped convex walls 21a and the arc-shaped concave walls 111 are correspondingly arranged. Therefore, when the stamping protrusion 11 mates with the mating concave wall 221 to stamp the substrate 100, the arc-shaped concave walls 111 of the stamping protrusion 11 press against the surface of the substrate 100, making one end of the outer convex surface of the flow channel 400 formed on the substrate 100 a rounded corner. This avoids stress accumulation at one end of the flow channel 400 during stamping and reduces the occurrence of hidden cracks during the stamping process. When the first template 10 moves down to press against the first punch 21, the arc-shaped convex walls 21a of the mating protrusion 211 will perform arc-shaped compression on one end of the inner concave surface of the flow channel 400, ensuring that the rounded corner at one end of the outer convex surface of the flow channel 400 reaches the required size.

[0064] It should be noted that the radius of the concave arc wall 111 can be equal to or greater than the radius of the convex arc wall 21a. When the radius of the concave arc wall 111 is greater than the radius of the convex arc wall 21a, the bending angle of the concave arc wall 111 at one end of the outer convex surface of the flow channel 400 is smaller, resulting in a relatively smaller arc radius and more stable structural forming. When the first template 10 moves down to press against the first punch 21, the convex arc wall 21a will squeeze the flow channel 400 into the stamping recess 12, which can increase the bending angle of the flow channel 400, so that the arc radius at one end of the outer convex surface of the flow channel 400 reaches the required size. See reference for details. Figure 10 and Figure 11 When the first template 10 is pressed against the second punch 22, the radius of the arc of one corner of the flow channel 400 formed on the surface of the substrate 100 is R1; when the first template 10 moves down to press against the first punch 21 at the same time, the radius of the arc of one corner of the flow channel 400 formed on the surface of the substrate 100 is R2, where R1≥R2.

[0065] In some embodiments, please refer to Figure 4One of the first punches 21 is a first allowance punch 24, and the dimension of the mating recess 221 of the first allowance punch 24 along the first direction X is larger than the dimensions of the other mating recesses 221. One of the second punches 22 is a second allowance punch 25, and the dimension of the mating protrusion 211 of the second allowance punch 25 along the first direction X is larger than the dimensions of the other mating protrusions 211. At least one first punch 21 and at least one second punch 22 are distributed between the first allowance punch 24 and the second allowance punch 25. It can be seen that when the stamping protrusion 11 mates with the mating recess 221 of the first allowance punch 24, a larger edge structure can be formed on the substrate 100, which can provide better stamping limit. Similarly, when the stamping recess 12 mates with the mating protrusion 211 of the second allowance punch 25, a larger edge structure can also be formed on the substrate 100, providing better stamping limit and ensuring stable stamping.

[0066] It should be noted that, please refer to Figure 10 and Figure 11 In the first stamping process, a flow channel 400 is formed on the substrate 100 near the first allowance punch 24. The width of the ridge of the flow channel 400 along the first direction X is denoted as a1. In the second stamping process, that is, after the first template 10 and the first punch 21 are pressed together, a flow channel 400 is formed on the substrate 100 near the second allowance punch 25. The width of the ridge of the flow channel 400 along the first direction X is denoted as a2. Wherein, a1≥1.4a2.

[0067] In some embodiments, please refer to Figure 2 It also includes a second template 40 and a guide member 41. The second template 40 is fitted outside the mating assembly 20 and is located on the bearing assembly 30. The guide member 41 is located between the first template 10 and the second template 40 and is used to guide the movement between the first template 10 and the second template 40. It can be seen that the introduction of the guide member 41 makes the movement of the first template 10 relative to the second template 40 more stable, thereby helping to improve the stamping effect.

[0068] To facilitate the implementation of the first template 10, please refer to... Figure 2 The device also includes a first mold base 50 and a second pad 51. The second pad 51 is stacked on the surface of the first mold template 10 facing away from the mating assembly 20, and the first mold base 50 is stacked on the second pad 51. Meanwhile, the supporting assembly 30 includes a third pad 31, a second mold base 32, a mold frame 33, a base 35, and a support plate 34. The second mold template 40 and the mating assembly 20 are both mounted on the second mold base 32 via the third pad 31, and the second mold base 32 is mounted on the base 35 via the mold frame 33. Furthermore, a height-limiting post 52 is provided between the first mold base 50 and the second mold base 32.

[0069] In some embodiments, please refer to Figure 12This application provides a method for optimizing the latent dark cracks in the stamping process of electrode plates, employing any of the above-mentioned apparatuses for optimizing the latent dark cracks in the stamping process of electrode plates, and the method includes the following steps:

[0070] S100: Place the substrate 100 on the surface of the mating component 20 facing the first template 10;

[0071] S200, drive the first template 10 toward the mating assembly 20, so that the stamping protrusion 11 engages with the mating recess 221, or the stamping recess 12 engages with the mating protrusion 211, and stamp the substrate 100 to form the intermediate plate 200.

[0072] S300, drive the first template 10 to continue moving, so that the stamping protrusion 11 engages with the mating recess 221 and the stamping recess 12 engages with the mating protrusion 211, and stamp the intermediate plate 200 to form the electrode plate 300.

[0073] S400, after the pressure holding preset time, separate the first template 10 from the mating component 20.

[0074] The aforementioned method for optimizing the hidden crack feature of electrode stamping uses the aforementioned apparatus for optimizing the hidden crack feature of electrode stamping. During the stamping process, a substrate 100 is placed on the surface of the mating assembly 20. Then, the first template 10 is driven to move towards the mating assembly 20. Since one of the first punch 21 and the second punch 22 is supported by the elastic member 28, the first template 10 can preferentially mate with the one supported by the elastic member 28, stamping the substrate 100 to form an intermediate plate 200. Then, the first template 10 continues to move, compressing the elastic member 28, so that the first template 10 is pressed into both the first punch 21 and the second punch 22. At this time, the stamping protrusion 11 is stamped into the mating recess 221, and the stamping recess 12 is stamped into the mating protrusion 211, so that the intermediate plate 200 is formed into an electrode 300. Therefore, this device involves two-step pressure forming, reducing the shear force during the first forming and increasing the flow range and freedom of the material at the edge of the electrode plate 300 during the forming process, effectively supplementing the material required for the intermediate forming of the electrode plate 300. This reduces the single forming height and forming thinning rate, thereby reducing the probability of molding defects such as hidden cracks and uneven flow channels 400, and improving product yield.

[0075] It should be noted that the substrate 100 refers to a sheet material structure whose surface has not been stamped to form the flow channels 400, and the intermediate plate 200 refers to an intermediate structure formed by the substrate 100 through the first stamping step, where the flow channels 400 on the surface of the intermediate plate 200 have not yet reached the required dimensions. Through the step-by-step stamping method of this embodiment, the stamping of thinner substrates 100 can be achieved; for example, the thickness of the substrate 100 can be less than or equal to 2 mm.

[0076] In step S400, when the first template 10 is simultaneously pressed against the first punch 21 and the second punch 22, the pressure can be kept constant for a certain period of time, making the structure of the formed electrode plate 300 more stable. The preset time can be determined according to the stamping depth, stamping pressure and material properties of the substrate 100, and is not specifically limited here.

[0077] In some embodiments, please refer to Figures 9 to 11 In the step of driving the first template 10 to move toward the mating assembly 20, the stamping protrusion 11 and the mating recess 221 cooperate to stamp the substrate 100 to form the intermediate plate 200. The height of the flow channel 400 of the intermediate plate 200 is denoted as h1, the ridge width of the flow channel 400 of the intermediate plate 200 is denoted as W1, the height of the flow channel 400 of the electrode plate 300 is denoted as h2, and the ridge width of the corresponding flow channel 400 on the electrode plate 300 and the intermediate plate is denoted as W2. h2 ≥ 1.2h1, and W1 ≥ 1.4W2. It can be seen that by dividing the stamping process into two steps, the single-step forming height is reduced, and the thinning rate of the single forming is reduced. Through two forming decompositions, the desired forming characteristics are finally achieved, thereby reducing dark cracks and deformation.

[0078] It should be noted that the ridge of the flow channel 400 refers to the relatively flat part of the convex surface of the flow channel 400. After the first stamping step, the center distance between the flow channels 400 of the formed intermediate plate 200 is denoted as L1, the radius of the arc at one end of the convex surface of the flow channel 400 is denoted as R1, and the thinning rate of the intermediate plate 200 relative to the substrate 100 is denoted as δ1. After the second stamping step, the center distance between the flow channels 400 of the formed electrode plate 300 is denoted as L2, the radius of the arc at one end of the convex surface of the flow channel 400 is denoted as R2, the thinning rate of the electrode plate 300 relative to the intermediate plate 200 is denoted as δ2, and the thinning rate of the electrode plate 300 relative to the substrate 100 is denoted as δ3. Wherein, δ3=δ1*δ2, L1=L2, R1≥R2.

[0079] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A device for optimizing the hidden dark cracks in electrode stamping, characterized in that, include: Support component (30); The first template (10) is located above the support component (30), and its surface facing the support component (30) is provided with a plurality of stamped protrusions (11) and stamped recesses (12) arranged alternately in sequence; The cooperating component (20) is located between the supporting component (30) and the first template (10); The mating assembly (20) includes an elastic element (28), a plurality of first punches (21) and a plurality of second punches (22). Each first punch (21) is spaced apart along a first direction (X), and each first punch (21) has an embedding gap (23) formed on at least one side along the first direction (X). Each second punch (22) is embedded in the corresponding embedding gap (23). One end of each first punch (21) is provided with a mating protrusion (211) that mates with the stamping recess (12). One end of each second punch (22) is provided with a mating recess (221) that mates with the stamping protrusion (11). The elastic element (28) is supported between the bearing assembly (30) and each first punch (21) or each second punch (22), so that one of the first punches (21) and the second punches (22) is stamped and mated with the first template (10) before the other.

2. The apparatus for optimizing the subliminal crack of the plate stamping forming feature according to claim 1, characterized in that, The mating component (20) further includes an inner mold (26) and an outer mold (27) sleeved outside the inner mold (26). The inner mold (26) and the outer mold (27) are both disposed on the bearing component (30). Each of the first punches (21) is spaced along the first direction (X) on the surface of the inner mold (26) facing the first template (10). Each of the second punches (22) is connected to the outer mold (27) at both ends along the second direction (Y) intersecting the first direction (X). The elastic element (28) is supported between the outer mold (27) and the bearing component (30).

3. The apparatus for optimizing the hidden dark cracks in electrode stamping as described in claim 2, characterized in that, The elastic element (28) is configured to drive the mating recess (221) beyond the mating protrusion (211) along the third direction (Z) when the first template (10) and the mating assembly (20) are separated in the third direction (Z), wherein the first direction (X), the second direction (Y) and the third direction (Z) intersect each other and are not coplanar.

4. The apparatus for optimizing the subliminal crack of the plate stamping forming feature according to claim 3, characterized in that, The mating recess (221) extends 5mm to 30mm beyond the mating protrusion (211) along the third direction (Z) under the action of the elastic member (28).

5. The apparatus for optimizing the subliminal crack of the plate stamping forming feature according to claim 2, characterized in that, The mating component (20) further includes a first pad (29), which is disposed on the bearing component (30). The inner mold (26) and the outer mold (27) are both disposed on the first pad (29). The first pad (29) is provided with a through hole (291). The elastic element (28) passes through the through hole (291) and abuts between the outer mold (27) and the bearing component (30).

6. The apparatus for optimizing the stamping feature of the implicit flash of the polar plate according to claim 2, wherein, The outer mold (27) includes a first part (271) and a second part (272) connected to each other. The first part (271) and the second part (272) are located on opposite sides of the inner mold (26) along the first direction (X). The first part (271) and / or the second part (272) are supported on the bearing assembly (30) by the elastic member (28).

7. The apparatus for optimizing the subliminal crack of the plate stamping forming feature according to claim 6, characterized in that, The first part (271) and / or the second part (272) are provided with mounting holes (273) on the surface facing the support assembly (30), and one end of the elastic member (28) is inserted into the mounting hole (273).

8. The apparatus for optimizing the hidden dark cracks in the stamping forming of electrode plates according to any one of claims 1-7, characterized in that, Each of the stamping protrusions (11) includes an arc-shaped concave wall (111) at both ends along the first direction (X), and each of the mating protrusions (211) includes an arc-shaped convex wall (21a) at both ends along the first direction (X). The arc-shaped convex wall (21a) and the arc-shaped concave wall (111) are respectively provided.

9. The apparatus for optimizing the stamping formation feature of the implicit flash crack of the polar plate according to any one of claims 1-7, characterized in that, One of the first punches (21) is a first allowance punch (24), and the size of the mating recess (221) of the first allowance punch (24) along the first direction (X) is larger than the size of the other mating recesses (221). One of the second punches (22) is a second allowance punch (25), and the size of the mating protrusion (211) of the second allowance punch (25) along the first direction (X) is larger than the size of the other mating protrusions (211). At least one first punch (21) and at least one second punch (22) are distributed between the first allowance punch (24) and the second allowance punch (25).

10. The apparatus for optimizing the stamping formation feature of the implicit flash crack of the polar plate according to any one of claims 1-7, characterized in that, It also includes a second template (40) and a guide (41). The second template (40) is sleeved on the mating assembly (20) and is disposed on the bearing assembly (30). The guide (41) is disposed between the first template (10) and the second template (40) and is used to guide the movement between the first template (10) and the second template (40).

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