Mold and mold plate
By using a diamond sintered body and a one-piece mold structure, and fixing it with an adhesive, the problem of mold assembly error was solved, and the accuracy and stability of stamping were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MITSUBOSHI DIAMOND IND CO LTD
- Filing Date
- 2021-12-27
- Publication Date
- 2026-07-03
AI Technical Summary
In parting dies, assembly errors can easily occur when the die elements are joined, affecting the stamping accuracy.
A mold consisting of a diamond sintered body and an integral structure is used. The mold is fixed to the plate body by an adhesive, which restricts the movement of the mold in the orthogonal direction.
This improves the precision of stamping, ensures that the mold is firmly fixed to the plate body, and reduces assembly errors.
Smart Images

Figure CN114682690B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to molds and mold plates. Background Technology
[0002] The stamping machine includes a die plate. The die plate contains a die. An example of a conventional parting die is shown in Patent Document 1.
[0003] Patent Document 1: Japanese Patent Application Publication No. 2011-136348 Summary of the Invention
[0004] The problem the invention aims to solve
[0005] In parting molds, assembly errors can occur when the elements constituting the mold are joined together.
[0006] Solution for solving the problem
[0007] The mold involved in this invention includes a diamond sintered body, an integral structure, and a side surface, wherein the side surface includes an inclined surface.
[0008] Because it incorporates a one-piece structure, it helps to improve the accuracy of stamping processes. The movement of the die plate relative to the main body is restricted in two orthogonal directions.
[0009] In one example of the mold, an adhesive preparation section for preparing the adhesive is also included.
[0010] The mold and the main body of the board are firmly joined by the adhesive applied to the adhesive application section.
[0011] The mold plate involved in this invention includes a plate body and a mold pressed into the plate body, the mold including a diamond sintered body and an integral structure.
[0012] The die has a one-piece structure, which helps to improve the accuracy of the stamping process. The die is pressed into the sheet metal body, thus securing it firmly to the sheet metal body.
[0013] Invention Effects
[0014] The mold and mold plate according to the present invention can help improve the accuracy of stamping processes. Attached Figure Description
[0015] Figure 1 It is a 3D view of the mold plate.
[0016] Figure 2 This is the front view of the mold plate.
[0017] Figure 3 This is a top view of the mold plate.
[0018] Figure 4 This is a bottom view of the mold plate.
[0019] Figure 5 This is a top view of the main body of the board.
[0020] Figure 6 This is a cross-sectional view of the main body of the plate related to the first recess.
[0021] Figure 7 This is a cross-sectional view of the main body of the plate related to the second recess.
[0022] Figure 8 This is a sectional view of the main body of the plate related to the third recess.
[0023] Figure 9 This is a top view of the first mold.
[0024] Figure 10 This is a side view of the first mold.
[0025] Figure 11 This is a top view of the second mold.
[0026] Figure 12 This is a side view of the second mold.
[0027] Figure 13 This is a top view of the third mold.
[0028] Figure 14 This is a side view of the third mold.
[0029] Figure 15 It is a cross-sectional view of the mold plate associated with the first recess and the first mold.
[0030] Figure 16 It is a cross-sectional view of the mold plate associated with the second recess and the second mold.
[0031] Figure 17 It is a cross-sectional view of the mold plate associated with the third recess and the third mold.
[0032] Figure 18 It is a 3D view of the mold plate.
[0033] Figure 19 This is a cross-sectional view of the first bonding and fixing part before the adhesive is applied.
[0034] Figure 20 This is a cross-sectional view of the first adhesive fixing part after the adhesive has been prepared.
[0035] Figure 21 This is a cross-sectional view of the second adhesive fixing part before the adhesive is applied.
[0036] Figure 22 This is a cross-sectional view of the second adhesive fixing part after the adhesive has been prepared.
[0037] Figure 23 This is a diagram showing the relationship between the second reference plane and the side surface of the recess.
[0038] Figure 24 This is a diagram showing the relationship between the second reference plane and the side of the mold.
[0039] Figure 25 Figure (1) shows the process of fixing the mold.
[0040] Figure 26 Figure (2) shows the process of fixing the mold.
[0041] Explanation of reference numerals in the attached figures
[0042] 10: Mold plate; 100: Plate body; 300: Mold; 313: Side; Q1: Parallel surface; Q2: Inclined surface; 350: Groove; 430: Adhesive preparation section; 440: Adhesive. Detailed Implementation
[0043] (First Implementation)
[0044] Figures 1-4 An example of mold plate 10 is shown.
[0045] The mold plate 10 is assembled into the stamping metal mold of the stamping machine.
[0046] The mold plate 10 may include, for example, a structure corresponding to the manufacture of general parts or a structure corresponding to the manufacture of precision parts. The dimensional tolerances of the precision parts are smaller than those of the general parts.
[0047] Examples of precision components include fixtures such as lead frames for semiconductor packages and metal molds such as lead frames for semiconductor packages.
[0048] The mold plate 10 specifies, for example, a first transverse direction, a second transverse direction, a first longitudinal direction, a second longitudinal direction, a first height direction, and a second height direction.
[0049] The first horizontal direction is the opposite of the second horizontal direction.
[0050] The first longitudinal direction is the opposite of the second longitudinal direction.
[0051] The first altitude direction is the opposite of the second altitude direction.
[0052] The horizontal direction is a collective term for the first and second horizontal directions.
[0053] The longitudinal direction is a collective term for the first and second longitudinal directions.
[0054] The altitude direction is a collective term for the first altitude direction and the second altitude direction.
[0055] The horizontal axis is parallel to the X-axis.
[0056] The longitudinal direction is parallel to the Y-axis.
[0057] The height direction is parallel to the Z-axis.
[0058] The X and Y axes define the first reference plane.
[0059] The X-axis and Z-axis define a second reference plane.
[0060] The Y-axis and Z-axis define a third reference plane.
[0061] The mold plate 10 includes one or more plate bodies 100 and one or more molds 300.
[0062] In the illustrated example, the mold plate 10 includes a plate body 100 and multiple molds 300.
[0063] The main body 100 constitutes the main body of the mold plate 10.
[0064] The main body of the plate 100 is, for example, a column.
[0065] The main body 100 is fixed to the lower die of the stamping metal mold.
[0066] Examples of raw materials for the main body 100 of the plate include ferrous materials such as superhard alloys and hardened steel.
[0067] The main body 100 includes a mold configuration section 200.
[0068] The mold configuration unit 200 is configured to be able to configure one or more molds 300.
[0069] The surface 110 of the main body 100 includes multiple surfaces.
[0070] Surface 110 includes, for example, a top surface 111, a bottom surface 112, and a side surface 113.
[0071] In the illustrated example, surface 110 includes a plurality of top surfaces 111.
[0072] The multiple top surfaces 111 include a first top surface 111A, a second top surface 111B, a third top surface 111C, and a fourth top surface 111D. Top surfaces 111 are a collective term for all top surfaces 111A to 111D.
[0073] The top surfaces 111A to 111D are arranged at intervals in the horizontal direction.
[0074] The first top surface 111A is located on the first horizontal direction relative to the second top surface 111B.
[0075] The second top surface 111B is located on the first horizontal direction relative to the third top surface 111C.
[0076] The third top surface 111C is located on the first horizontal direction relative to the fourth top surface 111D.
[0077] The top surface 111 faces the direction of the first height.
[0078] With the mold plate 10 assembled into the stamping metal mold, the top surface 111 faces the upper die of the stamping metal mold.
[0079] The top surface 111 is a plane.
[0080] The top surface 111 is parallel to the first reference surface.
[0081] The bottom surface 112 faces the direction of the second height.
[0082] With the mold plate 10 assembled into the stamping metal mold, the bottom surface 112 faces the lower die of the stamping metal mold.
[0083] The bottom surface 112 is a plane.
[0084] The parallel plane of the bottom surface 112 is parallel to the first reference plane.
[0085] In the illustrated example, surface 110 includes multiple side surfaces 113.
[0086] The multiple sides 113 include a first side 113A, a second side 113B, a third side 113C, and a fourth side 113D. Side 113 is a collective term for all sides 113A to 113D.
[0087] Side 113 faces horizontally or vertically.
[0088] Side 113 is connected to top surface 111 and bottom surface 112.
[0089] Side 113 is a plane.
[0090] Side 113 is parallel to the second or third reference plane.
[0091] The first side surface 113A is located in the first longitudinal direction relative to the top surface 111 and the bottom surface 112.
[0092] The first side surface 113A is parallel to the second reference plane.
[0093] The second side surface 113B is located in the second longitudinal direction relative to the top surface 111 and the bottom surface 112.
[0094] The second side surface 113B is parallel to the second reference plane.
[0095] The third side 113C is located on the first transverse side relative to the top surface 111 and the bottom surface 112.
[0096] The third side surface 113C is parallel to the third reference plane.
[0097] The fourth side 113D is located on the second transverse side relative to the top surface 111 and the bottom surface 112.
[0098] The fourth side surface 113D is parallel to the third reference plane.
[0099] The main body 100 may include one or more through portions 120.
[0100] In the illustrated example, the plate body 100 includes a plurality of through portions 120.
[0101] The multiple through sections 120 include a first through section 120A, a second through section 120B, and a third through section 120C. The through sections 120 are a collective term for all through sections 120A to 120C.
[0102] The through sections 120A to 120C are arranged at intervals in the horizontal direction.
[0103] The first through section 120A is located on the first transverse side relative to the second through section 120B.
[0104] The second through section 120B is located on the first transverse side relative to the third through section 120C.
[0105] The through portion 120 includes an inner circumferential surface 121 and a through hole 122.
[0106] The inner circumferential surface 121 specifies the through hole 122.
[0107] The through hole 122 is configured, for example, to allow molten slag from the workpiece to pass through.
[0108] The central axis of the through hole 122 is, for example, parallel to the height direction.
[0109] The through hole 122 includes a first opening 122A and a second opening 122B.
[0110] The first opening 122A opens into the mold configuration section 200.
[0111] The second opening 122B opens onto the bottom surface 112 of the main body 100.
[0112] The main body 100 includes, for example, multiple divisions 130.
[0113] The multiple divisions 130 include a first division 130A, a second division 130B, a third division 130C, and a fourth division 130D. The divisions 130 are a collective term for the divisions 130A to 130D.
[0114] The divisions 130A to 130D are arranged at intervals in the horizontal direction.
[0115] The first dividing section 130A is located on the first transverse side relative to the second dividing section 130B.
[0116] The second division 130B is located on the first transverse side relative to the third division 130C.
[0117] The third division 130C is located on the first transverse side relative to the fourth division 130D.
[0118] The first dividing section 130A includes a first top surface 111A.
[0119] The second division 130B includes a second top surface 111B.
[0120] The third division 130C includes the third top surface 111C.
[0121] The fourth division 130D includes the fourth top surface 111D.
[0122] The mold configuration section 200 includes, for example, one or more recesses 210.
[0123] In the illustrated example, the mold configuration section 200 includes a plurality of recesses 210.
[0124] The plurality of recesses 210 include a first recess 210A, a second recess 210B, and a third recess 210C. Recesses 210 are a collective term for all recesses 210A to 210C.
[0125] The recesses 210A to 210C are arranged at intervals in the transverse direction.
[0126] The first recess 210A is located on the first transverse side relative to the second recess 210B.
[0127] The second recess 210B is located on the first transverse side relative to the third recess 210C.
[0128] The first recess 210A is disposed between the first dividing portion 130A and the second dividing portion 130B.
[0129] The first recess 210A is configured to correspond to the first through portion 120A.
[0130] The first recess 210A is located in the first height direction relative to the first through portion 120A.
[0131] The second recess 210B is disposed between the second dividing portion 130B and the third dividing portion 130C.
[0132] The second recess 210B is configured to correspond to the second through portion 120B.
[0133] The second recess 210B is located in the first height direction relative to the second through portion 120B.
[0134] The third recess 210C is provided between the third dividing portion 130C and the fourth dividing portion 130D.
[0135] The third recess 210C is configured to correspond to the third through portion 120C.
[0136] The third recess 210C is located in the first height direction relative to the third through portion 120C.
[0137] Figure 5 The main body 100 of the plate is shown from above.
[0138] Figures 6-8 A cross-section of the plate body 100 parallel to the second reference plane is shown.
[0139] The recess 210 includes a configuration space 220, a concave surface 230, and an opening 240.
[0140] Configuration space 220 is configured to be able to configure mold 300.
[0141] The concave surface 230 specifies a configuration space of 220.
[0142] The concave surface 230 includes, for example, a bottom surface 231 and multiple side surfaces 232.
[0143] The bottom surface 231 is located in the second height direction relative to the configuration space 220.
[0144] Side 232 is located horizontally relative to configuration space 220.
[0145] The bottom surface 231 is a plane.
[0146] The bottom surface 231 is parallel to the first reference surface.
[0147] The first opening 122A of the through section 120 opens onto the bottom surface 231.
[0148] exist Figures 6-8 In the example shown, the multiple sides 232 include a first side 232A and a second side 232B. Side 232 is a collective term for all sides 232A and 232B.
[0149] As an example of the composition of side 232, the composition of the first to third side 232 can be listed.
[0150] In the first side configuration, side 232 includes a parallel surface but does not include an inclined surface.
[0151] In the second side configuration, side 232 includes an inclined surface but does not include a parallel surface.
[0152] In the third side configuration, side 232 includes a parallel surface and an inclined surface.
[0153] The first side profile includes, for example, the following components.
[0154] A parallel plane is a plane.
[0155] The parallel plane is parallel to the third reference plane.
[0156] The parallel surface is connected to the top surface 111 of the plate body 100 and the bottom surface 231 of the recess 210.
[0157] The second side is composed of, for example, the following components.
[0158] An inclined surface is a plane.
[0159] The inclined plane intersects with the third reference plane.
[0160] The inclined surface is connected to the top surface 111 of the plate body 100 and the bottom surface 231 of the recess 210.
[0161] The third side is composed of, for example, the following components.
[0162] A parallel plane is a plane.
[0163] The parallel plane is parallel to the third reference plane.
[0164] The parallel surface is connected to the bottom surface 231 of the recess 210.
[0165] An inclined surface is a plane.
[0166] The inclined plane intersects with the third reference plane.
[0167] The inclined surface is connected to the top surface 111 of the main body 100.
[0168] In one example, each side 232A, 232B includes any one of the first to third sides.
[0169] The relationship between the sides included in each side 232A and 232B is illustrated.
[0170] In the first example, the first side 232A includes the same side configuration as the second side 232B.
[0171] In the second example, the first side 232A includes a side configuration different from that of the second side 232B.
[0172] exist Figures 6-8 In the example shown, the first side 232A includes the second side.
[0173] The first side 232A is located on the first lateral side relative to the configuration space 220.
[0174] The first side surface 232A includes the inclined surface P.
[0175] The inclined surface P of the first side 232A is inclined from the second height direction toward the first height direction toward the center of the recess 210 about the lateral direction.
[0176] The inclined surface P of the first side surface 232A includes a first side and a second side that are parallel to the longitudinal direction.
[0177] The center of the first side 232A relative to the first side surface 232A in the height direction is located in the first height direction.
[0178] The center of the second side relative to the first side 232A in the height direction is located in the second height direction.
[0179] The first side is closer to the center of the concave portion 210 in the transverse direction than the second side.
[0180] exist Figures 6-8 In the example shown, the second side 232B includes the second side structure.
[0181] The second side 232B is located on the second lateral side relative to the configuration space 220.
[0182] The second side 232B includes the inclined surface P.
[0183] The inclined surface P of the second side 232B is inclined from the second height direction toward the first height direction toward the center of the recess 210 about the lateral direction.
[0184] The inclined surface P of the second side 232B includes a first side and a second side that are parallel to the longitudinal direction.
[0185] The center of the first side relative to the second side 232B in the height direction is located in the first height direction.
[0186] The center of the second side 232B relative to the second side surface 232B in the height direction is located in the second height direction.
[0187] The first side is closer to the center of the concave portion 210 in the transverse direction than the second side.
[0188] In examples where each side 232A, 232B is configured as a second side or a third side, the recess 210 forms a dovetail groove.
[0189] The opening 240 is connected to the configuration space 220.
[0190] The opening 240 is located on the surface 110 of the main body 100.
[0191] The opening 240 includes, for example, a top opening 241 and a side opening 242.
[0192] Top opening 241 opens onto the top surface 111 of the main body 100.
[0193] In the illustrated example, the opening 240 includes a plurality of side openings 242.
[0194] The plurality of side openings 242 include a first side opening 242A and a second side opening 242B.
[0195] The first side opening 242A is located on the first side 113A of the main body 100.
[0196] The second side opening 242B is located on the second side 113B of the main body 100.
[0197] The recess 210 is configured to allow the mold 300 to be inserted into the configuration space 220 via the first side opening 242A or the second side opening 242B.
[0198] exist Figure 1 In the example shown, the multiple molds 300 include a first mold 300A, a second mold 300B, and a third mold 300C. Mold 300 is a collective term for each mold 300A to 300C.
[0199] Each mold, from 300A to 300C, is arranged horizontally at intervals.
[0200] The first mold 300A is disposed in the first recess 210A.
[0201] The second mold 300B is disposed in the second recess 210B.
[0202] The third mold 300C is positioned in the third recess 210C.
[0203] Figure 9 A top view of the first mold 300A is shown.
[0204] Figure 10 A side view of the first mold 300A is shown.
[0205] Figure 11 A top view of the second mold 300B is shown.
[0206] Figure 12 A side view of the second mold 300B is shown.
[0207] Figure 13 A top view of the third mold 300C is shown.
[0208] Figure 14A side view of the third mold 300C is shown.
[0209] Mold 300 includes a diamond sintered body.
[0210] In the illustrated example, a portion of the mold 300, including the top surface 311, is made of diamond sintered material.
[0211] In another example, the entire mold 300 is made of diamond sintered material.
[0212] Mold 300 includes a one-piece structure.
[0213] The integral structure associated with mold 300 differs from the parting structure associated with existing molds. A mold including a parting structure is constructed by joining multiple elements. A mold including a parting structure includes joints where elements are joined together. Mold 300 including an integral structure does not include the joints included in a parting mold.
[0214] The shape of mold 300 is, for example, a plate.
[0215] The surface 310 of the mold 300 includes, for example, a top surface 311, a bottom surface 312, and a side surface 313.
[0216] The top surface 311 faces the direction of the first height.
[0217] With the mold 300 positioned in the mold mounting section 200, the top surface 311 faces the upper die of the stamping metal mold.
[0218] The bottom surface 312 faces the direction of the second height.
[0219] With the mold 300 positioned in the mold mounting section 200, the bottom surface 312 faces the lower die of the stamping metal mold.
[0220] Side 313 faces horizontally or vertically.
[0221] Side surface 313 is connected to top surface 311 and bottom surface 312.
[0222] In the illustrated example, the surface 310 of the mold 300 includes multiple side surfaces 313.
[0223] The multiple sides 313 include a first side 313A, a second side 313B, a third side 313C, and a fourth side 313D. Side 313 is a collective term for all sides 313A to 313D.
[0224] Examples of the composition of side 313 can be listed as the first to third side components.
[0225] In the first side configuration, side 313 includes a parallel surface but does not include an inclined surface.
[0226] In the second side configuration, side 313 includes an inclined surface but does not include a parallel surface.
[0227] In the third side configuration, side 313 includes a parallel surface and an inclined surface.
[0228] The first side profile includes, for example, the following components.
[0229] The parallel plane of side 313 is a plane.
[0230] The parallel plane of side 313 is parallel to the second or third reference plane.
[0231] The parallel surface of side 313 is connected to the top surface 311 and bottom surface 312 of mold 300.
[0232] The second side is composed of, for example, the following components.
[0233] The inclined surface of side 313 is a plane.
[0234] The inclined surface of side 313 intersects with the second or third reference surface.
[0235] The inclined surface of side 313 is connected to the top surface 311 and bottom surface 312 of mold 300.
[0236] The third side consists of the following components.
[0237] The parallel plane of side 313 is a plane.
[0238] The parallel plane of side 313 is parallel to the second or third reference plane.
[0239] The parallel surface of side 313 is connected to the bottom surface 312 of mold 300.
[0240] The inclined surface of side 313 is a plane.
[0241] The inclined surface of side 313 intersects with the second or third reference surface.
[0242] The inclined surface of side 313 is connected to the top surface 311 of mold 300.
[0243] In one example, each side 313A to 313D includes any one of the first to third sides.
[0244] The relationship between the sides included in each side 313A to 313D is illustrated.
[0245] In the first example, the first side 313A includes the same side configuration as the second side 313B.
[0246] In the second example, the first side 313A includes a side configuration different from that of the second side 313B.
[0247] In the third example, the third side 313C includes the same side configuration as the fourth side 313D.
[0248] In the fourth example, the third side 313C includes a side configuration different from that of the fourth side 313D.
[0249] In the fifth example, each side 313A, 313B includes one of the first and second examples. Each side 313C, 313D includes one of the third and fourth examples.
[0250] The fifth example includes the following examples 5A to 5C.
[0251] In Example 5A, the first side 313A and the second side 313B include side configurations that are identical to at least one of the third side 313C and the fourth side 313D.
[0252] In Example 5B, the first side 313A includes a side configuration identical to at least one of the third side 313C and the fourth side 313D. The second side 313B includes a side configuration different from that of the first side 313A.
[0253] In Example 5C, the second side 313B includes a side configuration identical to at least one of the third side 313C and the fourth side 313D. The first side 313A includes a side configuration different from that of the second side 313B.
[0254] In the illustrated example, the first side 313A includes the first side component.
[0255] The first side surface 313A is located in the first longitudinal direction relative to the top surface 311 and the bottom surface 312.
[0256] The first side surface 313A includes a parallel surface Q1.
[0257] The parallel plane Q1 of the first side surface 313A is parallel to the second reference plane.
[0258] In the illustrated example, the second side 313B comprises the first side.
[0259] The second side surface 313B is located in the second longitudinal direction relative to the top surface 311 and the bottom surface 312.
[0260] The second side surface 313B includes a parallel surface Q1.
[0261] The parallel plane Q1 of the second side surface 313B is parallel to the second reference plane.
[0262] In the illustrated example, the third side 313C is composed of the second side.
[0263] The third side surface 313C is located on the first transverse side relative to the top surface 311 and the bottom surface 312.
[0264] The third side 313C includes the inclined surface Q2.
[0265] The inclined surface Q2 of the third side 313C is inclined from the second height direction toward the first height direction toward the center of the mold 300 about the transverse direction.
[0266] The inclined surface Q2 of the third side 313C includes a first side and a second side that are parallel to the longitudinal direction.
[0267] The center of the first side relative to the third side 313C in the height direction is located in the first height direction.
[0268] The center of the second side relative to the third side 313C in the height direction is located in the second height direction.
[0269] The first side is closer to the center of the mold 300 relative to the second side in terms of the transverse direction.
[0270] In the illustrated example, the fourth side 313D is composed of the second side.
[0271] The fourth side surface 313D is located on the second transverse side relative to the top surface 311 and the bottom surface 312.
[0272] The fourth side surface 313D includes the inclined surface Q2.
[0273] The fourth side 313D is inclined from the second height direction toward the first height direction toward the center of the mold 300 about the transverse direction.
[0274] The inclined surface Q2 of the fourth side 313D includes a first side and a second side that are parallel to the longitudinal direction.
[0275] The center of the first side relative to the fourth side 313D in the height direction is located in the first height direction.
[0276] The center of the second side relative to the fourth side 313D in the height direction is located in the second height direction.
[0277] The first side is closer to the center of the mold 300 relative to the second side in terms of the transverse direction.
[0278] The mold 300 includes a longitudinal end, namely the longitudinal end 320, and a transverse end, namely the transverse end 330.
[0279] The longitudinal end portion 320 includes a first longitudinal end portion 320A and a second longitudinal end portion 320B.
[0280] The first longitudinal end 320A is located in the first longitudinal direction relative to the center of the mold 300 about the longitudinal direction.
[0281] The second longitudinal end 320B is located in the second longitudinal direction relative to the center of the mold 300 about the longitudinal direction.
[0282] The transverse end portion 330 includes a first transverse end portion 330A and a second transverse end portion 330B.
[0283] The first transverse end 330A is located on the first transverse side relative to the center of the mold 300 about the transverse side.
[0284] The second transverse end 330B is located on the second transverse side relative to the center of the mold 300 about the transverse side.
[0285] The mold 300 includes a diamond layer XA and a superhard alloy layer XB. The diamond layer XA is composed of a diamond sintered body. Figure 10 , Figure 12 , Figure 14 The dashed line described in the figure shows the boundary between the diamond layer XA and the superhard alloy layer XB.
[0286] The diamond layer XA is located in the first height direction relative to the superhard alloy layer XB.
[0287] The diamond layer XA includes a portion of the top surface 311 and the side surface 313.
[0288] The superhard alloy layer XB includes a portion of the bottom surface 312 and the side surface 313.
[0289] The mold 300 includes, for example, one or more through sections 340.
[0290] The through portion 340 includes an inner circumferential surface 341 and a through hole 342.
[0291] The inner circumferential surface 341 specifies the through hole 342.
[0292] Through hole 342 connects the diamond layer XA and the superhard alloy layer XB.
[0293] The through hole 342 is configured to allow the insertion of a punch into a stamping die.
[0294] The structure of the through hole 342 in each mold 300A to 300C is shown as an example.
[0295] In the first example, the shape of at least one through hole 342 provided in the first mold 300A is different from the shape of the through hole 342 in the second mold 300B and the shape of the through hole 342 in the third mold 300C.
[0296] In the second example, the shape of at least one through hole 342 provided in the second mold 300B is different from the shape of the through hole 342 in the first mold 300A and the shape of the through hole 342 in the third mold 300C.
[0297] In the third example, the shape of at least one through hole 342 provided in the third mold 300C is different from the shape of the through hole 342 of the first mold 300A and the shape of the through hole 342 of the second mold 300B.
[0298] In the fourth example, the shape of at least one through hole 342 provided in the first mold 300A is the same as the shape of at least one of the through holes 342 in the second mold 300B and the through holes 342 in the third mold 300C.
[0299] In the fifth example, the shape of at least one through hole 342 provided in the second mold 300B is the same as the shape of at least one of the through holes 342 in the first mold 300A and the through holes 342 in the third mold 300C.
[0300] In the sixth example, the shape of at least one through hole 342 provided in the third mold 300C is the same as the shape of at least one of the through holes 342 of the first mold 300A and the through holes 342 of the second mold 300B.
[0301] In the seventh example, the first mold 300A includes a plurality of through holes 342. The first mold 300A includes the configuration of the first example and the configuration of the fourth example.
[0302] In the eighth example, the second mold 300B includes a plurality of through holes 342. The second mold 300B includes the configuration of the second example and the configuration of the fifth example.
[0303] In the ninth example, the third mold 300C includes multiple through holes 342. The third mold 300C includes the configuration of the third example and the configuration of the sixth example.
[0304] exist Figure 9 In the example shown, the first mold 300A includes a through hole 342.
[0305] The shape of the through hole 342 is, for example, a circle.
[0306] exist Figure 11 In the example shown, the second mold 300B includes two through holes 342.
[0307] The first through hole 342 is semi-circular in shape.
[0308] The second through hole 342 is polygonal in shape. The vertices of the polygon are machined using the R-machining technique.
[0309] exist Figure 13 In the example shown, the third mold 300C includes a through hole 342.
[0310] The shape of the through hole 342 is, for example, a circle.
[0311] Figures 15-17 The cross-sections of the mold configuration section 200 and the mold 300 are shown.
[0312] When the mold 300 is configured in the mold configuration section 200, the plate body 100 and the mold 300 have, for example, the relationship shown below.
[0313] The through hole 342 of the through part 340 is connected to the through hole 122 of the plate body 100.
[0314] The third side surface 313C faces the first side surface 232A of the recess 210.
[0315] The inclined surface Q2 of the third side 313C is parallel to the inclined surface P of the first side 232A.
[0316] The fourth side surface 313D faces the second side surface 232B of the recess 210.
[0317] The inclined surface Q2 of the fourth side 313D is parallel to the inclined surface P of the second side 232B.
[0318] The position of the first side 313A of the longitudinal mold 300 is the same as the position of the first side 113A of the plate body 100.
[0319] The position of the second side 313B of the longitudinal mold 300 is the same as the position of the second side 113B of the plate body 100.
[0320] Regarding the height direction, the position of the top surface 311 of the mold 300 is the same as the position of the top surface 111 of the plate body 100.
[0321] Figure 18 A portion of the mold plate 10 is shown.
[0322] The mold plate 10 includes, for example, a fixing part 400.
[0323] The fixing part 400 fixes the mold 300 to the plate body 100.
[0324] The fixing part 400 fixes the mold 300 to the mold configuration part 200.
[0325] The fixing part 400 fixes the mold 300 by a prescribed fixing method.
[0326] Examples of prescribed fixing methods include pressing, bonding, and brazing.
[0327] The fixing part 400 includes, for example, at least one of the press-fit fixing part 410 and the adhesive fixing part 420.
[0328] exist Figure 1 In the example shown, the fixing part 400 includes a press-in fixing part 410 and a plurality of adhesive fixing parts 420.
[0329] Figures 15-17 An example of the press-fit fixing part 410 is shown.
[0330] The pressing and fixing part 410 includes the concave surface 230 of the recess 210 and the surface 310 of the mold 300.
[0331] In the press-fit fixing part 410, the concave surface 230 of the recess 210 is joined to the surface 310 of the mold 300 by pressing, and the mold 300 is fixed to the mold mounting part 200. The pressing method is, for example, light pressing.
[0332] In the illustrated example, the press-fit fixing part 410 includes a first side 232A and a second side 232B of the recess 210, and a third side 313C and a fourth side 313D of the mold 300.
[0333] The pressing-in fixing part 410 joins the first side 232A with the third side 313C by pressing, and joins the second side 232B with the fourth side 313D by pressing.
[0334] Figures 19-22 An example of the adhesive fixing part 420 is shown.
[0335] Figure 19 , Figure 21 This shows the state before the adhesive 440 is applied.
[0336] Figure 20 , Figure 22 This shows the state after the adhesive 440 has been applied.
[0337] The plurality of adhesive fixing parts 420 include a first adhesive fixing part 420A and a second adhesive fixing part 420B. The adhesive fixing parts 420 is a collective term for each adhesive fixing part 420A and 420B.
[0338] The adhesive fixing part 420 includes an adhesive preparation part 430 and an adhesive 440.
[0339] The adhesive preparation section 430 includes a preparation space 431 and a preparation surface 432.
[0340] Configuration space 431 is configured to configure adhesive 440.
[0341] Configuration surface 432 specifies configuration space 431.
[0342] As an example of adhesive 440, anaerobic adhesives can be cited.
[0343] Adhesive 440 is disposed in the configuration space 431.
[0344] The adhesive fixing part 420 joins the mold configuration part 200 and the mold 300 with adhesive 440, and fixes the mold 300 to the mold configuration part 200.
[0345] The first adhesive fixing part 420A fixes the first longitudinal end part 320A to the mold configuration part 200.
[0346] The second adhesive fixing part 420B fixes the second longitudinal end part 320B to the mold configuration part 200.
[0347] The adhesive preparation section 430 may include, for example, at least one of an adhesive preparation section 430 provided on the board body 100 and an adhesive preparation section 430 provided on the mold 300.
[0348] The adhesive preparation section 430 includes, for example, at least one of a chamfered portion and a recessed portion.
[0349] The chamfered portion of the adhesive preparation section 430 includes, for example, at least one of a portion that has been chamfered by C and a portion that has been chamfered by R.
[0350] The recess of the adhesive preparation section 430 includes, for example, at least one of a groove and a hole.
[0351] The hole includes, for example, at least one of the following: a hole that does not penetrate the plate body 100, a hole that penetrates the plate body 100, a hole that does not penetrate the mold 300, and a hole that penetrates the mold 300.
[0352] The configuration of the adhesive application section 430 of the panel body 100 is illustrated. Hereinafter, the first side surface 113A and the second side surface 113B of the panel body 100 will be collectively referred to as the "longitudinal side surface of the panel body 100".
[0353] In the first example, the adhesive dispensing part 430 of the board body 100 includes a groove provided at the corner of the bottom surface 231 of the recess 210 and the longitudinal side surface of the board body 100.
[0354] In the second example, the adhesive dispensing portion 430 of the board body 100 includes a groove provided at the corner of the side surface 232 of the recess 210 and the longitudinal side surface of the board body 100.
[0355] In the third example, the adhesive placement part 430 of the board body 100 includes a groove provided at the corner of the side surface 232 of the recess 210 and the top surface 111 of the board body 100.
[0356] In the fourth example, the adhesive preparation part 430 of the board body 100 includes a recess provided on the bottom surface 231 of the recess 210.
[0357] In the fifth example, the adhesive preparation part 430 of the board body 100 includes a recess provided on the side 232 of the recess 210.
[0358] In the sixth example, the adhesive preparation section 430 of the main body 100 includes at least two components from the first to fifth examples.
[0359] In the seventh example, the adhesive application portion 430 of the board body 100 includes a chamfered portion at the corner between the bottom surface 231 of the recess 210 and the longitudinal side surface of the board body 100.
[0360] In the eighth example, the adhesive application portion 430 of the board body 100 includes a chamfered portion at the corner of the side surface 232 of the recess 210 and the longitudinal side surface of the board body 100.
[0361] In the ninth example, the adhesive placement part 430 of the board body 100 includes a chamfered part provided at the corner of the side surface 232 of the recess 210 and the top surface 111 of the board body 100.
[0362] In the tenth example, the adhesive preparation section 430 of the main body 100 includes at least two components from the seventh to ninth examples.
[0363] In the eleventh example, the adhesive preparation section 430 of the board body 100 includes at least one component from the first to fifth examples and at least one component from the seventh to ninth examples.
[0364] The configuration of the adhesive application section 430 of the mold 300 is illustrated. Hereinafter, the first side surface 313A and the second side surface 313B of the mold 300 will be collectively referred to as the "longitudinal side surface of the mold 300". The third side surface 313C and the fourth side surface 313D of the mold 300 will be collectively referred to as the "transverse side surface of the mold 300".
[0365] In the first example, the adhesive dispensing section 430 of the mold 300 includes a groove provided at the corner of the bottom surface 312 of the mold 300 and the longitudinal side surface of the mold 300.
[0366] In the second example, the adhesive preparation section 430 of the mold 300 includes a groove provided at the corner of the bottom surface 312 of the mold 300 and the side surface of the mold 300.
[0367] In the third example, the adhesive preparation section 430 of the mold 300 includes a groove provided at the corner of the longitudinal side surface and the transverse side surface of the mold 300.
[0368] In the fourth example, the adhesive preparation section 430 of the mold 300 includes a groove provided at the corner of the top surface 311 of the mold 300 and the side surface of the mold 300.
[0369] In the fifth example, the adhesive preparation section 430 of the mold 300 includes a recess provided on the bottom surface 312 of the mold 300.
[0370] In the sixth example, the adhesive preparation section 430 of the mold 300 includes a recess provided on the lateral side of the mold 300.
[0371] In the seventh example, the adhesive preparation section 430 of the mold 300 includes at least two of the components found in the first to sixth examples.
[0372] In the eighth example, the adhesive preparation section 430 of the mold 300 includes chamfered portions provided at the corners of the bottom surface 312 and the longitudinal side surface of the mold 300.
[0373] In the ninth example, the adhesive preparation section 430 of the mold 300 includes chamfered portions provided at the corners of the bottom surface 312 and the lateral surface of the mold 300.
[0374] In the tenth example, the adhesive preparation section 430 of the mold 300 includes chamfered portions provided at the corners of the longitudinal side surface and the transverse side surface of the mold 300.
[0375] In the eleventh example, the adhesive preparation section 430 of the mold 300 includes chamfered portions provided at the corners of the top surface 311 and the lateral side surface of the mold 300.
[0376] In the twelfth example, the adhesive preparation section 430 of the mold 300 includes at least two components from the eighth to eleventh examples.
[0377] In the thirteenth example, the adhesive preparation section 430 of the mold 300 includes at least one component from the first to sixth examples and at least one component from the eighth to eleventh examples.
[0378] The mold 300 includes multiple slots 350.
[0379] The multiple slots 350 include the first slot 350A and the second slot 350B. Slot 350 is a collective term for all slots 350A and 350B.
[0380] The groove 350 is located at the corner between the bottom surface 312 of the mold 300 and the longitudinal side surface of the mold 300.
[0381] The groove 350 is located in the superhard alloy layer XB.
[0382] The groove 350 is formed, for example, by removing a portion of the bottom surface 312.
[0383] The mounting surface 432 of the adhesive fixing part 420 includes the bottom surface 231 and the side surface 232 of the recess 210, and the surface 351 of the groove 350.
[0384] The first adhesive fixing part 420A includes a first groove 350A.
[0385] The first groove 350A is located at the corner between the bottom surface 312 and the first side surface 313A.
[0386] The configuration surface 432 of the first adhesive fixing part 420A includes the bottom surface 231 and the side surface 232 of the recess 210, and the surface 351 of the first groove 350A.
[0387] The adhesive 440 of the first adhesive fixing part 420A includes a side surface 441.
[0388] The side surface 441 is located on the first longitudinal direction relative to the surface 351 of the first groove 350A.
[0389] Side 441 is a plane.
[0390] Side 441 is parallel to the second reference plane.
[0391] The position of the longitudinal side 441 is the same as that of the first side 313A.
[0392] The second adhesive fixing part 420B includes a second groove 350B.
[0393] The second groove 350B is located at the corner between the bottom surface 312 and the second side surface 313B.
[0394] The configuration surface 432 of the second adhesive fixing part 420B includes the bottom surface 231 and the side surface 232 of the recess 210, and the surface 351 of the second groove 350B.
[0395] The adhesive 440 of the second adhesive fixing part 420B includes a side surface 441.
[0396] The side surface 441 is located on the second longitudinal direction relative to the surface 351 of the second groove 350B.
[0397] Side 441 is a plane.
[0398] Side 441 is parallel to the second reference plane.
[0399] The position of the longitudinal side 441 is the same as that of the second side 313B.
[0400] (Second Implementation)
[0401] The mold plate 10 of the second embodiment is constructed based on the first embodiment.
[0402] The mold plate 10 is configured, for example, to correspond to the manufacturing of precision parts.
[0403] The length of the recess 210 in the height direction is called the "recess depth".
[0404] The depth of the recess is, for example, the distance between the top opening 241 and the bottom surface 231.
[0405] The depth of the recess is within the range above the first recess depth. The first recess depth can be arbitrarily selected. For example, the first recess depth is 2 mm.
[0406] The depth of the recess is within the range below the second recess depth. The second recess depth can be arbitrarily selected. For example, the second recess depth is 3mm, 5mm, or 16mm. The second recess depth is greater than the first recess depth.
[0407] Figure 23 The relationship between the second reference plane and the side surface 232 of the recess 210 is shown.
[0408] The straight line parallel to the height direction on the second reference plane is called the "first straight line LA".
[0409] The straight line on the second reference plane, including the inclined plane P, is called the "second straight line LB".
[0410] The angle between the first straight line LA and the second straight line LB is called the "concave tilt angle TP".
[0411] The inclination angle TP of the recess is within a range above the first inclination angle of the recess. The first inclination angle of the recess can be arbitrarily selected. For example, the first inclination angle of the recess is 1°, 2°, or 3°.
[0412] The inclination angle TP of the recess is within a range below the second inclination angle of the recess. The second inclination angle of the recess can be arbitrarily selected. For example, the second inclination angle of the recess is 8°, 9°, or 10°. The second inclination angle of the recess is greater than the first inclination angle of the recess.
[0413] The relationship between the inclination angle TP of the recess on the first side 232A and the inclination angle TP of the recess on the second side 232B is illustrated.
[0414] In the first example, the inclination angle TP of the recess on the first side 232A is equal to the inclination angle TP of the recess on the second side 232B.
[0415] In the second example, the inclination angle TP of the recess on the first side 232A is smaller than the inclination angle TP of the recess on the second side 232B.
[0416] In the third example, the inclination angle TP of the recess on the first side 232A is greater than the inclination angle TP of the recess on the second side 232B.
[0417] The relationship between the inclination angle TP of the first side surface 232A of each recess 210A to 210C is illustrated.
[0418] In the first example, the inclination angles TP of the recesses on the three first side surfaces 232A are all equal.
[0419] In the second example, the inclination angles TP of the recesses on the three first side surfaces 232A are all different.
[0420] In the third example, the inclination angles TP of the concave portions of any two first side surfaces 232A are equal.
[0421] The relationship between the inclination angle TP of the second side surface 232B of each recess 210A to 210C is illustrated.
[0422] In the first example, the inclination angles TP of the recesses on the three second side surfaces 232B are all equal.
[0423] In the second example, the inclination angles TP of the recesses on the three second sides 232B are all different.
[0424] In the third example, the inclination angles TP of the concave portions of any two second side surfaces 232B are equal.
[0425] The length of the mold 300 in the height direction is called the "mold thickness".
[0426] The mold thickness is, for example, the distance between the top surface 311 and the bottom surface 312.
[0427] The mold thickness is included within the range above the first mold thickness. The first mold thickness can be arbitrarily selected. For example, the first mold thickness is 2mm.
[0428] The mold thickness is within the range below the second mold thickness. The second mold thickness can be arbitrarily selected. For example, the second mold thickness is 3mm, 5mm, or 16mm. The second mold thickness is greater than the first mold thickness.
[0429] Figure 24 The relationship between the second reference plane and the side surface 313 of the mold 300 is shown.
[0430] The straight line parallel to the height direction on the second reference plane is called the "third straight line LC".
[0431] The straight line on the second reference plane, including the inclined plane Q2, is called the "fourth straight line LD".
[0432] The angle between the third straight line LC and the fourth straight line LD is called the "mold tilt angle TQ".
[0433] The mold tilt angle TQ is within the range above the first mold tilt angle. The first mold tilt angle can be arbitrarily selected. For example, the first mold tilt angle is 1°, 2°, or 3°.
[0434] The mold tilt angle TQ is within the range below the second mold tilt angle. The second mold tilt angle can be arbitrarily selected. For example, the second mold tilt angle is 8°, 9°, or 10°. The second mold tilt angle is greater than the first mold tilt angle.
[0435] The relationship between the mold tilt angle TQ of the third side 313C and the mold tilt angle TQ of the fourth side 313D is illustrated.
[0436] In the first example, the mold tilt angle TQ of the third side 313C is equal to the mold tilt angle TQ of the fourth side 313D.
[0437] In the second example, the mold tilt angle TQ of the third side 313C is smaller than the mold tilt angle TQ of the fourth side 313D.
[0438] In the third example, the mold tilt angle TQ of the third side 313C is greater than the mold tilt angle TQ of the fourth side 313D.
[0439] Example of the relationship between the mold tilt angle TQ of the third side 313C of each mold 300A to 300C.
[0440] In the first example, the mold tilt angles TQ of the three third sides 313C are all equal.
[0441] In the second example, the mold tilt angles TQ of the three third sides 313C are all different.
[0442] In the third example, the mold tilt angle TQ of any two third side surfaces 313C is equal.
[0443] Example of the relationship between the mold tilt angle TQ of the fourth side 313D of each mold 300A to 300C.
[0444] In the first example, the mold tilt angles TQ of the three fourth sides 313D are all equal.
[0445] In the second example, the mold tilt angles TQ of the three fourth sides 313D are all different.
[0446] In the third example, the mold tilt angle TQ of any two fourth side 313D is equal.
[0447] (Third Implementation)
[0448] In the third embodiment, an example of a method for manufacturing the mold plate 10 of the first or second embodiment is shown.
[0449] The manufacturing method of the mold plate 10 includes, for example, main body related processes, mold related processes, and mold fixing processes.
[0450] The main body-related processes include the processes for manufacturing the main body 100.
[0451] The mold-related processes include the manufacturing processes for mold 300.
[0452] The mold fixing process includes the process of fixing the mold 300 relative to the plate body 100.
[0453] The main related processes include, for example, processes S11 to S14.
[0454] In process S11, the initial state of the plate body 100 is manufactured.
[0455] The initial state of the plate body 100 does not include the recess 210 and the through portion 120.
[0456] Process S12 is performed after process S11.
[0457] In process S12, a recess 210 is formed in the main body 100 of the plate.
[0458] The recess 210 is formed, for example, by wire electrical discharge machining.
[0459] An inclined surface P is formed on the side 232 of the recess 210.
[0460] Process S13 is performed after process S12.
[0461] In process S13, a lower hole of the through hole 122 is formed in the portion of the plate body 100 corresponding to the through portion 120.
[0462] The lower hole of the through hole 122 is formed, for example, by fine-hole electrical discharge machining.
[0463] Process S14 is performed after process S13.
[0464] In process S14, a through hole 122 is formed in the portion of the plate body 100 corresponding to the through portion 120.
[0465] The through hole 122 is formed, for example, by enlarging the lower hole of the through hole 122 using wire electrical discharge machining.
[0466] The diameter of the through hole 122 is set such that when the through hole 342 of the mold 300 is formed by wire EDM, the wire does not interfere with the board body 100.
[0467] Through hole 122 and through hole 342 have, for example, the relationship shown below.
[0468] The through hole 122 projected onto the first reference plane is called the "first projection view". The through hole 342 projected onto the first reference plane is called the "second projection view". The second projection view overlaps with the first projection view. The outline of the second projection view does not overlap with the outline of the first projection view.
[0469] Mold-related processes include, for example, processes S21 and S22.
[0470] In process S21, a substrate comprising a diamond sintered body is formed.
[0471] Process S22 is performed after process S21.
[0472] In process S22, a mold 300 is formed from a substrate including a diamond sintered body.
[0473] Mold 300 is formed, for example, by wire electrical discharge machining.
[0474] A parallel surface Q1 and an inclined surface Q2 are formed on the side 313 of the mold 300.
[0475] The mold fixing process includes, for example, processes S31 to S34.
[0476] In process S31, the mold 300 is pressed into the recess 210 through the side opening 242 of the plate body 100. A pressing fixing part 410 is formed on the mold plate 10. The mold 300 is fixed to the plate body 100.
[0477] Process S32 is performed after process S31.
[0478] In process S32, the bonding and fixing part 420 is formed. The mold 300 is fixed to the plate body 100 through the bonding and fixing part 420.
[0479] Process S32 includes, for example, processes S32A to S32C. Processes S32A to S32C are performed on each of the adhesive fixing parts 420A and 420B.
[0480] In process S32A, adhesive 440 is applied at specified positions on the longitudinal side of the plate body 100 and the longitudinal side of the mold 300.
[0481] Figure 25 An example is shown where adhesive 440 is positioned in a designated location. Adhesive 440 is indicated by a double-dotted line.
[0482] The specified position is, for example, defined as covering the boundary between the longitudinal side of the plate body 100 and the longitudinal side of the mold 300, as well as the groove 350.
[0483] Operation S32B is performed after operation S32A.
[0484] In process S32B, the adhesive 440 present outside the arrangement space 431 of the bonding and fixing part 420 is removed.
[0485] Figure 26 This shows the state after the external adhesive 440 has been removed.
[0486] The external adhesive 440 is removed, for example, by wiping.
[0487] Process S33 is performed after process S32.
[0488] In process S33, a lower hole of the through hole 342 is formed in the part of the mold 300 corresponding to the through portion 340.
[0489] The lower hole of the through hole 342 is formed, for example, by fine-hole electrical discharge machining.
[0490] Process S34 is performed after process S33.
[0491] In process S34, a through hole 342 is formed in the part of the mold 300 corresponding to the through portion 340.
[0492] Through hole 342 is formed, for example, by enlarging the lower hole using wire electrical discharge machining.
[0493] In the wire electrical discharge machining process S34, the wire is configured to pass through the lower hole of the through hole 342 and the through hole 122 of the plate body 100.
[0494] (Effect)
[0495] According to various implementation methods, the following effects can be obtained, for example.
[0496] In one example of mold plate 10, mold 300 includes a diamond sintered body and an integral structure.
[0497] Because it includes a diamond sintered body, the die 300 is not easily worn. Its one-piece structure also helps to improve the precision of the stamping process.
[0498] In one example of mold plate 10, the side surface 313 of mold 300 includes inclined surface Q2.
[0499] The movement of the mold 300 relative to the plate body 100 is restricted in both the lateral and vertical directions.
[0500] In one example of mold plate 10, the recess 210 of the plate body 100 forms a dovetail groove.
[0501] The movement of the mold 300 relative to the plate body 100 is restricted in both the vertical and horizontal directions.
[0502] In one example of mold plate 10, mold plate 10 includes a press-in fixing part 410.
[0503] The mold 300 is securely fixed to the mold configuration section 200.
[0504] In one example of mold plate 10, mold plate 10 includes adhesive fixing part 420.
[0505] The mold 300 is securely fixed to the mold configuration section 200.
[0506] In one example of mold plate 10, mold 300 includes adhesive preparation section 430.
[0507] The mold 300 is firmly bonded to the plate body 100 by the adhesive 440 disposed in the adhesive dispensing section 430.
[0508] In one example of mold plate 10, the groove 350 of mold 300 is disposed on superhard alloy layer XB.
[0509] It can easily form a 350 groove.
[0510] In one example of mold plate 10, the mold thickness of mold 300 is included in the range above the first mold thickness.
[0511] The strength of the mold 300 is increased. For example, the deformation of the mold 300 when it is pressed into the recess 210 is suppressed.
[0512] In one example of mold plate 10, the mold thickness of mold 300 is included in the range below the thickness of the second mold.
[0513] The range of electrical discharge machining techniques that can be used to form the through hole 342 has been broadened. For example, the lower hole of the through hole 342 can be formed by fine-hole electrical discharge machining, and the through hole 342 can be formed by wire electrical discharge machining.
[0514] In one example of mold plate 10, the inclination angle TP of the recess of plate body 100 is included in the range above the first inclination angle of the recess.
[0515] In the first height direction, the movement of the mold 300 relative to the plate body 100 is strictly limited.
[0516] In one example of mold plate 10, the inclination angle TP of the recess of plate body 100 is included in the range below the second inclination angle of the recess.
[0517] The processing of the diamond layer XA was suppressed.
[0518] It should be noted that the molds and mold plates involved in this invention can be implemented in ways not limited to those described in the above embodiments. The molds and mold plates involved in this invention can be implemented in ways different from those exemplified in the embodiments. Examples include alternatives to embodiments where a portion of the components is replaced, modified, or omitted, or where new components are added to the embodiments.
Claims
1. A mold characterized in that, include: Diamond sintered body; Integrated structure; side; as well as Top surface, The side surface includes two longitudinal side surfaces and two transverse side surfaces, the two transverse side surfaces including inclined surfaces. The top surface includes at least one through portion. With the mold positioned on the mold mounting section of the mold plate, the inclined surface engages with the dovetail groove of the mold mounting section, and in the height direction, the position of the top surface of the mold is the same as the position of the top surface of the main body of the mold plate. The mold further includes an adhesive preparation section for preparing adhesive, the adhesive preparation section including grooves disposed at the corners of the bottom surface of the mold and the longitudinal side surface of the mold.
2. A mold plate, characterized in that, include: Main body of the board; as well as The mold as described in claim 1.