Ice maker

Abstract

The utility model discloses an ice maker, and relates to the technical field of ice making equipment. The device comprises a cooling container; the cold end face of the semiconductor chilling plate is thermally coupled with the cooling container, and the hot end face of the semiconductor chilling plate is thermally coupled with the water-cooling heat dissipation system; the water-cooling heat dissipation system comprises a circulating pump used for driving cooling water to circulate; the water storage tank is used for containing cooling water; the water-cooled coupler is used for mounting the semiconductor chilling plate and is thermally coupled with the hot end surface of the semiconductor chilling plate; the evaporative cooler is used for increasing the interface evaporation area of cooling water and air; a fan configured to perform forced ventilation on the evaporative cooler; and the water storage tank, the circulating pump, the water-cooled coupler and the evaporative cooler form a cooling water circulation loop. The water-cooling heat dissipation system dissipates heat by ventilating and evaporating cooling water, the heat dissipation capability is high, and the size of the semiconductor ice maker can be reduced.

Description

Technical Field

[0001] This invention relates to the field of ice manufacturing equipment technology, and in particular to a semiconductor ice maker that utilizes the Peltier effect. Background Technology

[0002] Current ice makers primarily use compressors as their core refrigeration component. While these have high energy efficiency and mature technology, they are relatively bulky and noisy, making them unsuitable for outdoor camping, vehicle use, or personal office environments. Another type of ice maker uses semiconductor cooling chips as its core refrigeration component, allowing for miniaturization and quiet operation. However, their energy efficiency COP (Coefficient of Performance) is between 0.5 and 0.6, significantly lower than the 2-3 of compressors. This results in slower ice production, higher heat generation, and an inability to match the ice production capacity and speed of compressor-based ice makers, making them less practical.

[0003] If a semiconductor ice maker simply uses air cooling and water cooling to cool the semiconductor refrigeration chip, the required air volume and heat sink surface area would be very large to achieve the ice-making speed of a compressor ice maker. The integrated volume would be not much different from that of a compressor ice maker.

[0004] In a water-cooling system, open-circuit evaporation of cooling water can enhance heat dissipation by utilizing the vaporization phase change of water. This allows for a reduction in the radiator area and ventilation volume, which is highly valuable for the miniaturization of semiconductor ice makers. Although cooling water is consumed during evaporation and needs to be replenished, it is not a scarce resource for ice maker applications, thus making it practically useful for this type of product. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an ice maker that addresses the above-mentioned technical deficiencies by using a water-cooling system that employs ventilated evaporative cooling water for heat dissipation, which has strong heat dissipation capacity and helps to reduce the size of the semiconductor ice maker.

[0006] The technical solution adopted in this invention is: an ice maker, comprising:

[0007] cooling container;

[0008] A semiconductor refrigeration chip, wherein the cold end face of the semiconductor refrigeration chip is thermally coupled to a cooling container, and the hot end face of the semiconductor refrigeration chip is thermally coupled to a water-cooled heat dissipation system;

[0009] The water-cooled heat dissipation system includes:

[0010] A circulating pump is used to drive the circulation of cooling water.

[0011] Water storage tank, used to hold cooling water;

[0012] A water-cooled coupler is installed on the hot end face of a semiconductor cooling chip and enables thermal coupling between the cooling water and the hot end face of the semiconductor cooling chip.

[0013] Evaporative coolers are used to provide interfacial evaporation area for cooling water and air;

[0014] A fan is configured to provide forced ventilation to the evaporative cooler;

[0015] The cooling water flows from the storage tank through the circulation pump, water-cooled coupler, and evaporative cooler in sequence and then back to the storage tank, forming a cooling water circulation loop.

[0016] Further optimization of this technical solution: The inner cavity of the cooling container is provided with multiple heat-conducting columns extending in a vertical direction, and the heat-conducting columns and the inner bottom surface of the cooling container form an integrated heat-conducting structure.

[0017] Further optimization of this technical solution: An ice maker further includes a housing, in which the cooling container, semiconductor refrigeration chip, and water cooling system are installed from top to bottom; the top surface of the housing is provided with a cooling water inlet, which is connected to a water storage tank; and a cover is provided on the inlet.

[0018] Further optimization of this technical solution: The bottom of the encapsulation shell is provided with a drain outlet, the inner side of the drain outlet is connected to the water storage tank, and a sealing plug is installed on the outer side of the drain outlet.

[0019] Further optimization of this technical solution: An ice maker also includes a control system, a water level detection unit for detecting the water level in the water storage tank, and a temperature detection unit for detecting the temperature of the cooling container; the water level detection unit and the temperature detection unit are both communicatively connected to the control system; the control system is configured to: b) turn off the semiconductor cooling chip when the temperature is lower than a set threshold; and b) stop the circulation pump and the semiconductor cooling chip when the water level is lower than a safe water level.

[0020] Further optimization of this technical solution: A rechargeable battery module is also built into the package housing, and the battery module is electrically connected to the semiconductor cooling chip, fan, and circulation pump.

[0021] Further optimization of this technical solution: The inner side of the cooling container and the outer side of the heat-conducting column are both provided with upward draft angles.

[0022] Further optimization of this technical solution: an insulating cover is placed at the upper opening of the cooling container; an ice-retrieving rod is slidably installed downwards in the middle of the insulating cover; and the outer surface of the ice-retrieving rod is provided with anti-slip texture.

[0023] Further optimization of this technical solution: The evaporative cooler is composed of an array of sheet-like structures made of hydrophilic materials.

[0024] Further optimization of this technical solution: The water-cooled coupler is provided with a cooling water flow channel, and the upper opening of the cooling water flow channel is sealed and connected by the hot end face of the semiconductor cooling chip; the cooling water directly contacts the hot end face of the semiconductor cooling chip in the flow channel to achieve thermal coupling with the hot end face of the semiconductor cooling chip.

[0025] This invention differs from conventional water-cooling systems in existing semiconductor ice makers. Conventional water-cooling systems use only cooling water as a heat transfer medium to transfer heat from the semiconductor cooling chip to a more flexible and spacious radiator. In this invention, the cooling water, under forced fan ventilation, directly contacts the flowing air on an evaporative cooler, evaporating and carrying away heat. For the same surface area, evaporative cooling is more efficient than air cooling. Therefore, for the same cooling requirements, the evaporative cooling system is smaller, significantly improving the miniaturization of the ice maker.

[0026] Other technical effects of the present invention will gradually become clear as the embodiments are described. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the present invention;

[0028] Figure 2 for Figure 1 A structural diagram from another direction;

[0029] Figure 3 This is a cross-sectional view of the present invention;

[0030] Figure 4 This is an exploded view of the present invention;

[0031] Figure 5 for Figure 4 A diagram from another direction;

[0032] Figure 6 This is a cross-sectional view of one embodiment of a water-cooled coupler.

[0033] In the diagram, 1. Cooling container; 2. Semiconductor cooling chip; 3. Circulating pump; 4. Water storage tank; 5. Water-cooled coupler; 5-1. Water inlet channel; 5-2. Water outlet channel; 5-3. Water distribution hole; 6. Evaporative cooler; 7. Fan; 8. Heat conduction column; 9. Encapsulation shell; 10. Refill port; 11. Cover; 12. Drain outlet; 13. Sealing plug; 14. Water level detection unit; 15. Temperature detection unit; 16. Battery module; 17. Insulation cover; 18. Ice removal rod; 19. Anti-slip texture; 20. Water flow channel; 21. Handle; 22. Ice making button; 23. Ice removal button; 24. Air conditioning fan button. Detailed Implementation

[0034] like Figures 1-6 As shown:

[0035] An ice maker, comprising:

[0036] Cooling container 1;

[0037] The semiconductor cooling chip 2 has its cold end face thermally coupled to the cooling container 1 and its hot end face thermally coupled to the water cooling heat dissipation system.

[0038] The water-cooled heat dissipation system includes:

[0039] Circulation pump 3 is used to drive the circulation of cooling water;

[0040] Water storage tank 4 is used to hold cooling water;

[0041] Water-cooled coupler 5 is installed on the hot end face of the semiconductor cooling chip 2 and enables the cooling water to establish thermal coupling with the hot end face of the semiconductor cooling chip 2.

[0042] Evaporative cooler 6 is used to provide interfacial evaporation area for cooling water and air;

[0043] Fan 7 is configured to provide forced ventilation to the evaporative cooler 6;

[0044] The cooling water flows from the water storage tank 4 through the circulation pump 3, the water-cooled coupler 5, and the evaporative cooler 6 in sequence and then flows back to the water storage tank 4, forming a cooling water circulation loop.

[0045] In this invention, thermal coupling refers to good thermal contact between two contact surfaces, including using thermally conductive silicone grease, phase change sheet or liquid metal as thermal conductive medium to achieve good thermal contact between the two surfaces, and also including the method of directly welding the two contact surfaces.

[0046] The water-cooled coupler 5 is a device that enables heat exchange between cooling water and the hot surface of the semiconductor cooling chip 2. The water-cooled coupler 5 can be an aluminum or copper water cooling head of a traditional water cooling system, or it can be a water channel structure made of plastic material. Combined with the hot end face of the semiconductor cooling chip 2, it forms a flow path, allowing the cooling water to directly impact the hot end face of the semiconductor cooling chip 2. This can further reduce the thickness of the water channel and improve the heat exchange efficiency.

[0047] Further optimization of this embodiment: The inner cavity of the cooling container 1 is provided with a plurality of heat-conducting columns 8 extending in a vertical direction, and the heat-conducting columns 8 and the inner bottom surface of the cooling container 1 form an integrated heat-conducting structure.

[0048] Because ice has a low thermal conductivity, the thicker the ice layer on the inner wall of the cooling container 1, the slower the inner layer freezes. The heat-conducting pillars 8 are designed to increase the surface area and volume of the heat-conducting medium within the cooling container 1, thereby increasing the ice-making speed. Additionally, the ice cubes will have channels in the heat-conducting pillars 8, which can increase the surface area of ​​the ice cubes when placed in beverages, further accelerating the chilling process.

[0049] Further optimization of this embodiment: An ice maker also includes a housing 9, in which the cooling container 1, the semiconductor refrigeration chip 2, and the water cooling heat dissipation system are installed from top to bottom inside the housing 9; the top surface of the housing 9 is provided with a cooling water inlet 10, which is connected to the water storage tank 4; a cover 11 is provided on the inlet 10.

[0050] As cooling water evaporates and is consumed, the cooling water level in the storage tank 4 will drop. The function of the replenishment port 10 is to replenish cooling water to the outlet tank.

[0051] Further optimization of this embodiment: The bottom of the encapsulation housing 9 is provided with a drain outlet 12, the inner side of the drain outlet 12 is connected to the water storage tank 4, and a sealing plug 13 is installed on the outer side of the drain outlet 12. When used for transferring or storing the ice maker, the sealing plug 13 of the drain outlet 12 can be opened to drain the cooling water.

[0052] Further optimized embodiment: An ice maker also includes a control system, a water level detection unit 14 for detecting the water level in the water storage tank 4, and a temperature detection unit 15 for detecting the temperature of the cooling container 1; the water level detection unit 14 and the temperature detection unit 15 are both communicatively connected to the control system; the control system is configured to: a) turn off the semiconductor cooling chip 2 when the temperature is lower than a set threshold; b) stop the circulation pump 3 and the semiconductor cooling chip 2 when the water level is lower than a safe water level.

[0053] The probe of the temperature detection unit 15 can be attached to the outer wall of the cooling container 1. When ice is being made, if the temperature reaches a predetermined value, such as -15 to -8 degrees Celsius, the thermoelectric cooler 2 will stop working. The specific predetermined value should be adapted to the volume, height, and installation position of the cooling container 1. Calibration and comparison should be performed by observing the icing situation inside the cooling container 1. The water level detection unit 14 can use a reed switch, capacitive, or probe-type water level detector. When the water level is insufficient, the circulation pump 3 and the thermoelectric cooler 2 should be shut down to prevent burnout.

[0054] Further optimization of this embodiment: A rechargeable battery module 16 is also built into the encapsulation housing 9, and the battery module 16 is electrically connected to the semiconductor cooling chip 2, the fan 7, and the circulation pump 3.

[0055] The ice maker with a built-in battery module 16 is more convenient for users to use outdoors, as it no longer relies on an external power source.

[0056] To further optimize this embodiment, both the inner surface of the cooling container 1 and the outer surface of the heat-conducting pillar 8 are provided with upward draft angles. Draft angles facilitate de-icing.

[0057] Further optimization of this embodiment: A heat preservation cover 17 is placed at the upper opening of the cooling container 1; an ice-removing rod 18 is slidably installed downward in the middle of the heat preservation cover 17; and the outer surface of the ice-removing rod 18 is provided with anti-slip texture 19.

[0058] During ice making, the ice-retrieving rod 18 is frozen in the cooling container 1. When removing the ice, the ice-retrieving rod 18 can be pulled to release the ice. A handle 21 can be provided on the upper part of the ice-retrieving rod 18 for easy ice removal. The ice-retrieving rod 18 can be made of stainless steel with a threaded surface to allow the ice to be unscrewed.

[0059] When removing ice from the cooling container 1, since the ice is frozen and fixed to the inner wall of the cooling container 1 and the heat-conducting column 8, the thermoelectric cooler 2 can be heated by turning on the circulating pump 3 separately. The temperature is conducted to the cooling container 1 through the thermoelectric cooler 2, raising the temperature of the cooling container 1 and causing the ice to detach from the cooling container 1. In addition, the direction of the current in the thermoelectric cooler 2 can be changed, so that the cold end face of the thermoelectric cooler 2 releases heat, which can heat the cooling container 1 and reduce the time for ice removal.

[0060] Further optimization of this embodiment: The evaporative cooler 6 is composed of an array of sheet-like structures made of hydrophilic material connected together.

[0061] The evaporative cooler 6 can be a humidifier or an air conditioning fan with a water curtain, as is available in the prior art. The function of the evaporative cooler 6 is to increase the evaporation area at the interface between water and air. Therefore, without turning on the semiconductor cooling chip 2, the present invention also has the function of a humidifier or an air conditioning fan.

[0062] Further optimization of this embodiment: The water-cooled coupler 5 is provided with a cooling water flow channel 20, and the upper opening of the cooling water flow channel 20 is sealed and connected by the hot end face of the semiconductor refrigeration chip 2; the cooling water directly contacts the hot end face of the semiconductor refrigeration chip 2 in the flow channel 20 to achieve thermal coupling with the hot end face of the semiconductor refrigeration chip 2.

[0063] like Figure 6As shown, the bottom surface of the water tank 20 forms a cooling water flow channel with the hot end face of the thermoelectric cooler 2. Cooling water enters the inlet channel 5-1 from the water supply pipe of the circulating pump 3, and then directly contacts the hot end face of the thermoelectric cooler 2 in the flow channel. The higher the flow rate of the cooling water, the faster the heat is removed. After flowing out of the flow channel, the cooling water passes through the outlet channel 5-2, and finally flows through multiple water distribution holes 5-3 to the cooling evaporator 6. The height of the flow channel is preferably set to 1 mm to 0.3 mm. Compared with traditional water cooling heads, this results in a lower vertical height, which helps to reduce the height of the ice maker. The bottom surface of the water tank is provided with a turbulence structure to create turbulence and promote sufficient heat exchange between the cooling water and the hot end face of the thermoelectric cooler.

[0064] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0065] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

Claims

1. An ice maker characterized by :include: cooling container; A semiconductor refrigeration chip, wherein the cold end face of the semiconductor refrigeration chip is thermally coupled to a cooling container, and the hot end face of the semiconductor refrigeration chip is thermally coupled to a water-cooled heat dissipation system; The water-cooled heat dissipation system includes: A circulating pump is used to drive the circulation of cooling water. Water storage tank, used to hold cooling water; A water-cooled coupler is installed on the hot end face of a semiconductor cooling chip and enables thermal coupling between the cooling water and the hot end face of the semiconductor cooling chip. Evaporative coolers are used to provide interfacial evaporation area for cooling water and air; A fan is configured to provide forced ventilation to the evaporative cooler; The cooling water flows from the storage tank through the circulation pump, water-cooled coupler, and evaporative cooler in sequence and then back to the storage tank, forming a cooling water circulation loop.

2. The ice maker of claim 1, wherein: The cooling container has multiple heat-conducting columns extending vertically inside its cavity, and the heat-conducting columns form an integrated heat-conducting structure with the inner bottom surface of the cooling container.

3. The ice maker of claim 1, wherein: It also includes a packaging shell, in which the cooling container, semiconductor refrigeration chip, and water cooling heat dissipation system are installed from top to bottom; the top surface of the packaging shell is provided with a cooling water inlet, which is connected to a water storage tank; and a cover is provided on the inlet.

4. An ice maker as claimed in claim 3, wherein: The bottom of the encapsulation shell is provided with a drain outlet, the inner side of which is connected to the water storage tank, and a sealing plug is installed on the outer side of the drain outlet.

5. The ice maker of claim 1, wherein: It also includes a control system, a water level detection unit for detecting the water level in the water storage tank, and a temperature detection unit for detecting the temperature of the cooling container; both the water level detection unit and the temperature detection unit are communicatively connected to the control system; the control system is configured to: a) shut down the thermoelectric cooler when the temperature is below a set threshold; b) stop the circulation pump and the thermoelectric cooler when the water level is below a safe water level.

6. The ice maker of claim 3, wherein: The packaged housing also contains a rechargeable battery module, which is electrically connected to the semiconductor cooling chip, fan, and circulation pump.

7. The ice maker of claim 2, wherein: The inner side of the cooling container and the outer side of the heat-conducting pillar are both provided with upward draft angles.

8. The ice maker of claim 1, wherein: An insulated cover is placed at the upper opening of the cooling container; an ice-retrieving rod is slidably installed in the middle of the insulated cover; and the outer surface of the ice-retrieving rod is provided with anti-slip texture.

9. The ice maker of claim 1, wherein: The evaporative cooler is an array of sheet-like structures made of hydrophilic material connected together.

10. The ice maker of claim 1, wherein: The water-cooled coupler is provided with a cooling water flow channel, and the upper opening of the cooling water flow channel is sealed and connected to the hot end face of the semiconductor cooling chip; the cooling water directly contacts the hot end face of the semiconductor cooling chip in the flow channel to achieve thermal coupling with the hot end face of the semiconductor cooling chip.

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