Refrigerator

Abstract

The utility model provides a refrigerator which comprises a refrigerating chamber, a semiconductor module, an evaporator, an environment temperature sensor, a refrigerating temperature sensor and a controller. The semiconductor module is arranged at the top of the refrigerating chamber, the semiconductor hot face of the semiconductor module faces the outer side of the top of a refrigerator body, and the semiconductor cold face of the semiconductor module faces the interior of the refrigerating chamber. The environment temperature sensor is arranged outside the refrigerator body; the evaporator and the refrigerating temperature sensor are arranged in the refrigerating chamber; the controller is electrically connected with the environment temperature sensor, the refrigerating temperature sensor and the semiconductor module, temperature threshold data capable of triggering the semiconductor module to be started and stopped are arranged in the controller, the phenomenon that the temperature of the upper portion of the refrigerating chamber is too high can be reduced, the uniformity of temperature distribution in the refrigerating chamber is improved, and the refrigerating efficiency is improved. The problem that the temperature of the upper portion of the refrigerating chamber is high is solved.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, and more particularly to a refrigerator. Background Technology

[0002] Maintaining a constant temperature for food is crucial for preserving its freshness and safety. As the primary equipment for food preservation, the temperature stability of the refrigerator compartment directly impacts the quality of the food. Especially in high-temperature environments, the refrigerator compartment needs to maintain a more precise and constant temperature to prevent repeated freezing and thawing or localized overheating. However, when existing refrigerators operate under high ambient temperatures, the upper part of the refrigerator compartment is prone to delayed cooling and uneven temperature distribution. This causes food to spoil more quickly due to temperature fluctuations, posing a potential safety hazard of foodborne illnesses.

[0003] Current technologies attempt to improve temperature distribution in refrigerator compartments by optimizing evaporator layout or adding auxiliary air supply devices. For example, multi-vent circulation systems are used to enhance cold air diffusion, or airflow guide structures are added to the top of the refrigerator compartment to guide cold air downwards. In addition, some solutions shorten the cooling interval by adjusting the compressor start-stop frequency, attempting to reduce the temperature rise during shutdown.

[0004] However, the above methods still have significant limitations: during evaporator shutdown, heat accumulates rapidly in the upper part of the refrigerator compartment due to the natural sinking effect of cold air, and the temperature rises at a significantly higher rate than in the lower part; while simply increasing the airflow can improve the cooling speed, it is difficult to balance temperature uniformity and energy efficiency. This results in a persistent temperature difference between the upper and lower parts of the refrigerator compartment, and the overall temperature fluctuation cannot be effectively suppressed, directly affecting the food preservation effect. Utility Model Content

[0005] This application provides a refrigerator to solve the problem of excessively high temperature in the upper part of the refrigerator compartment.

[0006] This application provides a refrigerator, including a refrigerator compartment, a semiconductor module, an evaporator, an ambient temperature sensor, a refrigerator temperature sensor, and a controller;

[0007] The semiconductor module is disposed at the top of the refrigerator compartment, with the hot side of the semiconductor module facing the outside of the top of the refrigerator body and the cold side of the semiconductor module facing the inside of the refrigerator compartment.

[0008] The ambient temperature sensor is located on the outside of the refrigerator body; the evaporator and the refrigeration temperature sensor are located inside the refrigeration compartment.

[0009] The controller is electrically connected to the ambient temperature sensor, the refrigeration temperature sensor and the semiconductor module respectively, and the controller has built-in temperature threshold data that can trigger the semiconductor module to turn on and off.

[0010] The refrigerator provided in this application has a semiconductor module installed at the top of the refrigerator compartment, with the cold side facing the inside of the refrigerator compartment and the hot side facing the outside of the compartment. Combined with the coordinated work of an ambient temperature sensor, a refrigerator temperature sensor and a controller, the opening and closing of the semiconductor module is controlled according to a preset temperature threshold. This can reduce the phenomenon of excessively high temperature in the upper part of the refrigerator compartment, improve the uniformity of temperature distribution in the refrigerator compartment and solve the problem of excessively high temperature in the upper part of the refrigerator compartment.

[0011] Optionally, the semiconductor module further includes a semiconductor wafer, a first thermally conductive silicone grease layer, and a second thermally conductive silicone grease layer;

[0012] The first thermal grease layer is located between the hot side of the semiconductor and the semiconductor wafer; the second thermal grease layer is located between the cold side of the semiconductor and the semiconductor wafer.

[0013] By setting a first thermally conductive silicone grease layer between the hot side of the semiconductor and the semiconductor wafer, and setting a second thermally conductive silicone grease layer between the cold side of the semiconductor and the semiconductor wafer, the heat conduction efficiency of the semiconductor module can be improved, the temperature transfer effect between the hot and cold sides of the semiconductor can be improved, thereby optimizing the cooling and heat dissipation performance of the semiconductor module.

[0014] Optionally, the first thermally conductive silicone grease layer has a groove on the side near the semiconductor chip, the top of the inner liner of the refrigerator compartment has a mounting through hole, the second thermally conductive silicone grease layer has a protrusion on the side near the semiconductor chip, the semiconductor chip is disposed inside the groove, and the protrusion is inserted into the groove through the mounting through hole.

[0015] By setting a groove on the side of the first thermal grease layer close to the semiconductor chip and setting a bump at the corresponding position on the second thermal grease layer, the semiconductor chip is embedded in the groove. At the same time, the bump is inserted into the groove through the mounting through hole on the top of the refrigerator inner liner. This can enhance the installation stability of the semiconductor module, improve the contact tightness between the thermal grease layer and the semiconductor chip, and thus improve the heat conduction efficiency.

[0016] Optionally, it also includes a freezer compartment, with the refrigerator compartment located above the freezer compartment; the refrigerator compartment is also equipped with a fan, which is located at the bottom of the semiconductor module.

[0017] By placing the refrigerator compartment above the freezer compartment and using a design where the refrigerator compartment's internal fan is located at the bottom of the semiconductor module, the efficiency of cold air circulation is optimized, temperature fluctuations between the refrigerator and freezer compartments are reduced, cooling uniformity is improved, and the overall energy efficiency of the refrigeration system is enhanced.

[0018] Optionally, the fan is a centrifugal fan; the air outlet axis of the fan forms a 45° angle with the semiconductor cold surface, and the fan is provided with a shock-absorbing bracket that is sealed and connected to the inner wall of the refrigerator.

[0019] The centrifugal fan has its outlet axis at a 45° angle to the semiconductor cold surface, which helps optimize the direction of cold air flow and improve refrigeration efficiency. The shock-absorbing brackets around the fan are sealed to the inner wall of the refrigerator, which can reduce operating vibration and noise, while reducing cold air leakage and improving the stability and energy efficiency of the refrigeration system.

[0020] Optionally, the outer surface of the semiconductor hot surface is provided with a plurality of parallel heat dissipation fins. The heat dissipation fins extend upward in a vertical direction and penetrate through the top of the refrigerator body. The ends of the heat dissipation fins are exposed in the outer space of the top of the refrigerator body to form an extended heat dissipation section. The height of the extended heat dissipation section is not lower than the top plane of the refrigerator body.

[0021] By setting vertically upward heat dissipation fins on the semiconductor hot surface and extending them through the top of the refrigerator body to form an exposed extended heat dissipation section, the heat dissipation area and air convection efficiency can be improved, thereby optimizing the heat dissipation effect of the semiconductor module, reducing the temperature of the hot surface, reducing heat accumulation inside the refrigerator, and improving the thermal management performance of the overall refrigeration system.

[0022] Optionally, the extended heat dissipation section is provided with staggered turbulence protrusions, each turbulence protrusion having an isosceles triangle cross section, and the height of the turbulence protrusions being 1 / 3 to 1 / 2 of the spacing between the heat dissipation fins.

[0023] By setting staggered isosceles triangular cross-section turbulence protrusions in the extended heat dissipation section and controlling their height to be 1 / 3-1 / 2 of the spacing between the heat dissipation fins, the airflow disturbance effect can be enhanced, the degree of air turbulence on the surface of the heat dissipation fins can be increased, thereby optimizing heat dissipation efficiency, reducing the temperature of the semiconductor hot surface, and improving the heat exchange performance of the heat dissipation system.

[0024] Optionally, an annular air guide plate is fixed to the periphery of the semiconductor cold surface; the air guide plate includes at least three guide plates evenly distributed along the circumference of the cold surface, each guide plate has a guide surface that is inclined downward from the edge of the cold surface at 10°-30°, the end of the guide surface extends to the upper edge of the air outlet of the refrigerator compartment, and each guide surface is provided with corrugated guide grooves that are distributed in parallel at intervals.

[0025] By setting an annular air guide plate around the semiconductor cold surface, which includes at least three evenly distributed air guide plates that are inclined downward at 10°-30°, and combined with the corrugated air guide groove design on the air guide surface, the cold air can be guided to flow downward evenly, reducing airflow turbulence, optimizing the cold air distribution effect in the refrigerator compartment, while reducing air supply resistance and improving the energy efficiency of the refrigeration system.

[0026] Optionally, both the hot side and the cold side of the semiconductor are made of aluminum substrate, and the surface of the aluminum substrate is provided with a surface modification layer formed by anodizing.

[0027] By using aluminum substrates on both the hot and cold sides of the semiconductor and applying an anodized surface modification layer, the corrosion resistance and surface hardness of the substrate can be enhanced, the thermal conductivity can be improved, and surface oxidation and thermal resistance can be reduced, thereby improving the long-term stability and thermal conductivity of the semiconductor module.

[0028] Optionally, the semiconductor hot surface and the semiconductor cold surface are respectively provided with mutually symmetrical bolt connection holes, and the top of the inner liner of the refrigerator compartment is provided with fixing holes; the bolt connection holes and the fixing holes are fixedly connected by fasteners; the fasteners are metal bolts.

[0029] By setting symmetrical bolt connection holes on the hot and cold sides of the semiconductor and fastening them to the fixing holes on the top of the inner liner of the refrigerator with metal bolts, the installation stability of the semiconductor module can be enhanced, the risk of displacement caused by vibration can be reduced, and the heat conduction efficiency can be improved, thereby improving the structural reliability and heat exchange performance of the refrigeration system.

[0030] As can be seen from the above technical solutions, this application provides a refrigerator, including a refrigerator compartment, a semiconductor module, an evaporator, an ambient temperature sensor, a refrigerator temperature sensor, and a controller; the semiconductor module is disposed at the top of the refrigerator compartment, with the hot side of the semiconductor module facing the outer side of the top of the refrigerator body and the cold side of the semiconductor module facing the interior of the refrigerator compartment; the ambient temperature sensor is disposed on the exterior of the refrigerator body; the evaporator and the refrigerator temperature sensor are disposed inside the refrigerator compartment; the controller is electrically connected to the ambient temperature sensor, the refrigerator temperature sensor, and the semiconductor module respectively, and the controller has built-in temperature threshold data that can trigger the opening and closing of the semiconductor module to solve the problem of excessively high temperature in the upper part of the refrigerator compartment. Attached Figure Description

[0031] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the internal structure of a refrigerator provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the semiconductor module connection structure in a refrigerator provided in an embodiment of this application.

[0034] Illustration:

[0035] Among them, 1-refrigeration compartment; 11-inner liner; 2-freezer compartment; 3-semiconductor module; 31-semiconductor hot surface; 32-bolt connection hole; 33-semiconductor chip; 34-semiconductor cold surface; 4-fan; 5-evaporator. Detailed Implementation

[0036] The embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described below do not represent all embodiments consistent with this application. They are merely examples of systems and methods consistent with some aspects of this application.

[0037] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0038] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0039] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclusively include, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0040] Maintaining a constant temperature for food is crucial for preserving its freshness and safety. As the primary equipment for food preservation, the temperature stability of the refrigerator compartment directly impacts the quality of the food. Especially in high-temperature environments, the refrigerator compartment needs to maintain a more precise and constant temperature to prevent repeated freezing and thawing or localized overheating. However, when existing refrigerators operate under high ambient temperatures, the upper part of the refrigerator compartment is prone to delayed cooling and uneven temperature distribution. This causes food to spoil more quickly due to temperature fluctuations, posing a potential safety hazard of foodborne illnesses.

[0041] In related embodiments, the temperature distribution in the refrigerator compartment is improved by optimizing the evaporator layout or adding auxiliary air supply devices. For example, a multi-outlet circulation system is used to enhance cold air diffusion, or a guide structure is added to the top of the refrigerator compartment to guide the cold air downwards. In addition, some solutions shorten the refrigeration interval by adjusting the compressor start-stop frequency, attempting to reduce the temperature rise during the shutdown phase.

[0042] However, the above methods still have significant limitations: during evaporator shutdown, heat accumulates rapidly in the upper part of the refrigerator compartment due to the natural sinking effect of cold air, and the temperature rises at a significantly higher rate than in the lower part; while simply increasing the airflow can improve the cooling speed, it is difficult to balance temperature uniformity and energy efficiency. This results in a persistent temperature difference between the upper and lower parts of the refrigerator compartment, and the overall temperature fluctuation cannot be effectively suppressed, directly affecting the food preservation effect.

[0043] To address the issue of excessively high temperatures in the upper part of the refrigerator compartment, see [link / reference]. Figures 1-2 This application provides a refrigerator, including a refrigerator compartment 1, a semiconductor module 3, an evaporator 5, an ambient temperature sensor, a refrigerator temperature sensor, and a controller;

[0044] The semiconductor module 3 is disposed at the top of the refrigerator compartment 1, with the semiconductor hot surface 31 of the semiconductor module 3 facing the outside of the top of the refrigerator body and the semiconductor cold surface 34 of the semiconductor module 3 facing the inside of the refrigerator compartment 1.

[0045] The ambient temperature sensor is located on the outside of the refrigerator body; the evaporator 5 and the refrigeration temperature sensor are located inside the refrigeration compartment 1.

[0046] The controller is electrically connected to the ambient temperature sensor, the refrigeration temperature sensor and the semiconductor module 3 respectively. The controller has built-in temperature threshold data that can trigger the semiconductor module 3 to open and close.

[0047] It should be understood that the semiconductor module 3 has the following two functions: first, to maintain the temperature of the upper part of the refrigerator compartment and reduce temperature fluctuations in the refrigerator compartment when the evaporator 5 stops cooling; second, to assist the evaporator 5 in accelerating the cooling of the refrigerator compartment under high ambient temperature conditions, thereby increasing the cooling rate of the refrigerator compartment 1 and solving the problem of excessively high temperature in the upper part of the refrigerator compartment. The control rules of the semiconductor module 3 are as follows: when the refrigerator compartment 1 stops cooling, the semiconductor module 3 operates, and the semiconductor cold surface 34 is used to assist in maintaining the temperature of the upper part of the refrigerator compartment 1 and reducing temperature fluctuations in the refrigerator compartment 1; when the temperature detected by the refrigerator temperature sensor reaches the refrigerator start-up point, the semiconductor module 3 stops operating; when the ambient temperature detected by the ambient temperature sensor exceeds 35 degrees Celsius, the semiconductor module 3 operates to assist the evaporator 5 in accelerating the cooling of the refrigerator compartment; when the temperature detected by the refrigerator temperature sensor reaches the refrigerator stop-down point, the semiconductor module 3 stops operating.

[0048] The refrigerator provided in this application has a semiconductor module 3 installed at the top of the refrigerator compartment 1, with its cold side facing the inside of the refrigerator compartment 1 and its hot side facing the outside of the cabinet. Combined with the coordinated work of the ambient temperature sensor, the refrigerator temperature sensor and the controller, the opening and closing of the semiconductor module 3 is controlled according to the preset temperature threshold. This can reduce the phenomenon of excessive temperature in the upper part of the refrigerator compartment 1, improve the uniformity of temperature distribution in the refrigerator compartment 1, and solve the problem of excessive temperature in the upper part of the refrigerator compartment 1.

[0049] In some embodiments, the semiconductor module 3 further includes a semiconductor chip 33, a first thermally conductive silicone grease layer, and a second thermally conductive silicone grease layer;

[0050] The first thermal grease layer is located between the hot side of the semiconductor 31 and the semiconductor wafer 33; the second thermal grease layer is located between the cold side of the semiconductor 34 and the semiconductor wafer 33.

[0051] By providing a first thermally conductive silicone grease layer between the semiconductor hot surface 31 and the semiconductor wafer 33, and a second thermally conductive silicone grease layer between the semiconductor cold surface 34 and the semiconductor wafer 33, the thermal conductivity of the semiconductor module 3 can be improved, the temperature transfer effect between the semiconductor hot surface 31 and the cold surface can be improved, thereby optimizing the cooling and heat dissipation performance of the semiconductor module 3.

[0052] In some embodiments, the first thermally conductive silicone grease layer has a groove on the side near the semiconductor chip 33, the inner liner 11 of the refrigerator compartment 1 has a mounting through hole on its top, the second thermally conductive silicone grease layer has a protrusion on the side near the semiconductor chip 33, the semiconductor chip 33 is disposed inside the groove, and the protrusion is inserted into the groove through the mounting through hole.

[0053] By setting a groove on the side of the first thermally conductive grease layer near the semiconductor chip 33 and setting a bump at the corresponding position on the second thermally conductive grease layer, the semiconductor chip 33 is embedded in the groove. At the same time, the bump is inserted into the groove through the mounting through hole at the top of the inner liner 11 of the refrigerator compartment 1. This can enhance the installation stability of the semiconductor module 3, improve the contact tightness between the thermally conductive grease layer and the semiconductor chip 33, and thus improve the heat conduction efficiency.

[0054] In some embodiments, the system further includes a freezer compartment 2, with the refrigerator compartment 1 disposed above the freezer compartment 2; the refrigerator compartment 1 is also provided with a fan 4, which is disposed at the bottom of the semiconductor module 3.

[0055] By placing the refrigerator compartment 1 above the freezer compartment 2 and designing the internal fan 4 of the refrigerator compartment 1 to be located at the bottom of the semiconductor module 3, it helps to optimize the cold air circulation efficiency, reduce temperature fluctuations between the refrigerator compartment 1 and the freezer compartment 2, improve the uniformity of cooling, and enhance the overall energy efficiency of the refrigeration system.

[0056] In some embodiments, the fan 4 is a centrifugal fan; the air outlet axis of the fan 4 forms a 45° angle with the semiconductor cold surface 34, and the fan 4 is provided with a shock-absorbing bracket that is sealed and connected to the inner wall of the cold storage compartment 1.

[0057] The centrifugal fan is used, and its outlet axis forms a 45° angle with the semiconductor cold surface 34, which helps to optimize the direction of cold air flow and improve refrigeration efficiency. The shock-absorbing bracket set around the fan 4 is sealed to the inner wall of the cold storage compartment 1, which can reduce operating vibration and noise, while reducing cold air leakage and improving the stability and energy efficiency of the refrigeration system.

[0058] In some embodiments, the outer surface of the semiconductor hot surface 31 is provided with a plurality of parallel heat dissipation fins. The heat dissipation fins extend upward in a vertical direction and penetrate through the top of the refrigerator body. The ends of the heat dissipation fins are exposed in the outer space of the top of the refrigerator body to form an extended heat dissipation section. The height of the extended heat dissipation section is not lower than the top plane of the refrigerator body.

[0059] By setting vertically upward heat dissipation fins on the semiconductor hot surface 31 and making them extend through the top of the refrigerator body to form an exposed extended heat dissipation part, the heat dissipation area and air convection efficiency can be enhanced, thereby optimizing the heat dissipation effect of the semiconductor module 3, reducing the temperature of the hot surface, reducing the accumulation of heat inside the refrigerator, and improving the thermal management performance of the overall refrigeration system.

[0060] In some embodiments, the extended heat dissipation portion is provided with staggered turbulence protrusions, each turbulence protrusion having an isosceles triangle cross section, and the height of the turbulence protrusions being 1 / 3 to 1 / 2 of the spacing between the heat dissipation fins.

[0061] By setting staggered isosceles triangular cross-section turbulence protrusions in the extended heat dissipation section and controlling their height to be 1 / 3-1 / 2 of the spacing between the heat dissipation fins, the airflow disturbance effect can be enhanced, the degree of air turbulence on the surface of the heat dissipation fins can be increased, thereby optimizing the heat dissipation efficiency, reducing the temperature of the semiconductor hot surface 31, and improving the heat exchange performance of the heat dissipation system.

[0062] In some embodiments, an annular air guide plate is fixed to the periphery of the semiconductor cold surface 34; the air guide plate includes at least three guide plates evenly distributed along the circumference of the cold surface, each guide plate has a guide surface that is inclined downward from the edge of the cold surface at 10°-30°, the end of the guide surface extends to the upper edge of the air outlet of the cold storage compartment 1, and each guide surface is provided with corrugated guide grooves that are distributed in parallel at intervals.

[0063] By setting an annular air guide plate around the semiconductor cold surface 34, which includes at least three evenly distributed air guide plates that are inclined downward at 10°-30°, and in conjunction with the corrugated air guide groove design on the air guide surface, the cold air can be guided to flow downward evenly, reducing airflow turbulence, optimizing the cold air distribution effect in the refrigerator compartment 1, while reducing air supply resistance and improving the energy efficiency of the refrigeration system.

[0064] In some embodiments, both the semiconductor hot surface 31 and the semiconductor cold surface 34 are made of aluminum substrate, and the surface of the aluminum substrate is provided with a surface modification layer formed by anodizing.

[0065] It should be understood that the aluminum substrate is specifically made of aluminum 6063.

[0066] By using aluminum substrates on the hot and cold sides of the semiconductor and setting an anodized surface modification layer, the corrosion resistance and surface hardness of the substrate can be enhanced, the thermal conductivity can be improved, and the surface oxidation and thermal resistance can be reduced, thereby improving the long-term stability and thermal conductivity of the semiconductor module 3.

[0067] In some embodiments, the semiconductor hot surface 31 and the semiconductor cold surface 34 are respectively provided with mutually symmetrical bolt connection holes 32, and the inner liner 11 of the refrigerator compartment 1 is provided with a fixing hole at the top; the bolt connection holes 32 and the fixing hole are fixedly connected by fasteners; the fasteners are metal bolts.

[0068] It should be understood that the semiconductor module 3 is installed by first fixing the semiconductor cold side 34 to the inner liner 11, then placing the semiconductor chip 33 at the corresponding position of the semiconductor cold side 34 through the second thermally conductive silicone grease layer, then connecting the semiconductor hot side 31 to the other side of the semiconductor chip 33 through the first thermally conductive silicone grease layer, and finally fixing the connection with fasteners.

[0069] By setting symmetrical bolt connection holes 32 on the hot and cold sides of the semiconductor module 31 and fastening them to the fixing holes on the top of the inner liner 11 of the refrigerator compartment 1 with metal bolts, the installation stability of the semiconductor module 3 can be enhanced, the risk of displacement caused by vibration can be reduced, and the heat conduction efficiency can be improved, thereby improving the structural reliability and heat exchange performance of the refrigeration system.

[0070] As can be seen from the above technical solutions, this application provides a refrigerator, including a refrigerator compartment 1, a semiconductor module 3, an evaporator 5, an ambient temperature sensor, a refrigerator temperature sensor, and a controller; the semiconductor module 3 is disposed at the top of the refrigerator compartment 1, with the semiconductor hot surface 31 of the semiconductor module 3 facing the outer side of the top of the refrigerator body, and the semiconductor cold surface 34 of the semiconductor module 3 facing the interior of the refrigerator compartment 1; the ambient temperature sensor is disposed on the exterior of the refrigerator body; the evaporator 5 and the refrigerator temperature sensor are disposed inside the refrigerator compartment 1; the controller is electrically connected to the ambient temperature sensor, the refrigerator temperature sensor, and the semiconductor module 3 respectively, and the controller has built-in temperature threshold data that can trigger the opening and closing of the semiconductor module 3 to solve the problem of excessively high temperature in the upper part of the refrigerator compartment 1.

[0071] Similar parts between the embodiments provided in this application can be referred to mutually. The specific implementation methods provided above are only a few examples under the overall concept of this application and do not constitute a limitation on the scope of protection of this application. For those skilled in the art, any other implementation methods extended from the solution of this application without creative effort shall fall within the scope of protection of this application.

Claims

1. A refrigerator characterized by comprising: Includes a cold storage compartment (1), a semiconductor module (3), an evaporator (5), an ambient temperature sensor, a cold storage temperature sensor, and a controller; The semiconductor module (3) is disposed at the top of the refrigerator compartment (1), with the semiconductor hot surface (31) of the semiconductor module (3) facing the outside of the top of the refrigerator body and the semiconductor cold surface (34) of the semiconductor module (3) facing the inside of the refrigerator compartment (1). The ambient temperature sensor is located on the outside of the refrigerator body; The evaporator (5) and the refrigeration temperature sensor are disposed inside the refrigeration compartment (1); The controller is electrically connected to the ambient temperature sensor, the refrigeration temperature sensor and the semiconductor module (3) respectively. The controller has built-in temperature threshold data that can trigger the semiconductor module (3) to turn on and off.

2. The refrigerator according to claim 1, characterized in that, The semiconductor module (3) also includes a semiconductor chip (33), a first thermally conductive silicone grease layer and a second thermally conductive silicone grease layer; The first thermal grease layer is located between the hot side (31) of the semiconductor and the semiconductor wafer (33); the second thermal grease layer is located between the cold side (34) of the semiconductor and the semiconductor wafer (33).

3. The refrigerator according to claim 2, characterized in that, The first thermal grease layer has a groove on the side near the semiconductor chip (33), and the inner liner (11) of the refrigerator compartment (1) has an installation through hole at the top. The second thermal grease layer has a protrusion on the side near the semiconductor chip (33), and the semiconductor chip (33) is disposed inside the groove. The protrusion is inserted into the groove through the installation through hole.

4. The refrigerator according to claim 1, characterized in that, It also includes a freezer compartment (2), and the refrigerator compartment (1) is located at the top of the freezer compartment (2); the refrigerator compartment (1) is also equipped with a fan (4), and the fan (4) is located at the bottom of the semiconductor module (3).

5. The refrigerator according to claim 4, characterized in that, The fan (4) is a centrifugal fan; the air outlet axis of the fan (4) forms a 45° angle with the semiconductor cold surface (34), and the fan (4) is provided with a shock-absorbing bracket that is sealed and connected to the inner wall of the cold storage chamber (1).

6. The refrigerator according to claim 1, characterized in that, The outer surface of the semiconductor hot surface (31) is provided with a number of parallel heat dissipation fins. The heat dissipation fins extend upward in the vertical direction and penetrate through the top of the refrigerator body. The ends of the heat dissipation fins are exposed in the outer space of the top of the refrigerator body to form an extended heat dissipation part. The height of the extended heat dissipation part is not lower than the top plane of the refrigerator body.

7. The refrigerator according to claim 6, characterized in that The extended heat dissipation section is provided with staggered turbulence protrusions, each of which has an isosceles triangle cross section and a height of 1 / 3 to 1 / 2 of the spacing between the heat dissipation fins.

8. The refrigerator according to claim 1, characterized in that, The semiconductor cold surface (34) is fixed with an annular air guide plate around its periphery; the air guide plate includes at least three guide plates evenly distributed around the cold surface, each guide plate has a guide surface that is inclined downward from the edge of the cold surface at 10°-30°, the end of the guide surface extends to the upper edge of the air outlet of the cold storage compartment (1), and each guide surface is provided with corrugated guide grooves that are distributed in parallel at intervals.

9. The refrigerator according to claim 1, characterized in that, Both the semiconductor hot surface (31) and the semiconductor cold surface (34) are made of aluminum substrate, and the surface of the aluminum substrate is provided with a surface modification layer formed by anodizing.

10. The refrigerator according to claim 1, characterized in that, The semiconductor hot surface (31) and the semiconductor cold surface (34) are respectively provided with mutually symmetrical bolt connection holes (32), and the inner liner (11) of the refrigerator compartment (1) is provided with a fixing hole at the top; the bolt connection holes (32) and the fixing holes are fixedly connected by fasteners; the fasteners are metal bolts.

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