Coaxial SLD aging monitoring system compatible with large current and small current

Abstract

The utility model provides a coaxial SLD aging monitoring system compatible with large and small currents, and the system comprises a multi-station driving platform which is provided with a plurality of aging driving sources which output different driving currents; a plurality of multi-station aging test devices are arranged in the high-temperature test box, and each multi-station aging test device is electrically connected with the corresponding aging driving source through an aging line; and the data acquisition platform comprises a computer, a data acquisition box and a plurality of photoelectric detection boxes, each photoelectric detection box is connected with the corresponding multi-station aging test device, and the data acquisition box is electrically connected with the computer and the plurality of photoelectric detection boxes. According to the utility model, the aging driving source is designed to be a plurality of independent constant-current driving modules, small-current driving can be directly carried out on a single SLD through each independent constant-current driving module, large-current driving can be carried out on the SLD after the outputs of the plurality of constant-current driving modules are combined, and the coaxial SLD aging test compatible with large and small currents can be simultaneously carried out.

Description

Technical Field

[0001] This application relates to the field of superluminescent light-emitting diode (SLD) manufacturing technology, and in particular to a coaxial SLD aging monitoring system compatible with both large and small currents. Background Technology

[0002] Superluminescent diodes (SLDs) are semiconductor optoelectronic devices with high output power and wide spectral width, making them suitable for optical coherence tomography (OCT) imaging systems and fiber optic gyroscopes (FOGs). They are widely used in industry, medical and military applications, and small-volume coaxial pigtail-packaged SLDs are particularly popular.

[0003] While coaxial fiber-mounted SLDs offer significant advantages, their small size can lead to poor heat dissipation. This can cause some SLD devices to experience power degradation and performance instability over a certain period. To ensure stable performance of coaxial SLDs, high-temperature aging screening is necessary. This serves two purposes: firstly, it eliminates potentially risky devices; secondly, high-temperature aging accelerates the process of overcoming instability, ensuring that all devices leaving the factory operate in a stable state.

[0004] For different application scenarios in the market, the specifications and drive current of coaxial SLDs will vary. Drive currents can range from tens of milliamps to several amps, requiring our aging drive source to provide different drive currents. Small drive current outputs are relatively easy to achieve, while large drive current outputs place high demands on the driving transistors and require auxiliary heat dissipation to prevent high-temperature damage. This results in a larger drive source size, making multi-station batch aging inconvenient. Furthermore, if a high-current drive source is used to age low-current devices, it's difficult to guarantee drive current accuracy, and overshoot is easily caused when setting the current, leading to device damage. Generally, devices of different sizes are aged separately, each using a separate aging system. This approach is space-consuming, inefficient, and expensive. Utility Model Content

[0005] This application provides a coaxial SLD aging monitoring system that is compatible with both large and small currents, which solves the problem that the aging drive source cannot be compatible with both large and small drive currents when performing aging tests on coaxial SLDs of different specifications.

[0006] This application provides a coaxial SLD aging monitoring system compatible with both large and small currents, including:

[0007] A multi-station drive station, wherein several aging drive sources with different output drive currents are installed on the multi-station drive station.

[0008] A high-temperature test chamber is provided, which is equipped with several multi-station aging test devices. Each of the multi-station aging test devices is electrically connected to a corresponding aging drive source through an aging line.

[0009] The aging drive source includes several constant current drive modules that output small drive currents. Each constant current drive module drives one SLD on a multi-station aging test device, or multiple constant current drive modules are combined to drive one SLD on a multi-station aging test device.

[0010] The data acquisition station includes a computer, a data acquisition box, and several photoelectric detection boxes. Each photoelectric detection box is connected to a corresponding multi-station aging test device, and the data acquisition box is electrically connected to the computer and several photoelectric detection boxes.

[0011] The technical solution provided in this application designs the aging drive source as multiple independent constant current drive modules. When a small aging current is required, each individual constant current drive module can directly power a single SLD. When a large aging current is required, the outputs of multiple constant current drive modules can be combined to power the SLD. Different aging drive source output circuits and corresponding multi-station aging test devices can be designed according to different aging current ranges, which can simultaneously support coaxial SLD aging tests with large and small currents. Furthermore, since the output current of each constant current drive module is small, no additional heat dissipation is required, thus reducing the size of the aging drive source.

[0012] In some implementations, the output current of the constant current drive module is adjustable in the range of 0 to 200 mA.

[0013] In some embodiments, the multi-station aging test device includes a PCB board, on which a current input interface and multiple coaxial test sockets electrically connected to the current input interface are provided. The coaxial test sockets are used to fix and drive the SLD. The current input interface connects the multiple drive currents output from the aging drive source to the multiple coaxial test sockets to power the multiple SLDs. During testing, the pins of the SLD are inserted into the coaxial test sockets to power on and test the SLD.

[0014] In some embodiments, a heat sink is mounted on the PCB board. The bottom surface of the heat sink has a clearance groove for avoiding the coaxial test socket, and the top surface of the heat sink has several through holes for passing through the SLD. The through holes penetrate the top surface of the clearance groove. By opening clearance grooves on the bottom surface of the heat sink, the installation of the coaxial test socket can be facilitated, and the heat dissipation area of ​​the heat sink can be increased, which can prevent heat accumulation from damaging the SLD.

[0015] In some embodiments, the coaxial test base and the photoelectric detection box are connected via an energy fiber, and the light emitted by the SLD is transmitted to the photoelectric detection box through the energy fiber. By guiding the light output by the coaxial SLD to the outside of the high-temperature test chamber for collection through the energy fiber, the influence of the high-temperature environment on the monitoring results can be avoided, thereby improving the accuracy of the SLD aging monitoring results.

[0016] In some embodiments, a plurality of fiber optic mounting bases are installed on the top surface of the heat sink for mounting the coupling connectors of the power fiber. Each fiber optic mounting base is coaxially configured with a corresponding SLD. By installing a plurality of fiber optic mounting bases on the top surface of the heat sink, independent monitoring of the optical power of each SLD can be achieved, avoiding interference between multiple SLDs.

[0017] In some embodiments, the fiber optic mounting base includes a fiber optic flange, the threaded connector at the top of the fiber optic flange being coaxially connected to the coupling connector of the energy fiber, and a limiting slot being provided at the bottom of the light-transmitting hole of the fiber optic flange. The inner diameter of the limiting slot matches the outer diameter of the SLD's tube seat, and the limiting slot can just hold the SLD, thereby further ensuring the coaxiality of the SLD and the fiber optic mounting base, thus improving the monitoring accuracy.

[0018] In some embodiments, the energy fiber is a large-aperture multimode fiber, which can effectively couple the light emitted by the SLD into the fiber, improving the accuracy of optical power monitoring.

[0019] In some embodiments, each of the photoelectric detection boxes is equipped with multiple photoelectric detectors, which are used to monitor the optical power of multiple SLDs on a multi-station aging test device, thereby enabling multi-channel optical power monitoring.

[0020] In some embodiments, the data acquisition box includes a microcontroller and an A / D conversion module, a level conversion module, and an analog switch connected to the microcontroller; the analog switch is connected to multiple photodetectors and is used to quickly scan and acquire the analog signals after photoelectric conversion from each photodetector; the A / D conversion module is used to convert the acquired analog signals into digital signals and transmit them to the microcontroller; the level conversion module is connected to a computer via an RS232 interface.

[0021] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0022] The accompanying drawings in this application are for illustrating preferred embodiments and to facilitate a clear understanding by those skilled in the art of various other advantages and benefits, and should not be construed as limiting the scope of this application. Furthermore, throughout all the drawings, the same reference numerals denote the same or similar types of components.

[0023] Figure 1 This is a block diagram of the architecture of a coaxial SLD aging monitoring system compatible with large and small currents according to an embodiment of this application;

[0024] Figure 2 This is a circuit schematic diagram of an aging drive source outputting a small current to drive an SLD in one embodiment of this application;

[0025] Figure 3 This is a circuit schematic diagram of an aging drive source outputting a large current to drive an SLD in one embodiment of this application;

[0026] Figure 4 This is an exploded view of a multi-station aging test device driven by a small current in one embodiment of this application;

[0027] Figure 5 This is an assembly diagram of a multi-station aging test device driven by a small current in one embodiment of this application;

[0028] Figure 6 This is an exploded view of a multi-station aging test device driven by high current in one embodiment of this application;

[0029] Figure 7 This is an assembly diagram of a multi-station aging test device driven by high current in one embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the fiber optic flange in one embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the internal electrical connection structure of the data acquisition station in one embodiment of this application;

[0032] Icons: 1. Multi-station drive stage; 2. Aging drive source; 3. High temperature test chamber; 4. Multi-station aging test device; 5. Aging line; 6. Constant current drive module; 7. SLD; 8. Data acquisition station; 9. Computer; 10. Data acquisition box; 11. Photoelectric detection box; 12. PCB board; 13. Current input interface; 14. Coaxial test base; 15. Heat sink; 16. Clearance slot; 17. Through hole; 18. Energy fiber; 19. Fiber optic mounting base; 20. Coupling connector; 21. Fiber optic flange; 22. Threaded connector; 23. Light transmission hole; 24. Limiting slot; 25. Photoelectric detector; 26. Microcontroller; 27. A / D conversion module; 28. Level conversion module; 29. ​​Analog switch. Detailed Implementation

[0033] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to specific examples. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more (including two), unless otherwise explicitly defined.

[0036] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0037] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0039] Please see Figures 1-9 This application provides a coaxial SLD aging monitoring system compatible with both large and small currents, comprising:

[0040] A multi-station drive stage 1, on which several aging drive sources 2 with different output drive currents are installed;

[0041] The high temperature test chamber 3 is equipped with several multi-station aging test devices 4, and each of the multi-station aging test devices 4 is electrically connected to the corresponding aging drive source 2 through an aging line 5.

[0042] The aging drive source 2 includes several constant current drive modules 6 that output small drive currents. Each constant current drive module 6 drives one SLD7 on a multi-station aging test device 4, or multiple constant current drive modules 6 are combined to drive one SLD7 on a multi-station aging test device 4.

[0043] The data acquisition station 8 includes a computer 9, a data acquisition box 10, and several photoelectric detection boxes 11. Each photoelectric detection box 11 is connected to a corresponding multi-station aging test device 4. The data acquisition box 10 is electrically connected to the computer 9 and several photoelectric detection boxes 11.

[0044] The technical solution provided in this application designs the aging drive source 2 as multiple independent constant current drive modules 6. When a smaller aging current is required, each individual constant current drive module 6 can directly power a single SLD7. When a larger aging current is required, the outputs of multiple constant current drive modules 6 can be combined to power the SLD7. Only different output circuits of the aging drive source 2 and corresponding multi-station aging test devices 4 need to be designed according to different aging current ranges, which can simultaneously support coaxial SLD7 aging tests with varying currents. Furthermore, since the output current of each constant current drive module 6 is small, no additional heat dissipation is required, reducing the size of the aging drive source 2. Moreover, the design of multiple independent constant current drive modules 6 ensures that a failure in one module will not affect the normal operation of other modules, facilitating the maintenance and replacement of peripheral equipment and components.

[0045] Please continue reading. Figure 2 , Figure 3 In some embodiments, the output current of the constant current drive module 6 is adjustable within the range of 0–200mA. When the drive current required by the SLD7 exceeds 200mA, the output currents of multiple constant current drive modules 6 can be combined to drive one SLD7, thereby achieving high-current drive. Combining the output currents of two constant current drive modules 6 can achieve an adjustable drive current within the range of 0–400mA; combining the output currents of three constant current drive modules 6 can achieve an adjustable drive current within the range of 0–600mA; and so on, combining the output currents of n constant current drive modules 6 can achieve an adjustable drive current within the range of 0–n×200mA. The specific implementation circuit is as follows: Figure 3 As shown, taking four constant current drive modules 6 combined as an example, the output current of each constant current drive module 6 is controlled by the same Vset voltage to ensure consistent output current in each drive mode. The collectors of the transistors in the four constant current drive modules 6 are connected together and then connected to the negative terminal of the same SLD7. This allows four constant current drive modules 6 to drive one SLD7, enabling the SLD7 drive current to be adjustable within the range of 0–800mA. Furthermore, each constant current drive module 6 still outputs a maximum current of 200mA without requiring additional heat dissipation.

[0046] Please continue reading. Figures 4-7 In some embodiments, the multi-station aging test device 4 includes a PCB board 12, on which a current input interface 13 (a DB25 interface is used in this embodiment) and multiple coaxial test sockets 14 electrically connected to the current input interface 13 are provided. The coaxial test sockets 14 are used to fix and drive the SLD7. The current input interface 13 connects the multiple driving currents output by the aging drive source 2 to the multiple coaxial test sockets 14 to power the multiple SLD7. During testing, the pins of the SLD7 are inserted into the coaxial test sockets 14 to power on and test the SLD7.

[0047] Please continue reading. Figures 4-7 In some embodiments, a heat sink 15 is mounted on the PCB board 12. The bottom surface of the heat sink 15 is provided with a clearance groove 16 for avoiding the coaxial test socket 14. The top surface of the heat sink 15 is provided with a plurality of through holes 17 for passing through the SLD7. The through holes 17 penetrate the top surface of the clearance groove 16. By opening the clearance groove 16 on the bottom surface of the heat sink 15, it is not only convenient to install the coaxial test socket 14, but also to increase the heat dissipation area of ​​the heat sink 15, which can prevent heat accumulation from damaging the SLD7.

[0048] In the specific implementation process, the bottom surface of the heat sink is provided with multiple screw holes, and the PCB board 12 is provided with multiple mounting holes that match the screw holes. When installing the heat sink 15, the heat sink 15 is placed on the PCB board 12, so that the multiple screw holes are aligned with the multiple mounting holes respectively, and then fixed and connected by screws.

[0049] During the high-temperature aging process of coaxial SLD7 devices, real-time power changes need to be monitored to effectively determine whether the device has entered the stabilizer stage and whether defects exist. There are two conventional monitoring methods. One is through a backlight detector (PD). This type of PD collects the power at the back end of the chip and converts it into an electrical signal output. By monitoring changes in this electrical signal, the backlight power is determined, indirectly assessing device stability. This indirect method is prone to misjudgment. Generally, the back end of the SLD7 chip is a light absorption region with relatively low power, which is even lower at high temperatures. The backlight PD also has very low responsivity at high temperatures, resulting in a very low converted electrical signal. Although it can be amplified by circuitry, significant noise and a low signal-to-noise ratio lead to inaccurate monitoring. The other conventional method is to directly detect the light emitted from the front end and monitor power changes. This method also suffers from low responsivity of the photodetector at high temperatures, leading to inaccurate monitoring.

[0050] To address the issue of low responsivity and inaccurate monitoring of photodetectors in high-temperature environments, please continue reading. Figures 4-7 In some embodiments, the coaxial test base 14 is connected to the photoelectric detection box 11 via an energy fiber 18. The light emitted by the SLD7 is transmitted to the photoelectric detection box 11 via the energy fiber 18. The light output by the coaxial SLD7 is guided to the outside of the high-temperature test chamber 3 for collection via the energy fiber 18, which can avoid the influence of the high-temperature environment on the monitoring results and thus improve the accuracy of the SLD7 aging monitoring results.

[0051] Please continue reading. Figures 4-7 In some embodiments, a plurality of fiber optic mounting bases 19 are installed on the top surface of the heat sink 15 for mounting the coupling connectors 20 of the power fiber 18 (FC / APC connectors are used in this embodiment). Each fiber optic mounting base 19 is coaxially arranged with a corresponding SLD7. By installing a plurality of fiber optic mounting bases 19 on the top surface of the heat sink 15, independent monitoring of the optical power of each SLD7 can be achieved, interference between multiple SLD7s can be avoided, and the power fiber 18 and SLD7 can be fixed concentrically and coaxially, thereby improving the accuracy of optical power monitoring.

[0052] Please continue reading. Figure 8In some embodiments, the fiber optic mounting base 19 includes a fiber optic flange 21 (an FC / PC optical flange is used in this embodiment). The threaded connector 22 at the top of the fiber optic flange 21 is coaxially connected to the coupling connector 20 of the energy fiber 18. The bottom of the light-transmitting hole 23 of the fiber optic flange 21 is provided with a limiting slot 24. The inner diameter of the limiting slot 24 matches the outer diameter of the tube seat of the SLD7. The limiting slot 24 can just hold the SLD7, thereby further ensuring the coaxiality of the SLD7 and the fiber optic mounting base 19, thereby improving the monitoring accuracy.

[0053] In the specific implementation process, the threaded connector 22 of the optical fiber flange 21 is provided with flange holes on both sides, and the through hole 17 of the heat sink 15 is provided with positioning holes on both sides corresponding to the flange holes. When installing the optical fiber fixing seat 19, the flange holes of the optical fiber flange 21 are aligned with the positioning holes of the heat sink 15 and fixed by screws.

[0054] Please continue reading. Figures 4-7 In some embodiments, for SLD7s with different drive current requirements, a multi-station aging test device 4 of different specifications can be designed. When the SLD7 requires a small current drive, 20 SLD7s can be installed on the multi-station aging test device 4 at the same time. That is, 20 coaxial test sockets 14 need to be installed on the PCB board 12 and 20 fiber optic fixing sockets 19 need to be installed on the heat sink 15, and aging tests can be performed on 20 SLD7s at the same time. When the SLD7 requires a large current drive, such as when the current output from 4 constant current drive modules 6 needs to be combined to drive the SLD7, 5 coaxial test sockets 14 need to be installed on the PCB board 12 and 5 fiber optic fixing sockets 19 need to be installed on the heat sink 15, and aging tests can be performed on 5 SLD7s at the same time.

[0055] In some embodiments, the energy fiber 18 is a large-aperture multimode fiber, which can effectively couple the light emitted by the SLD7 into the fiber, thereby improving the accuracy of optical power monitoring.

[0056] Please continue reading. Figure 9 In some embodiments, each of the photoelectric detection boxes 11 is equipped with multiple photoelectric detectors 25, which are used to monitor the optical power of multiple SLD7s on a multi-station aging test device 4, thereby realizing multi-channel optical power monitoring.

[0057] Please continue reading. Figure 9In some embodiments, the data acquisition box 10 is equipped with a microcontroller 26 and an A / D conversion module 27, a level conversion module 28, and an analog switch 29 connected to the microcontroller 26. The analog switch 29 is connected to a multi-channel photodetector 25 and is used to quickly scan and acquire the analog signals after photoelectric conversion by each photodetector 25. The A / D conversion module 27 is used to convert the acquired analog signals into digital signals and transmit them to the microcontroller 26. The level conversion module 28 is connected to a computer 9 via an RS232 interface and uses the RS232 communication protocol to upload the digital signals to the computer 9. The computer 9 records the real-time sampling data, calculates the power change, and analyzes the performance changes of the SLD7 device in real time, effectively screening out unqualified devices and devices with potential risks.

[0058] In this embodiment, multiple aging drive sources 2 are installed on a multi-station drive stage 1, and the output current and number of each aging drive source 2 are adjusted by merging multiple constant current drive modules 6. Multiple multi-station aging test devices 4 are installed in the high-temperature test chamber 3, each corresponding to one aging drive source 2, thereby enabling simultaneous aging tests on multiple SLD7s of different specifications (requiring different drive currents). Each multi-station aging test device 4 can perform aging tests on one specification of SLD7, thus achieving coaxial SLD7 aging tests compatible with both large and small currents. The light emitted by the SLD7 is guided to the photoelectric detection box 11 outside the high-temperature test chamber 3 by the energy optical fiber 18 for collection, realizing optical power monitoring of the SLD7 at room temperature, avoiding the influence of the high-temperature environment on the monitoring accuracy, thereby improving the monitoring accuracy.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no contradiction or conflict, the various technical features mentioned in the various embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A compatible size current coaxial SLD burn-in monitoring system, characterized in that, include: A multi-station drive stage (1) is provided, on which several aging drive sources (2) with different output drive currents are installed. High temperature test chamber (3), the high temperature test chamber (3) is equipped with several multi-station aging test devices (4), each of the multi-station aging test devices (4) is electrically connected to the corresponding aging drive source (2) through aging line (5); The aging drive source (2) includes several constant current drive modules (6) with small output drive current. Each constant current drive module (6) drives one SLD (7) on a multi-station aging test device (4), or multiple constant current drive modules (6) are combined to drive one SLD (7) on a multi-station aging test device (4). The data acquisition station (8) includes a computer (9), a data acquisition box (10) and several photoelectric detection boxes (11). Each photoelectric detection box (11) is connected to a corresponding multi-station aging test device (4). The data acquisition box (10) is electrically connected to the computer (9) and several photoelectric detection boxes (11).

2. A compatible size current coaxial SLD burn-in monitoring system according to claim 1, wherein, The output current of the constant current drive module (6) is adjustable in the range of 0 to 200mA.

3. A compatible size current coaxial SLD burn-in monitoring system according to claim 1, wherein, The multi-station aging test device (4) includes a PCB board (12), on which a current input interface (13) and multiple coaxial test sockets (14) electrically connected to the current input interface (13) are provided. The coaxial test sockets (14) are used to fix and drive the SLD (7).

4. A compatible size current coaxial SLD burn-in monitoring system according to claim 3, wherein, A heat sink (15) is installed on the PCB board (12). The bottom surface of the heat sink (15) is provided with a clearance groove (16) for avoiding the coaxial test seat (14). The top surface of the heat sink (15) is provided with several through holes (17) for passing through the SLD (7). The through holes (17) penetrate the top surface of the clearance groove (16).

5. A compatible size current coaxial SLD burn-in monitoring system according to claim 4, wherein, The coaxial test stand (14) is connected to the photoelectric detection box (11) through an energy fiber (18), and the light emitted by the SLD (7) is transmitted to the photoelectric detection box (11) through the energy fiber (18).

6. A compatible size current coaxial SLD burn-in monitoring system according to claim 5, wherein, The top surface of the heat sink (15) is equipped with several fiber optic mounting bases (19) for mounting the coupling connectors (20) of the energy fiber (18). Each fiber optic mounting base (19) is coaxially arranged with a corresponding SLD (7).

7. A compatible size current coaxial SLD burn-in monitoring system according to claim 6, wherein, The fiber optic mounting base (19) includes a fiber optic flange (21). The threaded connector (22) at the top of the fiber optic flange (21) is coaxially connected to the coupling connector (20) of the energy fiber (18). The bottom of the light-transmitting hole (23) of the fiber optic flange (21) is provided with a limiting slot (24). The inner diameter of the limiting slot (24) matches the outer diameter of the tube seat of the SLD (7).

8. A compatible size current coaxial SLD burn-in monitoring system according to claim 5, wherein, The energy fiber (18) is a large-aperture multimode fiber.

9. A coaxial SLD aging monitoring system compatible with both large and small currents according to claim 1, characterized in that, Each of the photoelectric detection boxes (11) is equipped with multiple photoelectric detectors (25), which are used to monitor the optical power of multiple SLDs (7) on a multi-station aging test device (4).

10. A compatible size current coaxial SLD burn-in monitoring system according to claim 9, wherein, The data acquisition box (10) is equipped with a microcontroller (26) and an A / D conversion module (27), a level conversion module (28), and an analog switch (29) connected to the microcontroller (26). The analog switch (29) is connected to a multi-channel photodetector (25) and is used to quickly scan and acquire the analog signals after photoelectric conversion by each photodetector (25). The A / D conversion module (27) is used to convert the acquired analog signals into digital signals and transmit them to the microcontroller (26). The level conversion module (28) is connected to the computer (9) via an RS232 interface.

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