Chip capacitor with anti-interference function

Abstract

The chip capacitor with the anti-interference function comprises a capacitor body and a base, a containing groove is formed in the upper end of the base, a device groove is formed in the bottom of the containing groove, the inner wall and the outer wall of the containing groove and the inner wall and the outer wall of the device groove are round, and electrode passing holes extend to adjacent cooling fins. Heat dissipation grooves are formed in the outer walls of the two sides of the capacitor body, the heat dissipation grooves extend into the device groove, the multiple sets of outer walls are coated with electromagnetic shielding coatings, and multiple sets of gaskets are installed at the lower end of the base. According to the utility model, through the design of the wave-shaped / sawtooth-shaped heat dissipation lines, the heat separation channels and the heat dissipation grooves of the heat dissipation fins, a multi-dimensional heat conduction path is constructed, Joule heat of the capacitor body is rapidly and transversely diffused to the external environment, the problem of longitudinal thermal resistance accumulation caused by dielectric layer isolation of a traditional MLCC is effectively solved, and meanwhile, the service life of the MLCC is prolonged. The flexible insulation isolation layer absorbs thermal stress in the welding and working process, and the risk of structural cracking caused by thermal expansion difference is avoided.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to surface mount capacitors with anti-interference function. Background Technology

[0002] Currently, capacitors are widely used as components in equipment across various industries. With the continuous advancement of technology and equipment technology, especially the large-scale use of power electronic devices, the requirements for capacitors are becoming increasingly stringent. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a surface-mount capacitor with anti-interference function.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An anti-interference surface mount capacitor includes a capacitor body and a base. The base has a placement slot at its upper end and a device slot at its bottom. Both the placement slot and the device slot have circular inner and outer walls. Two sets of flat motor pins are mounted on the lower end of the capacitor body. Multiple sets of heat dissipation fins are arranged on the inner wall of the device slot, with insulating layers separating the fins to form thermal separation channels. The bottom of the capacitor body and the top surface of the heat dissipation fins form a thermal coupling interface. The bottom of the capacitor body contacts the end faces of the multiple sets of heat dissipation fins. The side walls of the capacitor body are in close contact with the inner wall of the placement slot. A small gap exists between each pair of heat dissipation fins. Two sets of through holes are formed through the outer wall of one set of heat dissipation fins, extending to adjacent heat dissipation fins. Heat dissipation grooves are formed on both outer walls of the capacitor body, extending into the device slot. All outer walls are covered with an electromagnetic shielding coating. Multiple sets of pads are mounted on the lower end of the base.

[0006] Preferably, the heat dissipation fins are parallel sheet-like structures with their length direction perpendicular to the axial direction of the capacitor body, and the surface of the heat dissipation fins is provided with wavy or sawtooth heat dissipation patterns.

[0007] Preferably, the insulating layer is made of a flexible insulating material and covers the surface of the gap between the heat dissipation fins.

[0008] Preferably, the heat dissipation groove extends longitudinally along the side wall of the capacitor body, and an airflow channel is formed between the opening end of the heat dissipation groove and the inner wall of the placement groove, and the bottom of the groove is in direct contact with the end of the heat dissipation fins.

[0009] Preferably, the electromagnetic shielding coating covers the outer surface of the heat dissipation fins and the inner wall of the electrode hole, and the edge of the coating extends to the connection between the device slot and the placement slot.

[0010] This utility model has the following beneficial effects:

[0011] 1. This utility model constructs a multi-dimensional heat conduction path by designing the wave-shaped / serrated heat dissipation pattern of the heat dissipation fins, the heat separation channel and the heat dissipation groove, so as to quickly diffuse the Joule heat of the capacitor body laterally to the external environment, effectively solving the problem of longitudinal thermal resistance accumulation caused by dielectric layer isolation in traditional MLCCs. At the same time, the flexible insulating isolation layer absorbs the thermal stress during welding and operation, avoiding the risk of structural cracking caused by thermal expansion differences.

[0012] 2. In this utility model, the continuous electromagnetic shielding coating on the outer surface of the heat dissipation fins and the inner wall of the electrode hole forms a closed shielding circuit, blocking the coupling interference of high-frequency electromagnetic fields to the internal electrodes. At the same time, the parallel heat dissipation fins combined with the insulating isolation layer reduce high-frequency signal crosstalk. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the surface-mount capacitor with anti-interference function proposed in this utility model.

[0014] Figure 2 for Figure 1 Schematic diagram of the structure at the base.

[0015] In the diagram: 1. Capacitor body; 2. Base; 3. Placement slot; 4. Motor pin; 5. Device slot; 6. Heat sink fins; 7. Pad; 8. Heat sink groove; 9. Through hole. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Reference Figure 1-2The surface mount capacitor with anti-interference function includes a capacitor body 1 and a base 2. The upper end of the base 2 is provided with a placement groove 3, and the bottom of the placement groove 3 is provided with a device groove 5. The inner and outer walls of the placement groove 3 and the device groove 5 are both circular. Two sets of flat motor pins 4 are installed at the lower end of the capacitor body 1. Multiple sets of heat dissipation fins 6 are provided on the inner wall of the device groove 5. Each heat dissipation fin (6) is separated by an insulating isolation layer to form a thermal separation channel. The bottom of the capacitor body (1) and the top surface of the heat dissipation fins (6) form a thermal coupling interface. The bottom of the capacitor body 1 is in contact with the end face of the multiple sets of heat dissipation fins 6. The side wall of the capacitor body 1 is in contact with the inner wall of the placement groove 3. There is a certain small gap between each pair of the multiple sets of heat dissipation fins 6. Two sets of through holes 9 are provided through the outer wall of one set of heat dissipation fins 6. The through holes 9 extend to the adjacent heat dissipation fins 6. Heat dissipation grooves 8 are provided on both sides of the outer wall of the capacitor body 1. The heat dissipation grooves 8 extend into the device groove 5. The outer walls of the multiple sets of 6 are covered with an electromagnetic shielding coating. Multiple sets of pads 7 are installed at the lower end of the base 2.

[0018] The heat dissipation fins 6 are parallel sheet-like structures with their length direction perpendicular to the axis of the capacitor body 1. The surface of the heat dissipation fins 6 is provided with wavy or sawtooth heat dissipation patterns. The insulating layer is made of flexible insulating material and covers the gap surface between the heat dissipation fins 6. The heat dissipation groove 8 extends longitudinally along the side wall of the capacitor body 1. An airflow channel is formed between the opening end of the heat dissipation groove 8 and the inner wall of the placement groove 3. The bottom of the groove is in direct contact with the end of the heat dissipation fins 6. The electromagnetic shielding coating covers the outer surface of the heat dissipation fins 6 and the inner wall of the electrode hole 9, and the edge of the coating extends to the connection between the device groove 5 and the placement groove 3.

[0019] In this invention, when the device is in use: the Joule heat generated by the capacitor body 1 during operation is directly conducted to the heat dissipation fins 6 through the thermal coupling interface between the bottom and the heat dissipation fins 6. The wavy or sawtooth heat dissipation patterns on the surface of the heat dissipation fins 6 significantly increase the heat dissipation surface area, accelerating the radiation of heat to the surrounding environment. The thermal separation channels formed between the heat dissipation fins 6 can avoid the risk of short circuits between adjacent fins, and the physical isolation reduces longitudinal thermal coupling, forcing heat to diffuse laterally along the fins to the heat dissipation grooves 8.

[0020] External air enters the device slot 5 through the heat dissipation slot 8, and after directly contacting the ends of the heat dissipation fins 6, it forms convection heat dissipation. The heat is finally discharged through the electrode passage 9 and the heat dissipation slot 8. At the same time, the electromagnetic shielding coating covering the outer surface of the heat dissipation fins 6 and the inner wall of the electrode passage 9 forms a continuous shielding layer, blocking the coupling interference of external high-frequency electromagnetic fields to the internal electrode layer of the capacitor body 1. This surface mount capacitor achieves high-density charge storage while significantly improving heat dissipation efficiency and electromagnetic compatibility, making it suitable for high-frequency, high-power-density anti-interference circuit scenarios.

[0021] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A patch capacitor with anti-interference function, comprising a capacitor body (1) and a base (2), characterized in that, The base (2) has a placement groove (3) at its upper end and a device groove (5) at its bottom. The inner and outer walls of the placement groove (3) and the device groove (5) are both circular. Two sets of flat motor pins (4) are installed at the lower end of the capacitor body (1). Multiple sets of heat dissipation fins (6) are provided on the inner wall of the device groove (5). Each heat dissipation fin (6) is separated by an insulating layer to form a thermal separation channel. The bottom of the capacitor body (1) and the top surface of the heat dissipation fins (6) form a thermal coupling interface. The bottom of the capacitor body (1) and the multiple sets of heat dissipation fins (6) form a thermal coupling interface. The capacitor body (1) is in contact with the inner wall of the placement groove (3). There is a certain small gap between each pair of the multiple sets of heat dissipation fins (6). Two sets of through holes (9) are opened through the outer wall of one set of heat dissipation fins (6). The through holes (9) extend to the adjacent heat dissipation fins (6). Heat dissipation grooves (8) are opened on both sides of the outer wall of the capacitor body (1). The heat dissipation grooves (8) extend into the device groove (5). The outer walls of the multiple sets of 6 are covered with an electromagnetic shielding coating. Multiple sets of pads (7) are installed at the lower end of the base (2).

2. The patch capacitor with anti-interference function according to claim 1, characterized in that, The heat dissipation fins (6) are parallel sheet-like structures with their length direction perpendicular to the axis of the capacitor body (1), and the surface of the heat dissipation fins (6) is provided with wavy or sawtooth heat dissipation patterns.

3. The patch capacitor with anti-interference function according to claim 2, characterized in that, The insulating layer is made of flexible insulating material and covers the gap surface between the heat dissipation fins (6).

4. The patch capacitor with anti-interference function according to claim 3, characterized in that, The heat dissipation groove (8) extends longitudinally along the side wall of the capacitor body (1), and an airflow channel is formed between the opening end of the heat dissipation groove (8) and the inner wall of the placement groove (3), and the bottom of the groove is in direct contact with the end of the heat dissipation fins (6).

5. The patch capacitor with anti-interference function according to claim 4, characterized in that, The electromagnetic shielding coating covers the outer surface of the heat dissipation fins (6) and the inner wall of the through hole (9), and the edge of the coating extends to the connection between the device groove (5) and the placement groove (3).

Images