Anti-eavesdropping device
This anti-eavesdropping device, which combines an ultrasonic transmitting module with a drive control module, solves the problem of illegal recording by mobile phone microphones, achieves effective privacy protection, has a good shielding effect, and does not affect the normal use of mobile phones.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WIENER CORE TECH (WUXI) CO LTD
- Filing Date
- 2025-04-15
- Publication Date
- 2026-04-17
AI Technical Summary
Existing technologies lack effective physical-level anti-eavesdropping measures, especially against illegal recording of mobile phone microphones, leading to a high risk of privacy leaks.
An anti-eavesdropping device combining an ultrasonic transmitting module and a drive control module interferes with a mobile phone microphone by using ultrasonic waves. An environmental perception module detects the eavesdropping device and sends a feedback signal, driving the ultrasonic transmitting module to emit ultrasonic signals with a frequency of 20kHz to 100kHz to interfere with the eavesdropping device.
It effectively prevents unauthorized recording, protects user privacy, has a good blocking effect, does not affect the normal use of the mobile phone, and is easy to carry.
Smart Images

Figure CN224139045U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mobile phone protection technology, specifically to an anti-eavesdropping device. Background Technology
[0002] With the widespread use of smartphones in daily life and work, while the phone call and recording functions bring convenience, they also pose a risk of privacy leaks. Especially in sensitive or confidential environments, some eavesdropping devices may illegally eavesdrop through the phone's microphone, posing a serious threat to personal privacy and security. Therefore, preventing mobile phones from being illegally recorded has become an urgent need.
[0003] Currently, products on the market that protect mobile phone privacy mainly focus on the software level, such as call encryption and privacy protection applications. However, there are no mature application solutions for physical-level anti-eavesdropping technology, especially ultrasonic anti-eavesdropping phone cases. With the increasing awareness of privacy protection and the advancement of ultrasonic materials, ultrasonic anti-eavesdropping phone cases are expected to become a highlight in mobile phone accessories. Utility Model Content
[0004] To address the aforementioned problems, this utility model provides an anti-eavesdropping device that can interfere with a mobile phone microphone using ultrasonic waves, thereby effectively preventing illegal recording and protecting user privacy.
[0005] This utility model adopts the following technical solution: an anti-eavesdropping device, comprising a phone case compatible with the mobile device, wherein the phone case has a built-in ultrasonic transmitting module, a drive control module, and a power management module, wherein...
[0006] The power management module is connected to both the ultrasonic transmitting module and the drive control module, and is used to provide power.
[0007] An ultrasonic transmitting module is configured to correspond to the microphone position of the mobile device and is used to emit ultrasonic signals;
[0008] A drive control module, connected to the ultrasonic transmitting module, is used to drive and control the ultrasonic transmitting module to emit ultrasonic signals.
[0009] Furthermore, the frequency of the ultrasonic signal emitted by the ultrasonic transmitting module is 20kHz to 100kHz.
[0010] Furthermore, the phone case also contains an environmental sensing module, which is connected to the drive control module and is used to detect environmental noise and feed it back to the drive control module.
[0011] Furthermore, the power management module includes resistors R1-R6, capacitors C1-C8, battery BT1, interface CN1, boost converter U1, power manager U2, MOSFET Q1, inductors L1 and L2, Zener diodes D1 and D2, LED1, and LED2. The boost converter U1 uses an MT3608 boost chip, and the power manager U2 uses a TP5400 charge / discharge management chip. Interface CN1 is used to connect to an external lithium battery. Pin 1 of interface CN1 is connected to the drain of MOSFET Q1 and then to the battery voltage VB. In the circuit, the gate of MOSFET Q1 is connected to one end of resistor R1. The source of MOSFET Q1 is connected to one end of capacitors C1 and C2, one end of inductor L1, resistor R2, and one end of pin 5 of boost converter U1. The other end of resistor R1 is connected to the other end of capacitors C1 and C2, and pin 2 of interface CN1, and then grounded. The other end of resistor R2 is connected to pin 4 of boost converter U1. Pin 1 of boost converter U1 is connected to the other end of inductor L1 and the positive terminal of Zener diode D1. Pin 3 of boost converter U1 is connected to one end of resistors R3 and R4. The negative terminal of the Zener diode D1 is connected to the other end of resistor R3 and one end of capacitors C3 and C4, and then connected to voltage VIN. The other end of resistor R4 is connected to the other end of capacitors C3 and C4 and then grounded. One end of resistor R5 is connected to voltage 5V, and the other end of resistor R5 is connected to the positive terminals of LED1 and LED2. The negative terminals of LED1 and LED2 are respectively connected to pins 4 and 2 of the power manager U2. One end of resistor R6 is grounded, and the other end of resistor R6 is connected to... Pin 3 of power manager U2 is connected to pin 1 of the Zener diode D2 and then connected to a voltage of 5V. Pin 8 of power manager U2 is connected to the positive terminal of the Zener diode D2 and one end of inductor L2. Pin 6 of power manager U2 is connected to the other end of inductor L2, one end of capacitors C6, C7, and C8, and the positive terminal of battery BT1. Pin 5 of power manager U2 is connected to one end of capacitor C5 and then connected to a voltage of 5V. The other end of capacitor C5 is connected to the other ends of capacitors C6, C7, and C8, and the negative terminal of battery BT1, and then grounded.
[0012] Furthermore, the environmental sensing module includes resistors R7 to R9, LEDs 3 to LED5, interface J1, and microphone sensor MIC1. The microphone sensor MIC1 uses a GMI6027P-2C44DB chip. One end of resistors R7, R8, and R9 is connected to the positive terminal of LEDs 3, 4, and 5, respectively. The negative terminals of LEDs 3, 4, and 5 are all grounded. Pin 1 of the microphone sensor MIC1 is connected to pin 2 of interface J1, and pin 2 of the microphone sensor MIC1 is connected to pin 1 of interface J1 and then grounded.
[0013] Furthermore, the ultrasonic transmitting module includes resistors R10-R13, drivers U3 and U4, ultrasonic transducers U5 and U6, MOSFETs Q2 and Q3, and inductors L3 and L4. Drivers U3 and U4 both use UCC27517DBVR driver chips, and ultrasonic transducers U5 and U6 both use GU1008C-40T chips. The ultrasonic transducers U5 and U6 are positioned corresponding to the microphone of the mobile device. Pins 2 and 4 of driver U3 are connected to ground. One end of resistor R10 is connected to pin 5 of driver U3, and the other end of resistor R10 is connected to the gate of MOSFET Q2. The source of MOSFET Q2 is connected to the gate of the ultrasonic transducer U3. Resistor R11 is connected to ground. The drain of MOSFET Q2 is connected to pin 2 of ultrasonic transducer U5 and one end of inductor L3. Pin 1 of ultrasonic transducer U5 is connected to the other end of inductor L3 and then connected to voltage VIN. Pins 2 and 4 of driver U4 are connected and then grounded. One end of resistor R12 is connected to pin 5 of driver U4. The other end of resistor R12 is connected to the gate of MOSFET Q3. The source of MOSFET Q3 is connected to ground via resistor R13. The drain of MOSFET Q3 is connected to pin 2 of ultrasonic transducer U6 and one end of inductor L4. Pin 1 of ultrasonic transducer U6 is connected to the other end of inductor L4 and then connected to voltage VIN.
[0014] Further, the drive control module includes a controller U7, a crystal oscillator X1, an antenna AT1, an inductor L5, and capacitors C9 to C18. The controller U7 uses an AC6323A4 chip. One end of capacitor C9 is connected to pin 1 of the controller U7. One end of capacitors C10 and C11 is connected to pin 2 of the controller U7. One end of capacitor C12 is connected to pin 3 of the controller U7. One end of capacitor C13 is connected to pin 4 of the controller U7. The other ends of capacitors C9 to C13 are connected to ground. Pin 20 of the controller U7 is connected to inductor L5 and then to one end of capacitors C14 and C15. The other ends of capacitors C14 and C15 are connected to ground. One end of capacitor C16... The capacitor C17 is connected to pin 1 of the crystal oscillator X1 and then to pin 7 of the controller U7. One end of the capacitor C17 is connected to pin 3 of the crystal oscillator X1 and pin 8 of the controller U7. The other end of the capacitor C17 is connected to pins 2 and 4 of the crystal oscillator X1 and the other end of the capacitor C16 and then grounded. The connection terminal of the antenna AT1 is connected to one end of the capacitor C18 and then grounded. The other end of the capacitor C18 is connected to pin 6 of the controller U7. Pins 3 of the drivers U3 and U4 are connected to pins 14 and 15 of the controller U7, respectively. The other ends of the resistors R7, R8, and R9 are connected to pins 15, 17, and 16 of the controller U7, respectively. Pin 1 of the microphone sensor MIC1 is connected to pin 16 of the controller U7.
[0015] The beneficial effect of this utility model is that it drives the ultrasonic transmitting module to emit ultrasonic signals at the microphone position of the mobile phone device through the drive control module, thereby playing an effective interference role and realizing the anti-eavesdropping function, which has good application value. Attached Figure Description
[0016] Figure 1 This is a structural block diagram of the present invention;
[0017] Figure 2 This is the circuit schematic diagram of the power management module in this utility model;
[0018] Figure 3 This is the circuit schematic diagram of the environmental sensing module in this utility model;
[0019] Figure 4 This is a circuit diagram of the ultrasonic transmitting module in this utility model;
[0020] Figure 5 This is the circuit schematic diagram of the drive control module in this utility model. Detailed Implementation
[0021] like Figures 1-5As shown, this utility model discloses an anti-eavesdropping device, including a phone case (not shown) that matches the mobile phone device. The phone case has a built-in ultrasonic transmitting module, a drive control module, an environmental sensing module, and a power management module.
[0022] The power management module is connected to both the ultrasonic transmitting module and the drive control module, and is used to provide power.
[0023] The environmental perception module, connected to the drive control module, is used to detect environmental noise, that is, to detect electromagnetic radiation in the environment to find hidden listening devices, and to feed back the detection signal to the drive control module.
[0024] An ultrasonic transmitting module is configured to correspond to the microphone position of the mobile device and is used to emit ultrasonic signals;
[0025] The drive control module, connected to the ultrasonic transmitting module, is used to drive and control the ultrasonic transmitting module to emit ultrasonic signals based on the signals fed back by the environmental sensing module.
[0026] The ultrasonic signal emitted by the ultrasonic transmitting module has a frequency of 20kHz to 100kHz.
[0027] The power management module includes resistors R1-R6, capacitors C1-C8, battery BT1, interface CN1, boost converter U1, power manager U2, MOSFET Q1, inductor L1, inductor L2, Zener diode D1, Zener diode D2, LED1, and LED2. Boost converter U1 uses an MT3608 boost chip, and power manager U2 uses a TP5400 charge / discharge management chip. Interface CN1 is used to connect an external lithium battery; pin 1 of interface CN1 is connected to the drain of MOSFET Q1, which in turn connects to the battery. With voltage VBAT, the gate of MOSFET Q1 is connected to one end of resistor R1. The source of MOSFET Q1 is connected to one end of capacitors C1 and C2, one end of inductor L1, resistor R2, and one end of pin 5 of boost converter U1. The other end of resistor R1 is connected to the other end of capacitors C1 and C2, pin 2 of interface CN1, and then grounded. The other end of resistor R2 is connected to pin 4 of boost converter U1. Pin 1 of boost converter U1 is connected to the other end of inductor L1 and the positive terminal of Zener diode D1. Pin 3 of boost converter U1 is connected to one end of resistors R3 and R4. The connections are as follows: the negative terminal of Zener diode D1 is connected to the other end of resistor R3 and one end of capacitors C3 and C4, and then connected to voltage VIN. The other end of resistor R4 is connected to the other end of capacitors C3 and C4 and then grounded. One end of resistor R5 is connected to 5V, and the other end of resistor R5 is connected to the positive terminals of LED1 and LED2. The negative terminals of LED1 and LED2 are connected to pins 4 and 2 of power manager U2, respectively. One end of resistor R6 is grounded, and the other end of resistor R6 is connected to the power supply. Pin 3 of power manager U2 and pin 1 of power manager U2 are connected to the negative terminal of Zener diode D2 and then connected to a voltage of 5V. Pin 8 of power manager U2 is connected to the positive terminal of Zener diode D2 and one end of inductor L2. Pin 6 of power manager U2 is connected to the other end of inductor L2, one end of capacitors C6, C7, and C8, and the positive terminal of battery BT1. Pin 5 of power manager U2 is connected to one end of capacitor C5 and then connected to a voltage of 5V. The other end of capacitor C5 is connected to the other end of capacitors C6, C7, and C8, and the negative terminal of battery BT1 and then grounded.
[0028] The environmental sensing module includes resistors R7-R9, LEDs LED3-LED5, interface J1, and microphone sensor MIC1. Microphone sensor MIC1 uses a GMI6027P-2C44DB chip. Interface J1 is used to connect an external environmental sensor, which can also be selected as an optical sensor, depending on the situation. Microphone sensor MIC1 has the function of detecting ambient sound. One end of resistors R7, R8, and R9 is connected to the positive terminal of LEDs LED3, LED4, and LED5, respectively. The negative terminals of LEDs LED3, LED4, and LED5 are all grounded. Pin 1 of microphone sensor MIC1 is connected to pin 2 of interface J1, and pin 2 of microphone sensor MIC1 is connected to pin 1 of interface J1 and then grounded.
[0029] The ultrasonic transmitting module includes resistors R10-R13, drivers U3 and U4, ultrasonic transducers U5 and U6, MOSFETs Q2 and Q3, and inductors L3 and L4. Drivers U3 and U4 both use UCC27517DBVR driver chips, and ultrasonic transducers U5 and U6 both use GU1008C-40T chips. The ultrasonic transducers U5 and U6 are positioned to correspond to the microphone position of the mobile phone device, meaning their frequency range is 20kHz to 100kHz. Pins 2 and 4 of driver U3 are connected to ground. One end of resistor R10 is connected to pin 5 of driver U3, and the other end of resistor R10 is connected to the MOSFET Q2. The gate of MOSFET Q2 is connected to the source of MOSFET Q2 via resistor R11 and then grounded. The drain of MOSFET Q2 is connected to pin 2 of ultrasonic transducer U5 and one end of inductor L3. Pin 1 of ultrasonic transducer U5 is connected to the other end of inductor L3 and then connected to voltage VIN. Pins 2 and 4 of driver U4 are connected and then grounded. One end of resistor R12 is connected to pin 5 of driver U4, and the other end of resistor R12 is connected to the gate of MOSFET Q3. The source of MOSFET Q3 is connected to the source of MOSFET Q3 via resistor R13 and then grounded. The drain of MOSFET Q3 is connected to pin 2 of ultrasonic transducer U6 and one end of inductor L4. Pin 1 of ultrasonic transducer U6 is connected to the other end of inductor L4 and then connected to voltage VIN.
[0030] The drive control module includes controller U7, crystal oscillator X1, antenna AT1, inductor L5, and capacitors C9 to C18. Controller U7 uses an AC6323A4 chip. One end of capacitor C9 is connected to pin 1 of controller U7. One end of capacitors C10 and C11 is connected to pin 2 of controller U7. One end of capacitor C12 is connected to pin 3 of controller U7. One end of capacitor C13 is connected to pin 4 of controller U7. The other ends of capacitors C9 to C13 are connected to ground. Pin 20 of controller U7 is connected to one end of capacitors C14 and C15 via inductor L5. The other ends of capacitors C14 and C15 are connected to ground. One end of capacitor C16 is connected to the crystal oscillator. Pin 1 of X1 is connected to pin 7 of controller U7. One end of capacitor C17 is connected to pin 3 of crystal oscillator X1 and pin 8 of controller U7. The other end of capacitor C17 is connected to pins 2 and 4 of crystal oscillator X1 and the other end of capacitor C16 and then grounded. The connection end of antenna AT1 is connected to one end of capacitor C18 and then grounded. The other end of capacitor C18 is connected to pin 6 of controller U7. Pins 3 of drivers U3 and U4 are connected to pins 14 and 15 of controller U7, respectively. The other ends of resistors R7, R8, and R9 are connected to pins 15, 17, and 16 of controller U7, respectively. Pin 1 of microphone sensor MIC1 is connected to pin 16 of controller U7.
[0031] This invention uses an environmental sensing module to detect environmental noise, specifically the frequency band of the eavesdropping device. Abnormal frequency signals are fed back to the drive control module, which then drives the ultrasonic transmitting module to emit ultrasonic signals. This focuses interference signals around the microphone of the mobile phone (e.g., a ±30° cone-shaped area with the microphone as its apex), preventing the eavesdropping device from effectively collecting microphone signals. Furthermore, it avoids omnidirectional radiation interference with the phone's antenna, Bluetooth, WiFi, and other normal communication functions, thus achieving anti-eavesdropping functionality. Compared to existing anti-eavesdropping technologies, it does not affect normal phone use, has good shielding effects, and is easy to carry.
[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0033] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. An anti-eavesdropping device, characterized by: This includes a phone case compatible with mobile devices, wherein the phone case incorporates an ultrasonic transmitting module, a drive control module, and a power management module. The power management module is connected to both the ultrasonic transmitting module and the drive control module, and is used to provide power. An ultrasonic transmitting module is configured to correspond to the microphone position of the mobile device and is used to emit ultrasonic signals; A drive control module, connected to the ultrasonic transmitting module, is used to drive and control the ultrasonic transmitting module to emit ultrasonic signals.
2. The anti-eavesdropping device according to claim 1, characterized in that: The ultrasonic signal emitted by the ultrasonic transmitting module has a frequency of 20kHz to 100kHz.
3. The anti-eavesdropping device according to claim 1, wherein: The phone case also contains an environmental sensing module, which is connected to the drive control module and is used to detect environmental noise and feed it back to the drive control module.
4. The anti-eavesdropping device of claim 1, wherein: The power management module includes resistors R1~R6, capacitors C1~C8, battery BT1, interface CN1, boost converter U1, power manager U2, MOSFET Q1, inductor L1, inductor L2, Zener diode D1, Zener diode D2, LED1, and LED2. The boost converter U1 uses an MT3608 boost chip, and the power manager U2 uses a TP5400 charge / discharge management chip. Interface CN1 is used to connect to an external lithium battery. Pin 1 of interface CN1 is connected to the drain of MOSFET Q1 and then to the battery voltage VBAT. The gate of the MOSFET Q1 is connected to one end of the resistor R1. The source of the MOSFET Q1 is connected to one end of the capacitors C1 and C2, one end of the inductor L1, the resistor R2, and one end of pin 5 of the boost converter U1. The other end of the resistor R1 is connected to the other end of the capacitors C1 and C2, and pin 2 of the interface CN1, and then grounded. The other end of the resistor R2 is connected to pin 4 of the boost converter U1. Pin 1 of the boost converter U1 is connected to the other end of the inductor L1 and the positive terminal of the Zener diode D1. Pin 3 of the boost converter U1 is connected to one end of the resistors R3 and R4. The negative terminal of the Zener diode D1 is connected to the other end of resistor R3 and one end of capacitors C3 and C4, and then connected to voltage VIN. The other end of resistor R4 is connected to the other end of capacitors C3 and C4 and then grounded. One end of resistor R5 is connected to voltage 5V, and the other end of resistor R5 is connected to the positive terminals of LED1 and LED2. The negative terminals of LED1 and LED2 are respectively connected to pins 4 and 2 of the power manager U2. One end of resistor R6 is grounded, and the other end of resistor R6 is connected to the power supply. Pin 3 of the power manager U2 is connected to the negative terminal of the Zener diode D2 and then connected to a voltage of 5V. Pin 8 of the power manager U2 is connected to the positive terminal of the Zener diode D2 and one end of the inductor L2. Pin 6 of the power manager U2 is connected to the other end of the inductor L2, one end of capacitors C6, C7, and C8, and the positive terminal of battery BT1. Pin 5 of the power manager U2 is connected to one end of capacitor C5 and then connected to a voltage of 5V. The other end of capacitor C5 is connected to the other ends of capacitors C6, C7, and C8, and the negative terminal of battery BT1, and then grounded.
5. The anti-eavesdropping device according to claim 3, wherein: The environmental sensing module includes resistors R7-R9, LEDs LED3-LED5, interface J1, and microphone sensor MIC1. The microphone sensor MIC1 uses a GMI6027P-2C44DB chip. One end of resistors R7, R8, and R9 is connected to the positive terminal of LEDs LED3, LED4, and LED5, respectively. The negative terminals of LEDs LED3, LED4, and LED5 are all grounded. Pin 1 of the microphone sensor MIC1 is connected to pin 2 of interface J1, and pin 2 of the microphone sensor MIC1 is connected to pin 1 of interface J1 and then grounded.
6. An anti-eavesdropping device according to claim 5, wherein: The ultrasonic transmitting module includes resistors R10-R13, drivers U3 and U4, ultrasonic transducers U5 and U6, MOSFETs Q2 and Q3, and inductors L3 and L4. Drivers U3 and U4 both use UCC27517DBVR driver chips, and ultrasonic transducers U5 and U6 both use GU1008C-40T chips. The ultrasonic transducers U5 and U6 are positioned corresponding to the microphone of the mobile device. Pins 2 and 4 of driver U3 are connected to ground. One end of resistor R10 is connected to pin 5 of driver U3, and the other end of resistor R10 is connected to the gate of MOSFET Q2. The source of MOSFET Q2 is connected to resistor R10-R13. After 11, the circuit is grounded. The drain of the MOS transistor Q2 is connected to pin 2 of the ultrasonic transducer U5 and one end of the inductor L3. Pin 1 of the ultrasonic transducer U5 is connected to the other end of the inductor L3 and then connected to the voltage VIN. Pins 2 and 4 of the driver U4 are connected and then grounded. One end of the resistor R12 is connected to pin 5 of the driver U4. The other end of the resistor R12 is connected to the gate of the MOS transistor Q3. The source of the MOS transistor Q3 is grounded after being connected to the resistor R13. The drain of the MOS transistor Q3 is connected to pin 2 of the ultrasonic transducer U6 and one end of the inductor L4. Pin 1 of the ultrasonic transducer U6 is connected to the other end of the inductor L4 and then connected to the voltage VIN.
7. An anti-eavesdropping device according to claim 6, characterized in that: The drive control module includes a controller U7, a crystal oscillator X1, an antenna AT1, an inductor L5, and capacitors C9~C18. The controller U7 uses an AC6323A4 chip. One end of capacitor C9 is connected to pin 1 of the controller U7. One end of capacitors C10 and C11 are connected together and then connected to pin 2 of the controller U7. One end of capacitor C12 is connected to pin 3 of the controller U7. One end of capacitor C13 is connected to pin 4 of the controller U7. The capacitors C9~... The other end of C13 is connected to ground. Pin 20 of the controller U7 is connected to one end of capacitors C14 and C15 after being connected to inductor L5. The other ends of capacitors C14 and C15 are connected to ground. One end of capacitor C16 is connected to pin 1 of crystal oscillator X1 and then to pin 7 of controller U7. One end of capacitor C17 is connected to pin 3 of crystal oscillator X1 and pin 8 of controller U7. The other end of capacitor C17 is connected to pins 2 and 4 of crystal oscillator X1 and the other end of the controller U7. The other end of C16 is connected to ground. The connection end of the antenna AT1 is connected to one end of the capacitor C18 and then grounded. The other end of the capacitor C18 is connected to pin 6 of the controller U7. Pins 3 of the drivers U3 and U4 are connected to pins 14 and 15 of the controller U7, respectively. The other ends of the resistors R7, R8, and R9 are connected to pins 15, 17, and 16 of the controller U7, respectively. Pin 1 of the microphone sensor MIC1 is connected to pin 16 of the controller U7.