Packaging equipment for producing single-sided PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of packaging for single-sided circuit board production, in particular to packaging equipment for PCB single-sided circuit board production, which comprises a support frame, the top of the support frame is fixedly connected with a fixing frame, one side of a top plate of a frame body of the fixing frame is fixedly connected with an extension plate, a lifting end of the bottom of a telescopic air cylinder is provided with a connecting seat, and the lifting end of the bottom of the telescopic air cylinder is provided with a connecting rod. An upper pressing head is fixedly connected to the bottom of the connecting base, an auxiliary packaging assembly is installed on the connecting base and the upper pressing head, a telescopic cavity is formed in the connecting base, the lifting end of the connecting base is inserted into the telescopic cavity and fixedly connected with a connecting piece, a spring is installed at the bottom of the connecting piece, and the bottom of the spring is connected to the bottom end face of the inner wall of the telescopic cavity. The supporting frame is provided with the deviation rectifying assembly, through cooperative operation of the auxiliary packaging assembly and the deviation rectifying assembly, the pressure requirements of PCBs with different thicknesses and different sizes can be met, circuit board deformation or packaging material overflow caused by traditional rigid pressing is avoided, and meanwhile the electrostatic elimination and deviation rectifying effects on the circuit board are achieved.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology for single-sided circuit board production, and more specifically, to a packaging device for single-sided PCB production. Background Technology

[0002] After the production of a single-sided PCB is completed, it needs to be packaged using packaging equipment. The packaging process is a key step to ensure the moisture resistance, insulation and mechanical strength of the PCB, which can guarantee the subsequent transportation and sale of the PCB.

[0003] A search revealed publication number (CN216700475U), which discloses a workbench for circuit board packaging. The workbench includes "a support adjustment mechanism, a conveying mechanism, a fixing mechanism, and a packaging mechanism. The conveying mechanism is located above the support adjustment mechanism, the fixing mechanism is located above the conveying mechanism, and the packaging mechanism is located above the conveying mechanism. The fixing mechanism can fix the circuit board at the upper end of the conveyor belt, preventing movement during packaging and ensuring greater stability. Furthermore, the built-in electric push rod and fixing plate can clamp the circuit board in the middle, preventing displacement during packaging and further improving packaging stability. Simultaneously, the support adjustment mechanism allows for adjustment of the overall height of the device, facilitating operation by workers of different heights and effectively improving operational convenience."

[0004] The above-mentioned patents still have shortcomings in actual use. The existing technology cannot adapt to the pressure requirements of PCB boards of different thicknesses and sizes during operation, resulting in deviations in the thickness of the encapsulation layer and uneven curing of the encapsulation material. In addition, the circuit board is prone to displacement during the encapsulation process, and dust will be attracted to the circuit board due to static electricity, which affects the smooth progress of the encapsulation operation.

[0005] Based on this, this utility model discloses a packaging device for the production of single-sided PCB circuit boards. Summary of the Invention

[0006] To address the problems mentioned in the background art, such as the inability of existing technologies to adapt to the pressure requirements of PCB boards of different thicknesses and sizes during operation, resulting in deviations in encapsulation layer thickness and uneven curing of encapsulation materials, as well as the tendency for circuit boards to shift during encapsulation and the attraction of dust due to static electricity, thus hindering the smooth progress of the encapsulation operation, this utility model provides an encapsulation device for single-sided PCB production. The device includes a support frame, a fixed frame fixed to the top of the support frame, and an extension plate fixed to one side of the top plate of the fixed frame. A linear guide rail is installed, and a moving block is installed on the linear guide rail. A telescopic cylinder is installed at the bottom of the moving block. A connecting seat is installed at the lifting end of the bottom of the telescopic cylinder. An upper pressure head is fixed to the bottom of the connecting seat. An auxiliary encapsulation assembly is installed on the connecting seat and the upper pressure head. The auxiliary encapsulation assembly contains a telescopic cavity. The telescopic cavity is opened inside the connecting seat. The lifting end of the connecting seat is inserted into the telescopic cavity and fixed to a connecting piece. A spring is installed at the bottom of the connecting piece. The bottom of the spring is connected to the bottom end face of the inner wall of the telescopic cavity. A correction assembly is installed on the support frame.

[0007] As a further improvement to this technical solution, the correction assembly includes a mounting frame, a rotating shaft is installed between the frames of the mounting frame, a nylon brush is rotatably mounted on the outside of the rotating shaft cross-section, the axis of the nylon brush is grounded, a small motor is installed on one side of the mounting frame, the output shaft end of the small motor is connected to one end of the rotating shaft, and fixed seats are symmetrically installed on both sides of the support frame below the rotating shaft, a fixed shaft is installed on the top of the fixed seat, and a guide plate is rotatably sleeved on the outside of the fixed shaft cross-section.

[0008] As a further improvement to this technical solution, support seats are fixedly connected to the top of both sides of the support frame. A screw is rotatably mounted on the body of each support seat. One end of the screw extends through the support seat and is fitted with a rotating ball. The other end of the screw extends through the support seat and is fitted with a rotating knob. A scale is fixedly connected to the end of the screw near the rotating knob. An indicator needle is mounted on the top of the support seat. The working trajectory of the indicator needle intersects with the working trajectory of the scale. The scale moves with the screw.

[0009] As a further improvement to this technical solution, replacement grooves are symmetrically opened on the bottom end face of the upper pressure head. Magnets are installed on the top end face of the inner wall of each replacement groove. A metal block can be stuck inside the replacement groove. A base frame is fixed to the bottom of the metal block. A packaging mold is fixed to the bottom end face of the base frame. A honeycomb copper heat-conducting mesh is embedded in the heating and pressing surface of the packaging mold, and the bottom edge of the vertical inner wall surface around the packaging mold is inclined.

[0010] As a further improvement to this technical solution, an air extraction hole is provided on the bottom end face of the upper pressure head. The working range of the air extraction hole is located at the opening position of the basic frame plate. A fan is installed on one side of the upper pressure head, and the fan can provide an air source for the air extraction hole.

[0011] As a further improvement to this technical solution, a packaging platform is fixedly connected to the top center of the support frame, and rotating rollers are symmetrically installed on both ends of the spring on the support frame body. A first packaging structure is installed at both ends of the support frame body. The first packaging structure includes a take-up roller and a lower sealing film. A second packaging structure is fixedly connected to the middle of the support frame. The second packaging structure includes a take-up roller, an upper sealing film, and a connecting frame.

[0012] Compared with existing technologies, the beneficial effects of this utility model are:

[0013] 1. In this packaging equipment for producing single-sided PCBs, the packaging mold can be easily replaced by the auxiliary packaging components, and the pressure requirements of circuit boards of different thicknesses can be adapted to avoid the deformation of the circuit board or the overflow of the packaging material caused by traditional rigid pressing. This enables rapid packaging of circuit boards of different thicknesses and sizes, while ensuring the uniform curing of the packaging material.

[0014] 2. In this packaging equipment for producing single-sided PCBs, the auxiliary operation of the correction component ensures that the circuit board can enter the working range of the auxiliary packaging component along a predetermined trajectory, while achieving the effect of removing static electricity from the circuit board, thus ensuring the smooth progress of subsequent packaging operations. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the installation position structure of the packaging stage for this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the connector of this utility model;

[0018] Figure 4 This is a schematic diagram of the upper pressure head of this utility model;

[0019] Figure 5 For practical purposes Figure 1 Enlarged structural diagram at point A;

[0020] The meanings of the labels in the diagram are as follows:

[0021] 1. Support frame; 2. Fixing frame; 3. Extension plate; 4. Moving block; 5. Telescopic cylinder; 6. Connecting seat; 7. Upper pressure head; 8. Telescopic cavity; 9. Spring; 10. Connecting piece; 11. Replacement slot; 12. Metal block; 13. Base frame; 14. Packaging mold; 15. Honeycomb copper heat-conducting mesh; 16. Air extraction hole; 17. Fan; 18. Mounting bracket; 19. Rotating shaft; 20. Nylon brush; 21. Small motor; 22. Fixing seat; 23. Guide plate; 24. Support seat; 25. Screw; 26. Rotating knob; 27. Scale; 28. Indicator needle; 29. ​​Packaging platform; 30. Rotating roller; 31. First packaging structure; 32. Second packaging structure. Detailed Implementation

[0022] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] Therefore, this utility model provides a packaging device for the production of single-sided PCB circuit boards. See [link / reference]. Figure 1 - Figure 4 As shown, it includes a support frame 1, a fixed frame 2 fixedly connected to the top of the support frame 1, an extension plate 3 fixedly connected to one side of the top plate of the fixed frame 2, a linear guide rail installed on the extension plate 3, a moving block 4 installed on the linear guide rail, a telescopic cylinder 5 installed at the bottom of the moving block 4, a connecting seat 6 installed at the lifting end of the bottom of the telescopic cylinder 5, an upper pressure head 7 fixedly connected to the bottom of the connecting seat 6, an auxiliary encapsulation assembly installed on the connecting seat 6 and the upper pressure head 7, the auxiliary encapsulation assembly containing a telescopic cavity 8, a telescopic cavity 8 opened inside the connecting seat 6, a connecting piece 10 fixedly connected to the lifting end of the connecting seat 6 inserted into the telescopic cavity 8, a spring 9 installed at the bottom of the connecting piece 10, the bottom of the spring 9 connected to the bottom end face of the inner wall of the telescopic cavity 8, and a correction assembly installed on the support frame 1. Linear guides are existing technology, and their internal structure and principle are the same as those of linear guides inside CNC machine tools. The linear guide drives the moving block 4 to move horizontally left and right. A receiving box can be set below the end of the extension plate 3 to facilitate the collection of packaged circuit boards. After the circuit board enters the working range of the upper pressure head 7, the bottom extension end of the telescopic cylinder 5 pushes the upper pressure head 7 down. The upper pressure head 7 covers the top of the circuit board for operation. When the thickness of the circuit board changes, the upper pressure head 7 will be subjected to an upward reaction force. At this time, since the bottom extension end of the telescopic cylinder 5 is in a stationary state, the spring 9 inside the telescopic cavity 8 will be compressed. The connecting piece 10 follows the telescopic cylinder 5 and remains stationary, so that the upper pressure head 7 drives the connecting seat 6 to move upward, which can adapt to the pressure requirements of PCB boards of different thicknesses and sizes.

[0024] The upper pressure head 7 has symmetrically arranged replacement slots 11 on its bottom end face. Magnets are installed on the top end face of the inner wall of each replacement slot 11. A metal block 12 can be held inside the replacement slot 11. A base frame 13 is fixedly connected to the bottom of the metal block 12. A packaging mold 14 is fixedly connected to the bottom end face of the base frame 13. A honeycomb copper heat-conducting mesh 15 is embedded in the heating and pressing surface of the packaging mold 14, and the bottom edge of the vertical inner wall of the packaging mold 14 is inclined. The inclined surface at the bottom of the packaging mold 14 allows the circuit board to smoothly enter the working range of the packaging mold 14 during packaging. The honeycomb copper heat-conducting mesh 15 optimizes the heat conduction path, reduces temperature differences in the packaging area, and avoids uneven material curing caused by local overheating. When packaging circuit boards of different sizes is required, a mold of appropriate size can be selected. The metal block 12 is inserted into the replacement slot 11 using the base frame 13. The metal block 12 is attracted to the inside of the replacement slot 11 by the magnet, allowing the corresponding size packaging mold 14 to be quickly replaced.

[0025] An air extraction hole 16 is provided on the bottom end face of the upper pressure head 7. The working area of ​​the air extraction hole 16 is located at the opening position of the base frame 13 plate. A fan 17 is installed on one side of the upper pressure head 7, and the fan 17 can provide air supply to the air extraction hole 16. The air extraction hole 16 can be used in conjunction with the packaging mold 14 to temporarily fix the circuit board during packaging and ensure that the packaged circuit board can be transported to the designated location.

[0026] A packaging platform 29 is fixedly attached to the top center of the support frame 1. Rotating rollers 30 are symmetrically installed on both ends of the spring 9 on the support frame 1. A first packaging structure 31 is installed at both ends of the support frame 1, and the first packaging structure 31 includes a take-up roller and a lower sealing film. A second packaging structure 32 is fixedly attached to the middle of the support frame 1, and the second packaging structure 32 includes a take-up roller, an upper sealing film, and a connecting frame. Before packaging the circuit board, the upper and lower sealing films are installed in designated positions using the take-up roller to facilitate the continuous packaging operation. The packaging platform 29 can cooperate with the packaging mold 14 to uniformly cure the packaging material. The rotating rollers 30 can evenly lay the lower sealing film on the top end face of the packaging platform 29 and realize the transportation of the circuit board to the working range of the packaging mold 14.

[0027] During operation, based on the structural design of the auxiliary packaging components and the dimensions of the circuit board to be packaged, a suitable packaging mold 14 is selected. Using the base frame 13, a metal block 12 is inserted into the replacement slot 11. The metal block 12 is attracted to the replacement slot 11 by a magnet, thus fixing the appropriately sized packaging mold 14 to the bottom of the upper pressure head 7. Subsequently, the circuit board to be packaged is placed on the lower mold in the first packaging structure 31. With the rotation of the rotating roller 30, the first packaging structure 31 can transport the circuit board to the second packaging structure 32. Within the range, the telescopic cylinder 5 then pushes the upper pressure head 7 downwards. The packaging mold 14 and the packaging platform 29 work together to utilize the uniform curing effect of the honeycomb copper heat-conducting mesh 15 to successfully encapsulate the circuit board inside the sealing film. At the same time, the fan 17 operates, and the working port of the air extraction hole 16 generates suction to adsorb the encapsulated circuit board into the structural groove of the packaging mold 14. Subsequently, the moving block 4 drives the telescopic cylinder 5 and the upper pressure head 7 to move along the linear guide rail to the end of the extension plate 3, so that the encapsulated circuit board is adsorbed and transported to the receiving box.

[0028] Further, see Figure 1 , Figure 5 As shown, the correction assembly includes a mounting bracket 18. A rotating shaft 19 is installed between the bracket bodies of the mounting bracket 18. A nylon brush 20 is rotatably mounted on the outside of the rotating shaft 19. The axis of the nylon brush 20 is grounded. A small motor 21 is installed on one side of the bracket body of the mounting bracket 18. The output shaft end of the small motor 21 is connected to one end of the rotating shaft 19. Fixed seats 22 are symmetrically installed on both sides of the support bracket 1 below the rotating shaft 19. A fixed shaft is installed on the top of the fixed seat 22, and a guide plate 23 is rotatably sleeved on the outside of the fixed shaft. A spring is installed between the fixed shaft and the guide plate 23. After the circuit board is placed on the lower sealing film of the first packaging structure 31, the small motor 21 on the mounting bracket 18 is started. The rotating shaft 19 drives the nylon brush 20 to rotate. The nylon brush 20 rubs the circuit board to eliminate static electricity on the surface of the circuit board and prevent the packaging material from adsorbing dust.

[0029] Support seats 24 are fixedly connected to the top of both sides of the support frame 1. A screw 25 is rotatably installed on the body of each support seat 24. One end of the screw 25 extends through the support seat 24 and is fitted with a rotating ball. The other end of the screw 25 extends through the support seat 24 and is fitted with a rotating knob 26. A scale 27 is fixedly connected to the end of the screw 25 near the rotating knob 26. An indicator needle 28 is installed on the top of the support seat 24. The working trajectory of the indicator needle 28 intersects with the working trajectory of the scale 27. The scale 27 moves with the screw 25. The movement trajectory of the guide plate 23 can be observed through the scale 27 to accommodate the packaging of circuit boards of different sizes. According to the size of the circuit board to be packaged, the rotation force is applied to the screw 25 by rotating the knob 26. The rotating ball pushes the guide plate 23 to shift towards the center of the support frame 1. The scale 27 moves together with the screw 25. By observing the relative movement position of the indicator needle 28 on the scale 27, the guide plate 23 is rotated to the appropriate position to achieve the guiding function for circuit boards of different sizes.

[0030] During operation, based on the dimensions of the circuit board to be packaged, a rotational force is applied to the screw 25 by rotating the knob 26. The rotating ball pushes the guide plate 23 to shift towards the center of the support frame 1. The scale 27 moves together with the screw 25. By observing the relative movement position of the indicator needle 28 on the scale 27, the guide plate 23 is rotated to the appropriate position, ensuring that the circuit board can enter the working range of the packaging mold 14 at the predetermined position. Subsequently, the circuit board is placed on the lower sealing film of the first packaging structure 31, and the small motor 21 on the mounting frame 18 is started. The rotating shaft 19 drives the nylon brush 20 to rotate. The nylon brush 20 rubs the circuit board to eliminate static electricity on the surface of the circuit board, ensuring the smooth progress of subsequent packaging operations.

[0031] In summary, this effectively solves the problems of existing technologies being unable to adapt to the pressure requirements of PCB boards of different thicknesses and sizes during operation, resulting in deviations in the thickness of the encapsulation layer and uneven curing of the encapsulation material. In addition, during the encapsulation process, the circuit board is prone to displacement, and dust can be attracted to the circuit board due to static electricity, affecting the smooth progress of the encapsulation operation.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present utility have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present utility, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging device for producing single-sided PCBs, comprising a support frame (1), characterized in that: A fixed frame (2) is fixedly connected to the top of the support frame (1). An extension plate (3) is fixedly connected to one side of the top plate of the fixed frame (2). A linear guide rail is installed on the extension plate (3), and a moving block (4) is installed on the linear guide rail. A telescopic cylinder (5) is installed at the bottom of the moving block (4). A connecting seat (6) is installed at the lifting end of the bottom of the telescopic cylinder (5). An upper pressure head (7) is fixedly connected to the bottom of the connecting seat (6). An auxiliary encapsulation component is installed on the connecting seat (6) and the upper pressure head (7). The auxiliary encapsulation component contains a telescopic cavity (8). The telescopic cavity (8) is opened inside the connecting seat (6). The lifting end of the connecting seat (6) is inserted into the telescopic cavity (8) and a connecting piece (10) is fixedly connected to it. A spring (9) is installed at the bottom of the connecting piece (10). The bottom of the spring (9) is connected to the bottom end face of the inner wall of the telescopic cavity (8). A correction component is installed on the support frame (1).

2. The packaging apparatus for producing a single-sided PCB according to claim 1, wherein: The correction assembly includes a mounting frame (18), a rotating shaft (19) is installed between the frames of the mounting frame (18), a nylon brush (20) is rotatably installed on the outside of the cross section of the rotating shaft (19), the axis of the nylon brush (20) is grounded, a small motor (21) is installed on one side of the frame of the mounting frame (18), the output shaft end of the small motor (21) is connected to one end of the rotating shaft (19), and fixed seats (22) are symmetrically installed on both sides of the support frame (1) below the rotating shaft (19), a fixed shaft is installed on the top of the fixed seat (22), and a guide plate (23) is rotatably sleeved on the outside of the cross section of the fixed shaft.

3. The packaging apparatus for producing a single-sided PCB according to claim 2, characterized in that: The support frame (1) has a support base (24) fixedly attached to the top of both sides of the frame. A screw (25) is rotatably mounted on the body of each support base (24). One end of the screw (25) extends through the support base (24) and is fitted with a rotating ball. The other end of the screw (25) extends through the support base (24) and is fitted with a rotating knob (26). A scale (27) is fixedly attached to the end of the screw (25) near the rotating knob (26). An indicator needle (28) is mounted on the top of the support base (24). The working trajectory of the indicator needle (28) intersects with the working trajectory of the scale (27). The scale (27) moves with the screw (25).

4. The packaging apparatus for producing a single-sided PCB according to claim 1, wherein: The upper pressure head (7) has symmetrical replacement grooves (11) on its bottom end face. Magnets are installed on the top end face of the inner wall of the replacement groove (11). A metal block (12) can be stuck inside the replacement groove (11). A base frame (13) is fixed to the bottom of the metal block (12). A packaging mold (14) is fixed to the bottom end face of the base frame (13). A honeycomb copper heat-conducting mesh (15) is embedded on the heating and pressing surface of the packaging mold (14). The bottom edge of the vertical inner wall surface of the packaging mold (14) is inclined.

5. The packaging apparatus for producing a single-sided PCB according to claim 4, wherein: An air extraction hole (16) is provided on the bottom end face of the upper pressure head (7). The working range of the air extraction hole (16) is located at the opening position of the plate of the foundation frame (13). A fan (17) is installed on one side of the upper pressure head (7), and the fan (17) can provide air source for the air extraction hole (16).

6. The packaging apparatus for producing a single-sided PCB according to claim 1, wherein: A packaging platform (29) is fixedly connected to the top center of the support frame (1). Rotating rollers (30) are symmetrically installed on both ends of the spring (9) on the support frame (1). A first packaging structure (31) is installed at both ends of the support frame (1). The first packaging structure (31) includes a take-up roller and a lower sealing film. A second packaging structure (32) is fixedly connected to the middle of the support frame (1). The second packaging structure (32) includes a take-up roller, an upper sealing film, and a connecting frame.

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