Ultra-thin LED power supply
By using a long strip PCB board and a planar transformer in the LED power supply, combined with a heat-conducting plate and heat dissipation fins, the problems of large thickness affecting aesthetics and poor heat dissipation are solved, achieving an ultra-thin LED power supply with both aesthetic appeal and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGMEN HUAHUI SMART POWER TECH CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-17
AI Technical Summary
Traditional LED power supplies are quite thick, which affects the product's aesthetics. Furthermore, reducing the thickness can lead to poor heat dissipation and a shortened lifespan.
It adopts a long strip PCB board and planar transformer design, combined with heat conduction and heat dissipation structures, including heat conduction plates, heat dissipation fins and thermal conductive silicone pads, to achieve rapid heat dissipation.
This reduces the overall thickness of the power supply, improving its aesthetics, while also effectively dissipating heat and extending its lifespan.
Smart Images
Figure CN224139236U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED power supply technology, specifically to an ultra-thin LED power supply. Background Technology
[0002] LED power supplies are the core components that drive LEDs to emit light. Their performance directly affects the brightness, lifespan, and system stability of LEDs. The energy conversion mechanism of LED power supplies is usually to convert AC power into DC voltage through a rectifier bridge, and then through a switching circuit, such as a PWM controller, to achieve step-down or step-up voltage. In real life, switching power supplies use MOSFET high-frequency switching to store electrical energy in an inductor or transformer, and then output stable DC through rectification and filtering.
[0003] Traditional LED power supplies are limited by the height of components such as transformers or the arrangement of electrical components, and the overall thickness usually exceeds 1cm. During use, due to the large thickness, it is not easy to hide and it can easily affect the aesthetics of the product. Trying to reduce the thickness as much as possible will affect the heat dissipation of components on the circuit board and reduce the lifespan of the power supply. Therefore, an ultra-thin LED power supply is proposed. Utility Model Content
[0004] To address the shortcomings of existing technologies, this utility model provides an ultra-thin LED power supply with advantages such as small thickness and good heat dissipation, solving the problems of traditional LED power supplies having a large thickness that affects product aesthetics and reducing thickness that affects heat dissipation.
[0005] To achieve the above objectives, this utility model provides the following technical solution: an ultra-thin LED power supply, including a housing and a PCB board fixed inside the housing. Several transformers are fixed on the top of the PCB board, and a rectifier module and a filter capacitor are provided on the outside of the transformers. A heat-conducting structure for heat dissipation is provided at the bottom of the PCB board, and a heat dissipation structure is provided on the surface of the housing in conjunction with the heat-conducting structure.
[0006] The heat-conducting structure includes a heat-conducting plate fixedly installed on the bottom of the PCB board. The bottom of the heat-conducting plate is embedded inside the outer shell and fixedly installed with the outer shell by a snap fastener. The bottom of the PCB board has several heat dissipation vents for use with the transformer.
[0007] The heat dissipation structure includes heat dissipation fins fixed to the bottom wall of the outer casing, and the bottom of the outer casing has a number of heat dissipation holes that cooperate with the heat dissipation fins for heat dissipation.
[0008] Furthermore, the outer shell is a long, slotted structure, and the PCB board is a long strip that adapts to the length and width of the outer shell, with several connection terminals fixed on its surface.
[0009] Furthermore, the rectifier module and filter capacitor are arranged horizontally in a single layer and fixed on the surface of the PCB board, and are electrically connected to the corresponding connection terminals.
[0010] Furthermore, the number of transformers is three, and the transformers are distributed on both sides of the PCB board surface according to the installation positions of the rectifier module and the filter capacitor.
[0011] Furthermore, the heat-conducting plate has several evenly distributed snap-fit slots on its left and right sides, and the inner wall of the outer shell is fixed with several limiting blocks that cooperate with the snap-fit slots.
[0012] Furthermore, the upper and lower surfaces of the heat-conducting plate are provided with mutually perpendicular flow channels, and the bottom flow channel is filled with a thermally conductive silicone sheet.
[0013] Furthermore, the bottom of the heat-conducting plate abuts against the surface of the heat dissipation fins, and the bottom heat dissipation fins of the thermally conductive silicone sheet are bonded together.
[0014] Compared with the prior art, the technical solution of this application has the following beneficial effects:
[0015] 1. This ultra-thin LED power supply uses a long strip-shaped PCB board to load components, reducing the density of components in the horizontal space of the PCB board. At the same time, the planar transformer reduces the overall height of the PCB board structure. With the protection of the casing, the overall thickness of the power supply is minimized, making it easier to hide the power supply and improving its aesthetics during use.
[0016] 2. This ultra-thin LED power supply uses a heat-conducting structure and a heat dissipation structure inside the casing to quickly dissipate the heat generated on the PCB board surface to the external environment, reducing heat accumulation on the PCB board and preventing components from being damaged or having their lifespan reduced due to excessive temperature. Attached Figure Description
[0017] Figure 1 This is a perspective view of the present utility model;
[0018] Figure 2 This is a connection diagram of the PCB board and the heat-conducting structure of this utility model;
[0019] Figure 3 This is a perspective view of the outer shell and heat dissipation structure of this utility model.
[0020] In the diagram: 1. Outer casing; 2. PCB board; 3. Transformer; 4. Rectifier module; 5. Filter capacitor; 6. Thermal conductive structure; 61. Heat-conducting plate; 62. Heat dissipation port; 63. Airflow channel; 64. Thermal conductive silicone pad; 7. Heat dissipation structure; 71. Heat dissipation fins; 72. Heat dissipation hole. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1 An ultra-thin LED power supply in this embodiment includes a housing 1 and a PCB board 2 fixed inside the housing 1. Several transformers 3 are fixed on the top of the PCB board 2. A rectifier module 4 and a filter capacitor 5 are provided on the outside of the transformers 3. A heat-conducting structure 6 for heat dissipation is provided at the bottom of the PCB board 2. A heat dissipation structure 7 is provided on the surface of the housing 1 in conjunction with the heat-conducting structure 6.
[0023] It should be noted that the heat-conducting structure 6, together with the heat dissipation structure 7, transfers the heat generated on the PCB board 2 to the air, thereby improving the service life of the electrical components on the PCB board 2.
[0024] In this embodiment, the outer shell 1 is a long, slotted structure, and the PCB board 2 is a long strip that adapts to the length and width of the outer shell 1, and has several connection terminals fixed on its surface.
[0025] It should be noted that the length of the outer casing 1 is slightly larger than that of the PCB board 2, so that the power supply size is as small as possible and the redundant space is reduced.
[0026] In this embodiment, the rectifier module 4 and the filter capacitor 5 are arranged horizontally in a single layer and fixed on the surface of the PCB board 2, and are electrically connected to the corresponding connection terminals.
[0027] It should be noted that by setting the electronic components to a single layer, the top height of PCB board 2 is reduced, thereby making the power supply height as small as possible.
[0028] In this embodiment, there are three transformers 3, which are distributed on both sides of the PCB board 2 according to the installation positions of the rectifier module 4 and the filter capacitor 5.
[0029] It should be noted that by adopting a planar transformer structure, the height of transformer 3 is reduced to the greatest extent, so that the thickness of the power board formed by PCB board 2 does not exceed 0.95cm, and the overall thickness after adding the outer shell 1 does not exceed 1.28cm.
[0030] Please see Figure 2To prevent the circuit board from overheating and damaging the components, the heat conduction structure 6 in this embodiment includes a heat conduction plate 61 fixedly installed at the bottom of the PCB board 2. The bottom of the heat conduction plate 61 is embedded inside the outer shell 1 and fixedly installed with the outer shell 1 by a snap fastener. The bottom of the PCB board 2 has several heat dissipation ports 62 for use with the transformer 3.
[0031] In this embodiment, the heat-conducting plate 61 has several evenly distributed snap-fit slots on its left and right sides, and the inner sidewall of the outer shell 1 is fixed with several limiting blocks that cooperate with the snap-fit slots.
[0032] By setting a limiting block to be embedded inside the buckle slot, the outer shell 1 limits the heat conduction plate 61, so that the PCB board 2 can be stably fixed inside the outer shell 1.
[0033] In this embodiment, the upper and lower surfaces of the heat-conducting plate 61 are provided with mutually perpendicular flow channels 63, and the bottom flow channel 63 is filled with a thermally conductive silicone sheet 64.
[0034] It should be noted that the staggered flow channels 63 on both sides of the heat-conducting plate 61 can achieve preliminary heat dissipation, while a thermally conductive silicone pad 64 is set inside the bottom flow channel 63 for auxiliary heat conduction.
[0035] Please see Figure 3 In order to transfer the internal heat to the external air to achieve the heat dissipation effect, the heat dissipation structure 7 in this embodiment includes heat dissipation fins 71 fixed to the inner bottom wall of the outer shell 1, and a plurality of heat dissipation holes 72 are provided at the bottom of the outer shell 1 to cooperate with the heat dissipation fins 71 for heat dissipation.
[0036] In this embodiment, the bottom of the heat-conducting plate 61 abuts against the surface of the heat dissipation fins 71, and the bottom heat dissipation fins 71 are bonded to the thermally conductive silicone sheet 64.
[0037] It should be noted that the heat sink 71 and the heat conduction plate 61 are in contact, and the thermal conductive silicone pad 64 conducts heat transfer inside the heat conduction plate 61, thereby transferring all the heat generated by the PCB board 2 to the heat sink 71, which is then distributed into the air.
[0038] All electrical components mentioned in this article are electrically connected to the controller and power supply. The control method of this utility model is controlled by the controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the art. Furthermore, this utility model is mainly used to protect mechanical devices, so the control method and circuit connection will not be explained in detail.
[0039] The working principle of the above embodiments is as follows:
[0040] (1) By setting up a long strip PCB board 2 to fix electrical components such as rectifier module 4 and filter capacitor 5, the long strip distribution reduces the number of electrical components in the same position. At the same time, it works with a planar transformer 3 to realize voltage transformation, minimizing the thickness of the overall power supply structure. During use, it can improve the aesthetics of the device.
[0041] (2) By setting the outer shell 1 to cover the bottom of the electrical components such as the PCB board 2, a heat-conducting plate 61 is set at the bottom of the PCB board 2 to carry away the heat generated by the components on the PCB board 2. The heat generated by the components such as the transformer 3, which generate more heat, is transferred to the heat-conducting plate 61 through the heat dissipation port 62 on the surface of the PCB board 2. At the same time, the outer shell 1, together with the heat dissipation fins 71 and the thermally conductive silicone pad 64, transfers the heat generated by the whole to the external environment, thereby achieving the cooling effect.
[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.
Claims
1. An ultra-thin LED power supply comprising a housing (1) and a PCB board (2) fixed inside the housing (1), characterized in that: The top of the PCB board (2) is fixed with several transformers (3), and the outside of the transformers (3) is provided with a rectifier module (4) and a filter capacitor (5). The bottom of the PCB board (2) is provided with a heat-conducting structure (6) for heat dissipation, and the surface of the outer shell (1) is provided with a heat dissipation structure (7) for use with the heat-conducting structure (6). The heat-conducting structure (6) includes a heat-conducting plate (61) fixedly installed at the bottom of the PCB board (2). The bottom of the heat-conducting plate (61) is embedded inside the shell (1) and fixedly installed with the shell (1) by a snap fastener. The bottom of the PCB board (2) has several heat dissipation vents (62) for use with the transformer (3). The heat dissipation structure (7) includes heat dissipation fins (71) fixed to the bottom wall of the outer shell (1), and the bottom of the outer shell (1) is provided with a plurality of heat dissipation holes (72) that cooperate with the heat dissipation fins (71) for heat dissipation.
2. The ultra-thin LED power supply of claim 1, wherein: The outer shell (1) is a long, slotted structure, and the PCB board (2) is a long strip that adapts to the length and width of the outer shell (1), and has several connecting terminals fixed on its surface.
3. The ultra-thin LED power supply of claim 2, wherein: The rectifier module (4) and filter capacitor (5) are arranged horizontally in a single layer and fixed on the surface of the PCB board (2), and are electrically connected to the corresponding connection terminals.
4. The ultra-thin LED power supply of claim 1, wherein: The number of transformers (3) is three, and the transformers (3) are distributed on both sides of the PCB board (2) according to the installation positions of the rectifier module (4) and the filter capacitor (5).
5. The ultra-thin LED power supply of claim 1, wherein: The heat-conducting plate (61) has several evenly distributed snap-fit slots on its left and right sides, and the inner wall of the outer shell (1) is fixed with several limiting blocks that cooperate with the snap-fit slots.
6. The ultra-thin LED power supply of claim 1, wherein: The heat-conducting plate (61) has flow channels (63) perpendicular to each other on its upper and lower surfaces, and the bottom flow channel (63) is filled with a thermally conductive silicone sheet (64).
7. The ultra-thin LED power supply of claim 6, wherein: The bottom of the heat-conducting plate (61) and the surface of the heat dissipation fins (71) are in contact, and the bottom heat dissipation fins (71) of the thermally conductive silicone sheet (64) are bonded.