Heat dissipation structure of multi-window split-screen liquid crystal display module

Abstract

The utility model discloses a heat dissipation structure of a multi-window split-screen liquid crystal display module, which relates to the technical field of heat dissipation structures of liquid crystal display modules and comprises an air bellow, a semiconductor refrigeration box is fixedly mounted on the upper side of the rear of the outer surface of the air bellow, and a circulating pump is fixedly mounted on the upper side of the front of the outer surface of the air bellow. And the circulating pump is connected with the semiconductor refrigeration box through a pipeline. Compared with an existing heat dissipation structure of a common multi-window split-screen liquid crystal display module, the heat dissipation structure of the multi-window split-screen liquid crystal display module has the advantages that the cooling performance at high temperature is greatly improved, it can be ensured that the module works in a constant low-temperature state even in a high-temperature environment, and the heat dissipation performance of the multi-window split-screen liquid crystal display module is improved through the air guide plate. The air is intercepted in the middle of the interior of the air bellow, the single-time air circulation amount is reduced, namely, the flow speed of the air at the air guide plate is reduced, at the moment, new air can ensure that the left side of the interior of the air bellow makes full contact with the copper pipe, and therefore it is ensured that follow-up circulation air is lower-temperature air obtained after heat exchange with the copper pipe.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation structure for liquid crystal display modules, specifically a heat dissipation structure for a multi-window split-screen liquid crystal display module. Background Technology

[0002] An LCD module is a liquid crystal display screen. The LCD screen can be divided into multiple areas to display different working windows, which is called multi-window splitting. When the LCD screen is working, the internal electrical components will generate a certain amount of heat. In order to prevent the display module from overheating and overloading or screen distortion, and to ensure the normal operation of the entire display screen, a heat dissipation structure needs to be installed to dissipate heat and cool the display screen.

[0003] Existing multi-window split-screen LCD display modules mostly employ heat dissipation structures that rely on airflow through vents for automatic cooling, or use fans to increase airflow and enhance heat dissipation. While these methods are suitable for normal environments, they are less effective in hot weather, such as summer. In such conditions, the ambient temperature is already very high, and combined with the heat generated by the display module itself, the outside air blown by the fan is also at a relatively high temperature. Therefore, in such situations, it is not only difficult to ensure proper cooling of the display module, but it may also cause the display module to overheat and become unusable.

[0004] Therefore, in view of this, we studied and improved the existing structure to address its shortcomings, and proposed a heat dissipation structure for a multi-window split-screen LCD display module. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation structure for a multi-window split-screen liquid crystal display module to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation structure for a multi-window split-screen LCD display module, comprising a fan box, a semiconductor cooling box fixedly installed on the upper rear side of the outer surface of the fan box, a circulation pump fixedly installed on the upper front side of the outer surface of the fan box, the circulation pump and the semiconductor cooling box being connected by a pipe, a copper pipe fixedly connected to the left side of the inner surface of the fan box by a bracket, the copper pipe being arranged in an "S" shape inside the fan box, the upper left end of the copper pipe penetrating the fan box and connecting to the semiconductor cooling box, the upper right end of the copper pipe penetrating the fan box and connecting to the circulation pump, a crossbeam fixedly installed in the middle of the inner surface of the fan box, and air guide plates fixedly installed on both the upper and lower sides of the crossbeam in the middle of the inner surface of the fan box, the left side of the surface of the air guide plate being triangular.

[0007] Preferably, a double-ended motor is fixedly installed on the right side of the crossbeam, and a fan is connected to the right end of the double-ended motor.

[0008] Preferably, the left end shaft of the dual-end motor is fixedly connected to a soft brush through the crossbar, and the soft brush is in contact with the surface of the copper tube.

[0009] Preferably, three air inlet slots are evenly distributed on the left side of the outer surface of the air box, and conveying slots are opened at the intervals between the air guide plate and the cross frame.

[0010] Preferably, a filter screen is fixedly installed on the right side of the inner surface of the air box, and the mesh count of the air inlet screen, the conveying screen, and the filter screen gradually increases from left to right.

[0011] Preferably, a mounting plate is fixedly installed on the right side of the outer surface of the bellows, and a sealing gasket is fixedly connected to the right side of the surface of the mounting plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model, through the arrangement of a semiconductor cooling box, a circulating pump, copper pipes, and an air guide plate, allows the display module to operate in a high-heat environment. The circulating pump draws the refrigerant from the semiconductor cooling box into the copper pipes. As the refrigerant travels through the copper pipes, it preferentially contacts the air at the left air inlet of the cooling box, exchanging heat with the air at a lower temperature. This lowers the temperature of the incoming and outgoing air before it is blown into the module for more effective and thorough cooling. The refrigerant that has undergone heat exchange flows back into the semiconductor cooling box, where it is cooled by the semiconductor, transforming into an even lower-temperature refrigerant, which is then drawn and transported again by the circulating pump. This cycle significantly improves cooling performance at high temperatures, ensuring the module maintains a constant low temperature even in high-temperature environments. Furthermore, the air guide plate intercepts air in the middle of the cooling box, reducing the volume of airflow and decreasing the air velocity at the guide plate location. This ensures that newly entering air is fully in contact with the copper pipes on the left side of the cooling box, guaranteeing that subsequent airflow is cooled after heat exchange with the copper pipes.

[0014] 2. This utility model utilizes an air intake mesh, a dual-end motor, a fan, a soft brush, a conveying mesh, and a filter. The dual-end motor drives the fan to rotate, causing air to enter the air box through the air intake mesh, then through the conveying mesh into the right side of the air box, and finally through the filter into the display module for ventilation and heat dissipation of the electrical components. As the air flows sequentially, the air intake mesh, conveying mesh, and filter filter the air in sequence, with the filtration fineness gradually increasing, ensuring that the air blown into the display module is cleaner and preventing dust from entering. The air intake mesh initially filters out large dust particles, while small dust particles enter the left side of the air box and adhere to the copper tubes. The dual-end motor also drives the soft brush to brush against the surface of the copper tubes, thus preventing a large amount of small dust particles from adhering and reducing the contact area between the copper tubes and the air, which would otherwise decrease the heat exchange effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the overall side sectional view of the present invention;

[0017] Figure 3 This is a schematic diagram of the overall frontal sectional structure of this utility model.

[0018] In the diagram: 1. Air box; 2. Semiconductor refrigeration box; 3. Circulation pump; 4. Copper pipe; 5. Air inlet mesh trough; 6. Horizontal frame; 7. Air guide plate; 8. Dual-end motor; 9. Fan; 10. Soft brush; 11. Conveyor mesh trough; 12. Filter screen; 13. Mounting plate; 14. Sealing gasket. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figures 1-3As shown, a heat dissipation structure for a multi-window split-screen LCD display module includes a fan box 1. A semiconductor cooling box 2 is fixedly installed on the upper rear side of the outer surface of the fan box 1. A circulation pump 3 is fixedly installed on the upper front side of the outer surface of the fan box 1. The circulation pump 3 and the semiconductor cooling box 2 are connected by a pipe. A copper pipe 4 is fixedly connected to the left side of the inner surface of the fan box 1 by a bracket. The copper pipe 4 is located inside the fan box 1 and is set in an "S" shape. The upper left end of the copper pipe 4 passes through the fan box 1 and connects to the semiconductor cooling box 2. The upper right end of the copper pipe 4 passes through the fan box 1 and connects to the circulation pump 3. A crossbeam 6 is fixedly installed in the middle of the inner surface of the fan box 1. Air guide plates 7 are fixedly installed on both the upper and lower sides of the crossbeam 6 in the middle of the inner surface of the fan box 1. The left side of the surface of the air guide plate 7 is set in a triangular shape.

[0021] By adopting the above technical solution, when the display module is working in a high-heat environment, the circulating pump 3 can draw the refrigerant in the semiconductor cooling box 2 and transport it into the copper pipe 4. When the refrigerant is transported in the copper pipe 4, it will preferentially contact the air at the left air inlet of the air box 1, thereby exchanging heat with the air at a lower temperature, so that the air inlet and outlet are reduced to a lower temperature and then blown into the module for more effective and sufficient cooling and heat dissipation.

[0022] The heat exchanged cold medium will flow back into the semiconductor refrigeration box 2, where it will be cooled by the semiconductor and transformed into a cold medium at an even lower temperature. It will then be pumped and transported again by the circulation pump 3, and so on.

[0023] By using the air guide plate 7, the air will be intercepted in the middle of the air box 1, reducing the single air flow and thus reducing the air velocity at the air guide plate 7. At this time, the newly entering air will ensure that it is located on the left side of the air box 1 and fully contacts the copper pipe 4 for heat exchange.

[0024] Furthermore, a double-ended motor 8 is fixedly installed on the right side of the surface of the cross frame 6, and a fan 9 is connected to the right end of the double-ended motor 8.

[0025] By adopting the above technical solution, the fan 9 can draw in fresh air from the outside and blow it into the display module to cool down the electrical components.

[0026] Furthermore, the left end shaft of the dual-end motor 8 is fixedly connected to a soft brush 10 through the crossbeam 6, and the soft brush 10 is in contact with the surface of the copper tube 4.

[0027] By adopting the above technical solution, small dust particles and impurities will enter the left side of the air box 1 and adhere to the copper tube 4. The dual-end motor 8 can also drive the soft brush 10 to brush against the surface of the copper tube 4, thereby avoiding the large-scale adhesion of small dust particles, which would reduce the contact area between the copper tube 4 and the air, thus reducing the heat exchange effect.

[0028] Furthermore, three air inlet slots 5 are evenly distributed on the left side of the outer surface of the wind box 1, and conveying slots 11 are opened at the intervals between the air guide plate 7 and the cross frame 6; a filter screen 12 is fixedly installed on the right side of the inner surface of the wind box 1, and the mesh count of the air inlet slots 5, conveying slots 11 and filter screen 12 gradually increases from left to right.

[0029] The surfaces of the air intake mesh 5, the conveying mesh 11, and the filter mesh 12 are also provided with fine dust filter cloth from left to right.

[0030] By adopting the above technical solution, when the air flows in sequence, the air inlet mesh 5, the conveying mesh 11 and the filter 12 will filter the air in sequence, and the fineness of the filtration will gradually increase, thereby ensuring that the air blown into the display module is cleaner and preventing dust from entering.

[0031] Furthermore, a mounting plate 13 is fixedly installed on the right side of the outer surface of the bellows 1, and a sealing gasket 14 is fixedly connected to the right side of the surface of the mounting plate 13.

[0032] By adopting the above technical solution, the entire air box 1 can be assembled at the air inlet of the display module using the mounting plate 13, so that air can enter the module through the air box 1 for heat dissipation.

[0033] The sealing gasket 14 prevents air leakage at the installation joints, ensuring that air can only enter the module through the bellows 1.

[0034] Working Principle: When using the heat dissipation structure of this multi-window split-screen LCD display module, firstly, the air box 1 is fixedly mounted to the heat dissipation port of the display module via the mounting plate 13. During normal operation, only the dual-end motor 8 needs to be started to drive the fan 9 to rotate. The fan 9 will cause air to enter the air box 1 through the air intake mesh 5, then enter the right side of the air box 1 through the conveying mesh 11, and finally be blown into the display module through the filter screen 12 to ventilate and dissipate heat for the electrical components. As the air flows sequentially, the air intake mesh 5, the conveying mesh 11, and the filter screen 12 will filter the air sequentially, and the filtration fineness will gradually increase, thereby ensuring that the air blown into the display module is cleaner and preventing dust from entering. The air intake mesh 5 initially filters large dust particles and impurities, while small dust particles and impurities will enter the left side of the air box 1 and adhere to the copper pipe 4. The dual-end motor 8 can also drive the soft brush 10 to brush against the surface of the copper pipe 4, thereby avoiding a large amount of small dust particles adhering. In the already high-temperature environment, the fan 9 blows air from the outside environment. When the cooling effect of fresh air weakens, the circulating pump 3 can draw the refrigerant from the semiconductor cooling box 2 and transport it into the copper pipe 4. When the refrigerant is transported in the copper pipe 4, it will preferentially contact the air at the left air inlet of the air box 1, thereby exchanging heat with the air at a lower temperature. This lowers the temperature of the incoming and outgoing air and then blows it into the module for more effective and thorough cooling. The refrigerant that has exchanged heat will flow back into the semiconductor cooling box 2, where it will be cooled by the semiconductor and transformed into a refrigerant at an even lower temperature. It will then be drawn and transported by the circulating pump 3 again. This cycle continues. Furthermore, the air guide plate 7 will intercept the air in the middle of the air box 1, reducing the amount of airflow per pass and thus reducing the air velocity at the air guide plate 7. This ensures that the newly entering air is in full contact with the copper pipe 4 on the left side of the air box 1, ensuring that the airflow that follows is cooler air after exchanging heat with the copper pipe 4. This is the working principle of the heat dissipation structure of the multi-window split-screen LCD display module.

Claims

1. A heat dissipation structure of a multi-window split-screen liquid crystal display module, comprising a wind box (1), characterized in that, A semiconductor cooling box (2) is fixedly installed on the upper rear side of the outer surface of the air box (1). A circulation pump (3) is fixedly installed on the upper front side of the outer surface of the air box (1). The circulation pump (3) and the semiconductor cooling box (2) are connected by a pipe. A copper pipe (4) is fixedly connected to the left side of the inner surface of the air box (1) by a bracket. The copper pipe (4) is located inside the air box (1) and is set in an "S" shape. The upper left end of the copper pipe (4) passes through the air box (1) and is connected to the semiconductor cooling box (2). The upper right end of the copper pipe (4) passes through the air box (1) and is connected to the circulation pump (3). A crossbeam (6) is fixedly installed in the middle of the inner surface of the air box (1). A guide plate (7) is fixedly installed on both the upper and lower sides of the crossbeam (6) in the middle of the inner surface of the air box (1). The left side of the surface of the guide plate (7) is set in a triangular shape.

2. The heat dissipation structure of a multi-window split-screen liquid crystal display module according to claim 1, characterized in that, A double-ended motor (8) is fixedly installed on the right side of the surface of the cross frame (6), and a fan (9) is connected to the right end of the double-ended motor (8).

3. The heat dissipation structure of a multi-window split-screen liquid crystal display module according to claim 2, characterized in that, The left end shaft of the dual-end motor (8) is fixedly connected to a soft brush (10) through the cross frame (6), and the soft brush (10) is in contact with the surface of the copper tube (4).

4. The heat dissipation structure of a multi-window split-screen liquid crystal display module according to claim 1, characterized in that, Three air inlet slots (5) are evenly distributed on the left side of the outer surface of the wind box (1), and conveying slots (11) are opened at the intervals between the air guide plate (7) and the cross frame (6).

5. The heat dissipation structure of a multi-window split-screen liquid crystal display module according to claim 1, characterized in that, A filter screen (12) is fixedly installed on the right side of the inner surface of the air box (1), and the mesh count of the air inlet mesh groove (5), the conveying mesh groove (11) and the filter screen (12) distributed from left to right gradually increases.

6. The heat dissipation structure of a multi-window split-screen liquid crystal display module according to claim 1, characterized in that, An mounting plate (13) is fixedly installed on the right side of the outer surface of the bellows (1), and a sealing gasket (14) is fixedly connected to the right side of the surface of the mounting plate (13).

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