Crystal core screen die bonding jig

Abstract

The utility model relates to a crystal core screen die bonding jig which comprises a substrate and a positioning plate, the positioning plate is provided with a plurality of wafer holes which are arranged in a penetrating mode, the wafer holes are distributed in the positioning plate in an array mode, the wafer holes correspond to light-emitting wafers respectively, when a crystal core screen is produced, a PET plate is located between the substrate and the positioning plate, and when the light-emitting wafers need to be welded and fixed on the PET plate, the light-emitting wafers are welded and fixed on the PET plate. The substrate and the positioning plate are used for clamping and fixing the two sides of the PET plate, and then the wafer holes are used for performing array positioning on the positions, where the luminous wafers need to be welded and fixed, on the surface of the PET plate, so that the luminous wafers are quickly and uniformly welded and fixed on the surface of the PET plate during welding, and meanwhile, the substrate and the positioning plate can be repeatedly utilized. The method has the effect of reducing the positioning cost of the light-emitting wafer produced by the crystal core screen.

Description

Technical Field

[0001] This application relates to the field of crystal chip screen manufacturing, and in particular to a crystal chip screen die bonding fixture. Background Technology

[0002] A crystal chip screen is a type of high frame rate LED display. During the production of a crystal chip screen, it is generally necessary to weld and fix the light-emitting wafers (LED chips) on a PET board. In order to achieve a better display effect, it is necessary to ensure that the arrangement of the light-emitting wafers fixed on the PET board is uniform. Therefore, the fixing position of the light-emitting wafers needs to be precisely positioned to ensure that the light-emitting wafers are evenly arranged on the PET board.

[0003] The precise positioning of existing light-emitting wafers on PET boards is generally achieved using lasers.

[0004] Regarding the aforementioned technologies, using lasers for precise positioning of light-emitting wafers is costly and therefore not economically viable. Summary of the Invention

[0005] In order to reduce the cost of positioning light-emitting wafers in the production of crystal core screens, this application provides a crystal core screen die bonding fixture.

[0006] The crystal chip screen die bonding fixture provided in this application adopts the following technical solution:

[0007] A crystal core screen die bonding fixture includes a substrate and a positioning plate. The positioning plate has a plurality of through-hole wafer holes, and each wafer hole is distributed in an array on the positioning plate. Each wafer hole corresponds to a light-emitting wafer. During the production of the crystal core screen, a PET board is located between the substrate and the positioning plate.

[0008] By adopting the above technical solution, when the PET board needs to be welded and fixed with light-emitting wafers, the substrate and positioning plate clamp and fix the two sides of the PET board. Then, each wafer hole is arrayed and positioned on the surface of the PET board where the light-emitting wafer needs to be welded and fixed. This allows the light-emitting wafers to be quickly and evenly welded and fixed on the surface of the PET board during welding. At the same time, the substrate and positioning plate can be reused repeatedly, which improves the problem of high positioning cost and poor economic efficiency when using laser for precise positioning of light-emitting wafers.

[0009] Optionally, the positioning plate has multiple through-holes, and the base plate has multiple positioning posts fixedly disposed thereon. When the positioning plate and the base plate are connected, each positioning post passes through each of the positioning holes.

[0010] Optionally, the positioning plate includes a magnetic metal, and the substrate is fixedly provided with a plurality of magnetic components so that the positioning plate and the substrate are magnetically attracted and fixed.

[0011] Optionally, each of the magnetic attraction arrays is distributed on the substrate.

[0012] Optionally, the positioning plate has a through mounting groove, which is used to position the control module of the PET board for installation.

[0013] Optionally, the substrate includes a first fixing area and a second fixing area, each of the magnetic components is located in the first fixing area, and the second fixing area is disposed opposite to the mounting groove.

[0014] Optionally, the positioning plate includes a first plate and a second plate, and when the positioning plate is installed on the substrate, the first plate and the second plate abut against each other.

[0015] Optionally, the substrate material may include synthetic stone.

[0016] Optionally, the substrate is slidably fitted with multiple positioning blocks, and when the substrate and positioning plate clamp and position the PET board, each positioning block abuts against the positioning plate.

[0017] Optionally, each of the positioning blocks is provided with a positioning groove. When each of the positioning blocks abuts against the positioning plate, each of the positioning rods passes through each of the positioning grooves and is engaged and fixed with each positioning groove.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] When a PET board needs to be welded and fixed with a light-emitting wafer, the substrate and positioning plate clamp and fix the two sides of the PET board. Then, each wafer hole is arrayed and positioned on the surface of the PET board where the light-emitting wafer needs to be welded and fixed. This allows the light-emitting wafer to be quickly and evenly welded and fixed on the surface of the PET board during welding. At the same time, the substrate and positioning plate can be reused, which improves the problem of high positioning cost and poor economic efficiency when using laser for precise positioning of light-emitting wafers. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1;

[0021] Figure 2 This is a schematic diagram of the substrate structure in Embodiment 1;

[0022] Figure 3 This is a schematic diagram of the positioning plate structure in Embodiment 1;

[0023] Figure 4 yes Figure 3 Enlarged view of part A;

[0024] Figure 5 This is a schematic diagram of the overall structure of Embodiment 2;

[0025] Figure 6 This is a schematic diagram of the positioning block structure in Embodiment 2;

[0026] Figure 7 This is a schematic diagram of the fixture clamping the PET sheet;

[0027] Figure 8 This is a schematic diagram showing the positioning of the wafer aperture to the light-emitting wafer.

[0028] Explanation of reference numerals in the attached drawings: 1. Substrate; 11. First fixing area; 12. Second fixing area; 13. Magnetic component; 14. Positioning post; 2. Positioning plate; 21. Positioning hole; 22. Wafer hole; 201. First plate body; 2011. Mounting groove; 202. Second plate body; 3. Positioning block; 31. Positioning groove; 10. PET plate; 20. Light-emitting wafer. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0030] This application discloses a die-bonding fixture for a semiconductor chip. (Refer to...) Figure 1 A crystal core screen bonding fixture includes a substrate 1 and a positioning plate 2, wherein the positioning plate 2 is disposed on the substrate 1.

[0031] Reference Figure 2 The substrate 1 is rectangular and includes a first fixing area 11 and a second fixing area 12. The second fixing area 12 is rectangular and located inside the first fixing area 11. The first fixing area 11 encloses the second fixing area 12. A plurality of magnetic elements 13 are fixedly disposed on one side of the bottom of the substrate 1. Each magnetic element 13 is located in the first fixing area 11 and is evenly distributed in an array in the first fixing area 11, thereby forming a plurality of strong magnetic points in the first fixing area 11, thereby making the substrate 1 magnetic. In this embodiment, the substrate 1 is made of synthetic stone and each magnetic element 13 is made of magnet.

[0032] Reference Figure 1 The substrate 1 is fixedly provided with a plurality of positioning posts 14, and the positioning plate 2 is provided with a plurality of through positioning holes 21. When the positioning plate 2 is connected to the substrate 1, each positioning post 14 is respectively inserted into each positioning hole 21, thereby stabilizing the connection position between the substrate 1 and the positioning plate 2.

[0033] Reference Figure 3 and Figure 4The positioning plate 2 is rectangular and has several through-holes 22, each of which is square. These holes are arrayed on the positioning plate 2, each corresponding to a light-emitting wafer. The positioning plate 2 includes a first plate 201 and a second plate 202. When the positioning plate 2 is mounted on the substrate 1, the first plate 201 and the second plate 202 abut against each other. The distance between the wafer holes 22 located on the first plate 201 and closest to the second plate 202 and the wafer holes 22 located on the second plate 202 and closest to the first plate 201 is... The array spacing of each wafer aperture 22 is the same. The first plate 201 has a through mounting groove 2011 at the end away from the second plate 202. The mounting groove 2011 is used to position the control module of the PET board. In this embodiment, the positioning plate 2 is made of magnetic steel sheet. When the positioning plate 2 and the substrate 1 are connected, the substrate 1 uses each magnetic attraction component to magnetically fix the positioning plate 2. This makes the clamping and fixing stability of the positioning plate 2 and the substrate 1 on both sides of the PET board better when the PET board is installed between the positioning plate 2 and the substrate 1.

[0034] The implementation principle of the crystal core screen fixing fixture in this application embodiment is as follows: When the PET board needs to be welded and fixed with light-emitting wafers, the substrate 1 and the positioning plate 2 clamp the two sides of the PET board. The substrate 1 and the positioning plate 2 are magnetically fixed by various magnetic suction components. Then, each wafer hole 22 is arrayed and positioned at the position on the surface of the PET board where the light-emitting wafers need to be welded and fixed. This allows the light-emitting wafers to be quickly and evenly welded and fixed to the surface of the PET board during welding. At the same time, the substrate 1 and the positioning plate 2 can be reused repeatedly, which improves the problem of high positioning cost and poor economic efficiency when using laser for precise positioning of light-emitting wafers.

[0035] Example 2.

[0036] Reference Figure 5 and Figure 6 The main technical difference between Embodiment 2 and Embodiment 1 is that the crystal core screen fixing fixture further includes multiple positioning blocks 3. Each positioning block 3 slides along the width direction of the substrate 1 and is fitted onto the substrate 1. When the substrate 1 and the positioning plate 2 clamp and position the PET board, each positioning block 3 slides towards the positioning plate 2 until each positioning block 3 abuts against the positioning plate 2, thereby further increasing the stability of the connection between the substrate 1 and the positioning plate 2, making it less likely for the positioning plate 2 to detach from the substrate 1. Each positioning block 3 has a positioning groove 31. When each positioning block 3 abuts against the positioning plate 2, each positioning rod passes through each positioning groove 31 and is locked and fixed to each positioning groove 31, thereby making the position of each positioning block 3 more stable, and thus making the abutment fit between each positioning block 3 and the positioning plate 2 more stable.

[0037] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A die bonding fixture for a crystal core screen, characterized in that: The device includes a substrate (1) and a positioning plate (2). The positioning plate (2) has a plurality of through-hole wafer holes (22). Each wafer hole (22) is arrayed on the positioning plate (2). Each wafer hole (22) corresponds to a light-emitting wafer. During the production of the chip screen, the PET board is located between the substrate (1) and the positioning plate (2).

2. The die core die bonding tool according to claim 1, wherein: The positioning plate (2) has multiple through-holes (21), and the base plate (1) is fixedly provided with multiple positioning posts (14). When the positioning plate (2) and the base plate (1) are connected, each positioning post (14) passes through each positioning hole (21).

3. The die core die bonding tool according to claim 1, wherein: The positioning plate (2) includes magnetic metal, and the substrate (1) is fixedly provided with a plurality of magnetic components (13) so that the positioning plate (2) and the substrate (1) are magnetically attracted and fixed.

4. The die core die bonding tool according to claim 3, wherein: Each of the magnetic components (13) is arrayed on the substrate (1).

5. The die core die bonding tool according to claim 3, wherein: The positioning plate (2) has a through mounting groove (2011) for positioning the control module of the PET board.

6. The die core die bonding tool according to claim 5, wherein: The substrate (1) includes a first fixing area (11) and a second fixing area (12). Each of the magnetic components (13) is located in the first fixing area (11), and the second fixing area (12) is directly opposite to the mounting groove (2011).

7. The die core die bonding tool of claim 1, wherein: The positioning plate (2) includes a first plate body (201) and a second plate body (202). When the positioning plate (2) is installed on the substrate (1), the first plate body (201) and the second plate body (202) abut against each other.

8. The die core die bonding tool of claim 1, wherein: The substrate (1) is made of synthetic stone.

9. The die core die bonding tool of claim 1, wherein: The substrate (1) is slidably fitted with a plurality of positioning blocks (3). When the substrate (1) and the positioning plate (2) clamp and position the PET board, each of the positioning blocks (3) abuts against the positioning plate (2).

10. The die core die bonding tool of claim 9, wherein: Each of the positioning blocks (3) is provided with a positioning groove (31). When each of the positioning blocks (3) and the positioning plate (2) abut against each other, each of the positioning plates (2) passes through each of the positioning grooves (31) and is locked and fixed with each of the positioning grooves (31).

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