Etching device for semiconductor chip production
By designing a limiting mechanism and a driving mechanism, combined with vents and a one-way valve, the semiconductor chip etching device achieves automated operation and sealing, solves the problem of harmful gas leakage, and improves safety and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 魏建辉
- Filing Date
- 2025-05-26
- Publication Date
- 2026-04-17
AI Technical Summary
Traditional semiconductor chip etching equipment releases a large amount of harmful gas when the chamber is opened after etching is completed, posing a health risk to workers.
An etching device including a limiting mechanism and a driving mechanism was designed. The inlet and outlet are sealed by a cover plate, and combined with air holes and one-way valves, harmful gases are prevented from escaping. The placement box is automatically moved up and down by an electric push rod, reducing manual operation.
It effectively prevents the leakage of harmful gases, protects the health of workers, improves the safety of the working environment, reduces labor intensity, and improves work efficiency and the stability and reliability of the etching process.
Smart Images
Figure CN224139420U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor chip manufacturing technology, and in particular to an etching apparatus for semiconductor chip manufacturing. Background Technology
[0002] Semiconductor chips are semiconductor devices that perform specific functions, manufactured on semiconductor wafers through processes such as etching and wiring. Common materials include not only silicon but also gallium arsenide and germanium. The invention of the semiconductor chip is considered a great innovation of the 20th century, ushering in a new chapter in the information age. In the semiconductor chip manufacturing process, etching is one of the most frequently used and extremely important steps.
[0003] However, traditional semiconductor chip etching equipment has obvious drawbacks. It uses manual placement of chips into the etching chamber for etching. After etching is completed, a large amount of harmful gas will escape when the chamber is opened, which will seriously endanger the health of the workers and affect their normal work. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides an etching device for semiconductor chip production, which solves the problem that a large amount of harmful gas will overflow when the box is opened after the etching is completed, which will seriously endanger the health of the workers.
[0005] This utility model provides an etching device for semiconductor chip production, comprising a housing, with an outlet pipe and an inlet pipe fixedly connected to the right end of the housing, the outlet pipe being directly below the inlet pipe. An inlet and outlet are provided on the upper surface of the housing. A sleeve is fixedly connected inside the housing, located directly below the inlet and outlet. A placement box is disposed inside the sleeve, with through holes on both its left and right end faces. The outer wall of the placement box abuts against the inner wall of the sleeve. A limiting mechanism is provided at the upper end of the housing, with a cover plate inside the limiting mechanism for sealing the inlet and outlet. The device also includes...
[0006] A drive mechanism is located inside the housing and is used to drive the placement box to move up and down.
[0007] Preferably, the limiting mechanism includes a first upright and a second upright, each in a pair, and fixedly connected to the upper end of the box located on the left and right sides of the inlet and outlet. The first upright is located directly behind the second upright. A first limiting groove is formed on the adjacent end face of the first upright, and a second limiting groove is formed on the adjacent end face of the second upright. An arc-shaped rod is fixedly connected to the upper end of the second upright, and an arc-shaped groove is formed on the adjacent end face of the arc-shaped rod. The arc-shaped groove communicates with the second limiting groove, and the upper end of the first upright is fixedly connected to the lower end of the arc-shaped groove.
[0008] Preferably, the first limiting groove and the second limiting groove are opened at the same height.
[0009] Preferably, a sealing ring is fixedly connected to the front end of the cover plate, and a first limiting block is fixedly connected to both the left and right ends of the upper side of the cover plate. The first limiting block is located inside the arc-shaped groove and is slidably connected thereto. A second limiting block is fixedly connected to both the left and right ends of the lower side of the cover plate. The second limiting block is located inside the first limiting groove and is slidably connected thereto. A handle is also fixedly connected to the upper end of the cover plate.
[0010] Preferably, the sleeve has air holes on its left and right end faces, and a one-way valve is fixedly connected inside the air holes.
[0011] Preferably, the driving mechanism includes an electric push rod and connecting rods. A pair of electric push rods are provided and fixedly connected to the upper end of the housing. The output shaft end of the electric push rod extends into the interior of the housing. A connecting plate is fixedly connected to the output shaft end of the electric push rod. A stop plate is fixedly connected between the two connecting plates. Four connecting rods are provided and fixedly connected to the lower end of the placement box. The lower ends of the four connecting rods are respectively fixed to the four corners of the upper end of the stop plate.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. This utility model, by setting a limiting mechanism and a cover plate with good sealing performance, can effectively prevent the leakage of harmful gases during the immersion process. When the cover plate is opened after immersion is completed, a large amount of harmful gases will not leak out instantly, thereby avoiding harm to the health of workers, protecting the health of workers, and improving the safety of the working environment.
[0014] 2. By setting up a driving mechanism, this utility model realizes the automatic up and down movement of the placement box, eliminating the need for manual placement or removal of chips in the etching chamber. This greatly reduces the tediousness and labor intensity of manual operation, improves work efficiency, and also reduces the errors that may be caused by manual operation, further enhancing the stability and reliability of the entire etching process. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall main structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the overall front view of the present invention.
[0017] Figure 3 This is a schematic diagram of the overall front view sectional structure of this utility model;
[0018] Figure 4 This is a schematic diagram of the overall bottom view cross-sectional structure of this utility model.
[0019] Numbering on the map:
[0020] 1. Housing; 11. Inlet pipe; 12. Outlet pipe; 13. Sleeve; 131. Air vent; 14. Check valve; 15. Inlet and outlet; 2. Limiting mechanism; 21. First upright; 211. First limiting groove; 22. Second upright; 221. Second limiting groove; 23. Arc rod; 231. Arc groove; 3. Cover plate; 31. First limiting block; 32. Second limiting block; 33. Sealing ring; 34. Handle; 4. Placement box; 41. Through hole; 5. Drive mechanism; 51. Electric push rod; 52. Connecting plate; 53. Support plate; 54. Connecting rod. Detailed Implementation
[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. In this specification, "multiple" refers to two or more.
[0023] In the description of this specification, references to terms such as "embodiment," "one embodiment," and "one implementation" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or implementation is included in at least one embodiment or illustrative embodiment of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or implementation. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or implementations.
[0024] Reference Figures 1-4As shown, this embodiment of the present invention provides an etching apparatus for semiconductor chip production, including a housing 1. A water outlet pipe 12 and a water inlet pipe 11 are fixedly connected to the right end of the housing 1, with the water outlet pipe 12 located directly below the water inlet pipe 11. An inlet / outlet 15 is provided on the upper surface of the housing 1. A sleeve 13 is fixedly connected inside the housing 1, located directly below the inlet / outlet 15. A placement box 4 is provided inside the sleeve 13, with through holes 41 on both its left and right ends. The outer wall of the placement box 4 abuts against the inner wall of the sleeve 13. A limiting mechanism 2 is provided at the upper end of the housing 1, with a cover plate 3 inside the limiting mechanism 2 for sealing the inlet / outlet 15. The apparatus also includes…
[0025] The drive mechanism 5 is located inside the housing 1 and is used to drive the placement box 4 to move up and down. During operation, etching liquid is injected into the housing 1 through the water inlet pipe 11. When the liquid level reaches a suitable height, the semiconductor chip is placed inside the placement box 4. Then, the drive mechanism 5 is activated to move the placement box 4 into the housing 1, so that the semiconductor chip inside the placement box 4 can fully contact the etching liquid and achieve uniform etching. When the placement box 4 moves into the housing 1, the cover plate 3 also moves downward with the downward movement of the placement box 4 until it seals the inlet and outlet 15. After etching is completed, the drive mechanism 5 lifts the placement box 4 to a suitable position. At this time, the placement box 4 pushes the cover plate 3 upward, sealing the inlet and outlet 15 to prevent the leakage of toxic gases. Then, the cover plate 3 can be opened to remove the etched chip.
[0026] In a further embodiment, refer to Figures 2-3 The limiting mechanism 2 includes a first upright 21 and a second upright 22. A pair of first uprights 21 and second uprights 22 are provided and fixedly connected to the upper ends of the box 1 located on the left and right sides of the inlet / outlet 15. The first upright 21 is located directly behind the second upright 22. A first limiting groove 211 is formed on the adjacent end face of the first upright 21, and a second limiting groove 221 is formed on the adjacent end face of the second upright 22. An arc-shaped rod 23 is fixedly connected to the upper end of the second upright 22. An arc-shaped groove 231 is formed on the adjacent end face of the arc-shaped rod 23. The arc-shaped groove 231 connects to the second limiting groove 221. The grooves 221 are connected. The upper end of the first upright 21 is fixedly connected to the lower end of the arc groove 231. The first limiting groove 211 and the second limiting groove 221 are opened at the same height. A sealing ring 33 is fixedly connected to the front end of the cover plate 3. The left and right ends of the upper side of the cover plate 3 are fixedly connected to the first limiting block 31. The first limiting block 31 is located inside the arc groove 231 and is slidably connected to it. The left and right ends of the lower side of the cover plate 3 are fixedly connected to the second limiting block 32. The second limiting block 32 is located inside the first limiting groove 211 and is slidably connected to it. A handle 34 is also fixedly connected to the upper end of the cover plate 3.
[0027] In this embodiment, the limiting mechanism 2 enables stable, reliable sealing and precise positioning of the cover plate 3. When the cover plate 3 is closed, the first limiting block 31 slides along the arc groove 231, and the second limiting block 32 rotates at the upper end inside the first limiting groove 211. Then, when the first limiting block 31 slides to the second limiting groove 221, the first limiting block 31 and the second limiting block 32 slide in the second limiting groove 221 and the first limiting groove 211, respectively. This structural design allows the cover plate 3 to reach the sealing position smoothly and accurately, ensuring that the inlet and outlet 15 are tightly sealed, effectively preventing harmful gases from escaping from the inlet and outlet 15 during the immersion process, and ensuring the safety of the entire immersion process. At the same time, the sealing ring 33 at the front end of the cover plate 3 further enhances the sealing effect, allowing the interior of the box 1 to maintain a good sealing state during the immersion process, preventing outside air from entering and affecting the immersion effect, and also preventing harmful gas leakage from causing harm to the environment and personnel. In addition, the handle 34 facilitates the operation of the cover plate 3 by the staff, making it easy to open or close the cover plate 3, thus improving the ease of use of the device.
[0028] In a further embodiment, refer to Figure 3 The sleeve 13 has air holes 131 on both the left and right ends inside, and a one-way valve 14 is fixedly connected inside the air holes 131.
[0029] In this embodiment, the problem of toxic gas leakage is cleverly solved by setting an air hole 131 and a one-way valve 14 inside the sleeve 13. When the placement box 4 moves up and down inside the sleeve 13, its lower side wall is tightly fitted with the inner wall of the sleeve 13, which can effectively prevent toxic gas in the box 1 from leaking out through the through hole 41 of the placement box 4. At the same time, when the placement box 4 moves upward, the air pressure inside the upper part of the sleeve 13 will increase. At this time, the one-way valve 14 opens, and the toxic gas is guided into the box 1 through the air hole 131 instead of leaking directly to the outside. When the placement box 4 moves to the upper part of the box 1, the lower part of the placement box 4 moves above the air hole 131, thereby greatly reducing the risk of toxic gas leakage and further improving the safety and environmental protection of the device.
[0030] In a further embodiment, refer to Figures 3-4 The drive mechanism 5 includes an electric push rod 51 and a connecting rod 54. There is a pair of electric push rods 51, which are fixedly connected to the upper end of the housing 1. The output shaft end of the electric push rod 51 extends into the interior of the housing 1. A connecting plate 52 is fixedly connected to the output shaft end of the electric push rod 51. A backing plate 53 is fixedly connected between the two connecting plates 52. There are four connecting rods 54, which are fixedly connected to the lower end of the placement box 4. The lower ends of the four connecting rods 54 are respectively fixed at the four corners of the upper end of the backing plate 53.
[0031] In this embodiment, the drive mechanism 5, consisting of an electric push rod 51 and connecting rods 54, enables precise and stable up-and-down movement of the placement box 4 within the sleeve 13. The extension and retraction of the electric push rod 51 precisely controls the movement speed and position of the placement box 4, ensuring that the semiconductor chip inside the placement box 4 can be uniformly contacted with the etching solution, thereby achieving an efficient and uniform etching effect. Meanwhile, the four connecting rods 54 are evenly distributed at the lower end of the placement box 4 and connected to the connecting plate 52 of the electric push rod 51 via the abutment plate 53. This not only enhances the stability of the placement box 4 but also ensures its balance during movement, avoiding uneven etching caused by the tilting of the placement box 4. Furthermore, the automated control function of the electric push rod 51 reduces the tediousness of manual operation and improves the automation level and work efficiency of the entire etching process.
[0032] Although the disclosure is as stated above, the scope of protection of this disclosure is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this disclosure, and all such changes and modifications will fall within the protection scope of this utility model.
Claims
1. An etching device for semiconductor chip production, comprising a housing (1), characterized in that The right end of the box (1) is fixedly connected to a water outlet pipe (12) and a water inlet pipe (11). The water outlet pipe (12) is located directly below the water inlet pipe (11). The upper surface of the box (1) is provided with an inlet and outlet (15). A sleeve (13) is fixedly connected inside the box (1). The sleeve (13) is located directly below the inlet and outlet (15). A placement box (4) is provided inside the sleeve (13). Both the left and right ends of the placement box (4) are provided with through holes (41). The outer wall of the placement box (4) abuts against the inner wall of the sleeve (13). A limiting mechanism (2) is provided at the upper end of the box (1). A cover plate (3) is provided inside the limiting mechanism (2). The cover plate (3) is used to seal the inlet and outlet (15). The box (1) also includes... A drive mechanism (5) is provided inside the housing (1) and is used to drive the placement box (4) to move up and down.
2. The etching apparatus for semiconductor chip production according to claim 1, wherein The limiting mechanism (2) includes a first upright (21) and a second upright (22). The first upright (21) and the second upright (22) are provided in pairs and are fixedly connected to the upper end of the box (1) located on the left and right sides of the inlet and outlet (15). The first upright (21) is located directly behind the second upright (22). A first limiting groove (211) is opened on the adjacent end face of the first upright (21), and a second limiting groove (221) is opened on the adjacent end face of the second upright (22). An arc-shaped rod (23) is fixedly connected to the upper end of the second upright (22). An arc-shaped groove (231) is opened on the adjacent end face of the arc-shaped rod (23), and the arc-shaped groove (231) is connected to the second limiting groove (221). The upper end of the first upright (21) is fixedly connected to the lower end of the arc-shaped groove (231).
3. The etching apparatus for semiconductor chip production according to claim 2, wherein The first limiting groove (211) and the second limiting groove (221) are opened at the same height.
4. The etching apparatus for semiconductor chip production according to claim 1, wherein A sealing ring (33) is fixedly connected to the front end of the cover plate (3). A first limiting block (31) is fixedly connected to both the left and right ends of the upper side of the cover plate (3). The first limiting block (31) is located inside the arc groove (231) and is slidably connected thereto. A second limiting block (32) is fixedly connected to both the left and right ends of the lower side of the cover plate (3). The second limiting block (32) is located inside the first limiting groove (211) and is slidably connected thereto. A handle (34) is also fixedly connected to the upper end of the cover plate (3).
5. The etching apparatus for semiconductor chip production according to claim 1, wherein The sleeve (13) has air holes (131) on its left and right end faces, and a one-way valve (14) is fixedly connected inside the air holes (131).
6. The etching apparatus for semiconductor chip production according to claim 1, wherein The drive mechanism (5) includes an electric push rod (51) and a connecting rod (54). There is a pair of electric push rods (51) and they are fixedly connected to the upper end of the box (1). The output shaft end of the electric push rod (51) extends into the inside of the box (1). A connecting plate (52) is fixedly connected to the output shaft end of the electric push rod (51). A backing plate (53) is fixedly connected between the two connecting plates (52). There are four connecting rods (54) and they are fixedly connected to the lower end of the placement box (4). The lower ends of the four connecting rods (54) are respectively fixed at the four corners of the upper end of the backing plate (53).