Vacuum chuck for fixing warped wafer

Abstract

The utility model relates to the technical field of vacuum chucks, and discloses a vacuum chuck for fixing a warped wafer, which comprises a mounting table top for mounting a suction nozzle component; the suction nozzle assembly is mounted on the surface of the mounting table top and is used for adsorbing the warped wafer; wherein the suction nozzle assembly comprises a plurality of suction nozzle components arranged on the periphery of the surface of the mounting table top and in the center of the surface of the mounting table top, and two air pipe joints are arranged on the outer side of the mounting table top and connected with the suction nozzle components on the periphery of the surface of the mounting table top and the suction nozzle components in the center of the surface of the mounting table top respectively. According to the utility model, two sets of independent adsorption mechanisms at the periphery and the center are arranged, so that the adsorption force can be independently adjusted according to different warping degrees of the edge and the center of the wafer, the adsorption failure caused by pressure unbalance of a single vacuum source is avoided, and the purpose of adsorbing and fixing the large-warping wafer can be achieved by using lower air exhaust speed and lower vacuum degree; and the use effect is excellent.

Description

Technical Field

[0001] This utility model relates to the field of vacuum chuck technology, and in particular to a vacuum chuck for fixing warped wafers. Background Technology

[0002] During chip manufacturing and testing, some wafers may undergo significant deformation.

[0003] Existing vacuum chucks generally use microporous ceramic adsorption structures or adsorption structures with nozzles or multiple air channels to adsorb wafers. The former can generally only be used to adsorb wafers with relatively high flatness. Air leakage will occur between the wafer and the adsorption structure, resulting in insufficient suction and failure to hold the wafer. Although the latter can adsorb wafers with lower flatness, a very high pumping speed is required to achieve the adsorption purpose when the wafer warpage is large. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a vacuum chuck for fixing warped wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A vacuum chuck for securing warped wafers, comprising:

[0007] Mounting platform for mounting nozzle components;

[0008] The nozzle assembly is mounted on the surface of the mounting platform and is used to pick up warped wafers;

[0009] The nozzle assembly includes several nozzle components disposed on the periphery of the mounting surface and at the center of the mounting surface. Two air pipe connectors are provided on the outer side of the mounting surface, which are respectively connected to several nozzle components on the periphery of the mounting surface and several nozzle components at the center of the mounting surface.

[0010] Preferably, the surface of the mounting platform is provided with a wafer alignment area, which is circular and used for wafer alignment.

[0011] Preferably, the nozzle component includes a nozzle core, a nozzle body, and a vacuum logic valve connected in sequence. The nozzle core passes through the nozzle body and is threadedly connected to the vacuum logic valve. The end of the vacuum logic valve away from the nozzle core is connected to an air tube and is connected to an air tube connector through the air tube.

[0012] Preferably, the nozzle components located on the periphery of the mounting platform are arranged in pairs in a circular array at the center of the wafer alignment area, and each group of nozzle components is symmetrically arranged in the radial direction.

[0013] Preferably, a number of suction nozzle components located at the center of the mounting platform are arranged in pairs in a circular array at the center of the wafer alignment area, and each group of suction nozzle components is arranged along a radial line.

[0014] Preferably, six sets of suction nozzle components are provided on both the periphery of the mounting surface and the center of the mounting surface.

[0015] Preferably, the nozzle body is integrally molded from flexible rubber material, and the top of the nozzle body is located above the mounting surface.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This utility model achieves the following by setting up two independent adsorption mechanisms, one on the periphery and one on the center:

[0018] The adsorption force can be independently adjusted for different degrees of warpage at the edge and center of the wafer, avoiding adsorption failure caused by pressure imbalance of a single vacuum source. It can achieve the purpose of adsorbing and fixing large warpage wafers with low pumping speed and low vacuum degree, and the effect is excellent. Attached Figure Description

[0019] Figure 1 This is a front view of a vacuum chuck for fixing a warped wafer, as proposed in this utility model.

[0020] Figure 2 This is a top view of a vacuum chuck for fixing a warped wafer according to the present invention.

[0021] Figure 3 This is an exploded view of the nozzle component of a vacuum chuck for fixing warped wafers, as proposed in this utility model.

[0022] Figure 4 This is a cross-sectional view of the nozzle component of a vacuum chuck for fixing warped wafers, as proposed in this utility model.

[0023] In the diagram: 1. Mounting platform; 2. Nozzle assembly; 3. Wafer alignment area; 4. Nozzle core; 5. Nozzle body; 6. Vacuum logic valve; 7. Air pipe connector. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Reference Figures 1-4 A vacuum chuck for fixing warped wafers, comprising:

[0026] Mounting platform 1 is used to mount the nozzle assembly;

[0027] The nozzle assembly 2 is mounted on the surface of the mounting platform 1 and is used to adsorb warped wafers;

[0028] The suction nozzle assembly 2 includes several suction nozzle components disposed on the periphery of the surface of the mounting platform 1 and at the center of the surface of the mounting platform 1. Two air pipe connectors 7 are disposed on the outer side of the mounting platform 1, which are respectively connected to several suction nozzle components on the periphery of the surface of the mounting platform 1 and several suction nozzle components at the center of the surface of the mounting platform 1.

[0029] The suction nozzle body 5 is integrally molded from flexible rubber material, and the top of the suction nozzle body 5 is located above the mounting platform 1. The top of the suction nozzle core 4 is flush with the mounting platform 1, which can ensure that the wafer will not be adsorbed and deformed.

[0030] When using this vacuum suction cup, the end of the air pipe connector 7 away from the nozzle component needs to be connected to a vacuum pump. When the warped wafer is placed on the nozzle assembly 2, the wafer only contacts part of the nozzle component. At this time, air is only drawn through the nozzle component that contacts the wafer, and the requirement for the air drawing speed is reduced.

[0031] Since the tip of the suction nozzle component that only contacts the wafer is higher than the mounting surface 1, and since the suction nozzle component is made of rubber, which is soft and easily deformed, when the suction nozzle component picks up the wafer, it contracts due to negative pressure, and the wafer is pulled down and stuck to the mounting surface 1. Then, the suction body 5 of the suction nozzle component that does not contact the wafer will come into contact with the wafer. At this time, by pumping air from this part of the suction nozzle component, the suction nozzle component that has a gap with the wafer will tightly pick up the wafer, and the corresponding part of the wafer will also be pulled down and stuck to the mounting surface 1, completing the process of the suction nozzle assembly 2 picking up all the wafers in a very short time.

[0032] When the air pipe connector 7 breaks the vacuum, the suction nozzle component can be released from the vacuum, at which point the wafer can be removed. This process can be achieved by installing a pressure relief valve on the pipeline connecting the air pipe connector 7 and the vacuum pump.

[0033] Compared to existing technologies, this invention sets up two independent adsorption mechanisms, one at the periphery and one at the center, which can independently adjust the adsorption force for different degrees of warpage at the wafer edge and center. This avoids adsorption failure caused by pressure imbalance of a single vacuum source. It can achieve the purpose of adsorbing and fixing large warpage wafers with lower pumping speed and lower vacuum degree, and the effect is excellent.

[0034] In this embodiment, the surface of the mounting platform 1 is provided with a wafer alignment area 3. The wafer alignment area 3 is circular and is used for wafer alignment. For example, when a 12-inch wafer is placed, it can coincide with this circle.

[0035] In this embodiment, the suction nozzle component includes a suction nozzle core 4, a suction nozzle body 5, and a vacuum logic valve 6 connected in sequence. The suction nozzle core 4 passes through the suction nozzle body 5 and is threadedly connected to the vacuum logic valve 6. The end of the vacuum logic valve 6 away from the suction nozzle core 4 is connected to an air tube and is connected to an air tube connector 7 through a flexible air tube (not shown in the figure, the flexible air tube is located in the inner cavity of the mounting platform 1). The vacuum logic valve 6 can prevent air leakage from the suction nozzle component when the warped part of the wafer is not in contact with the suction nozzle component, which would result in insufficient suction force of the suction nozzle component in contact with the wafer, and thus fail to pull the wafer down and flatten it on the mounting platform 1.

[0036] In this embodiment, several suction nozzle components located on the periphery of the mounting platform 1 are arranged in pairs in a circular array around the center of the wafer alignment region 3. Each group of suction nozzle components is symmetrically arranged in the radial direction. There are six groups of suction nozzle components located on the periphery of the mounting platform 1 and six groups of suction nozzle components located at the center of the mounting platform 1. Several suction nozzle components located at the center of the mounting platform 1 are arranged in pairs in a circular array around the center of the wafer alignment region 3. Each group of suction nozzle components is arranged along a radial line. The double-layer circular array structure of the periphery and the center forms a gradient adsorption system. The symmetrically arranged suction nozzle components 2 on the periphery can apply a balanced radial constraint force to the edge of the wafer. The radially arranged suction nozzle group in the center provides an axial positioning reference. The six symmetrically distributed suction nozzle components constitute 12 adsorption nodes distributed at equal angles, which effectively improves the adsorption pressure per unit area while maintaining a minimized contact area.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A vacuum chuck for fixing warped wafers, characterized in that: include: Mounting platform for mounting nozzle components; The nozzle assembly is mounted on the surface of the mounting platform and is used to pick up warped wafers; The nozzle assembly includes several nozzle components disposed on the periphery of the mounting surface and at the center of the mounting surface. Two air pipe connectors are provided on the outer side of the mounting surface, which are respectively connected to several nozzle components on the periphery of the mounting surface and several nozzle components at the center of the mounting surface.

2. The vacuum chuck for holding a warped wafer as set forth in claim 1, wherein: The surface of the mounting platform is provided with a wafer alignment area, which is circular and used for wafer alignment.

3. A vacuum chuck for fixing a warped wafer according to claim 1, characterized in that: The nozzle component includes a nozzle core, a nozzle body, and a vacuum logic valve connected in sequence. The nozzle core passes through the nozzle body and is threadedly connected to the vacuum logic valve. The end of the vacuum logic valve away from the nozzle core is connected to an air tube and is connected to an air tube connector through the air tube.

4. The vacuum chuck for holding a warped wafer as defined in claim 2, wherein: Several suction nozzle components located on the periphery of the mounting platform are arranged in pairs in a circular array at the center of the wafer alignment area, and each group of suction nozzle components is symmetrically arranged in the radial direction.

5. The vacuum chuck for holding a warped wafer as defined in claim 4, wherein: Several nozzle components located at the center of the mounting platform are arranged in pairs in a circular array at the center of the wafer alignment area, and each group of nozzle components is arranged along a radial line.

6. The vacuum chuck for holding a warped wafer as defined in claim 5, wherein: There are six sets of suction nozzle components located on the periphery of the mounting surface and six sets of suction nozzle components located at the center of the mounting surface.

7. The vacuum chuck for holding a warped wafer as defined in claim 3, wherein: The nozzle body is integrally molded from flexible rubber material, and the top of the nozzle body is located above the mounting surface.

8. The vacuum chuck for holding a warped wafer as defined in claim 7, wherein: The top of the suction nozzle core is flush with the mounting surface.

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