Power module packaging structure

Abstract

The utility model discloses a power module packaging structure. The packaging structure comprises a first substrate; the power device is located on the first surface of the first substrate; the shell bears a first substrate and the power device, the shell comprises a first side edge and a second side edge which are opposite to each other and a third side edge and a fourth side edge which are opposite to each other, the first side edge is perpendicular to the third side edge, and the first side edge, the second side edge, the third side edge and the fourth side edge are provided with supporting structures which are connected with each other; the silica gel is located in the supporting structure of the shell, and the first substrate and the power device are covered with the silica gel; the cover plate is assembled on the supporting structure of the shell; according to the packaging structure, the special combination of the groove and the boss is designed between the shell and the cover plate, and the sealant filling and curing technology is utilized, so that the stability and the reliability of the packaging structure in a vibration environment are remarkably improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing, and more specifically, to a power module packaging structure. Background Technology

[0002] With the widespread application of power modules in industrial automation, automotive electronics, and high-performance power equipment, the reliability of their packaging structure is of paramount importance. In real-world operating environments, power modules are often exposed to complex vibration and shock conditions, such as prolonged vehicle operation, bumps during transportation, and dynamic loading during assembly. These external vibrations can generate continuous mechanical stress on the packaging structure, potentially leading to structural failure.

[0003] Existing packaging technologies mostly employ mechanical locking to improve vibration resistance, but these methods often fail to meet the multi-directional protection requirements of complex vibration environments. Packaging failure can lead to a decline in the electrical and mechanical connection performance within the module, thereby severely impacting the product's functional reliability and lifespan.

[0004] Therefore, there is an urgent need for a power module packaging structure to reduce the impact of external vibration on the packaging structure and improve the reliability and service life of the product. Summary of the Invention

[0005] In view of this, the purpose of this utility model is to provide a power module packaging structure. The structure significantly improves the stability and reliability of the packaging structure under vibration environment by designing a special combination of glue grooves and bosses between the outer shell and the cover plate, and by using sealant filling and curing technology.

[0006] According to this application, a power module packaging structure is provided, comprising: a first substrate; a power device located on a first surface of the first substrate; a housing including opposing first and second sides and opposing third and fourth sides, the first, second, third, and fourth sides of the housing surrounding the first substrate, the first and third sides being perpendicular to each other, the first, second, third, and fourth sides each having a support structure, and the support structures of the first, second, third, and fourth sides being connected; a silicone gel covering the first substrate and the power device; a cover plate mounted on the support structure of the housing; the support structure having a groove, and the cover plate having a boss structure, the groove and the boss structure engaging together.

[0007] Preferably, the boss structure of the cover plate is discontinuously distributed, and the corresponding grooves of the outer shell are also discontinuously distributed.

[0008] Preferably, the boss structure of the cover plate is discontinuously distributed, and the groove of the outer shell is a continuous groove corresponding to the boss area.

[0009] Preferably, the boss and the cover plate are an integral structure.

[0010] Preferably, there is sealant between the groove and the boss.

[0011] Preferably, the first side and the second side have grooves.

[0012] Preferably, the third side and the fourth side have grooves.

[0013] Preferably, the power device is divided into three phases, each phase is separated from the other by beams on the outer casing, the beams have grooves, and the cover plate has a boss structure at the corresponding position.

[0014] Preferably, the outer shell has positioning posts, and the cover plate has positioning holes, with the positioning posts and positioning holes cooperating to assemble the cover plate.

[0015] Preferably, the outer casing has PCB mounting holes, and the cover plate has notches at its four corners, with the PCB mounting holes and notches fitting together to assemble the cover plate.

[0016] Preferably, one end of the power terminal is located on the first surface of the first substrate, and the other end extends out of the housing.

[0017] Preferably, one end of the signal terminal is located on the first surface of the first substrate, and the other end extends out of the cover pinhole of the cover plate.

[0018] Preferably, the outer shell has a buckle, and the cover plate has buckle recesses on both sides of the protrusion, and the buckle and buckle recesses cooperate to assemble the cover plate.

[0019] Preferably, the cover plate boss structure is one of a discontinuous cuboid, rhombus, or columnar shape.

[0020] Preferably, the cover plate boss structure is a continuous cuboid.

[0021] According to the power module packaging structure provided in this application, a special combination of grooves and bosses is designed between the outer shell and the cover plate, and filled with flexible sealant to cover the gap in the mechanical connection between the outer shell and the cover plate, avoiding abnormal noise caused by vibration; effectively buffering the contact friction between the signal terminals and the cover plate holes, reducing chipping and contamination problems. Simultaneously, the flexible sealant can absorb mechanical stress, preventing the clips from failing due to fatigue. After the sealant cures, it forms a rigid structure, providing a stable connection and preventing direct wear between the cover plate and the outer shell during vibration. The power module packaging structure design provided in this application combines flexibility and rigidity, can adapt to complex vibration environments, and significantly improves the packaging's resistance to vibration failure. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this application, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings in the following description only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0023] Figure 1 This is a schematic diagram of a typical structure after the glue groove has been optimized.

[0024] Figure 2a A schematic diagram of adding a discontinuous cuboid boss structure to the cover plate.

[0025] Figure 2b A schematic diagram of adding a discontinuous rhomboid boss structure to the cover plate.

[0026] Figure 2c A schematic diagram of adding a continuous cuboid boss structure to the cover plate.

[0027] Figure 3 This is a schematic diagram of the structure after the outer shell cover is assembled.

[0028] Explanation of reference numerals in the attached figures:

[0029] 201-Positioning post; 202-PCB board mounting hole; 203-Signal terminal; 204-Snap-fit; 205-Sealant groove; 206-Cover plate pinhole; 207-Cover plate boss structure Detailed Implementation

[0030] The present application will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown. For simplicity, a semiconductor device obtained after several steps can be depicted in a single figure.

[0031] Many specific details of this application, such as the structure, materials, dimensions, processing techniques, and methods of the devices, are described below to provide a clearer understanding of the application. However, as those skilled in the art will understand, this application may be implemented without adhering to these specific details.

[0032] Figure 1 This is a schematic diagram of a power module packaging structure provided by the present invention, as shown below. Figure 1As shown, the power module packaging structure includes a first substrate, at least one power device, a housing, silicone gel, and a cover plate. Specifically, the power device is located on a first surface of the first substrate; the housing includes opposing first and second sides, as well as opposing third and fourth sides, which surround the first substrate. The first and third sides are perpendicular to each other. Each of the first, second, third, and fourth sides has a support structure, and these support structures are connected. Silicone gel covers the first substrate and the power device. Grooves are present on the first and second sides or on the third and fourth sides.

[0033] Figure 2 is a schematic diagram of the cover plate structure provided by this utility model. The cover plate is assembled on the support structure of the outer shell. The cover plate is provided with a cover plate pinhole 206 and a boss structure 207. The boss structure of the cover plate is discontinuously distributed, and the groove of the outer shell corresponds to the boss area as a continuous groove, and the boss and the cover plate are an integral structure. One end of the signal terminal 203 is located on the first surface of the first substrate, and the other end extends out of the cover plate pinhole 206. One end of the power terminal is located on the first surface of the first substrate, and the other end extends out of the outer shell. The power device is divided into three phases, and each phase is separated from each other by the beam of the outer shell. The beam has a groove, and the corresponding position of the cover plate is provided with a boss structure. In some embodiments, the boss structure of the cover plate is discontinuously distributed, and the corresponding position of the groove of the outer shell is discontinuously distributed. The positioning post 201, PCB mounting hole 202 and buckle 204 on the outer shell cooperate with the positioning hole on the cover plate, the notch at the four corners of the cover plate and the buckle groove on both sides of the boss of the cover plate to assemble the cover plate. Figure 3 As shown, sealant is filled between the groove 205 of the outer shell and the boss 207 of the cover plate to form a high-strength connection, which reduces the impact of external vibration on the packaging structure and improves the reliability and service life of the product.

[0034] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0035] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. The scope of this application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this application, and all such substitutions and modifications should fall within the scope of this application.

Claims

1. A power module packaging structure, characterized in that: First substrate; A power device, wherein the power device is located on a first surface of the first substrate; The housing includes opposing first and second sides, as well as opposing third and fourth sides. The first, second, third, and fourth sides of the housing surround a first substrate. The first and third sides are perpendicular to each other. The first, second, third, and fourth sides each have a supporting structure, and the supporting structures of the first, second, third, and fourth sides are connected to each other. Silicone gel, which covers the first substrate and the power device; A cover plate, which is mounted on the support structure of the outer casing; The support structure has a groove, and the cover plate has a boss structure, which are fitted together.

2. The package structure of claim 1, wherein, The boss structure of the cover plate is discontinuously distributed, and the corresponding grooves of the outer shell are also discontinuously distributed.

3. The package structure of claim 1, wherein, The boss structure of the cover plate is discontinuously distributed, while the groove of the outer shell is a continuous groove corresponding to the boss area.

4. The package structure of claim 1, wherein, The boss and the cover plate are an integral structure.

5. The package structure of claim 1, wherein, There is sealant between the groove and the boss.

6. The package structure of claim 1, wherein, The first side and the second side have grooves.

7. The package structure of claim 1, wherein, The third and fourth sides have grooves.

8. The packaging structure according to claim 1, wherein the power device is divided into three phases, each phase is separated from the other by a beam of the outer casing, the beam has a groove, and the cover plate has a boss structure at the corresponding position.

9. The packaging structure according to claim 1, wherein the outer shell has positioning posts and the cover plate has positioning holes, and the positioning posts and positioning holes cooperate to assemble the cover plate.

10. The packaging structure according to claim 1, wherein the outer shell has PCB mounting holes, and the four corners of the cover plate have notches, and the PCB mounting holes and the notches cooperate to assemble the cover plate.

11. The packaging structure according to claim 1, wherein one end of the power terminal is located on the first surface of the first substrate, and the other end extends out of the housing.

12. The packaging structure according to claim 1, wherein one end of the signal terminal is located on the first surface of the first substrate, and the other end extends out of the cover pinhole of the cover plate.

13. The packaging structure according to claim 1, wherein the outer shell has a buckle, and the cover plate has buckle recesses on both sides of the boss, and the buckle and the buckle recesses cooperate to assemble the cover plate.

14. The encapsulation structure according to claim 1, wherein the cover plate boss structure is one of a discontinuous cuboid, a rhombus, or a column.

15. The packaging structure according to claim 1, wherein the cover plate boss structure is a continuous cuboid.

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