Heating disc assembly and food processor
By introducing an air heat transfer layer and heat-conducting components into the heating plate assembly, the problem of uneven heat distribution in the heating plate assembly is solved, achieving uniform heat transfer and preventing scorching, thus improving the safety and efficiency of the food processor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SHAOXING SUPOR DOMESTIC ELECTRICAL APPLIANCE CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-04-21
AI Technical Summary
Existing food processor heating plate components suffer from uneven heat distribution, resulting in cold spots near the wiring terminals and hot spots in the center, which can easily lead to food burning.
The structure includes a heating plate, a heating element, a first heat-conducting element, and a plate cover. By setting an air heat transfer layer between the first heat-conducting element and the plate surface and plate cover, and combining the difference in thermal conductivity between the first and second heat-conducting elements, rapid heat transfer and balanced distribution are achieved, avoiding local overheating.
It effectively solves the problem of uneven heat distribution in the heating plate assembly, reduces the risk of food burning, and ensures uniform heat distribution and safety during food processing.
Smart Images
Figure CN224140659U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of small household appliance technology, and more specifically, to a heating plate assembly and a food processor. Background Technology
[0002] Current food processors typically use heating elements, but these elements suffer from uneven heat distribution. For example, the area near the two terminals receives less heat, creating a cold zone, while the area between the terminals receives more heat, forming a hot zone. When cooking, food in these hot zones is prone to burning. Summary of the Invention
[0003] This application provides a heating plate assembly and a food processor. The heating plate assembly provides even heat distribution and reduces the risk of food burning.
[0004] A heating plate assembly, comprising:
[0005] A heating plate, including a plate surface for the side facing the food processing chamber;
[0006] A heating element is disposed on the side of the heating plate facing away from the plate surface. The heating element can generate heat when energized. The heating element includes a first heating area and a second heating area, and the heat of the first heating area is higher than that of the second heating area.
[0007] A lid, which covers the surface of the disc;
[0008] A first heat-conducting element is located between the disc surface and the disc cover. The thermal conductivity of the first heat-conducting element is greater than that of the disc cover. An air heat transfer layer is also provided between the disc surface and the disc cover, and the air heat transfer layer is provided corresponding to the first heating area.
[0009] The heating plate assembly and food processor provided in this application, during the heat transfer process, allow the first heat-conducting component to receive heat from the heating plate and rapidly transfer the heat to balance the heat difference transferred to the lid. Furthermore, the air heat transfer layer corresponding to the first heating zone can insulate against or slow down heat transfer, reducing the heat transferred from the first heating zone to the lid and preventing localized overheating of the lid that could cause food to burn.
[0010] Optionally, the first heat-conducting element is disposed correspondingly to the second heating zone. In this way, the heat from the second heating zone can be directly transferred to the first heat-conducting element through the heating plate, and then transferred to the plate cover via the first heat-conducting element, thereby accelerating the heat transfer rate of the second heating zone, reducing the heat difference, and making the plate cover heated evenly.
[0011] Optionally, the first heat-conducting element has a through groove extending along its thickness at a position corresponding to the first heating zone, forming the air heat transfer layer between the disc surface and the disc cover. In other words, the first heat-conducting element is positioned away from the first heating zone, creating a gap between the disc surface and the disc cover, which forms the air heat transfer layer. This simplifies the formation of the air heat transfer layer, provides a large space within the layer, and results in better heat insulation.
[0012] Optionally, the first heat-conducting element has a groove with a depth smaller than its own thickness at the position corresponding to the first heating area, so that an air heat transfer layer is formed between the plate surface and the plate cover. In this way, the air heat transfer layer can slow down the heat transfer in the first heating area and avoid local overheating. At the same time, the first heat-conducting element can directly contact the heating plate or plate cover, so that heat is quickly transferred to other parts of the first heat-conducting element, reducing the heat difference and ensuring heat balance.
[0013] Optionally, the first heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion that are circumferentially opposite and connected along the disk surface. The first heat-conducting portion is located on the same side of the disk surface as the first heating area and does not cover the first heating area, while the second heat-conducting portion covers the second heating area. With this configuration, the first heat-conducting portion is positioned on the disk surface adjacent to the first heating area, and its shape matches the shape of the first heating area. The first heat-conducting portion can transfer some of the heat from the first heating area, thus preventing excessive heat loss from the first heating area.
[0014] Optionally, the central angle corresponding to the first heat-conducting part is β, where 30°≤β≤270°. Within this angle range, heat can be effectively transferred to the first heating zone, avoiding local overheating.
[0015] Optionally, the thermal conductivity of the first heat-conducting element is greater than that of the heating plate. This allows the heat transferred from the heating plate to the first heat-conducting element to achieve rapid heat exchange on the first heat-conducting element, reaching thermal equilibrium, thereby making the heat transferred to the plate cover more even.
[0016] Optionally, the heating plate assembly further includes a second heat-conducting element disposed between the heating element and the heating plate. The second heat-conducting element is in contact with the heating element and covers both the first heating area and the second heating area. The thermal conductivity of the second heat-conducting element is greater than that of the heating plate. In this way, heat from both the first and second heating areas can be quickly transferred to the second heat-conducting element, which itself can quickly exchange heat to reduce the heat difference and make the heat transferred to the heating plate more even.
[0017] Optionally, the second heat-conducting element and the heating element are configured as an integral structure. This can reduce thermal resistance and increase the heat transfer rate.
[0018] Optionally, the upper surface of the lid facing away from the plate surface has multiple protrusions. These protrusions can thicken the lid, improving the prevention of food sticking to the bottom; furthermore, they can also separate the food from the upper surface of the lid, reducing the contact area between the food and the upper surface and making it easier to clean.
[0019] A food processor includes a cup body and a heating plate assembly as described in any of the preceding claims, the heating plate assembly being assembled at the bottom of the cup body and forming a food processing chamber together with the cup body.
[0020] Optionally, the food processor also includes a mixing blade rotatably disposed in the food processing chamber to blend the food within. The heating plate assembly provides even heat distribution, minimizing the risk of food burning. This food processor also features a blending function, making it suitable for various applications such as making slurries and rice pastes. Attached Figure Description
[0021] Figure 1 This is a cross-sectional view of the cup assembly of a food processor shown in an exemplary embodiment of this application;
[0022] Figure 2 This is a bottom view of the heating element assembly;
[0023] Figure 3 This is an exploded view of the heating element assembly;
[0024] Figure 4 This is a cross-sectional view of the heating element assembly;
[0025] Figure 5 This is a top view of the heating plate and the first heat-conducting component stacked together;
[0026] Figure 6 This is a top view of the heating element assembly. Detailed Implementation
[0027] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0028] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.
[0029] Please refer to Figure 1 , Figure 1 A cross-sectional view of the cup assembly 100 of a food processor shown as an exemplary embodiment of this application.
[0030] The cup assembly 100 includes a cup body 10, a cup base 20, a heating plate assembly 30, and a cup lid 40. The cup body 10 is hollow, forming a food processing cavity 101 within the hollow space, which is used to hold food. The cup base 20 is installed at the bottom of the cup body 10 to support it, allowing the cup body 10 to be placed stably on a countertop. The gap between the cup body 10 and the cup base 20 can be sealed with a sealing ring. The cup lid 40 covers the top of the cup body 10.
[0031] The heating plate assembly 30 is housed and assembled within the cup holder 20, serving as the base of the cup body 10. The heating plate assembly 30 and the cup body 10 together form a food processing cavity 101. A sealing ring may be provided between the heating plate assembly 30 and the cup body 10 to seal the gap between them.
[0032] exist Figure 1 In the illustrated embodiment, the cup assembly 100 further includes a stirring blade 50, which is rotatably disposed in the food processing chamber 101 to agitate the food within the chamber. Specifically, the blade shaft of the stirring blade 50 passes through and is rotatably mounted on the heating plate assembly 30. The axial direction of the blade shaft is aligned with the height direction of the cup body 10. The blades of the stirring blade 50 are connected to the blade shaft and located within the food processing chamber 101 for crushing and agitating the ingredients. In one embodiment, the heating plate assembly 30 has a central hole at its center for the blade shaft to pass through.
[0033] It should be noted that the food processor may also include a main unit (not shown). For example, the main unit may be a base-type main unit, which is assembled to the bottom of the cup assembly 100 and can be detachably assembled with the cup assembly 100. Alternatively, the main unit may be a head-type main unit, which is assembled to the top of the cup assembly 100.
[0034] Please refer to Figures 2 to 5 , Figure 2 This is a bottom view of the heating plate assembly 30. Figure 3 This is an exploded view of the heating plate assembly 30. Figure 4 This is a cross-sectional view of the heating plate assembly 30. Figure 5 This is a top view of the heating plate 31 and the first heat-conducting element 33 stacked together.
[0035] The heating plate assembly 30 includes a heating plate 31, a heating element 32, a first heat-conducting element 33, and a plate cover 34. The heating plate 31 includes a plate surface 310 facing the food processing cavity 101. The heating element 32 is disposed on the side of the heating plate 31 facing away from the plate surface 310, and the heating element 32 generates heat when energized. The plate cover 34 covers the plate surface 310, and the first heat-conducting element 33 is disposed between the plate surface 310 and the plate cover 34. The heating plate 31, heating element 32, first heat-conducting element 33, and plate cover 34 can be welded together using welding processes such as lead soldering, but are not limited to these methods. The heating plate 31 can be a stainless steel plate, the first heat-conducting element 33 can be an aluminum component, and the plate cover 34 can be a stainless steel cover, but are not limited to these methods.
[0036] The heating element 32 includes a first heating zone 321 and a second heating zone 322, wherein the heat of the first heating zone 321 is higher than that of the second heating zone 322. The heating element 32 is generally ring-shaped and includes a first terminal (L terminal) and a second terminal (N terminal), wherein the L terminal is used to connect to the live wire and the N terminal is used to connect to the neutral wire.
[0037] exist Figure 2 In the embodiment shown, the region of the heating element 32 near the L end and N end is the second heating region 322. Figure 2 The unshaded area on the left side of the heating element 32 is the first heating zone 321. Figure 2 (The shaded area on the right side). A gap exists between the two terminals of the heating element 32. Therefore, the area of the heating element 32 near the L and N terminals is conducive to heat dissipation, and the heat generated here is relatively less than in the middle area. This results in the heating element 32 forming a first heating zone 321 and a second heating zone 322 with uneven heat distribution. It should be noted that the first heating zone 321 and the second heating zone 322 may differ depending on the structural form of the heating element 32.
[0038] An air heat transfer layer 300 is also provided between the disc surface 310 and the disc cover 34, and the air heat transfer layer 300 is provided corresponding to the first heating area 321.
[0039] As described above, the first heat-conducting element 33 is located between the plate surface 310 and the plate cover 34, and has a relatively high thermal conductivity. During the heat transfer process, after receiving heat from the heating plate 31, the first heat-conducting element 33 can achieve rapid heat transfer to balance the heat difference transferred to the plate cover 34. Furthermore, the air heat transfer layer 300 corresponding to the first heating zone 321 can block heat or slow down heat transfer, reducing the heat transferred from the first heating zone 321 to the plate cover 34 and preventing local overheating of the plate cover 34 that could cause scorching.
[0040] In one embodiment, such as Figure 4 As shown, the first heat-conducting element 33 has a through groove extending along its thickness at a position corresponding to the first heating area 321, forming the air heat transfer layer 300 between the disk surface 310 and the disk cover 34. In other words, the first heat-conducting element 33 is positioned to avoid the first heating area 321, creating a gap between the disk surface 310 and the disk cover 34, which forms the air heat transfer layer 300. Thus, the formation of the air heat transfer layer 300 is simple, the air heat transfer layer 300 has a large space, and the heat insulation effect is better.
[0041] In another embodiment, the first heat-conducting element 33 has a groove with a depth smaller than its own thickness at the position corresponding to the first heating area 321, forming the air heat transfer layer 300 between the disk surface 310 and the disk cover 34. In this embodiment, the thickness of the first heat-conducting element 33 corresponding to the first heating area 321 is smaller than the thickness of other parts, thus creating a gap between the disk surface 310 and the disk cover 34, which forms the air heat transfer layer 300. With this configuration, the air heat transfer layer 300 can slow down the heat transfer of the first heating area 321, avoiding local overheating. The first heat-conducting element 33 can also directly contact the heating disk 31 or the disk cover 34, thereby quickly transferring heat to other parts of the first heat-conducting element 33, reducing heat difference, and ensuring heat balance.
[0042] This application does not limit the specific manner in which the groove is formed. For example, a groove may be provided on the side of the first heat-conducting element 33 facing the plate cover 34, so that an air heat transfer layer 300 is formed between the first heat-conducting element 33 and the plate cover 34. As another example, a groove may be provided on the side of the first heat-conducting element 33 facing the heating plate 31, so that an air heat transfer layer 300 is formed between the first heat-conducting element 33 and the heating plate 31.
[0043] In one embodiment, such as Figure 4 and Figure 5As shown, the first heat-conducting element 33 is correspondingly disposed with respect to the second heating zone 322. In this way, the heat from the second heating zone 322 can be directly transferred to the first heat-conducting element 33 via the heating plate 31, and then transferred to the plate cover 34 via the first heat-conducting element 33, thereby accelerating the heat transfer rate from the second heating zone 322, reducing the heat difference, and ensuring uniform heating of the plate cover 34. Simultaneously, the corresponding placement of the first heat-conducting element 33 and the second heating zone 322 creates an opening between the plate surface 31 corresponding to the first heating zone 321 and the plate cover 34, thus defining the aforementioned air heat transfer layer 300.
[0044] In one embodiment, such as Figure 3 and Figure 5 As shown, the first heat-conducting element 33 includes a first heat-conducting portion 331 and a second heat-conducting portion 332 that are circumferentially opposite and connected to each other along the disk surface 310. The first heat-conducting portion 331 is located on the side of the disk surface 310 where the first heating area 321 is located, and does not cover the first heating area 321. The second heat-conducting portion 332 covers the second heating area 322. In this embodiment, the first heat-conducting portion 331 is disposed on the disk surface 310 adjacent to the first heating area 321, and its shape matches the shape of the first heating area 321. The first heat-conducting portion 331 can transfer part of the heat from the first heating area 321, which can prevent excessive heat loss from the first heating area 321.
[0045] In one embodiment, the central angle corresponding to the first heat-conducting part 331 is β, where 30° ≤ β ≤ 270°. Within this angle range, heat from the first heating zone 321 can be effectively transferred, preventing localized overheating. In an alternative embodiment, the angle β can be set to 30°, 50°, 80°, 100°, 120°, 150°, 200°, 230°, or 270°, but is not limited to these.
[0046] exist Figure 5 In the embodiment shown, the edge of the heating plate 31 corresponds to the first heating area 321, and the first heat-conducting part 331 is located on the side where the first heating area 321 is located and is disposed inside the plate surface 310, without covering the first heating area 321. In this way, heat dissipation can be achieved, and heat insulation can be achieved through the air heat transfer layer 300.
[0047] In one embodiment, the thermal conductivity of the first heat-conducting element 33 is greater than that of the heating plate 31. A higher thermal conductivity results in a higher heat transfer rate, allowing for rapid heat exchange and thermal equilibrium between the heating plate 31 and the first heat-conducting element 33, thus ensuring a more even distribution of heat to the cover 34. The first heat-conducting element 33 can be made of aluminum or copper, but is not limited to these. The heating plate 31 can be made of stainless steel, but is not limited to these. In this embodiment, the thermal conductivity of the cover 34 is the same as that of the heating plate 31.
[0048] In one embodiment, the heating plate assembly 30 further includes a second heat-conducting element 35 disposed between the heating element 32 and the heating plate 31. The second heat-conducting element 35 is in contact with the heating element 32 and covers both the first heating area 321 and the second heating area 322. The thermal conductivity of the second heat-conducting element 35 is greater than that of the heating plate 31. Thus, heat from both the first heating area 321 and the second heating area 322 can be quickly transferred to the second heat-conducting element 35. The second heat-conducting element 35 itself can quickly exchange heat to reduce the heat difference and make the heat transferred to the heating plate 31 more even.
[0049] In one embodiment, the second heat-conducting element 35 and the heating element 32 are configured as an integral structure. This reduces thermal resistance and increases the heat transfer rate. Of course, the second heat-conducting element 35 can also be fixed to the heating element 32 by welding.
[0050] Please refer to Figure 6 , Figure 6 This is a top view of the heating plate assembly 30.
[0051] In one embodiment, the upper surface of the lid 34 facing away from the plate surface 310 is provided with multiple protrusions 340. These protrusions 340 can, on the one hand, thicken the lid 34 and improve the prevention of food sticking to the bottom; on the other hand, they can also separate the food from the upper surface of the lid 34, reducing the contact area between the food and the upper surface and facilitating cleaning. The protrusions 340 can be circular, but are not limited to this.
[0052] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A heat disc assembly, characterized by, include: Heating plate (31), including a plate surface (310) for the side facing the food processing chamber; A heating element (32) is disposed on the side of the heating plate (31) facing away from the plate surface. The heating element (32) can generate heat when powered on. The heating element (32) includes a first heating area (321) and a second heating area (322). The heat of the first heating area (321) is higher than that of the second heating area (322). A cover (34) is provided on the disc surface (310); A first heat-conducting element (33) is located between the disk surface (310) and the disk cover (34). The thermal conductivity of the first heat-conducting element (33) is greater than that of the disk cover (34). An air heat transfer layer (300) is also provided between the disk surface (310) and the disk cover (34). The air heat transfer layer (300) is provided corresponding to the first heating area (321).
2. The heat disc assembly of claim 1, wherein, The first heat-conducting element (33) is provided correspondingly to the second heat-generating area (322).
3. The heating plate assembly according to claim 1, characterized in that, The first heat-conducting element (33) has a through groove extending along its thickness at the position corresponding to the first heating area (321), so that the air heat transfer layer (300) is formed between the disk surface (310) and the disk cover (34); or The first heat-conducting element (33) has a groove with a depth smaller than its own thickness at the position corresponding to the first heating area (321), so that the air heat transfer layer (300) is formed between the disk surface (310) and the disk cover (34).
4. The heat disc assembly of claim 1, wherein, The first heat-conducting element (33) includes a first heat-conducting part (331) and a second heat-conducting part (332) that are circumferentially opposite and connected to each other along the disk surface (310). The first heat-conducting part (331) is located on the same side as the first heating area (321) in the circumferential direction of the disk surface and does not cover the first heating area (321). The second heat-conducting part (332) covers the second heating area (322).
5. The heat disc assembly of claim 4, wherein, The central angle corresponding to the first heat-conducting part (331) is β, 30°≤β≤270°.
6. The heat disc assembly according to any one of claims 1 to 5, wherein, The thermal conductivity of the first heat-conducting element (33) is greater than that of the heating plate (31).
7. The heat disc assembly according to any one of claims 1 to 5, wherein, The heating plate assembly (30) further includes a second heat-conducting element (35) disposed between the heating element (32) and the heating plate (31). The second heat-conducting element (35) is in contact with the heating element and simultaneously covers the first heating area (321) and the second heating area (322). The thermal conductivity of the second heat-conducting element (35) is greater than that of the heating plate (31).
8. The heat disc assembly of claim 7, wherein, The second heat-conducting element (35) and the heating element (32) are configured as an integral structure.
9. The heat disc assembly according to any one of claims 1 to 5, wherein, The upper surface of the cover (34) facing away from the disk surface (310) has a plurality of protrusions (340).
10. A food processor, characterized in that, The food processor includes a cup body (10) and a heating plate assembly (30) as described in any one of claims 1 to 8, wherein the heating plate assembly (30) is assembled at the bottom of the cup body (10) and together with the cup body (10) forms a food processing cavity (101). The food processor further comprises a stirring blade (50) rotatably arranged in the food processing cavity (101) to stir the food in the food processing cavity (101).