Nozzle cleaning device and wafer gluing and developing equipment

Abstract

The utility model provides a nozzle cleaning device and wafer gluing developing equipment, the nozzle cleaning device comprises a cleaning box, a liquid supply mechanism, an ultrasonic generation mechanism, a liquid discharge mechanism and a liquid level detection mechanism, the liquid supply mechanism is communicated with the cleaning box and used for injecting cleaning liquid into the cleaning box, and the ultrasonic generation mechanism is connected to the cleaning box and used for discharging the cleaning liquid into the cleaning box. The liquid discharging mechanism communicates with the cleaning box and is used for discharging the cleaning liquid out of the cleaning box, the liquid level detection mechanism is arranged in the cleaning box and is used for detecting the liquid level height of the cleaning liquid in the cleaning box, the cleaning liquid in the cleaning box is subjected to cavitation through the ultrasonic generation mechanism, and therefore colloid attached to the nozzles is removed from the nozzles; therefore, the purpose of cleaning the nozzle is achieved, and the quality of the wafer is prevented from being influenced by the falling of the colloid from the nozzle.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing technology, and more specifically, relates to a nozzle cleaning device and a wafer coating and developing equipment. Background Technology

[0002] Photoresist coating and developing equipment is a key piece of equipment in semiconductor manufacturing, mainly used in the two core steps of photolithography: photoresist coating and development. Its function directly affects the accuracy of the photolithographic pattern and the chip yield.

[0003] The coating and developing equipment applies adhesive to the wafer through linear drive nozzles. The surface of the linear drive nozzles is prone to adhesive adhesion. Over time, the adhered adhesive will fall off and form particles, which will affect the quality of the wafer.

[0004] Currently, preventive maintenance of linear drive nozzles typically involves manual cleaning and wiping with a lint-free cloth and deionized water. However, this approach has several drawbacks: manual wiping is insufficient to completely remove the adhering adhesive, and it can easily cause the adhesive to spread across the surface of the linear drive nozzle. Furthermore, it can clog the nozzle's outlet, damaging or even rendering the nozzle unusable. Utility Model Content

[0005] The purpose of this application is to provide a nozzle cleaning device and a wafer coating and developing equipment, which uses ultrasonic waves to clean the linear drive nozzles in the wafer coating and developing equipment to ensure that the adhesive adhering to the linear drive nozzles is completely removed.

[0006] To achieve the above objectives, a first aspect of this application is to provide a nozzle cleaning apparatus for cleaning nozzles, comprising:

[0007] Cleaning box;

[0008] A liquid supply mechanism, connected to the cleaning tank, is used to inject cleaning liquid into the cleaning tank;

[0009] An ultrasonic generator, connected to the cleaning tank, is used to generate ultrasonic waves;

[0010] A draining mechanism, connected to the cleaning tank, is used to drain the cleaning solution from the cleaning tank;

[0011] A liquid level detection mechanism is installed inside the cleaning tank and electrically connected to the liquid supply mechanism and the liquid discharge mechanism. When the liquid level detection mechanism detects that the liquid level of the cleaning liquid is higher than the first liquid level height, it controls the liquid supply mechanism to stop injecting the cleaning liquid into the cleaning tank; when the liquid level detection mechanism detects that the liquid level of the cleaning liquid is lower than the second liquid level height, it controls the liquid discharge mechanism to stop discharging the cleaning liquid from the cleaning tank.

[0012] The second liquid level is lower than the first liquid level.

[0013] Optionally, the ultrasonic generating mechanism includes:

[0014] Controller;

[0015] The transducer is installed in the cleaning tank and electrically connected to the controller.

[0016] Optionally, there are multiple transducers, and the multiple transducers are evenly arranged in the cleaning tank.

[0017] Optionally, the liquid level detection mechanism includes:

[0018] The first liquid level sensor is located on the top of the cleaning tank and is electrically connected to the liquid supply mechanism;

[0019] The second liquid level sensor is located at the bottom of the cleaning tank and is electrically connected to the draining mechanism.

[0020] Optionally, the plurality of first liquid level sensors are spaced apart circumferentially along the cleaning tank, and the detection parts of the plurality of first liquid level sensors are all located at the same height;

[0021] Multiple second liquid level sensors are all located at the bottom of the cleaning tank, and the detection points of multiple second liquid level sensors are all located at the same height.

[0022] Optionally, the liquid supply mechanism includes:

[0023] A storage tank for storing the cleaning solution;

[0024] The first valve body is installed on the pipeline connecting the liquid storage tank and the cleaning tank, and is used to inject the cleaning fluid into the cleaning tank when it is opened.

[0025] Optionally, the liquid supply mechanism further includes:

[0026] A filter is disposed between the liquid storage tank and the first valve body, or between the first valve body and the cleaning tank.

[0027] Optionally, the drainage mechanism includes:

[0028] A drain pipe, connected to the cleaning tank, is used to discharge the cleaning solution;

[0029] The second valve body is installed on the drain pipe and is used to discharge the cleaning fluid from the cleaning tank when it is opened.

[0030] Optionally, it also includes:

[0031] An air jet is disposed inside the cleaning tank and is used to blow air onto the nozzle when the liquid level of the cleaning fluid is lower than the first liquid level height, so as to dry the nozzle.

[0032] The beneficial effects of the nozzle cleaning device provided in this application are as follows: Compared with the prior art, the nozzle cleaning device provided in this application includes a cleaning tank, a liquid supply mechanism, an ultrasonic generator, a liquid discharge mechanism, and a liquid level detection mechanism. The liquid supply mechanism is connected to the cleaning tank and is used to inject cleaning liquid into the cleaning tank. The ultrasonic generator is connected to the cleaning tank. The liquid discharge mechanism is connected to the cleaning tank and is used to discharge the cleaning liquid from the cleaning tank. The liquid level detection mechanism is set in the cleaning tank to detect the liquid level of the cleaning liquid in the cleaning tank. Through the ultrasonic generator, the cleaning liquid in the cleaning tank undergoes cavitation, thereby removing the colloid adhering to the nozzle from the nozzle, achieving the purpose of cleaning the nozzle, and preventing the quality of the wafer from being affected by the colloid falling off the nozzle.

[0033] Secondly, this application provides a wafer coating and developing apparatus, comprising:

[0034] Nozzles are used to apply adhesive to the target wafer;

[0035] A nozzle cleaning device for cleaning the nozzle, wherein the nozzle cleaning device is any one of the nozzle cleaning devices described above.

[0036] The beneficial effects of the wafer coating and developing equipment provided in this application are as follows: Compared with the prior art, the wafer coating and developing equipment provided in this application, by setting a nozzle cleaning device on the wafer coating and developing equipment, cleans the nozzles when the nozzles are idle. The nozzle cleaning device uses an ultrasonic generator to cause cavitation of the cleaning liquid in the cleaning tank, thereby removing the adhesive adhering to the nozzles from the nozzles, achieving the purpose of cleaning the nozzles, and preventing the quality of the wafers from being affected by the adhesive falling off the nozzles. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the nozzle cleaning device provided in the embodiments of this application;

[0039] Figure 2 This is a schematic diagram of the structure of the cleaning tank provided in an embodiment of this application.

[0040] The following are the labeling elements in the figure:

[0041] 10. Cleaning tank; 11. Air nozzle; 20. Liquid supply mechanism; 21. Liquid storage tank; 22. First valve body; 23. Filter; 30. Ultrasonic generating mechanism; 31. Controller; 32. Transducer; 40. Drainage mechanism; 41. Drainage pipe; 42. Second valve body; 43. Hazardous waste treatment center; 50. Liquid level detection mechanism; 51. First liquid level sensor; 52. Second liquid level sensor; 60. Nitrogen storage mechanism;

[0042] h1, first liquid level height; h2, second liquid level height. Detailed Implementation

[0043] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0044] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0045] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] Please refer to the following: Figure 1 and Figure 2 The nozzle cleaning device and wafer coating and developing equipment provided in the embodiments of this application will now be described.

[0048] The first aspect of this application is to provide a nozzle cleaning device for cleaning nozzles in a wafer coating and developing equipment, comprising a cleaning tank 10, a liquid supply mechanism 20, an ultrasonic generator 30, a liquid draining mechanism 40, and a liquid level detection mechanism 50.

[0049] For details, please refer to Figure 1 and Figure 2 The cleaning tank 10 is used to hold the cleaning solution, which is a mixture of pure water and isopropanol, wherein the ratio of pure water to isopropanol is 90:10.

[0050] The liquid supply mechanism 20 is connected to the cleaning tank 10 and electrically connected to the control module in the wafer coating and developing equipment. When it is necessary to inject cleaning fluid into the cleaning tank 10, the control module controls the liquid supply mechanism 20 to open so as to inject cleaning fluid into the cleaning tank 10.

[0051] The ultrasonic generator 30 is connected to the bottom of the cleaning tank 10 and electrically connected to the control module in the wafer coating and developing equipment. It is used to generate ultrasonic waves and transmit the ultrasonic waves to the cleaning fluid. When the nozzle is immersed below the surface of the cleaning fluid, the control module controls the ultrasonic generator to work. Under the action of the ultrasonic waves, the cleaning fluid produces cavitation, thereby cleaning the nozzle and causing the adhesive attached to the nozzle to fall off the nozzle.

[0052] The draining mechanism 40 is connected to the cleaning tank 10 and electrically connected to the control module. After the nozzle cleaning operation is completed, the control mechanism controls the draining mechanism 40 to start. The draining mechanism 40 is used to drain the cleaning liquid and the colloid that falls off the nozzle from the cleaning tank 10 to prevent the colloid from contaminating the nozzle during the subsequent nozzle cleaning process.

[0053] The liquid level detection mechanism 50 is installed inside the cleaning tank 10 and is electrically connected to the liquid supply mechanism 20 and the liquid discharge mechanism 40 through the control module. When the liquid level detection mechanism 50 detects that the liquid level of the cleaning liquid is higher than the first liquid level height h1, the liquid level detection mechanism 50 generates a first detection signal and transmits the first detection signal to the control module. The control module controls the liquid supply mechanism 20 to close according to the first detection signal, so as to stop injecting cleaning liquid into the cleaning tank 10.

[0054] When the liquid level detection mechanism 50 detects that the level of the cleaning fluid is lower than the second liquid level height h2, the liquid level detection mechanism 50 generates a second detection signal and transmits the second detection signal to the control module. The control module controls the drainage mechanism 40 to close according to the second detection signal, so as to stop the drainage of the cleaning fluid from the cleaning tank 10. The second liquid level height h2 is lower than the first liquid level height h1.

[0055] Compared with the prior art, the nozzle cleaning device provided in this application includes a cleaning tank 10, a liquid supply mechanism 20, an ultrasonic generator 30, a liquid draining mechanism 40, and a liquid level detection mechanism. The liquid supply mechanism 20 is connected to the cleaning tank 10 and is used to inject cleaning liquid into the cleaning tank 10. The ultrasonic generator 30 is connected to the cleaning tank 10. The liquid draining mechanism 40 is connected to the cleaning tank 10 and is used to drain the cleaning liquid from the cleaning tank 10. The liquid level detection mechanism 50 is set inside the cleaning tank 10 and is used to detect the liquid level of the cleaning liquid in the cleaning tank 10. Through the ultrasonic generator 30, the cleaning liquid in the cleaning tank 10 undergoes cavitation, thereby removing the colloid adhering to the nozzle from the nozzle, achieving the purpose of cleaning the nozzle, and preventing the quality of the wafer from being affected by the colloid falling off the nozzle.

[0056] In this application, the ultrasonic generating mechanism 30 includes a controller 31 and a transducer 32.

[0057] Specifically, such as Figure 1 and Figure 2 As shown, the controller 31 is electrically connected to the control module, and the transducer 32 is installed at the bottom of the cleaning tank 10 and electrically connected to the controller 31. The transducer 32 is used to generate ultrasonic waves. When the nozzle needs to be cleaned, the controller 31 controls the transducer 32 to be connected to the power supply according to the on control signal sent by the control module, so that the transducer 32 generates ultrasonic waves. After the cleaning operation of the nozzle is completed, the controller 31 controls the transducer 32 to be disconnected from the power supply according to the off control signal sent by the control module, so that the transducer 32 stops generating ultrasonic waves.

[0058] There are multiple transducers 32, which are evenly arranged on the cleaning box 10.

[0059] Preferably, in this application, there are four transducers 32, which are evenly spaced along the length of the cleaning tank 10, so as to transmit ultrasonic waves to the cleaning fluid in the cleaning tank 10 at multiple locations, thereby improving the cavitation effect of the cleaning fluid and thus improving the cleaning ability of the nozzle.

[0060] In this application, the liquid level detection mechanism 50 includes a first liquid level sensor 51 and a second liquid level sensor 52.

[0061] like Figure 2 As shown, the first liquid level sensor 51 is disposed on the top of the cleaning tank 10 and is electrically connected to the liquid supply mechanism 20 through the control module. When the first liquid level sensor 51 detects that the liquid level of the cleaning liquid is equal to the first liquid level height h1, it generates a first detection signal and transmits the first detection signal to the control module, thereby causing the control module to control the liquid supply mechanism 20 to close according to the first detection signal, so as to stop the injection of cleaning liquid into the cleaning tank 10.

[0062] The second liquid level sensor 52 is located at the bottom of the cleaning tank 10 and is electrically connected to the draining mechanism 40 via the control module. When the second liquid level sensor 52 detects that the liquid level of the cleaning fluid is equal to the second liquid level height h2, the liquid level detection mechanism 50 generates a second detection signal and transmits the second detection signal to the control module. The control module controls the draining mechanism 40 to close according to the second detection signal, so as to stop the discharge of the cleaning fluid from the cleaning tank 10.

[0063] There are multiple first liquid level sensors 51 and multiple second liquid level sensors 52. The multiple first liquid level sensors 51 are spaced apart circumferentially along the cleaning tank 10, and the detection parts of the multiple first liquid level sensors 51 are all located at the same height. The multiple second liquid level sensors 52 are all located at the bottom of the cleaning tank 10, and the detection parts of the multiple second liquid level sensors 52 are all located at the same height.

[0064] Specifically, in this application, there are two first liquid level sensors 51, which are spaced apart circumferentially along the cleaning tank 10, and the detection parts of the two first liquid level sensors 51 are at the same height. There are three second liquid level sensors 52, with one second liquid level sensor 52 located between any two adjacent transducers 32 among the four transducers 32, and the detection parts of the three second liquid level sensors 52 are at the same height.

[0065] By setting multiple first liquid level sensors 51 and multiple second liquid level sensors 52, the detection accuracy of the cleaning fluid level height is improved.

[0066] In this application, the liquid supply mechanism 20 includes a liquid storage tank 21 and a first valve body 22.

[0067] like Figure 1 and Figure 2 As shown, the storage tank 21 is used to store the cleaning fluid, and the height of the storage tank 21 is higher than that of the cleaning tank 10. The first valve body 22 is a solenoid valve and is electrically connected to the control module. The first valve body 22 is located on the pipeline connecting the storage tank 21 and the cleaning tank 10. When cleaning fluid needs to be injected into the cleaning tank 10, the control module controls the first valve body 22 to open, so as to inject the cleaning fluid into the cleaning tank 10. After the control module receives the first detection signal generated by the first liquid level sensor 51, it controls the first valve body 22 to close, so as to stop the injection of cleaning fluid into the cleaning tank 10.

[0068] In one embodiment of this application, the liquid supply mechanism 20 further includes a filter 23.

[0069] like Figure 2As shown, the filter 23 is installed on the pipeline between the liquid storage tank 21 and the first valve body 22, or on the pipeline between the first valve body 22 and the cleaning tank 10, for filtering the cleaning liquid injected into the cleaning tank 10.

[0070] In this application, the drainage mechanism 40 includes a drainage pipe 41 and a second valve body 42.

[0071] like Figure 1 and Figure 2 As shown, the drain pipe 41 is connected to the bottom of the cleaning tank 10 for discharging the cleaning fluid. The second valve body 42 is also a solenoid valve and is electrically connected to the control module. The second valve body 42 is mounted on the drain pipe 41. When it is necessary to discharge the cleaning fluid from the cleaning tank 10, the control module controls the second valve body 42 to open, thereby discharging the cleaning fluid from the cleaning tank 10. The discharged cleaning fluid is collected and treated by the hazardous waste treatment center 43. After the control module receives the second detection signal generated by the second liquid level sensor 52, it controls the second valve body 42 to close, thereby stopping the discharge of the cleaning fluid from the cleaning tank 10.

[0072] In one embodiment of the application, the nozzle cleaning device further includes an air jet 11.

[0073] Specifically, such as Figure 1 and Figure 2 As shown, the jet nozzle is installed on the cleaning tank 10 and connected to an external nitrogen storage mechanism 60. When the liquid level of the cleaning fluid is lower than the first liquid level height, i.e., when the cleaning fluid is discharged from the cleaning tank 10, nitrogen is blown onto the nozzle to dry the nozzle.

[0074] After the nozzle drying process is completed, the control module controls the nozzle to move to the pre-dispensing position to perform pre-dispensing to prevent the cleaning fluid in the nozzle from contaminating the wafer.

[0075] Secondly, this application provides a wafer coating and developing apparatus, including a nozzle and a nozzle cleaning device.

[0076] Specifically, the nozzles are used to apply adhesive to the wafers. A nozzle cleaning device is installed on the coating and developing machine and is used to clean the nozzles; the nozzle cleaning device is any of the nozzle cleaning devices provided above.

[0077] Compared with the prior art, the wafer coating and developing equipment provided in this application, by setting a nozzle cleaning device on the wafer coating and developing equipment, cleans the nozzles when the nozzles are idle. The nozzle cleaning device uses an ultrasonic generator 30 to cause cavitation in the cleaning liquid in the cleaning tank 10, thereby removing the adhesive adhering to the nozzles from the nozzles, achieving the purpose of cleaning the nozzles, and preventing the quality of the wafer from being affected by the adhesive falling off the nozzles.

[0078] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A nozzle cleaning device for cleaning a nozzle, characterized by include: Cleaning box; A liquid supply mechanism, connected to the cleaning tank, is used to inject cleaning liquid into the cleaning tank; An ultrasonic generator, connected to the cleaning tank, is used to generate ultrasonic waves; A draining mechanism, connected to the cleaning tank, is used to drain the cleaning solution from the cleaning tank; A liquid level detection mechanism is installed inside the cleaning tank and electrically connected to the liquid supply mechanism and the liquid discharge mechanism. When the liquid level detection mechanism detects that the liquid level of the cleaning liquid is higher than the first liquid level height, it controls the liquid supply mechanism to stop injecting the cleaning liquid into the cleaning tank; when the liquid level detection mechanism detects that the liquid level of the cleaning liquid is lower than the second liquid level height, it controls the liquid discharge mechanism to stop discharging the cleaning liquid from the cleaning tank. The second liquid level is lower than the first liquid level.

2. The nozzle washing apparatus of claim 1, wherein The ultrasonic wave generating mechanism includes: Controller; The transducer is installed in the cleaning tank and electrically connected to the controller.

3. The nozzle cleaning device as described in claim 2, characterized in that, The number of transducers is multiple, and the multiple transducers are evenly arranged in the cleaning tank.

4. The nozzle washing apparatus according to claim 1 or 3, wherein The liquid level detection mechanism includes: The first liquid level sensor is located on the top of the cleaning tank and is electrically connected to the liquid supply mechanism; The second liquid level sensor is located at the bottom of the cleaning tank and is electrically connected to the draining mechanism.

5. The nozzle cleaning device as described in claim 4, characterized in that, There are multiple first liquid level sensors and multiple second liquid level sensors; Multiple first liquid level sensors are spaced apart circumferentially along the cleaning tank, and the detection parts of multiple first liquid level sensors are all located at the same height; Multiple second liquid level sensors are all located at the bottom of the cleaning tank, and the detection points of multiple second liquid level sensors are all located at the same height.

6. The nozzle washing apparatus of claim 5, wherein The liquid supply mechanism includes: A storage tank for storing the cleaning solution; The first valve body is installed on the pipeline connecting the liquid storage tank and the cleaning tank, and is used to inject the cleaning fluid into the cleaning tank when it is opened.

7. The nozzle washing apparatus of claim 6, wherein The liquid supply mechanism also includes: A filter is disposed between the liquid storage tank and the first valve body, or between the first valve body and the cleaning tank.

8. The nozzle washing apparatus of claim 7, wherein The drainage mechanism includes: A drain pipe, connected to the cleaning tank, is used to discharge the cleaning solution; The second valve body is installed on the drain pipe and is used to discharge the cleaning fluid from the cleaning tank when it is opened.

9. The nozzle washing apparatus of claim 1, wherein Also includes: An air jet is disposed inside the cleaning tank and is used to blow air onto the nozzle when the liquid level of the cleaning fluid is lower than the first liquid level height, so as to dry the nozzle.

10. A wafer coating and developing apparatus, characterized in that, include: Nozzles are used to apply adhesive to the target wafer; A nozzle cleaning device for cleaning the nozzle, wherein the nozzle cleaning device is the nozzle cleaning device according to any one of claims 1-9.

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