Radian electronic product waterproof pouring sealant device

Abstract

The utility model relates to the technical field of product pouring sealant, in particular to a waterproof pouring sealant device for electronic products with radian, which comprises a rack and a sealant injection positioning unit, the sealant injection positioning unit comprises a lower mold, an upper mold, a silica gel plate, a track frame, a sliding frame, a driving machine, a connecting frame, a pull rod, a sealant injection component and a heating component, during use, an electronic product is placed on the silica gel plate, the silica gel plate is attached to the curve of the electronic product through good flexibility, the driving machine is started to drive the connecting frame to rotate and is matched with the pull rod to drive the sliding frame to move downwards, and at the moment, the sliding frame moves in the rail frame till the upper mold and the lower mold are matched. The glue injection assembly is used for discharging glue from the glue injection hole, the heating assembly is used for curing the glue, and a positioning structure is formed in the mode, so that the situation of non-uniform glue injection is avoided, and the glue pouring efficiency and quality of electronic products are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of product potting adhesive technology, and in particular to a curved waterproof potting adhesive device for electronic products. Background Technology

[0002] With the development of technology, potting compounds have been widely used in electronic products. Electronic products are encapsulated with potting compounds according to their structure or usage requirements. However, when warranty or repair is needed during use, the products cannot be repaired and can only be discarded, resulting in a great waste.

[0003] The prior art patent application with authorization publication number CN203554840U discloses a new type of potting compound for electronic products, including LED waterproof power supplies, IC bonding products, potting encapsulation modules, and coil windings. A protective layer is provided on the surface of the components covered by the potting compound. By adding a protective layer covering the components between the traditional potting compound layer and the components, damage to the components or parts caused by disassembling the potting compound layer can be prevented, thereby realizing the potting of electronic products and reducing cost waste.

[0004] However, in the aforementioned prior art, it is impossible to position the electronic product during potting, which easily leads to uneven potting and low efficiency, affecting the quality of the potting compound for electronic products. Utility Model Content

[0005] The purpose of this invention is to provide a curved waterproof potting compound device for electronic products, which aims to solve the problems in the prior art where it is impossible to position the electronic product during potting, resulting in uneven dispensing, low efficiency, and affecting the quality of the potting compound for electronic products.

[0006] To achieve the above objectives, this utility model provides a curved waterproof potting compound device for electronic products, including a frame and a dispensing positioning unit. The dispensing positioning unit includes a lower mold, an upper mold, a silicone plate, a track frame, a slide, a drive motor, a connecting frame, a pull rod, a dispensing assembly, and a heating assembly. The dispensing positioning unit is positioned above the frame. The lower mold is positioned above the frame. The silicone plate is detachably connected to the lower mold and located on the inner wall of the lower mold. The track frame is fixedly connected to the frame and located on the inner wall of the frame. Above, the slide is slidably connected to the track frame and located on the inner side wall of the track frame; the upper mold is detachably connected to the slide and located on one side of the slide; the drive motor is fixedly connected to the frame and located below the frame; the connecting frame is fixedly connected to the drive motor and located at the output end of the drive motor; the pull rod is rotatably connected to the slide and the connecting frame respectively; the upper mold has an injection hole; the injection assembly is located above the frame; and the heating assembly is connected to the frame and the lower mold respectively.

[0007] The glue dispensing assembly includes a bracket, a glue storage tank, a metering pump, a connecting pipe, and a glue dispensing gun. The bracket is fixedly connected to the frame and located above the frame. The glue storage tank is fixedly connected to the bracket and located above the bracket. The metering pump is fixedly connected to the bracket and located above the bracket, and is connected to the glue storage tank. The connecting pipe is connected to the metering pump and located at the output end of the metering pump. The glue dispensing gun is connected to the connecting pipe and located at one end of the connecting pipe, and is adapted to the glue dispensing hole.

[0008] The glue dispensing assembly further includes a rotating frame and a stirring frame. The stirring frame is rotatably connected to the glue storage tank and is located on the inner side wall of the glue storage tank. The rotating frame is fixedly connected to the stirring frame and is located above the stirring frame. The rotating frame is rotatably engaged with the glue storage tank.

[0009] The heating assembly includes a heating plate, a heating wire, and a heat insulation plate. The heat insulation plate is fixedly connected to the frame and located above the frame. The heating plate is detachably connected to the heat insulation plate and the lower mold. The heating wire is fixedly connected to the heating plate and located on the inner sidewall of the heating plate.

[0010] The heating assembly further includes a temperature sensor, which is detachably connected to the lower mold and located on the inner sidewall of the lower mold.

[0011] This utility model discloses a curved waterproof potting compound device for electronic products. In use, the electronic product is placed on a silicone plate, which, due to its good flexibility, conforms to the curve of the electronic product. The drive motor is activated, causing the connecting frame to rotate. This, in conjunction with the pull rod, moves the slide downwards. The slide moves within the track frame until the upper mold and lower mold are engaged. The dispensing component dispenses the compound through the dispensing hole, and the heating component cures the compound. This method creates a positioning structure, preventing uneven dispensing and ensuring the efficiency and quality of the potting compound for the electronic product. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the structure of the curved waterproof potting compound device for electronic products according to this utility model.

[0014] Figure 2 This is a cross-sectional view of the curved waterproof potting compound device for electronic products according to this utility model.

[0015] Figure 3 This is a front view of the curved waterproof potting compound device for electronic products according to this utility model.

[0016] Figure 4 This is the utility model Figure 3 A sectional view along line AA.

[0017] 101-Frame, 102-Lower mold, 103-Upper mold, 104-Silicone plate, 105-Rail frame, 106-Slide carriage, 107-Driver, 108-Connecting frame, 109-Tie rod, 110-Bracket, 111-Glue storage tank, 112-Metering pump, 113-Connecting pipe, 114-Glue gun, 115-Rotating frame, 116-Mixing frame, 117-Heating plate, 118-Heating wire, 119-Insulation plate, 120-Temperature sensor, 121-Glue injection hole. Detailed Implementation

[0018] Please see Figures 1 to 4 ,in, Figure 1 This is a schematic diagram of the structure of the curved waterproof potting compound device for electronic products according to this utility model. Figure 2 This is a cross-sectional view of the curved waterproof potting compound device for electronic products according to this utility model. Figure 3 This is a front view of the curved waterproof potting compound device for electronic products according to this utility model. Figure 4 This is the utility model Figure 3A sectional view along line AA.

[0019] This utility model provides a curved waterproof potting device for electronic products, including a frame 101 and a glue injection positioning unit. The glue injection positioning unit includes a lower mold 102, an upper mold 103, a silicone plate 104, a track frame 105, a slide 106, a drive motor 107, a connecting frame 108, a pull rod 109, a glue injection assembly, and a heating assembly. The glue injection assembly includes a bracket 110, a glue storage tank 111, a metering pump 112, a connecting pipe 113, a glue injection gun 114, a rotating frame 115, and a stirring frame 116. The heating assembly includes a heating plate 117, a heating wire 118, a heat insulation plate 119, and a temperature sensor 120. The upper mold 103 has a glue injection hole 121.

[0020] The glue injection positioning unit is disposed above the frame 101; the lower mold 102 is disposed above the frame 101; the silicone plate 104 is detachably connected to the lower mold 102 and is located on the inner side wall of the lower mold 102; the track frame 105 is fixedly connected to the frame 101 and is located above the frame 101; the slide 106 is slidably connected to the track frame 105 and is located on the inner side wall of the track frame 105; the upper mold 103 is detachably connected to the slide 106 and is located on the inner side wall of the lower mold 102. On one side of the slide 106, the drive motor 107 is fixedly connected to the frame 101 and located below the frame 101. The connecting frame 108 is fixedly connected to the drive motor 107 and located at the output end of the drive motor 107. The pull rod 109 is rotatably connected to the slide 106 and the connecting frame 108 respectively. The upper mold 103 has a glue injection hole 121. The glue injection assembly is disposed above the frame 101. The heating assembly is connected to the frame 101 and the lower mold 102 respectively.

[0021] In this embodiment, the electronic product is placed on the silicone plate 104, which conforms to the curves of the electronic product due to its good flexibility. The drive motor 107 is activated to rotate the connecting frame 108, which in turn drives the slide 106 to move downwards in conjunction with the pull rod 109. At this time, the slide 106 moves within the track frame 105 until the upper mold 103 and the lower mold 102 are engaged. The glue injection component is used to discharge the glue from the glue injection hole 121, and the heating component is used to cure the glue. This method forms a positioning structure, avoiding uneven glue injection and ensuring the efficiency and quality of the potting glue for the electronic product.

[0022] The upper mold 103 and the lower mold 102 can be replaced according to the size of the electronic product.

[0023] The drive unit 107 uses a stepper motor to achieve synchronous rotation control.

[0024] Furthermore, the bracket 110 is fixedly connected to the frame 101 and located above the frame 101; the glue storage tank 111 is fixedly connected to the bracket 110 and located above the bracket 110; the metering pump 112 is fixedly connected to the bracket 110 and located above the bracket 110, and the metering pump 112 is connected to the glue storage tank 111; the connecting pipe 113 is connected to the metering pump 112 and located at the output end of the metering pump 112; the glue injection gun 114 is connected to the connecting pipe 113 and located at one end of the connecting pipe 113; and the glue injection gun 114 is adapted to the glue injection hole 121.

[0025] In this embodiment, the glue gun 114 is inserted into the glue injection hole 121, and the metering pump 112 is started to quantitatively extract the glue from the glue storage tank 111. The glue is then introduced into the cavity formed by the upper mold 103 and the lower mold 102 through the connecting pipe 113. The structure is simple and easy for workers to operate and use.

[0026] Furthermore, the stirring rack 116 is rotatably connected to the glue storage tank 111 and is located on the inner side wall of the glue storage tank 111. The rotating rack 115 is fixedly connected to the stirring rack 116 and is located above the stirring rack 116. The rotating rack 115 is rotatably engaged with the glue storage tank 111.

[0027] In this embodiment, rotating the rotating frame 115 causes the stirring frame 116 to stir and mix the colloid in the storage tank 111, thereby preventing the colloid from separating and ensuring the quality of the colloid.

[0028] Furthermore, the heat insulation plate 119 is fixedly connected to the frame 101 and located above the frame 101. The heating plate 117 is detachably connected to the heat insulation plate 119 and the lower mold 102 respectively. The heating wire 118 is fixedly connected to the heating plate 117 and located on the inner sidewall of the heating plate 117.

[0029] In this embodiment, the heating wire 118 is activated, and heat is transferred to the lower mold 102 by utilizing the heat transfer property. Then, the high-temperature resistant silicone plate 104 acts on the electronic product, so that the potting compound can be cured at the set temperature, ensuring that the potting compound can be cured quickly and uniformly, thereby improving production efficiency and potting quality.

[0030] Furthermore, the temperature sensor 120 is detachably connected to the lower mold 102 and is located on the inner sidewall of the lower mold 102.

[0031] In this embodiment, the temperature sensor 120 is used to detect the temperature inside the lower mold 102, so that the staff can observe it.

[0032] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments, and equivalent variations made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A curved waterproof potting compound device for electronic products, comprising a frame, characterized in that, It also includes a glue injection positioning unit, which is disposed above the frame; The glue injection positioning unit includes a lower mold, an upper mold, a silicone plate, a track frame, a slide, a drive motor, a connecting frame, a pull rod, a glue injection assembly, and a heating assembly. The lower mold is located above the frame. The silicone plate is detachably connected to the lower mold and is located on the inner wall of the lower mold. The track frame is fixedly connected to the frame and is located above the frame. The slide is slidably connected to the track frame and is located on the inner wall of the track frame. The upper mold is detachably connected to the slide and is located on one side of the slide. The drive motor is fixedly connected to the frame and is located below the frame. The connecting frame is fixedly connected to the drive motor and is located at the output end of the drive motor. The pull rod is rotatably connected to the slide and the connecting frame respectively. The upper mold has a glue injection hole. The glue injection assembly is located above the frame. The heating assembly is connected to the frame and the lower mold respectively.

2. The curved electronic product waterproof potting compound device as described in claim 1, characterized in that, The glue dispensing assembly includes a bracket, a glue storage tank, a metering pump, a connecting pipe, and a glue dispensing gun. The bracket is fixedly connected to the frame and located above the frame. The glue storage tank is fixedly connected to the bracket and located above the bracket. The metering pump is fixedly connected to the bracket and located above the bracket, and the metering pump is connected to the glue storage tank. The connecting pipe is connected to the metering pump and located at the output end of the metering pump. The glue dispensing gun is connected to the connecting pipe and located at one end of the connecting pipe, and the glue dispensing gun is adapted to the glue dispensing hole.

3. The curved electronic product waterproof potting compound device as described in claim 2, characterized in that, The glue dispensing assembly also includes a rotating frame and a stirring frame. The stirring frame is rotatably connected to the glue storage tank and is located on the inner side wall of the glue storage tank. The rotating frame is fixedly connected to the stirring frame and is located above the stirring frame. The rotating frame is rotatably engaged with the glue storage tank.

4. The curved electronic product waterproof potting compound device as described in claim 3, characterized in that, The heating assembly includes a heating plate, a heating wire, and a heat insulation plate. The heat insulation plate is fixedly connected to the frame and located above the frame. The heating plate is detachably connected to the heat insulation plate and the lower mold, respectively. The heating wire is fixedly connected to the heating plate and located on the inner sidewall of the heating plate.

5. The curved electronic product waterproof potting compound device as described in claim 4, characterized in that, The heating assembly also includes a temperature sensor, which is detachably connected to the lower mold and located on the inner sidewall of the lower mold.

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