Semiconductor equipment lifting device bearing platform

Abstract

The utility model relates to a lifting device bearing platform, in particular to a semiconductor equipment lifting device bearing platform which comprises an equipment cabinet body, a lifting device is fixedly arranged on the inner wall of the equipment cabinet body, a box process hole is formed in the side wall of the equipment cabinet body, and the lifting device comprises a fixing plate. The fixed plate is fixedly connected with an air cylinder, one end of a piston rod of the air cylinder is fixedly connected with a bearing plate, the bearing plate comprises a first bearing plate and a second bearing plate, the first bearing plate and the second bearing plate are both fixedly provided with supporting columns used for placing wafers, and the air cylinder is arranged to serve as a power source of the lifting device. The piston rod stretches out and draws back to drive the bearing plate to move up and down, the upper magnetic switch and the lower magnetic switch trigger signals by detecting the magnetic ring on the piston rod, accurate feedback of the position of the bearing plate is achieved, the accuracy and stability of the lifting process are ensured, and accurate processing of the A face and the B face of the same wafer is achieved.

Description

Technical Field

[0001] This utility model relates to a lifting device support platform, and more particularly to a semiconductor equipment lifting device support platform. Background Technology

[0002] Semiconductor manufacturing involves various precision equipment and complex processes, such as etching, thin film deposition, and ion implantation. These processes require extremely high precision in wafer transport and positioning; even the slightest deviation can lead to product defects or reduced yield. Therefore, a lifting platform capable of precisely controlling wafer orientation and achieving stable transport is needed. Utility Model Content

[0003] The main objective of this invention is to provide a support platform for a semiconductor equipment lifting device, in order to solve the problems raised in related technologies.

[0004] To achieve the above objectives, according to one aspect of the present invention, a semiconductor equipment lifting device support platform is provided, including an equipment cabinet. A lifting device is fixedly installed on the inner wall of the equipment cabinet, and a box process hole is opened on the side wall of the equipment cabinet. The lifting device includes a fixing plate, and a cylinder is fixedly connected to the fixing plate. One end of the piston rod of the cylinder is fixedly connected to a support plate. The support plate includes a first support plate and a second support plate. Support columns for placing wafers are fixedly installed on both the first support plate and the second support plate.

[0005] Furthermore, support plates are fixedly connected to both ends of the fixed plate, and a load-bearing sheet metal is fixedly connected to the center of the fixed plate.

[0006] Furthermore, a mounting plate is fixedly connected to the bottom of the cylinder, the mounting plate is fixedly mounted on the supporting sheet metal, and an upper magnetic switch and a lower magnetic switch are fixedly mounted on one side of the outer wall of the cylinder.

[0007] Furthermore, an upper position sensor and a lower position sensor are respectively fixedly installed on the first support plate and the second support plate.

[0008] Compared with the prior art, the present invention has the following beneficial effects:

[0009] In this semiconductor equipment lifting device platform, a cylinder is set as the power source for the lifting device. The extension and retraction of the piston rod drives the support plate to move up and down. The upper and lower magnetic switches detect the trigger signal of the magnetic ring on the piston rod, realizing precise feedback of the position of the support plate, ensuring the accuracy and stability of the lifting process, and realizing precise processing of the A and B sides of the same wafer. Attached Figure Description

[0010] Figure 1This is a perspective view of the overall structure of the semiconductor equipment lifting device carrying platform in a preferred embodiment of the present invention;

[0011] Figure 2 This is an overall sectional view of the lifting device in a preferred embodiment of the present invention;

[0012] Figure 3 This is a schematic diagram of the structure of the fixing plate, cylinder and bearing plate in a preferred embodiment of the present invention;

[0013] Figure 4 This is an exploded view of the support plate in a preferred embodiment of the present invention.

[0014] Figure label:

[0015] 1. Equipment cabinet; 11. Cabinet process openings;

[0016] 2. Fixed plate; 21. Support plate; 23. Load-bearing sheet metal;

[0017] 3. Cylinder; 31. Upper magnetic switch; 32. Lower magnetic switch; 33. Mounting plate;

[0018] 4. Support plate; 41. First support plate; 411. Upper position sensor; 42. Second support plate; 421. Lower position sensor;

[0019] 5. Support column; 6. Support frame. Detailed Implementation

[0020] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0021] like Figures 1 to 4 As shown, this embodiment provides a semiconductor equipment lifting device carrying platform, including an equipment cabinet 1. A lifting device is fixedly installed on the inner wall of the equipment cabinet 1, and a box process hole 11 is opened on the side wall of the equipment cabinet 1. The purpose of the box process hole 11 is to provide space for the robotic arm to pick up the wafer.

[0022] The lifting device includes a fixed plate 2, on which a cylinder 3 is fixedly connected. One end of the piston rod of the cylinder 3 is fixedly connected to a bearing plate 4. The bearing plate 4 includes a first bearing plate 41 and a second bearing plate 42. The first bearing plate 41 and the second bearing plate 42 are fixed to each other and separated by a support partition. Support columns 5 for placing wafers and support frames 6 are fixedly provided on both the first bearing plate 41 and the second bearing plate 42.

[0023] Both ends of the fixed plate 2 are fixedly connected to the support plate 21, the support plate 21 is fixed to the inner wall of the equipment cabinet 1, and the center of the fixed plate 2 is fixedly connected to the load-bearing sheet metal 23.

[0024] The bottom of the cylinder 3 is fixedly connected to a mounting plate 33, which is fixedly mounted on the supporting sheet metal 23. An upper magnetic switch 31 and a lower magnetic switch 32 are fixedly mounted on the outer wall of one side of the cylinder 3. When the piston rod of the cylinder 3 drives the supporting plate 4 to a designated position, the magnetic switch triggers the signal by detecting the magnetic ring on the piston rod to achieve position feedback.

[0025] An upper position sensor 411 and a lower position sensor 421 are fixedly installed on the first support plate 41 and the second support plate 42, respectively. The wafer placement status on the support column 5 is monitored in real time through non-contact detection (such as photoelectric sensor or capacitive sensor). When the wafer is detected to be placed on the support column 5 or to be removed from the support column 5, the signal is transmitted to the magnetic switch to control the start and stop of the cylinder 3.

[0026] Cylinder 3 drives the support plate 4 to move up and down to two fixed upper and lower processing positions, and the external robot arm performs the wafer picking and placing actions. The specific movement process is as follows: The external robot arm delivers the wafer to the first support plate 41 of this device. At this time, the wafer A side is facing up and is placed on the support column 5. After the upper position sensor 411 detects that a wafer has been placed at this position, cylinder 3 pushes the support plate 4 up. After reaching the designated position, the upper magnetic switch 31 on cylinder 3 is triggered, and cylinder 3 stops pushing up. At this time, the external robot arm moves to this position, grabs the wafer, and performs subsequent processing on the wafer A side. After the wafer is removed, the upper position sensor 411 is triggered, and the system transmits a signal to cylinder 3. Cylinder 3 descends to the lower limit position, and the lower magnetic switch 32 of cylinder 3 is triggered, and cylinder 3 stops descending. The external robot arm's wafer delivery action is completed.

[0027] When the integrated unit senses that the lithography machine needs to process the B-side of the same wafer, it transmits the information back to the machine. Cylinder 3 is pushed up to its upper limit position, triggering the upper magnetic switch 31 of cylinder 3. Cylinder 3 stops its upward movement, and the external robotic arm flips the wafer so that the B-side is facing up and transfers it to the second carrier plate 42. The lower position sensor 421 is triggered, and cylinder 3 returns to its lower limit position. The lower magnetic switch 32 is triggered, and cylinder 3 stops its downward movement. The external robotic arm removes the wafer and performs subsequent processing on the B-side of the wafer. The wafer removal action by the external robotic arm is then complete.

[0028] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A semiconductor equipment lifting device carrying platform, comprising an equipment cabinet (1), a cabinet process hole (11) is opened in the side wall of the equipment cabinet (1), and a lifting device is fixedly arranged on the inner wall of the equipment cabinet (1), characterized in that, The lifting device includes a fixed plate (2), on which a cylinder (3) is fixedly connected. One end of the piston rod of the cylinder (3) is fixedly connected to a bearing plate (4). The bearing plate (4) includes a first bearing plate (41) and a second bearing plate (42). Support columns (5) for placing wafers are fixedly provided on both the first bearing plate (41) and the second bearing plate (42).

2. The semiconductor equipment hoist carrier platform of claim 1, wherein, Both ends of the fixed plate (2) are fixedly connected to the support plate (21), and the center of the fixed plate (2) is fixedly connected to the load-bearing sheet metal (23).

3. The semiconductor equipment hoist carrier platform of claim 2, wherein, The bottom of the cylinder (3) is fixedly connected to a mounting plate (33), the mounting plate (33) is fixedly mounted on the bearing sheet metal (23), and an upper magnetic switch (31) and a lower magnetic switch (32) are fixedly mounted on one side of the outer wall of the cylinder (3).

4. The semiconductor equipment hoist carrier platform of claim 1, wherein, An upper position sensor (411) and a lower position sensor (421) are respectively fixedly installed on the first support plate (41) and the second support plate (42).

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