Water purification equipment

Abstract

The utility model relates to water purification equipment. The water purification equipment comprises a first water purification tank, a second water purification tank, a cold water tank, a hot water tank, a first semiconductor refrigerator and a second semiconductor refrigerator; each of the first semiconductor cooler and the second semiconductor cooler is provided with a cooling surface and a heating surface; the first semiconductor cooler is clamped between the first purified water tank and the cold water tank, the cooling surface is attached to the cold water tank, and the heating surface is attached to the first purified water tank; the second semiconductor cooler is clamped between the second purified water tank and the hot water tank, the cooling surface is attached to the second purified water tank, and the heating surface is attached to the hot water tank. The water purification equipment can reduce energy waste.

Description

Technical Field

[0001] This utility model relates to the field of water purifiers, specifically to a water purification device. Background Technology

[0002] A water purifier, also called a water purification machine or water quality purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. Currently, the cooling function in related technologies is achieved through semiconductor coolers. However, when a semiconductor cooler is heating, one side heats while the other side cools, resulting in energy waste. Utility Model Content

[0003] Therefore, this utility model provides a water purification device. The water purification device can reduce energy waste.

[0004] This utility model provides the following technical solution:

[0005] A water purification device includes: a first water purification tank, a second water purification tank, a cold water tank, a hot water tank, a first semiconductor refrigerator, and a second semiconductor refrigerator;

[0006] Both the first and second semiconductor coolers have a cooling surface and a heating surface;

[0007] The first semiconductor cooler is sandwiched between the first purified water tank and the cold water tank, wherein the cooling surface is attached to the cold water tank and the heating surface is attached to the first purified water tank.

[0008] The second semiconductor cooler is sandwiched between the second purified water tank and the hot water tank, wherein the cooling surface is attached to the second purified water tank and the heating surface is attached to the hot water tank.

[0009] Furthermore, the first purified water tank is connected to the hot water tank, and the second purified water tank is connected to the cold water tank. The first purified water tank is used to replenish water to the hot water tank, and the second purified water tank is used to replenish water to the hot water tank.

[0010] Furthermore, it also includes: thermal conductive components;

[0011] The first water tank, the second water tank, the cold water tank, and the hot water tank are all provided with mounting holes, and each mounting hole is provided with a heat-conducting component. The heat-conducting component is attached to the first semiconductor cooler and / or the second semiconductor cooler and is used to transfer heat to the first water tank, the second water tank, the cold water tank, and the hot water tank.

[0012] Furthermore, the heat-conducting component includes: a heat-absorbing element and multiple heat-conducting elements;

[0013] Multiple heat-conducting elements are spaced apart on the heat-absorbing element, and the heat-absorbing element is attached to the cooling surface and / or heating surface. The heat-conducting element is used to transfer heat from the heat-absorbing element.

[0014] Furthermore, the heat-conducting component is a heat-conducting sheet, which extends into the first purified water tank, the second purified water tank, the cold water tank, and the hot water tank.

[0015] Furthermore, it also includes: limiting components;

[0016] The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

[0017] Furthermore, the outer periphery of the cold water tank, the hot water tank, the first purified water tank, and the second purified water tank are all provided with a heat insulation layer.

[0018] Furthermore, it also includes: a booster pump, a first valve body, and a second valve body;

[0019] The first purified water tank and the cold water tank are both connected to the first valve body, the second purified water tank and the hot water tank are both connected to the second valve body, and the first valve body and the second valve body are both connected to the booster pump.

[0020] Furthermore, it also includes: filter element assembly;

[0021] The filter cartridge assembly is disposed in the water purification equipment, which is connected to the first water purification tank and the second water purification tank respectively.

[0022] Furthermore, it also includes: vane pumps;

[0023] The vane pump is connected to the hot water tank and the cold water tank, and the vane pump is used to supply water to the water-using equipment.

[0024] The aforementioned water purification equipment incorporates a first semiconductor cooler and a second semiconductor cooler. A cooling tank is positioned on the cooling surface of the first semiconductor cooler, and a first purified water tank is positioned on the heating surface of the first semiconductor cooler. This allows the first semiconductor cooler to cool the cooling tank while simultaneously storing heat in the first purified water tank through the heat generated on its heating surface. Similarly, a second purified water tank is positioned on the cooling surface of the second semiconductor cooler, and a hot water tank is positioned on its heating surface to heat the hot water tank. This allows the second semiconductor cooler to heat the hot water tank while simultaneously cooling the cold water pipe through heating the hot water tank. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 One of the structural schematic diagrams of the water purification equipment provided in the embodiments of this utility model;

[0027] Figure 2 A partial structural cross-sectional view of the water purification equipment provided in this embodiment of the utility model;

[0028] Figure 3 This is a schematic diagram of the structure of the heat-conducting component provided in an embodiment of the present utility model;

[0029] Figure 4 A cross-sectional view of a cold water tank provided for an embodiment of this utility model;

[0030] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0031] Figure 6 This is the second structural schematic diagram of the water purification equipment provided in the embodiment of this utility model;

[0032] Figure 7 The third schematic diagram of the water purification equipment provided in this embodiment of the utility model;

[0033] Figure 8 The fourth schematic diagram of the water purification equipment provided in the embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Water purification equipment; 10-First purified water tank; 11-Mounting hole; 20-Second purified water tank; 30-Cold water tank; 40-Hot water tank; 50-First semiconductor cooler; 60-Second semiconductor cooler; 61-Cooling surface; 62-Heating surface; 70-Heat-conducting component; 71-Heat-absorbing component; 72-Multiple heat-conducting components; 80-Limiting component; 801-Extension; 802-Limiting component; 81-Insulation layer; 90-Booster pump; 91-First valve body; 92-Second valve body; 93-Filter element assembly; 94-Vannel pump. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0039] A water purifier, also called a water purification machine or water quality purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. Currently, the cooling function in related technologies is achieved through semiconductor coolers. However, when a semiconductor cooler is heating, one side heats while the other side cools, resulting in energy waste.

[0040] Therefore, this embodiment provides a water purification device 100. The water purification device 100 can reduce energy waste.

[0041] Please see Figure 1 A water purification device 100 includes: a first water purification tank 10, a second water purification tank 20, a cold water tank 30, a hot water tank 40, a first semiconductor cooler 50, and a second semiconductor cooler 60;

[0042] Both the first semiconductor cooler 50 and the second semiconductor cooler 60 have a cooling surface 61 and a heating surface 62;

[0043] The first semiconductor cooler 50 is sandwiched between the first purified water tank 10 and the cold water tank 30, wherein the cooling surface 61 is attached to the cold water tank 30 and the heating surface 62 is attached to the first purified water tank 10.

[0044] The second semiconductor cooler 60 is sandwiched between the second purified water tank 20 and the hot water tank 40, wherein the cooling surface 61 is attached to the second purified water tank 20 and the heating surface 62 is attached to the hot water tank 40.

[0045] The aforementioned water purification device 100 is equipped with a first semiconductor cooler 50 and a second semiconductor cooler 60. A cooling tank is installed on the cooling surface 61 of the first semiconductor cooler 50, and a first purified water tank 10 is installed on the heating surface 62 of the first semiconductor cooler 50. In this way, when the first semiconductor cooler 50 cools the cooling tank, it can also store heat in the first purified water tank 10 through the heat generated by the heating surface 62. Thus, the first semiconductor cooler 50 can heat the first purified water tank 10 and simultaneously cool the cold water tank 30. Similarly, a second purified water tank 20 is installed on the cooling surface 61 of the second semiconductor cooler, and a hot water tank 40 is installed on the heating surface 62 of the second semiconductor cooler 60 and heated. In this way, when the second semiconductor cooler 60 heats the hot water tank 40, the cooling energy generated by its cooling surface 61 can cool the second purified water tank 20. Thus, the second semiconductor cooler can heat the hot water tank 40 and simultaneously cool the cold water pipe.

[0046] Understandably, the first semiconductor cooler 50 can simultaneously cool the cold water tank 30 and heat the first purified water tank 10. The water flow from the cold water tank 30 can be directly output to the water purification device 100, thus enabling the water purification device 100 to output cold water. Simultaneously, the heated water flow from the first purified water tank 10 can be output to the water purification device 100 as water at different temperatures, or it can be used as reserve water for the hot water tank 40. Similarly, the second semiconductor cooler 60 can simultaneously heat the hot water tank 40 and cool the purified water in the second purified water tank 20. The hot water in the hot water tank 40 can be directly discharged from the water purification device 100, while the purified water in the second purified water tank 20 can be used as backup water, either directly discharged from the water purification device 100 or as reserve water for the cold water tank 30. In this way, the first semiconductor cooler 50 and the second semiconductor cooler 60 can simultaneously utilize the energy from both the heating surface 62 and the cooling surface 61, reducing energy waste during use.

[0047] Please see Figure 1 In some embodiments, the first purified water tank 10 is connected to the hot water tank 40, and the second purified water tank 20 is connected to the cold water tank 30. The first purified water tank 10 is used to replenish water to the hot water tank 40, and the second purified water tank 20 is used to replenish water to the hot water tank 40.

[0048] Understandably, the first purified water tank 10 is positioned on the heating surface 62, so that the first purified water tank 10 can be heated by the heating surface 62. This allows the water in the first purified water tank 10 to be heated. When the first purified water tank 10 is connected to the hot water tank 40, the water in the first purified water tank 10 can flow into the hot water tank 40, thus enabling the first purified water tank 10 to replenish the water in the hot water tank 40. Similarly, in some usage scenarios, the water in the hot water tank 40 can flow into the first purified water tank 10.

[0049] Similarly, the second purified water tank 20 is set on the cooling surface 61, so the second purified water tank 20 can be heated by the cooling surface 61, and the water in the second purified water tank 20 can be cooled. When the second purified water tank 20 is connected to the cold water tank 30, the water in the second purified water tank 20 can flow into the cold water tank 30, so the second purified water tank 20 can replenish the cold water tank 30. Similarly, in some usage scenarios, the water in the hot water tank 40 can flow into the first purified water tank 10.

[0050] In some embodiments, level gauges are installed in the hot water tank 40 and the cold water tank 30. When the level gauges detect that the current water level in the hot water tank 40 and the cold water tank 30 is lower than a preset water level, the first purified water tank 10 can replenish water to the hot water tank 40, and the second purified water tank 20 can replenish water to the cold water tank 30, so as to achieve dynamic balance of water flow in the cold water tank 30 and the hot water tank 40.

[0051] Please see Figure 2 In some embodiments, it also includes: a thermally conductive component 70;

[0052] The first water tank 10, the second water tank 20, the cold water tank 30, and the hot water tank 40 are all provided with mounting holes 11. Each mounting hole 11 is provided with a heat-conducting component 70. The heat-conducting component 70 is attached to the first semiconductor cooler 50 and / or the second semiconductor cooler 60 and is used to transfer heat to the first water tank 10, the second water tank 20, the cold water tank 30, and the hot water tank 40.

[0053] Understandably, mounting holes 11 are provided on the side walls of the first purified water tank 10, the second purified water tank 20, the cold water tank 30, and the hot water tank 40. By installing heat-conducting components 70 in the mounting holes 11, the heat-conducting components 70 can come into contact with the water flow in the water tank, thereby improving the heat exchange efficiency of the water purification equipment 100. Specifically, the cooling surface 61 and heating surface 62 of the first semiconductor cooler 50 and the cooling surface 61 and heating surface 62 of the second semiconductor cooler 60 are all provided with heat-conducting components 70, and the heat-conducting components 70 extend into the first purified water tank 10, the second purified water tank 20, the cold water tank 30, and the hot water tank 40. In this way, the cold energy generated by the semiconductor cooler can be transferred to the first purified water tank 10, the second purified water tank 20, the cold water tank 30, and the hot water tank 40 through the heat-conducting components 70, thereby improving the efficiency of the water purification equipment 100 in preparing cold water and / or hot water.

[0054] Understandably, the heat-conducting components 70 installed on the heating surfaces 62 of the first and second semiconductor coolers 50 and 60 respectively can transfer heat to the first purified water tank 10 and the hot water tank 40, thereby heating the water in the first purified water tank 10 and the hot water tank 40, and thus improving the semiconductor heating effect. Similarly, the heat-conducting components 70 installed on the cooling surfaces 61 of the first and second semiconductor coolers 50 and 60 respectively can transfer cooling energy to the second purified water tank 20 and the cold water tank 30, thereby cooling the water in the second purified water tank 20 and the cold water tank 30, and thus improving the semiconductor cooling effect.

[0055] Please see Figure 3 In some embodiments, the heat-conducting component 70 includes: a heat-absorbing element 71 and a plurality of heat-conducting elements 72;

[0056] Multiple heat-conducting elements are spaced apart on the heat-absorbing element 71, and the heat-absorbing element 71 is attached to the cooling surface 61 and / or the heating surface 62. The heat-conducting elements are used to transfer heat from the heat-absorbing element 71.

[0057] Understandably, the heat-conducting component 70 includes a heat-absorbing element 71 and a heat-conducting element, with multiple heat-conducting elements 72 spaced apart on the heat-absorbing element 71. The heat-absorbing element 71 is connected to the cooling surface 61 and the heating surface 62 of the first semiconductor cooler 50 and the second semiconductor cooler 60, thus enabling the heat-absorbing element 71 to conduct the cold or heat generated by the first semiconductor cooler 50. The heat-conducting elements are perpendicular to the heat-absorbing element 71 and extend into the aforementioned tanks, allowing the heat-conducting component 70 to transfer the cold energy on the heat-absorbing element 71 to the aforementioned tanks. This also allows the cold energy generated by the semiconductor cooler to be transferred to the water storage tank via the heat-absorbing element 71 and the heat-conducting elements. The multiple heat-conducting elements 72 accelerate energy transfer efficiency, enabling energy to enter the water storage tank more quickly and evenly, achieving heat exchange, and thus enabling the heat-conducting component 70 to conduct heat.

[0058] Please see Figure 2 and Figure 3 In some embodiments, the heat-conducting element is a heat-conducting sheet that extends into the first purified water tank 10, the second purified water tank 20, the cold water tank 30, and the hot water tank 40.

[0059] Understandably, setting the heat-conducting component as a heat-conducting plate can increase the contact area between the heat-conducting component and the water flow, thereby improving the heat conduction efficiency of the heat-conducting component. At the same time, the heat-conducting plate extends into the first purified water tank 10, the second purified water tank 20, the cold water tank 30, and the hot water tank 40, which can reduce energy loss and allow the heat-conducting plate to directly exchange heat with the water flow, so that heat can be transferred to the water inside the tank more directly and efficiently, greatly improving the heat exchange efficiency and ensuring rapid water temperature regulation.

[0060] Please see Figure 4 and Figure 5 In some embodiments, it also includes: a limiting member 80;

[0061] The limiting member 80 is disposed around the outer periphery of the mounting hole 11. The limiting member 80 includes an extension 801 and a limiting part 802, wherein the limiting part 802 is disposed on the extension 801, and there is an included angle between the extension 801 and the limiting part 802; when the heat-conducting component 70 is installed in the mounting hole 11, the limiting part 802 is parallel to the heat-conducting sheet.

[0062] Understandably, a limiting member 80 is provided on the outer periphery of the mounting hole 11. The limiting member 80 is used to cooperate with the heat-conducting component 70 to limit the relative position of the heat-conducting component 70 relative to the water storage tank. The limiting member 80 includes an extension 801 and a limiting part 802. The extension 801 extends away from the mounting hole 11 (i.e., extends to the outside of the water storage tank). The limiting part 802 is disposed on the extension 801. The limiting part 802 can be disposed perpendicularly on the extension 801 or form an angle with the limiting part 802. This allows the limiting part 802 to limit the installation position of the heat-conducting component 70, making the installation of the heat-conducting component 70 more convenient.

[0063] Understandably, after the heat-conducting component 70 is installed on the limiting part 802, a seal can be provided between the limiting part 802 and the heat-conducting component 70 to prevent water leakage from the mounting hole 11. The heat-conducting component 70 can be directly fixed on the limiting part 802. Specifically, the limiting part 802 can be connected by providing the mounting hole 11 on the limiting part 802 and by connecting the heat-conducting component 70 to the mounting hole 11.

[0064] Please see Figure 6 In some embodiments, the outer periphery of the cold water tank 30, the hot water tank 40, the first purified water tank 10, and the second purified water tank 20 are all provided with a heat insulation layer 81.

[0065] It is understandable that a heat insulation layer 81 is provided on the outer periphery of the cold water tank 30, hot water tank 40, first purified water tank 10, and second purified water tank 20. The heat insulation layer 81 can effectively reduce the heat exchange between the tank and the external environment, reduce the rate of cold water heating and hot water cooling, and significantly improve the heat preservation and cold preservation performance of the equipment.

[0066] Please see Figure 6 In some embodiments, it also includes: a booster pump 90, a first valve body 91, and a second valve body 92;

[0067] The first purified water tank 10 and the cold water tank 30 are both connected to the first valve body 91, the second purified water tank 20 and the hot water tank 40 are both connected to the second valve body 92, and the first valve body 91 and the second valve body 92 are both connected to the booster pump 90.

[0068] Understandably, the first valve body 91 is connected to the first purified water tank 10 and the cold water tank 30, respectively, and the second valve body 92 is connected to the second purified water tank 20 and the hot water tank 40, respectively. Both the first valve body 91 and the second valve body 92 are connected to the booster pump 90. In this way, the water in the first purified water tank 10 or the second purified water tank 20 can enter the booster pump 90 through the first valve body 91, be pressurized, and then enter the second valve body 92, and then be discharged into the hot water tank 40. For example, when it is necessary to add water to the hot water tank 40, the first valve body 91 and the second valve body 92 can connect the first purified water tank 10 to the second purified water tank 40. The hot water tank 40 is connected, so that the water in the first purified water tank 10, after being preheated, can be discharged through the first valve body 91, and after being pressurized by the booster pump 90, it enters the second valve body 92, and then enters the hot water tank 40 through the second valve body 92. This can realize the replenishment of water to the hot water tank 40. Since the water in the first purified water tank 10 is heated, the water can reduce the heating temperature required by the hot water tank 40 when it enters the hot water tank 40, thus improving the heating efficiency of the hot water tank 40 and reducing energy waste and consumption.

[0069] Understandably, similarly, when it is necessary to replenish the cold water tank 30, the second purified water tank 20 can be connected to the cold water tank 30 through the first valve body 91 and the second valve body 92. In this way, the water in the second purified water tank 20, after being cooled, can be discharged through the first valve body 91, and after being pressurized by the booster pump 90, it enters the second valve body 92, and then enters the cold water tank 30 through the second valve body 92. This can achieve the replenishment of the cold water tank 30. Furthermore, since the water in the second purified water tank 20 is cooled, when the water enters the hot water tank 40, it can reduce the cooling temperature required by the cold water tank 30, thereby improving the cooling efficiency of the cold water tank 30 and reducing energy waste and consumption.

[0070] Please see Figure 7 In some embodiments, it also includes: filter element assembly 93;

[0071] The filter element assembly 93 is disposed in the water purification device 100, and the water purification device 100 is connected to the first water purification tank 10 and the second water purification tank 20 respectively.

[0072] Understandably, the filter element assembly 93 is installed in the water purification equipment 100. The water purification equipment 100 can purify the municipal water entering the equipment and output the purified water to the cold water tank 30 and / or hot water tank 40 and / or first purified water tank 10 and / or second purified water tank 20, thus achieving water replenishment for the aforementioned tanks. The filter element assembly 93 includes a filter element and a booster pump 90. The booster pump 90 is used to pressurize the municipal water because the filter element assembly 93 is equipped with an RO filter element assembly 93 (Reverse Osmosis membrane). The water pressure of the municipal water supply is insufficient to allow water to pass through the RO filter element assembly 93 during water purification. In order to ensure that the water can flow smoothly through the filter element assembly 93, the booster pump 90 is installed to ensure that the water can flow into the filter element assembly 93 and at the same time ensure the purification efficiency of the filter element assembly 93.

[0073] Please see Figure 8 In some embodiments, it also includes: a vane pump 94;

[0074] The vane pump 94 is connected to the hot water tank 40 and the cold water tank 30, and the vane pump 94 is used to supply water to the water-using equipment.

[0075] Understandably, the vane pump 94 can be installed at any location within the water purification equipment 100. The vane pump 94, along with the hot water tank 40 and the cold water tank 30, can pressurize the water in each tank and deliver it to the user, thus supplying water to the water purification equipment 100. Specifically, the water from each tank can exit separately (or separately if mixed water, i.e., warm water, is required) and flow to the vane pump 94. The vane pump 94 pressurizes the water and delivers it to the user. The vane pump 94 ensures that the location of the heat storage tank is not affected by water pressure and can smoothly deliver the hot water from the heat storage tank to the water-using equipment, thereby improving the user experience.

[0076] In some embodiments, the first water tank 10 and the second water tank 20 are also connected to the vane pump 94, so that the water in the first water tank 10 and the second water tank 20 can also be delivered to the user end through the vane pump 94.

[0077] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A water purification device, characterized in that, include: First purified water tank, second purified water tank, cold water tank, hot water tank, first semiconductor refrigerator, second semiconductor refrigerator; Both the first and second semiconductor coolers have a cooling surface and a heating surface; The first semiconductor cooler is sandwiched between the first purified water tank and the cold water tank, wherein the cooling surface is attached to the cold water tank and the heating surface is attached to the first purified water tank. The second semiconductor cooler is sandwiched between the second purified water tank and the hot water tank, wherein the cooling surface is attached to the second purified water tank and the heating surface is attached to the hot water tank.

2. The water purification apparatus according to claim 1, characterized by The first purified water tank is connected to the hot water tank, and the second purified water tank is connected to the cold water tank. The first purified water tank is used to replenish water to the hot water tank, and the second purified water tank is used to replenish water to the hot water tank.

3. The water purification apparatus according to claim 1, characterized by Also includes: Thermal conductive components; The first water tank, the second water tank, the cold water tank, and the hot water tank are all provided with mounting holes, and each mounting hole is provided with a heat-conducting component. The heat-conducting component is attached to the first semiconductor cooler and / or the second semiconductor cooler and is used to transfer heat to the first water tank, the second water tank, the cold water tank, and the hot water tank.

4. The water purification apparatus according to claim 3, characterized by The heat-conducting component includes: a heat-absorbing element and multiple heat-conducting elements; Multiple heat-conducting elements are spaced apart on the heat-absorbing element, and the heat-absorbing element is attached to the cooling surface and / or heating surface. The heat-conducting element is used to transfer heat from the heat-absorbing element.

5. The water purification apparatus according to claim 4, characterized by The heat-conducting component is a heat-conducting sheet, which extends into the first purified water tank, the second purified water tank, the cold water tank, and the hot water tank.

6. The water purification apparatus according to claim 5, characterized by Also includes: Limiting components; The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

7. The water purification apparatus of claim 1, wherein The cold water tank, the hot water tank, the first purified water tank, and the second purified water tank are all provided with a heat insulation layer on their outer periphery.

8. The water purification apparatus according to claim 7, characterized by Also includes: Booster pump, first valve body, second valve body; The first purified water tank and the cold water tank are both connected to the first valve body, the second purified water tank and the hot water tank are both connected to the second valve body, and the first valve body and the second valve body are both connected to the booster pump.

9. The water purification apparatus according to claim 8, characterized by Also includes: Filter cartridge assembly; The filter cartridge assembly is disposed in the water purification equipment, which is connected to the first water purification tank and the second water purification tank respectively.

10. The water purification apparatus of claim 1, wherein Also includes: vane pump; The vane pump is connected to the hot water tank and the cold water tank, and the vane pump is used to supply water to the water-using equipment.

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