Electroplating flow field baffle plate and electroplating system

By designing a large-diameter central area and a gradient-increasing opening structure on the electroplating flow field shielding plate, the problem of uneven height and proportion of silver-gold alloy bumps was solved, thereby improving electroplating efficiency and uniformity.

CN224148207UActive Publication Date: 2026-04-21厦门通富微电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
厦门通富微电子有限公司
Filing Date
2025-05-13
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing electroplating flow field shielding plates result in uneven height and silver-gold ratio of silver-gold alloy bumps, failing to meet the requirements for electroplating uniformity.

Method used

The aperture of the electroplating flow field shield is designed to be larger in the central region than in the edge region, and increases in a gradient along the radial direction, forming a concentric circular matrix distribution. This improves the convection and concentration stability of the plating solution, and ensures the uniformity of electroplating efficiency.

Benefits of technology

By optimizing the aperture design, the electroplating efficiency in the central area of ​​the wafer was improved, and the height and proportion of the silver-gold alloy bumps achieved optimal uniformity, thus solving the unevenness problem existing in the prior art.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an electroplating flow field baffle plate and an electroplating system, the electroplating flow field baffle plate is used for electroplating silver-gold alloy bumps and comprises a baffle plate body, and the baffle plate body is provided with a plurality of holes; wherein the aperture size of the opening in the central area of the shielding plate body is larger than that of the opening in the edge area of the shielding plate body. The aperture size of the holes in the central area of the shielding plate body is increased, so that the convection of plating solution can be increased, the plating solution exchange during electroplating is facilitated, and the concentration stability of Ag + and Au + during electroplating is ensured, thereby improving the electroplating efficiency of the central area of the wafer, and finally increasing the height of the bumps in the central area of the wafer. And the uniformity of the height of the silver-gold alloy bump and the silver-gold ratio of the wafer is optimal.
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