Air tightness testing device of PCB air pressure sensor

Abstract

The utility model relates to the technical field of detection, in particular to an air tightness testing device for a PCB air pressure sensor, which comprises a negative pressure flow control module, a carrier module and a sealing module, the carrier module comprises a base, an air inlet is formed in the bottom face of the base, and the negative pressure flow control module is connected with the air inlet through a pipeline. The sealing module comprises a cylinder and a signal access probe arranged in the cylinder, a PCB with an air pressure sensor is arranged in the cylinder in a sealed mode, the signal access probe is vertically arranged, the top end of the signal access probe makes contact with an air pressure sensor signal pin on the PCB, a power supply probe is arranged in the base, and the power supply probe is connected with the PCB. The power supply probe is in contact with the bottom end of the signal access probe; and the base and the cylinder are buckled to form a sealed cavity at the same time. The air tightness detection of the air pressure sensor on the PCB can be realized, so that human resources are effectively saved, and the working efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to an airtightness testing device for a PCB board air pressure sensor. Background Technology

[0002] With the continuous development of electronic products, barometric pressure sensors are widely used in various fields such as industrial control, consumer electronics, and medical equipment. Especially in PCB board integration design, the reliability of barometric pressure sensors directly affects the performance and stability of the entire device. To ensure that the barometric pressure sensor still has good sealing performance after packaging, it is usually necessary to perform airtightness testing before leaving the factory.

[0003] In existing technologies, airtightness testing is mostly done manually. The process requires placing each PCB board under test into a testing fixture, and then manually performing sealing, power supply, and signal reading. This testing method is not only inefficient but also highly dependent on the operator, making it prone to inconsistencies due to human error, thus affecting product quality. Furthermore, because the sealing structure and signal connection parts are not modularly designed, problems such as air leakage and poor signal contact often occur during testing, severely impacting the accuracy and repeatability of the test results.

[0004] Therefore, there is an urgent need in the existing technology for a detection device with a reasonable structure, simple operation, and reliable detection results, which can be used to realize the rapid detection of the air tightness of the air pressure sensor on the PCB board, thereby effectively saving manpower, improving work efficiency, and ensuring the standardization of the detection process and the reliability of the results. Utility Model Content

[0005] To enable rapid airtightness testing of pressure sensors on PCB boards, thereby effectively saving manpower, improving work efficiency, and ensuring the standardization of the testing process and the reliability of the results, this application provides an airtightness testing device for pressure sensors on PCB boards. This application provides the following technical solution:

[0006] An airtightness testing device for a PCB board air pressure sensor includes a negative pressure flow control module, a carrier module, and a sealing module. The carrier module includes a base with an air inlet on its bottom surface. The negative pressure flow control module is connected to the air inlet via a pipeline. The sealing module includes a cylinder and a signal access probe disposed within the cylinder. A PCB board with an air pressure sensor is sealed inside the cylinder. The signal access probe is vertically positioned, and its top end contacts the signal pin of the air pressure sensor on the PCB board. A power supply probe is disposed within the base, and its bottom end contacts the signal access probe. The base and the cylinder are fastened together to form a sealed cavity.

[0007] In one specific implementation, the negative pressure flow control module includes a gas source negative pressure controller, a gas source proportional control valve, a pressure gauge, and a gas flow meter connected in sequence. The gas source negative pressure controller is used to connect to the gas source used in the air tightness testing device that works with the PCB board pressure sensor. The output end of the gas flow meter is connected to the air inlet through a pipeline.

[0008] In one specific implementation, the cylinder has upper hanging ears on both sides of its bottom end, and each upper hanging ear has a guide post at its bottom end. The base has lower hanging ears on both sides of its top end, and each lower hanging ear has a guide hole for inserting the guide post.

[0009] In one specific implementation, a first sealing ring is provided on the inner sidewall of the bottom end of the cylinder.

[0010] In one specific implementation, a second sealing ring is provided on the inner sidewall of the top of the base.

[0011] In one specific implementation, the base is provided with a power supply module, which is embedded in the side wall of the base, and one end of the power supply module located inside the base is connected to the power supply probe.

[0012] In one specific implementation, a third sealing ring is provided at the connection between the power supply probe and the power supply module.

[0013] In summary, the beneficial effects of this application include at least the following:

[0014] 1) By mechanically mating the sealing module and carrier module using a guide post and guide hole structure, and constructing a closed cavity with multiple sealing rings, combined with a negative pressure flow control module to provide a controllable negative pressure environment, a standardized sealing test process for PCB board pressure sensors has been achieved. This structural design reduces reliance on manual operation, improves assembly consistency and positioning accuracy, effectively saves manpower, and reduces operational errors, thereby improving overall testing efficiency and ease of operation.

[0015] 2) By setting a vertical conductive structure between the signal access probe and the power supply probe, signal access and power supply functions are completed simultaneously in a sealed state. Furthermore, a sealing ring is placed at the connection between the power supply probe and the power supply module to ensure the sealing and reliability of the signal connection process. Compared to traditional solutions that establish signal paths through external wiring, this design significantly improves the stability of the signal connection and the accuracy of the detection data, avoiding measurement errors caused by poor contact or leakage, and ensuring the consistency and reliability of the detection results.

[0016] First, a PCB board with a pressure sensor is inserted into the cylinder of the sealing module, and the bottom of the PCB board contacts the top of the signal access probe located inside the cylinder to introduce a signal. Then, the sealing module is inserted into the guide hole of the lower hanging ear of the carrier module via a guide post at its bottom, precisely positioning the cylinder and the base and achieving structural engagement. The lower area of ​​the PCB board is covered by a first sealing ring on the inner side of the cylinder and a second sealing ring on the inner wall of the top of the base, forming a sealed cavity. Further, the top of the power supply probe in the power supply module contacts the bottom of the signal access probe, and a third sealing ring at the connection point ensures airtightness. Based on this, a negative pressure flow control module connects to the air inlet of the base through the output of a gas flow meter to form an air path. The air pressure inside the sealed cavity is regulated and monitored sequentially through a negative pressure controller, a proportional control valve, a pressure gauge, and a gas flow meter, enabling rapid and standardized testing of the airtightness of the pressure sensor on the PCB board. This process effectively overcomes the problems of high degree of human intervention, inaccurate positioning, unreliable signal connection, and poor consistency of detection results in traditional detection, significantly improving detection efficiency and accuracy, and ensuring the repeatability and reliability of results.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the airtightness testing device for the PCB board air pressure sensor in this embodiment.

[0019] Figure 2 This is a schematic diagram of the negative pressure flow control module in this embodiment.

[0020] Figure 3 This is a schematic diagram of the sealing module in this embodiment.

[0021] Figure 4 This is a schematic diagram of the vehicle module in this embodiment.

[0022] Figure 5 This is a schematic diagram of the power supply module in this embodiment.

[0023] Reference numerals: 1. Negative pressure flow control module; 11. Air source negative pressure controller; 12. Air source proportional control valve; 13. Pressure gauge; 14. Gas flow meter; 2. Carrier module; 21. Base; 22. Lower hanging ear; 23. Air inlet; 24. Second sealing ring; 25. Guide hole; 3. Sealing module; 31. Cylinder; 32. First sealing ring; 33. Upper hanging ear; 34. Signal input probe; 35. Guide post; 4. PCB board; 5. Power supply module; 6. Power supply probe; 7. Third sealing ring. Detailed Implementation

[0024] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0026] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] This application discloses an airtightness testing device for a PCB board air pressure sensor.

[0029] Reference Figure 1 The airtightness testing device for the PCB board air pressure sensor includes a negative pressure flow control module 1, a carrier module 2, and a sealing module 3. Combined with... Figure 2The negative pressure flow control module 1 includes a gas source negative pressure controller 11, a gas source proportional control valve 12, a pressure gauge 13, and a gas flow meter 14 arranged sequentially. The input terminal of the gas source negative pressure controller 11 is connected to the gas source used in the airtightness testing device that works with the PCB board pressure sensor. The output terminal of the gas source negative pressure controller 11 is connected to the input terminal of the gas source proportional control valve 12. The output terminal of the gas source proportional control valve 12 is connected to the input terminal of the pressure gauge 13. The output terminal of the pressure gauge 13 is connected to the input terminal of the gas flow meter 14. The output terminal of the gas flow meter 14 is connected to the carrier module 2. In implementation, the gas source negative pressure controller 11 is used to connect an external gas source (such as a vacuum pump) to the system to provide a primary negative pressure gas source. The gas source proportional control valve 12 is used to adjust the gas source pressure or flow rate as needed, thereby meeting the negative pressure requirements of different testing stages or test objects. The pressure gauge 13 is used to display the pressure value inside the negative pressure chamber in real time, facilitating observation and control of the sealing stability during the testing process. Gas flow meter 14 is used to monitor and provide feedback on gas flow in the system, so as to identify and analyze minor leaks. The end of the entire negative pressure control path is connected to carrier module 2, thereby applying the regulated negative pressure environment to subsequent airtightness testing.

[0030] Reference Figure 1 and Figure 3 The sealing module 3 includes a cylinder 31 and a signal access probe 34 disposed inside the cylinder 31. A PCB board 4 with a pressure sensor is disposed inside the cylinder 31. The end of the PCB board 4 with the pressure sensor, i.e., the bottom end, is sealed inside the cylinder 31. The signal access probe 34 is vertically positioned, and its top end contacts the signal pin of the pressure sensor on the PCB board 4. Upper hanging ears 33 are provided on both sides of the bottom end of the cylinder 31, and each upper hanging ear 33 has a guide post 35 at its bottom end. A first sealing ring 32 is provided on the inner sidewall of the bottom end of the cylinder 31.

[0031] Reference Figure 1 and Figure 4 The vehicle module 2 includes a base 21, and an air inlet 23 is provided on the bottom surface of the base 21. Figure 2 The output end of the gas flow meter 14 is connected to the air inlet 23 via a pipeline. A second sealing ring 24 is provided on the inner side wall of the top of the base 21. Figure 3 and Figure 5 A power supply module is embedded in the side wall of the base 21. One end of the power supply module, located inside the base 21, is connected to a power supply probe 6. The power supply probe 6 contacts the bottom end of the signal input probe 34, and a third sealing ring 7 is provided at the connection between the power supply probe 6 and the power supply module. The top two sides of the base 21 have lower hanging ears 22, each with a guide hole 25 for inserting a guide post 35. In implementation, by inserting the guide post 35 into the corresponding guide hole 25, the base 21 and the cylinder 31 are fastened together, forming a sealed cavity.

[0032] In summary, during implementation, the PCB board 4 with the air pressure sensor is first inserted into the cylinder 31 of the sealing module 3, and the bottom end of the PCB board 4 contacts the top end of the signal access probe 34 located inside the cylinder 31 to introduce the signal. Then, the sealing module 3 is inserted into the guide hole 25 of the lower hanging lug 22 of the carrier module 2 via the guide post 35 at its bottom end, so that the cylinder 31 and the base 21 are precisely positioned and structurally engaged. The first sealing ring 32 inside the cylinder 31 and the second sealing ring 24 on the inner wall of the top of the base 21 together cover the lower area of ​​the PCB board 4. A sealed cavity is formed. Furthermore, the top of the power supply probe 6 in the power supply module contacts the bottom of the signal input probe 34, while the third sealing ring 7 at the connection point ensures airtightness. Based on this, the negative pressure flow control module 1 connects to the air inlet 23 of the base 21 through the output of the gas flow meter 14 to form an air path. The air path passes sequentially through the negative pressure controller 11, the proportional control valve 12, the pressure gauge 13, and the gas flow meter 14, thereby regulating and monitoring the internal air pressure of the sealed cavity. This allows for rapid and standardized testing of the airtightness of the pressure sensor on the PCB board 4. This process effectively overcomes the problems of high manual intervention, inaccurate positioning, unreliable signal connection, and poor consistency of test results in traditional testing, significantly improving testing efficiency and accuracy, and ensuring the repeatability and reliability of the results.

[0033] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An air tightness testing device for a PCB board air pressure sensor, characterized by, The system includes a negative pressure flow control module, a carrier module, and a sealing module. The carrier module includes a base with an air inlet on its bottom surface. The negative pressure flow control module is connected to the air inlet via a pipeline. The sealing module includes a cylinder and a signal access probe disposed inside the cylinder. A PCB board with a pressure sensor is sealed inside the cylinder. The signal access probe is vertically positioned, and its top end contacts the signal pin of the pressure sensor on the PCB board. A power supply probe is disposed inside the base, and its bottom end contacts the signal access probe. The base and the cylinder are fastened together to form a sealed cavity.

2. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 1, wherein, The negative pressure flow control module includes a negative pressure air source controller, a proportional air source control valve, a pressure gauge, and a gas flow meter connected in sequence. The negative pressure air source controller is used to connect to the air source used in the air tightness testing device that works with the PCB board pressure sensor. The output end of the gas flow meter is connected to the air inlet through a pipeline.

3. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 1, wherein, The bottom of the cylinder is provided with upper hanging ears on both sides, and each upper hanging ear is provided with a guide post at its bottom. The top of the base is provided with lower hanging ears on both sides, and each lower hanging ear is provided with a guide hole for the guide post to be inserted.

4. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 1, wherein, A first sealing ring is provided on the inner side wall of the bottom end of the cylinder.

5. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 1, wherein, A second sealing ring is provided on the inner side wall of the top of the base.

6. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 1, wherein, The base is equipped with a power supply module, which is embedded in the side wall of the base. One end of the power supply module located inside the base is connected to the power supply probe.

7. The hermeticity test apparatus of a PCB board air pressure sensor according to claim 6, wherein, A third sealing ring is provided at the connection between the power supply probe and the power supply module.

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