Dual-mode gateway of Internet of Things

By integrating LoRaWAN and Wi-SUN RF modules, the dual-mode IoT gateway solves the problem that existing gateway devices cannot support multiple communication protocols simultaneously, achieving compatibility with LoRaWAN and Wi-SUN protocols, improving the flexibility and stability of IoT applications, and reducing deployment and maintenance costs.

CN224154234UActive Publication Date: 2026-04-21HUNAN TENGFA MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUNAN TENGFA MICROELECTRONICS CO LTD
Filing Date
2025-03-26
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing gateway devices typically only support a single communication protocol, which cannot simultaneously meet the needs of wide-area IoT and industrial-grade intelligent networks. This results in limited application diversity and flexibility, high deployment costs, and low system stability and efficiency.

Method used

Design an IoT dual-mode gateway that integrates a LoRaWAN RF module and a Wi-SUN RF module. The central microprocessor processes and converts data packets for LoRaWAN and Wi-SUN protocols, supports multiple communication methods including 4G/LTE, Ethernet and Wi-Fi, and features LED UI interaction, GPS positioning and eSIM communication interface. The power module supports multiple power supply methods to adapt to different environments and network requirements.

Benefits of technology

It achieves compatibility with LoRaWAN and Wi-SUN protocols, improves the flexibility and efficiency of IoT applications, reduces deployment and maintenance costs, is suitable for various environments and network scenarios, and has high reliability and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of Internet of Things, in particular to an Internet of Things dual-mode gateway. The dual-mode gateway of the Internet of Things comprises an antenna module, a LoRaWAN radio frequency module, a Wi-SUN radio frequency module, an uplink communication module, a central microprocessor and a power supply module, and by integrating the LoRaWAN radio frequency module and the Wi-SUN radio frequency module, support for two communication protocols of the LoRaWAN and the Wi-SUN is realized, so that the requirements of the wide-area Internet of Things and an industrial-grade intelligent network can be met at the same time.
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Description

Technical Field

[0001] This application relates to the field of Internet of Things (IoT) technology, and in particular to an IoT dual-mode gateway. Background Technology

[0002] LoRaWAN (Long Range Wide Area Network) and Wi-SUN (Wireless Sun) are two widely used communication protocols in the current Internet of Things (IoT) field, each with its own distinct characteristics and applicable scenarios. LoRaWAN, with its low power consumption and long-distance transmission capabilities, demonstrates significant advantages in LPWAN applications, particularly suitable for environmental monitoring, smart cities, and agricultural tracking. Wi-SUN, on the other hand, plays a crucial role in industrial-grade smart networks, such as smart grids, industrial automation, and intelligent transportation systems, thanks to its high reliability and large-scale node access capabilities.

[0003] However, existing gateway devices typically support only a single communication protocol, failing to simultaneously meet the needs of wide-area IoT and industrial-grade smart networks. For example, patent application CN216057511U provides a dual-channel IoT smart gateway based on LoRa wireless technology, which can efficiently process communication data using the LoRaWAN protocol but does not support the Wi-SUN protocol. Similarly, patent application CN110740455A, while providing a network based on Wi-SUN communication technology, does not mention compatibility with LoRaWAN or other non-Wi-SUN protocols. This limitation of supporting only one protocol not only restricts the diversity and flexibility of IoT applications but also increases deployment and maintenance costs. Especially in scenarios requiring simultaneous coverage of wide-area IoT and industrial-grade smart networks, users are forced to deploy multiple gateways with different protocols, which not only increases hardware investment but may also reduce the overall system stability and efficiency due to increased network management complexity. Utility Model Content

[0004] Therefore, it is necessary to provide an IoT dual-mode gateway to address the issue that existing gateways cannot integrate the LoRaWAN and Wi-SUN protocols.

[0005] This application provides an IoT dual-mode gateway. The IoT dual-mode gateway includes an antenna module, a LoRaWAN radio frequency module, a Wi-SUN radio frequency module, an uplink communication module, a central microprocessor, and a power module. The first end of the LoRaWAN radio frequency module, the first end of the Wi-SUN radio frequency module, the first end of the uplink communication module, and the power module are all connected to the central microprocessor. The second end of the LoRaWAN radio frequency module, the second end of the Wi-SUN radio frequency module, and the second end of the uplink communication module are all connected to the antenna module.

[0006] Furthermore, the uplink communication module includes a 4G / LTE communication module, an Ethernet communication module, and a WiFi communication module.

[0007] Furthermore, the IoT dual-mode gateway also includes an LED UI interaction module, a GPS positioning module, and an eSIM communication interface connected to the central microprocessor.

[0008] Furthermore, the antenna module includes a 4G antenna, a GPS antenna, a WiFi antenna, a Wi-SUN antenna, and a LoRaWAN antenna.

[0009] Furthermore, the 4G antenna, the GPS antenna, and the WiFi antenna are all flat panel antennas, while the LoRaWAN antenna and the Wi-SUN antenna are both glass antennas.

[0010] Furthermore, the LoRaWAN antenna has a maximum receiving sensitivity of -137dBm and a maximum transmitting power of +27dBm; the Wi-SUN antenna has a maximum receiving sensitivity of -107dBm and a maximum transmitting power of +30dBm.

[0011] Furthermore, the power module includes an AC power supply unit, a DC power supply unit, and a power management unit. The AC power supply unit is connected to the first terminal of the DC power supply unit, the central microprocessor and the Ethernet communication module are both connected to the second terminal of the DC power supply unit, and the third terminal of the DC power supply unit is connected to the power management unit.

[0012] Furthermore, the DC power supply unit includes a battery and a supercapacitor.

[0013] Furthermore, the AC power supply unit supports a voltage input of 85-265V, and the DC power supply unit has a power supply range of 9-15V.

[0014] Furthermore, the central microprocessor is model EG25-G.

[0015] The aforementioned IoT dual-mode gateway includes an antenna module, a LoRaWAN RF module, a Wi-SUN RF module, an uplink communication module, a central microprocessor, and a power module. By integrating the LoRaWAN RF module and the Wi-SUN RF module, it supports both LoRaWAN and Wi-SUN communication protocols, thereby simultaneously meeting the needs of wide-area IoT and industrial-grade intelligent networks. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an IoT dual-mode gateway in one embodiment;

[0017] Figure 2 This is a schematic diagram of the structure of an IoT dual-mode gateway in another embodiment;

[0018] Figure 3 This is a schematic diagram of the antenna module in one embodiment;

[0019] Figure 4 This is a schematic diagram of the structure of a LoRaWAN radio frequency module in one embodiment;

[0020] Figure 5 This is a schematic diagram of the structure of the Wi-SUN radio frequency module in one embodiment. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] Example 1

[0023] like Figure 1 As shown, this embodiment provides an IoT dual-mode gateway, including an antenna module, a LoRaWAN radio frequency module, a Wi-SUN radio frequency module, an uplink communication module, a central microprocessor, and a power module. The first end of the LoRaWAN radio frequency module, the first end of the Wi-SUN radio frequency module, the first end of the uplink communication module, and the power module are all connected to the central microprocessor. The second end of the LoRaWAN radio frequency module, the second end of the Wi-SUN radio frequency module, and the second end of the uplink communication module are all connected to the antenna module.

[0024] The antenna module is responsible for receiving and transmitting LoRaWAN and Wi-SUN signals. This embodiment features a dual-band design, independently supporting the LoRaWAN and Wi-SUN bands, which operate separately. Therefore, this dual-mode IoT gateway is widely compatible with multiple regional frequency bands, including but not limited to those in China (470-510MHz), Europe (863-870MHz), the United States (902-928MHz), India (865-867MHz), Australia (915-928MHz), and Latin America (902MHz). Furthermore, to meet global market demands, those skilled in the art can flexibly configure the frequency bands. In addition, the antenna module incorporates high gain and anti-interference design, significantly improving signal transmission and reception efficiency, expanding coverage, and effectively resisting external interference to ensure signal quality. Structurally, the LoRaWAN and Wi-SUN antennas share some components, achieving miniaturization and cost reduction.

[0025] The LoRaWAN antenna in this embodiment has a coverage range of up to 20 kilometers in open areas and up to 5 kilometers in rural areas. The Wi-SUN antenna has a point-to-point communication range of up to 2 kilometers and a maximum communication rate of 2.4 Mbps, supporting high-speed data transmission. In terms of RF performance parameters, the LoRaWAN antenna has a maximum receiver sensitivity of -137 dBm (SF12, 125 kHz) and a maximum transmit power of +27 dBm. The Wi-SUN antenna has a maximum receiver sensitivity of -107 dBm (50 kbps, 125 kHz) and a maximum transmit power of +30 dBm. These superior performance indicators together ensure stable and efficient signal transmission.

[0026] The LoRaWAN RF module demodulates the LoRaWAN signal to obtain LoRaWAN protocol data packets, and then sends these data packets to the central microprocessor. The Wi-SUN RF module demodulates the Wi-SUN signal to obtain Wi-SUN protocol data packets, and then sends these data packets to the central microprocessor.

[0027] In particular, the IoT dual-mode gateway in this embodiment is compatible with LoRaWAN and Wi-SUN FAN1.1 standards, and is suitable for fields such as industrial IoT and smart manufacturing. It not only supports the three device types of LoRaWAN (Class A, Class B, and Class C), but also has the ability to handle large-scale Wi-SUN node access, with a maximum of 5,000 nodes.

[0028] The central microprocessor is used to perform protocol conversion on LoRaWAN or Wi-SUN protocol data packets to obtain uplink communication data packets. Specifically, when the central microprocessor receives LoRaWAN protocol data packets sent by the LoRaWAN RF module, it first parses the data to extract useful information, such as sensor data and device ID. Next, it filters the parsed data, removing redundant or invalid data and retaining valid data to improve processing speed. Then, it performs data protocol format conversion, transforming the parsed data into the protocol format required by the target communication network to generate the corresponding uplink communication data packets. For example, it converts LoRaWAN data into a protocol format suitable for Ethernet communication network transmission. For instance, taking LoRaWAN to Ethernet protocol conversion as an example, when the central microprocessor receives a LoRaWAN protocol data packet, it first parses the packet to extract the payload, device ID, timestamp, and other information. Then, it converts the extracted data into the format required by Ethernet communication networks (such as TCP / IP), such as encapsulating the data into JSON format. Afterward, it adds an Ethernet header and an IP header, encapsulating the converted data into an Ethernet protocol data packet. The Ethernet protocol data packets are then sent to the Ethernet communication module, which in turn sends them to the Ethernet communication network.

[0029] The same process applies to the processing of Wi-SUN protocol data packets. When the central microprocessor receives Wi-SUN protocol data packets sent by the Wi-SUN radio frequency module, it sequentially performs data parsing, data filtering, and data protocol format conversion to transform the Wi-SUN protocol data packets into a protocol format suitable for the target communication network, generating the corresponding uplink communication data packets. The communication module then sends the uplink communication data packets to the target communication network. Taking the Wi-SUN to Wi-Fi protocol conversion as an example, when the central microprocessor receives a Wi-SUN protocol data packet, it first parses the packet to extract information such as the payload, device ID, and timestamp. Then, it converts the extracted data into the format required by the Wi-Fi protocol (such as 802.11), for example, encapsulating the data as an HTTP request. Finally, it adds a Wi-Fi header (802.11 Header), encapsulates the converted data into a Wi-Fi protocol data packet, and then sends the encapsulated Wi-Fi protocol data packet through the Wi-Fi communication module.

[0030] The central microprocessor also receives downlink communication data packets sent by the uplink communication module and converts them into LoRaWAN or Wi-SUN protocol data packets. Specifically, when the central microprocessor receives downlink communication data packets from the uplink communication module, it first extracts useful information, such as device ID and timestamps, from the downlink communication data packets. Then, it performs data filtering to remove redundant or invalid data, and converts the processed data into LoRaWAN or Wi-SUN protocol data packets. Afterward, the central microprocessor sends the LoRaWAN protocol data packets to the LoRaWAN RF module, which modulates the LoRaWAN protocol data packets into a LoRaWAN signal and then transmits the LoRaWAN signal to the LoRaWAN communication network via the LoRaWAN antenna. Alternatively, the central microprocessor sends Wi-SUN protocol data packets to the Wi-SUN RF module, which modulates the Wi-SUN protocol data packets into a Wi-SUN signal and then transmits the Wi-SUN signal to the Wi-SUN communication network via the Wi-SUN antenna. In a preferred embodiment, the central microprocessor can be an EG25-G chip. The EG25-G is an LTE Cat4 wireless communication module designed specifically for the IoT field. It has a rich set of built-in network protocols and integrates multiple industry standard interfaces.

[0031] Furthermore, such as Figure 2 As shown, the uplink communication module includes a 4G / LTE communication module, an Ethernet communication module, and a WiFi communication module. It supports multiple uplink communication methods such as Gigabit Ethernet (RJ-45), 4G / LTE, and Wi-Fi, ensuring the stability and flexibility of data transmission. To meet the needs of different communication technologies, such as... Figure 3As shown, the antenna module includes a 4G antenna, a GPS antenna, a WiFi antenna, a Wi-SUN antenna, and a LoRaWAN antenna. The 4G, GPS, and WiFi antennas are all planar antennas, which offer advantages such as small size, light weight, and ease of integration. The LoRaWAN and Wi-SUN antennas are both fiberglass antennas, which possess high mechanical strength and weather resistance, maintaining stable communication performance even in harsh environments. All antennas utilize high-performance materials, exhibiting excellent corrosion resistance, allowing for long-term use in humid, salt spray, and other harsh environments without damage, and also possessing high-temperature resistance, maintaining stable electrical performance even at high temperatures. Therefore, the IoT dual-mode gateway in this embodiment has strong environmental adaptability, with an outdoor dustproof and waterproof rating of IP65, suitable for harsh outdoor environments (such as high temperature, low temperature, humidity, dust, etc.). The operating temperature range is -40°C to 75°C (extreme temperature: -45°C to 85°C), and the operating humidity range is 5% to 95% (non-condensing).

[0032] Furthermore, such as Figure 2 As shown, the IoT dual-mode gateway also includes an LED UI interaction module, a GPS positioning module, and an eSIM communication interface connected to the central microprocessor. The LED UI interaction module serves as the intuitive interface for interaction between the IoT gateway and the user. Different flashing patterns or colors of the LED indicators display information such as the gateway's operating status, network connectivity, and battery level. This simple and clear interaction method allows users to quickly understand the gateway's operational status. The GPS positioning module determines the IoT gateway's geographical location. It uses satellite signals to calculate the gateway's precise location, typically expressed in longitude and latitude. The GPS positioning module enhances the IoT gateway's geographical location awareness, enabling it to respond more intelligently to location-related commands and requests, improving the flexibility and practicality of IoT applications. Furthermore, the GPS positioning module also provides a clock signal to the central microprocessor, supporting GPS clock synchronization and further ensuring the system's time accuracy and consistency. The eSIM communication interface supports dual SIM cards, adapting to different operator networks and achieving fast and stable network connections. The integration and application of these modules enable the IoT gateway to exhibit superior performance in data acquisition, communication protocol conversion, security management, and local data processing.

[0033] Furthermore, such as Figure 2As shown, the power module includes an AC power supply unit, a DC power supply unit, and a power management unit. The AC power supply unit is connected to the first terminal of the DC power supply unit, the central microprocessor and Ethernet communication module are both connected to the second terminal of the DC power supply unit, and the third terminal of the DC power supply unit is connected to the power management unit. The AC power supply unit supports an input voltage of 85-265V. The DC power supply unit operates within a 9-15V range (suitable for solar panel input) and incorporates a battery and supercapacitor to support emergency power needs. The peak power consumption of the entire power module is below 10W, ensuring efficient and energy-saving operation. The power management unit monitors the power status of the entire module, including key parameters such as voltage and current, and intelligently adjusts power consumption according to actual needs. For example, it can use AI-based power optimization algorithms to dynamically adjust power consumption. When the input voltage of either the AC or DC power supply unit changes, the power management unit responds quickly to ensure the stability and reliability of the output voltage. Furthermore, the power management unit also provides intelligent power distribution and protection functions, effectively preventing overcurrent, overvoltage, short circuits, and other abnormal conditions, thereby ensuring the safe and stable operation of the gateway.

[0034] In some embodiments, the Ethernet communication module also features Power Over Ethernet (POE) power supply functionality, conforming to the IEEE 802.3af / at power supply standard, capable of providing power to devices over distances up to 100 meters. Specifically, the Ethernet communication module includes an Ethernet communication unit and a POE power supply unit. The third terminal of the DC power supply unit is connected to the first terminal of the POE power supply unit, the second terminal of the POE power supply unit is connected to the first terminal of the Ethernet communication unit, and the second terminal of the Ethernet communication unit is connected to the central microprocessor, thus realizing both data transmission and power supply while reducing wiring complexity.

[0035] In a preferred embodiment, both the LoRaWAN RF module and the Wi-SUN module use custom MCU chips. The custom MCU chip has a total of 54 pins. Pin 2 is the power interface, used to connect a 4~5.5V voltage; pin 6 is a general purpose input / output port (GPIO); pin 16 is the power supply port (POWER_ON); pin 17 is the serial clock interface (SPI_SCK); pin 19 is the master / slave output port (SPI_MISO); pin 23 is the master / slave input port (SPI_MOSI); pin 25 is the slave chip select signal port (SPI_CSN); pin 22 (SX1302_RESET) is the reset control pin, used to reset the SX1302 chip; pin 24 (SX1261_BUSY) is the busy status indicator pin of the SX1261 chip, used to indicate the current internal operating state of the SX1261 chip to the MCU, such as busy or idle state; pins 28 (SX1261_DIO2) and 46 (SX1261_DIO1) are general purpose interrupt pins, used to indicate the SX1261 chip... This pin represents an internal state or event; pin 30 (I2C_SCL) is the serial clock pin for the I2C bus; pin 32 (I2C_SDA) is the serial data line pin for the I2C bus; pin 36 (SX1302_UART_RX) is the UART receive data pin; pin 38 (SX1302_UART_TX) is the UART transmit data pin; pin 44 (SX1261_NSS) is the chip select signal pin; pin 48 (SX1261_NRESET) is the reset pin for the SX1261 chip; pin 45 (JTCK-SWCLK*) is the JTAG / SWD clock pin, used to provide a clock signal in JTAG or SWD debug mode; pin 47 (JTCK-SWDIO*) is the JTAG mode select or SWD data input / output pin, used to select debug operation in JTAG mode, or for data input and output in SWD mode; pin 49 (MCU_NRESET) is the MCU chip reset pin. Pin 31 is defined as the PPS (Peripheral Pin Select) pin, allowing users to map the functions of peripherals to this pin. For example, in this embodiment, the IoT dual-mode gateway uses the PPS pin to receive signals from the GPS positioning module to synchronize the MCU's system clock with an external time source, making the system clock more accurately reflect the actual time and thus achieving high-precision time synchronization. Furthermore, pins 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 55, and 56 are ground pins (GND), and the remaining pins are redundant pins (NC).

[0036] Specifically, Figure 4This diagram shows the detailed circuit of the MCU chip (U5) in the LoRaWAN RF module. Pin 17 of the MCU is connected to the serial clock signal line (LR_SCK) of the LoRaWAN RF module, responsible for providing or receiving the clock signal to ensure synchronous data transmission. Pins 19, 23, and 25 are connected to other key functional modules in the LoRaWAN RF module, such as the LoRa modulation / demodulation module and the LoRa RF transceiver module, which work together to process and transmit signals. Pin 31 is connected to the GPS positioning module through resistor R24. Pin 22 is connected to a 3.3V power supply through resistor R55 and grounded through capacitor C164, forming a stable power supply circuit to ensure the normal operation of the MCU chip. Pins 30 and 32 are connected to the serial clock line and serial data line of the I2C bus through resistors R236 and R237, respectively. Pin 2 is grounded through parallel capacitors C163, C109, and E8 and connected to a 5V voltage (LR_5.0). These capacitors are used to filter and stabilize the power supply voltage, reducing the impact of voltage fluctuations on the MCU chip. The central microprocessor communicates with the MCU chip of the LoRAWAN RF module via the I2C bus.

[0037] Specifically, Figure 5 The detailed circuit diagram of the MCU chip (U6) in the Wi-SUN RF module is shown. Pin 19 of the MCU is connected to the serial transmit data line of the Wi-SUN RF module through resistor R93; pin 23 is connected to the serial receive data line of the Wi-SUN RF module through resistor R95, and connected to a 3.3V power supply through resistor R47; pin 31 of the MCU chip is connected to the GPS positioning module through resistor R29; pin 22 is connected to a 3.3V power supply through resistor R62 and grounded through capacitor C167; pin 2 is grounded through parallel capacitors C165, C166, and E9, and connected to a 5V voltage (WS_5.0). The central microprocessor communicates with the MCU chip in the Wi-SUN RF module through the serial transmit and receive data lines of the Wi-SUN RF module.

[0038] Furthermore, the IoT dual-mode gateway in this embodiment operates over a wide temperature range, typically from -40°C to 75°C, and can operate stably within -45°C to 85°C under extreme conditions, ensuring reliability in extreme weather. The gateway has passed a series of rigorous environmental tests, including high and low temperature tests, humidity tests, and EMC / ESD tests (compliant with IEC61000-4 standards, covering 15kV air discharge, 8kV contact discharge electrostatic discharge tests, fast transient / pulse tests, and electromagnetic field tests), ensuring the device's stability and durability. In terms of communication configuration, the gateway supports up to 32 uplink channels, supports detailed parameter settings for LoRaWAN and Wi-SUN, such as network communication configuration and beacon configuration, and provides OpenVPN configuration for secure remote access. The built-in web graphical interface simplifies the quick configuration and management process, while supporting local and remote firmware upgrades, reducing maintenance costs. In addition, the gateway is equipped with various diagnostic tools, such as log export, network ping testing, and device event querying, facilitating troubleshooting and system monitoring. In terms of installation flexibility, the gateway supports both wall-mounted and pole-mounted installations, adapting to diverse application scenarios. For network connectivity, it provides multiple backup communication methods (such as the aforementioned 4G or Ethernet) to ensure continuous and stable network connectivity. Regarding security, the gateway supports certificate management for Wi-SUN and OpenVPN, employing multiple authentication mechanisms (such as Radius server configuration) to comprehensively protect data transmission and network security. This gateway can be widely used in smart cities (such as urban infrastructure monitoring and smart lighting), industrial IoT (factory equipment monitoring and smart manufacturing), agricultural IoT (farmland environmental monitoring and irrigation control), and energy management (remote monitoring of electricity and water). The casing is made of durable aluminum alloy, with a built-in hardware real-time clock and supports over 10 years of battery power, further enhancing its practical value and long-term stability.

[0039] This embodiment of the IoT dual-mode gateway integrates a LoRaWAN RF module and a Wi-SUN RF module, enabling simultaneous support for both LoRaWAN and Wi-SUN communication protocols. The LoRaWAN and Wi-SUN RF modules are respectively responsible for demodulating the signals of their respective protocols, converting the received wireless signals into corresponding protocol data packets, and sending them to the central microprocessor for processing. The central microprocessor, as the core component of the gateway, can not only perform protocol conversion between LoRaWAN and Wi-SUN protocol data packets to generate data packets suitable for uplink communication, but also receive downlink communication data packets from the uplink communication module and convert them back to the corresponding LoRaWAN or Wi-SUN protocol data packets. This bidirectional and flexible protocol conversion function ensures that the gateway can achieve high-speed and accurate data transmission and interaction between different communication protocols, greatly enhancing the flexibility and efficiency of IoT applications.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An Internet of Things dual-mode gateway, characterized by, The IoT dual-mode gateway includes an antenna module, a LoRaWAN radio frequency module, a Wi-SUN radio frequency module, an uplink communication module, a central microprocessor, and a power module. The first end of the LoRaWAN radio frequency module, the first end of the Wi-SUN radio frequency module, the first end of the uplink communication module, and the power module are all connected to the central microprocessor. The second end of the LoRaWAN radio frequency module, the second end of the Wi-SUN radio frequency module, and the second end of the uplink communication module are all connected to the antenna module.

2. The IoT dual-mode gateway of claim 1, wherein, The uplink communication module includes a 4G / LTE communication module, an Ethernet communication module, and a WiFi communication module.

3. The IoT dual-mode gateway of claim 1 or 2, wherein, The IoT dual-mode gateway also includes an LED UI interaction module, a GPS positioning module, and an eSIM communication interface connected to the central microprocessor.

4. The IoT dual-mode gateway of claim 3, wherein, The antenna module includes a 4G antenna, a GPS antenna, a WiFi antenna, a Wi-SUN antenna, and a LoRaWAN antenna.

5. The IoT dual-mode gateway of claim 4, wherein, The 4G antenna, the GPS antenna, and the WiFi antenna are all flat panel antennas, while the LoRaWAN antenna and the Wi-SUN antenna are both glass antennas.

6. The IoT dual-mode gateway of claim 4, wherein, The LoRaWAN antenna has a maximum receiving sensitivity of -137dBm and a maximum transmitting power of +27dBm; the Wi-SUN antenna has a maximum receiving sensitivity of -107dBm and a maximum transmitting power of +30dBm.

7. The IoT dual-mode gateway according to claim 2, characterized in that, The power module includes an AC power supply unit, a DC power supply unit, and a power management unit. The AC power supply unit is connected to the first terminal of the DC power supply unit. The central microprocessor and the Ethernet communication module are both connected to the second terminal of the DC power supply unit. The third terminal of the DC power supply unit is connected to the power management unit.

8. The IoT dual-mode gateway of claim 7, wherein, The DC power supply unit includes a battery and a supercapacitor.

9. The IoT dual-mode gateway of claim 7, wherein, The AC power supply unit supports a voltage input of 85-265V, and the DC power supply unit has a power supply range of 9-15V.

10. The IoT dual-mode gateway of claim 1, wherein, The central microprocessor is model EG25-G.

Citation Information

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