Multi-layer heat dissipation integrated board for electric vehicle

Abstract

The utility model provides a multilayer heat dissipation integrated board for an electric vehicle, which relates to the technical field of integrated boards for electric vehicles and comprises an integrated board body, a heat conduction substrate is attached to the lower surface of the integrated board body, a cooling frame board is fixed in the middle of the lower surface of the heat conduction substrate, and heat dissipation fins are distributed on the front side and the rear side of the cooling frame board. A small fan is installed on the lower end face of the cooling frame plate, limiting side plates are fixed to the left side and the right side of the cooling frame plate, air outlet net openings are formed in the side faces of the limiting side plates, a cooling cavity is formed in the upper end of the cooling frame plate, a cooling bent pipe is installed on the surface of the cooling cavity, and the inner sides of the limiting side plates communicate with the cooling cavity through air guide cavities. The electric vehicle integrated board solves the problem that heat generated by an existing electric vehicle integrated board is mostly conducted and dissipated through heat conduction materials, so that the heat dissipation effect is poor, and the integrated board is prone to high-temperature damage.

Description

Technical Field

[0001] This utility model relates to the field of electric vehicle integrated board technology, specifically to a multi-layer heat dissipation integrated board for electric vehicles. Background Technology

[0002] The integrated circuit board (ICB) of an electric vehicle is its control center, responsible for coordinating and controlling various parts of the vehicle, such as the motor, battery, and braking system. It uses computer programs to intelligently control the vehicle, monitoring data such as battery level, speed, and temperature to ensure safe operation. However, most existing ICBs in electric vehicles use thermally conductive materials to dissipate the heat generated, resulting in poor heat dissipation and a tendency for the ICB to overheat and be damaged. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, a multi-layer heat dissipation integrated board for electric vehicles is provided. This solves the problem that most of the heat generated by existing electric vehicle integrated boards is conducted and dissipated using thermally conductive materials, resulting in poor heat dissipation and easy high-temperature damage to the integrated board.

[0004] To achieve the above objectives, a multi-layer heat dissipation integrated board for electric vehicles is provided, comprising: an integrated board body, wherein a thermally conductive substrate is attached to the lower surface of the integrated board body.

[0005] A cooling frame is fixed in the middle of the lower surface of the heat-conducting substrate. Heat dissipation fins are distributed on the front and rear sides of the cooling frame. A small fan is installed on the lower end face of the cooling frame. Limiting side plates are fixed on the left and right sides of the cooling frame. An air outlet is opened on the side of the limiting side plate. A cooling cavity is provided at the upper end of the cooling frame. A cooling bend is installed on the surface of the cooling cavity. The inner side of the limiting side plate is connected to the cooling cavity through an air guide cavity.

[0006] Furthermore, a thermally conductive silicone sheet is embedded and bonded to the upper surface of the thermally conductive substrate; and the thermally conductive silicone sheet is bonded and bonded to the lower surface of the integrated board body.

[0007] Furthermore, heat dissipation fins are symmetrically and equidistantly welded to the lower end face of the thermally conductive substrate, and the upper end of the cooling bend is in contact with the lower surface of the thermally conductive substrate through a support column.

[0008] Furthermore, the lower opening of the cooling bend is sealed with a liquid-blocking plug; and the lower opening of the cooling bend is located at the lower end of the cooling frame plate.

[0009] Furthermore, a temperature controller is embedded and fixed in the surface of the cooling frame plate; and the temperature controller is electrically connected to a small fan.

[0010] Furthermore, an air inlet is provided on the lower end face of the cooling frame plate; and a small fan is located on the lower surface of the air inlet.

[0011] Furthermore, the lower end face of the limiting side plate is provided with a support foot, and the limiting side plate is symmetrically snapped and attached to the left and right sides of the integrated plate body.

[0012] The beneficial effects of this utility model are as follows: the multi-layer heat dissipation integrated plate for electric vehicles utilizes a heat-conducting substrate, heat dissipation fins, a small fan, a cooling frame plate, and a cooling bend to form a multi-layer heat dissipation structure. The heat dissipation fins at the lower end of the heat-conducting substrate dissipate the heat of the electric vehicle integrated plate to the outside. When the heat of the electric vehicle integrated plate remains high, the small fan sends external airflow into the cavity of the heat-conducting substrate, allowing the external airflow to exchange heat with the coolant in the cooling bend before being discharged to the upper surface of the integrated plate. This effectively accelerates the dissipation of heat from the upper and lower layers of the electric vehicle integrated plate, enhances the heat dissipation effect of the electric vehicle integrated plate, avoids high-temperature failure of the integrated plate due to poor heat dissipation of a single layer, and improves the service life of the electric vehicle integrated plate. Attached Figure Description

[0013] Figure 1 This is a front view structural diagram of the multi-layer heat dissipation integrated plate for electric vehicles according to an embodiment of the present invention.

[0014] Figure 2 This is a front cross-sectional view of the multi-layer heat dissipation integrated plate for electric vehicles according to an embodiment of the present invention.

[0015] Figure 3 This is a top view of the cooling frame plate and cooling bend pipe according to an embodiment of the present invention.

[0016] Figure 4 This is a schematic diagram of the lower end face of the heat dissipation structure of the integrated board according to an embodiment of the present utility model.

[0017] In the diagram: 1. Integrated board body; 2. Thermally conductive substrate; 21. Heat dissipation fins; 22. Thermally conductive silicone pad; 3. Small fan; 31. Temperature controller; 4. Cooling frame plate; 41. Limiting side plate; 42. Support leg; 43. Air outlet; 44. Air guide cavity; 45. Air inlet; 46. Cooling cavity; 5. Cooling bend; 51. Support column; 52. Liquid blocking plug. Detailed Implementation

[0018] Reference Figures 1 to 4 As shown, this utility model provides a multi-layer heat dissipation integrated board for electric vehicles, including: an integrated board body 1, and a heat-conducting substrate 2 attached to the lower surface of the integrated board body 1.

[0019] A cooling frame plate 4 is fixed in the middle of the lower surface of the heat-conducting substrate 2. Heat dissipation fins 21 are distributed on the front and rear sides of the cooling frame plate 4. A small fan 3 is installed on the lower end face of the cooling frame plate 4. Limiting side plates 41 are fixed on the left and right sides of the cooling frame plate 4. An air outlet 43 is opened on the side of the limiting side plate 41. A cooling cavity 46 is provided at the upper end of the cooling frame plate 4. A cooling bend 5 is installed on the surface of the cooling cavity 46. The inner side of the limiting side plate 41 is connected to the cooling cavity 46 through the air guide cavity 44.

[0020] The integrated board body 1 consists of a multi-layer heat dissipation structure composed of a heat-conducting substrate 2, heat dissipation fins 21, a small fan 3, a cooling frame plate 4, and a cooling bend pipe 5. The heat-conducting substrate 2 conducts heat downwards, allowing the heat dissipation fins 21 at the lower end to dissipate the heat from the electric vehicle integrated board to the outside. When the heat of the electric vehicle integrated board remains high, the small fan 3 starts, sending external airflow into the cavity of the heat-conducting substrate 4. After the external airflow exchanges heat with the coolant in the cooling bend pipe 5, it is discharged to the upper surface of the integrated board through the air outlet 43 of the limiting side plate 41. This effectively accelerates the dissipation of heat from the upper and lower layers of the electric vehicle integrated board, enhances the heat dissipation effect of the electric vehicle integrated board, avoids high-temperature failure of the integrated board due to poor heat dissipation of a single layer, and improves the service life of the electric vehicle integrated board.

[0021] In this embodiment, a thermally conductive silicone sheet 22 is embedded and bonded to the upper surface of the thermally conductive substrate 2; and the thermally conductive silicone sheet 22 is bonded to the lower surface of the integrated board body 1. Heat dissipation fins 21 are symmetrically and equidistantly welded to the lower end face of the thermally conductive substrate 2, and the upper end of the cooling bend 5 contacts the lower surface of the thermally conductive substrate 2 via a support post 51. A liquid-blocking plug 52 is sealed to the lower opening of the cooling bend 5; and the lower opening of the cooling bend 5 passes through and is located at the lower end of the cooling frame plate 4.

[0022] In a preferred embodiment, the thermally conductive substrate 2 is made of aluminum plate. The heat generated by the integrated board body 1 is transferred downward through the thermally conductive substrate 2 and the thermally conductive silicone sheet 22, so that the heat dissipation fins 21 on both sides of the lower end dissipate the heat outward, thereby achieving the effect of heat conduction. Coolant is filled into the cooling bend 5. After the coolant in the cooling bend 5 exchanges heat with the external airflow entering the cooling cavity 46, it is discharged to the upper end surface of the integrated board body 1, which promotes the dissipation of heat from the upper layer of the integrated board body 1 and enhances the heat dissipation performance of the integrated board body 1.

[0023] In this embodiment, a temperature controller 31 is embedded and fixed on the surface of the cooling frame plate 4; and the temperature controller 31 is electrically connected to a small fan 3. An air inlet 45 is provided on the lower end surface of the cooling frame plate 4; and the small fan 3 is located on the lower surface of the air inlet 45. A support foot 42 is provided on the lower end surface of the limiting side plate 41, and the limiting side plate 41 is symmetrically snapped and attached to the left and right sides of the integrated plate body 1.

[0024] In a preferred embodiment, the temperature controller 31 contacts the heat-conducting substrate 2 through a temperature probe to detect the temperature change of the heat-conducting substrate 2. When the temperature continues to rise, the small fan 3 starts and delivers the external airflow to the cavity of the cooling frame plate 4. After exchanging heat with the cooling bend 5, the airflow is discharged from the air outlet 43 of the limiting side plate 41. This facilitates the dissipation of heat from the upper layer of the electric vehicle integrated plate, avoids high-temperature failure of the integrated plate due to poor heat dissipation of a single heat sink, and improves the service life of the electric vehicle integrated plate.

[0025] This utility model's multi-layer heat dissipation integrated board for electric vehicles effectively solves the problem that existing electric vehicle integrated boards mostly use thermally conductive materials for heat dissipation, resulting in poor heat dissipation and easy high-temperature damage to the integrated board. It facilitates the effective acceleration of heat dissipation from the upper and lower layers of the electric vehicle integrated board, enhances the heat dissipation effect of the electric vehicle integrated board, avoids high-temperature failure of the integrated board due to poor heat dissipation of a single layer, and improves the service life of the electric vehicle integrated board. It is suitable for multi-layer heat dissipation integrated boards for electric vehicles.

Claims

1. A multi-layer heat dissipating integrated plate for electric vehicles, comprising: An integrated board body (1), wherein a thermally conductive substrate (2) is attached to the lower surface of the integrated board body (1), characterized in that: A cooling frame plate (4) is fixed in the middle of the lower surface of the heat-conducting substrate (2). Heat dissipation fins (21) are distributed on the front and rear sides of the cooling frame plate (4). A small fan (3) is installed on the lower end face of the cooling frame plate (4). Limiting side plates (41) are fixed on the left and right sides of the cooling frame plate (4). An air outlet (43) is opened on the side of the limiting side plate (41). A cooling cavity (46) is provided at the upper end of the cooling frame plate (4). A cooling bend (5) is installed on the surface of the cooling cavity (46). The inner side of the limiting side plate (41) is connected to the cooling cavity (46) through the air guide cavity (44).

2. A multi-layer heat dissipating integrated plate for electric vehicles according to claim 1, characterized in that, The thermally conductive substrate (2) has a thermally conductive silicone sheet (22) embedded and bonded to its upper surface; and the thermally conductive silicone sheet (22) is bonded and bonded to the lower surface of the integrated board body (1).

3. A multi-layer heat dissipating integrated plate for electric vehicles according to claim 1, characterized in that, The heat-conducting substrate (2) has heat dissipation fins (21) symmetrically and equidistantly welded on its lower end surface, and the upper end of the cooling bend (5) is in contact with the lower surface of the heat-conducting substrate (2) through a support column (51).

4. The multi-layer heat dissipating integrated plate for electric vehicles according to claim 1, characterized in that, The lower end of the cooling bend (5) is sealed with a liquid-blocking plug (52); and the lower end of the cooling bend (5) is located at the lower end of the cooling frame plate (4).

5. The multi-layer heat dissipating integrated plate for electric vehicles according to claim 1, characterized in that, A temperature controller (31) is embedded and fixed on the surface of the cooling frame plate (4); and the temperature controller (31) is electrically connected to a small fan (3).

6. A multi-layer heat dissipating integrated plate for electric vehicles according to claim 1, characterized in that, The cooling frame plate (4) has an air inlet (45) on its lower end face; and a small fan (3) is located on the lower surface of the air inlet (45).

7. The multi-layer heat dissipating integrated plate for electric vehicles of claim 1, wherein, The lower end face of the limiting side plate (41) is provided with a support foot (42), and the limiting side plate (41) is symmetrically snapped and attached to the left and right sides of the integrated plate body (1).

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