LED lamp bead structure

Abstract

The utility model relates to the technical field of LED lamp beads, and discloses an LED lamp bead structure which comprises a support, an LED light-emitting chip is arranged at the upper end of the support, a shell is arranged at the upper end of the support, electrode plates are arranged on the two sides of the support, and heat dissipation devices are arranged on the two sides of the support. According to the LED lamp bead, heat at the LED light-emitting chip can be quickly conducted out, then heat dissipation at the LED light-emitting chip is completed, when the LED lamp bead is used, the heat is not dissipated, and the situation that the service life of the LED lamp bead is affected is avoided, so that the using effect of the LED lamp bead can be improved. The heat dissipation fins can be supported, and the situation that after being stressed, the heat dissipation fins get close to one another, and then use of the heat dissipation fins is affected is avoided. And the side, away from the connecting plate, of the containing plate can be supported, the situation that the containing plate shakes due to stress is avoided, and therefore the use stability of the containing plate can be improved.

Description

Technical Field

[0001] This utility model relates to the technical field of LED lamp beads, and in particular to an LED lamp bead structure. Background Technology

[0002] LED beads, short for light-emitting diodes, are semiconductor devices that convert electrical energy into light energy. LED beads have high photoelectric conversion efficiency and consume less energy compared to traditional light sources, thus saving energy and reducing energy consumption.

[0003] When using LED beads, the LED chips on the bracket emit light after being powered on. The light passes through a transparent shell coated with fluorescent material at the top of the bracket for illumination. Electrode plates are located on both sides of the bracket. During operation, LED beads generate a significant amount of heat. If this heat is not dissipated, it can shorten the lifespan of the LED beads. Utility Model Content

[0004] The purpose of this invention is to provide an LED bead structure that addresses the problem that LED beads generate a large amount of heat during use, and the failure to dissipate this heat can affect their lifespan.

[0005] This utility model is implemented as follows: an LED lamp bead structure includes a bracket, an LED light-emitting chip is provided at the upper end of the bracket, a housing is provided at the upper end of the bracket, electrode plates are provided on both sides of the bracket, and a heat dissipation device is provided on both sides of the bracket. The heat dissipation device dissipates heat from the LED light-emitting chip quickly through heat dissipation fins.

[0006] Preferably, the heat dissipation device includes a through hole in the bracket, and a connecting plate inserted into the through hole of the bracket. The connecting plate has an arc plate on the side close to the LED light-emitting chip, and a placement plate on the side of the connecting plate away from the arc plate. A plurality of heat dissipation fins are provided on one side of the placement plate.

[0007] Preferably, the connecting plate, the arc plate, the placement plate, and the heat dissipation fins are all made of aluminum.

[0008] Preferably, a support assembly is provided on one side of the placement plate.

[0009] Preferably, the support assembly includes a fixing plate, a connecting frame, and a support plate. The fixing plate fixes the connecting frame to one side of the placement plate, and the connecting frame places the support plate in the gap between the heat dissipation fins.

[0010] Preferably, the size of the support plate is adapted to the spacing of the plurality of heat dissipation fins, and the support plate is located in the middle area of ​​the heat dissipation fins.

[0011] Preferably, a stabilizing component is provided on the side of the placement plate away from the connecting plate.

[0012] Preferably, the stabilizing component includes a slot formed on the bracket, the stabilizing component includes a stabilizing plate that is snapped into the slot on the surface of the bracket, and a reinforcing plate is provided on one side of the stabilizing plate.

[0013] The beneficial effects of the LED lamp bead structure disclosed in this utility model are:

[0014] 1. By using a heat dissipation device, the heat from the LED light-emitting chip can be quickly dissipated, thus completing the heat dissipation of the LED light-emitting chip. If the heat is not dissipated during the use of the LED beads, it will affect the lifespan of the LED beads, thereby improving the performance of the LED beads.

[0015] 2. By using support components, the heat sink fins can be supported, preventing them from moving closer together under stress and affecting their operation.

[0016] 3. By using stabilizing components, the side of the placement plate away from the connecting plate can be supported, preventing the placement plate from shaking under force, thereby improving the stability of the placement plate in use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an LED lamp bead structure provided in an embodiment of the present utility model;

[0018] Figure 2 This utility model provides an LED lamp bead structure. Figure 1 Schematic diagram of a partial structure;

[0019] Figure 3 This is a schematic diagram of a heat dissipation device for an LED lamp bead structure provided in an embodiment of this utility model;

[0020] Figure 4 This is a schematic diagram of a support component structure for an LED lamp bead structure provided in an embodiment of this utility model.

[0021] Marker explanation:

[0022] 1. Bracket; 2. LED chip; 3. Housing; 4. Electrode; 5. Heat dissipation device; 6. Support assembly; 7. Stabilizing assembly;

[0023] 51. Through hole; 52. Connecting plate; 53. Arc plate; 54. Placement plate; 55. Heat dissipation fins;

[0024] 61. Fixing plate; 62. Connecting frame; 63. Support plate;

[0025] 71. Card slot; 72. Stabilizing plate; 73. Reinforcing plate. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0027] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0028] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0029] In this embodiment:

[0030] Reference Figures 1-4 The diagram shows a preferred embodiment of the present invention.

[0031] This embodiment of an LED lamp bead structure includes a bracket 1, an LED light-emitting chip 2 mounted on the upper end of the bracket 1, a housing 3 mounted on the upper end of the bracket 1, electrode plates 4 mounted on both sides of the bracket 1, and heat dissipation devices 5 mounted on both sides of the bracket 1. The heat dissipation devices 5 dissipate heat from the LED light-emitting chip 2 quickly through heat dissipation fins 55. When the LED lamp bead is in use, the LED light-emitting chip 2 on the bracket 1 emits light after being powered on. The light passes through the transparent housing 3, which is coated with fluorescent material, at the upper end of the bracket 1 for illumination. The electrode plates 4 on both sides of the bracket 1, along with the heat dissipation devices 5, rapidly conduct heat away from the LED light-emitting chip 2 during its use, thus completing the heat dissipation process.

[0032] Figures 1-4The heat dissipation device 5 shown includes a through hole 51 opened on the bracket 1. The heat dissipation device 5 includes a connecting plate 52 inserted into the through hole 51 of the bracket 1. The connecting plate 52 has an arc plate 53 on the side close to the LED light-emitting chip 2, and a placement plate 54 on the side of the connecting plate 52 away from the arc plate 53. A plurality of heat dissipation fins 55 are provided on one side of the placement plate 54. When installing the LED chip 2, the connecting plate 52, which has the arc plate 53 fixed to it, is placed on one side of the LED chip 2, with the connecting plate 52 passing through the through hole 51 on the bracket 1. Then, the placement plate 54 is fixed to the side of the connecting plate 52 away from the arc plate 53. Next, the heat dissipation fins 55 are fixed in place. After the LED chip 2 generates heat during operation, the arc plate 53 conducts the heat through the connecting plate 52 to the bracket 1 and the housing 3, and then the heat is dissipated through the heat dissipation fins 55 on the placement plate 54. By using the heat dissipation device 5, the heat from the LED chip 2 can be quickly dissipated, thus preventing the LED from failing to dissipate heat during use and affecting its lifespan, thereby improving the performance of the LED. The connecting plate 52, arc plate 53, placement plate 54, and heat dissipation fins 55 are all made of aluminum. When using the connecting plate 52, the arc plate 53, the placement plate 54, and the heat dissipation fins 55, they are made of aluminum to give them good thermal conductivity, thereby improving the performance of the heat dissipation device 5.

[0033] Figures 1-4 A support assembly 6 is provided on one side of the placement plate 54. Using the support assembly 6, the heat dissipation fins 55 can be supported, preventing them from moving closer together under stress and affecting their operation. The support assembly 6 includes a fixing plate 61, a connecting frame 62, and a support plate 63. The fixing plate 61 fixes the connecting frame 62 to one side of the placement plate 54, and the connecting frame 62 places the support plate 63 at the gaps between the heat dissipation fins 55. Before using the heat dissipation fins 55, the support plate 63 with the connecting frame 62 is placed at the gaps between several heat dissipation fins 55. Then, the fixing plate 61 on one side of the connecting frame 62 is fixed to one end of the placement plate 54, and the support plate 63 supports the gaps between the several heat dissipation fins 55. The size of the support plate 63 is adapted to the spacing between the several heat dissipation fins 55, and the support plate 63 is located in the middle area of ​​the heat dissipation fins 55. By using the support plate 63, the gaps between the heat dissipation fins 55 are supported, making it less likely for the heat dissipation fins 55 to be subjected to force and thus improving the performance of the heat dissipation fins 55.

[0034] Figures 1-4A stabilizing component 7 is provided on the side of the placement plate 54 away from the connecting plate 52. By using the stabilizing component 7, the side of the placement plate 54 away from the connecting plate 52 can be supported, preventing the placement plate 54 from shaking under force, thereby improving the stability of the placement plate 54. The stabilizing component 7 includes a slot 71 formed on the bracket 1, and a stabilizing plate 72 that snaps into the slot 71 on the surface of the bracket 1. A reinforcing plate 73 is provided on one side of the stabilizing plate 72. When the placement plate 54 is fixed to one side of the connecting plate 52, the stabilizing plate 72 fixed to the other side of the placement plate 54 is inserted into the slot 71 of the bracket 1. At this time, the reinforcing plate 73 increases the support range of the stabilizing plate 72, and then the stabilizing plate 72 supports and stabilizes the side of the placement plate 54 away from the connecting plate 52.

[0035] Working principle: When using LED beads, the LED light-emitting chip 2 on the bracket 1 emits light after being powered on. The light passes through the transparent shell 3 coated with fluorescent material on the upper end of the bracket 1 for illumination. Electrode plates 4 are provided on both sides of the bracket 1. When installing the LED light-emitting chip 2, the connecting plate 52, which is fixed with the arc plate 53, is placed on one side of the LED light-emitting chip 2, and the connecting plate 52 passes through the through hole 51 on the bracket 1. Then, the placement plate 54 is fixed to the side of the connecting plate 52 away from the arc plate 53. When the placement plate 54 is fixed to the side of the connecting plate 52, the stabilizing plate 72 fixed on the other side of the placement plate 54 is inserted into the slot 71 of the bracket 1. At this time, the reinforcing plate 73 increases the support range of the stabilizing plate 72, and the stabilizing plate 72 supports and stabilizes the side of the placement plate 54 away from the connecting plate 52. Next, the position of the heat dissipation fins 55 is fixed. Before using the heat dissipation fins 55, the support plate 63 with the connecting bracket 62 is placed in the gap between several heat dissipation fins 55. Then, the fixing plate 61 on one side of the connecting bracket 62 is fixed to one end of the placement plate 54. Then, the support plate 63 supports the gap between several heat dissipation fins 55. After the LED light-emitting chip 2 emits light and generates heat, the arc plate 53 conducts the heat out of the bracket 1 and the housing 3 through the connecting plate 52, and then dissipates the heat through the heat dissipation fins 55 on the placement plate 54 to complete the heat dissipation.

[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED lamp bead structure comprising a bracket, characterized in that, The upper end of the bracket is provided with an LED light-emitting chip, the upper end of the bracket is provided with a housing, the two sides of the bracket are provided with electrode plates, and the two sides of the bracket are provided with heat dissipation devices. The heat dissipation devices dissipate heat from the LED light-emitting chip quickly through heat dissipation fins. The heat dissipation device includes a through hole in the bracket, and a connecting plate inserted into the through hole of the bracket. The connecting plate has an arc plate on the side close to the LED light-emitting chip, and a placement plate on the side of the connecting plate away from the arc plate. A plurality of heat dissipation fins are provided on one side of the placement plate. A support assembly is provided on one side of the placement plate. The support assembly includes a fixing plate, a connecting frame, and a support plate. The fixing plate fixes the connecting frame to one side of the placement plate, and the connecting frame places the support plate in the gap between the heat dissipation fins. The size of the support plate is adapted to the spacing of several heat dissipation fins. The support plate is located in the middle area of ​​the heat dissipation fins. A stabilizing component is provided on the side of the placement plate away from the connecting plate. The stabilizing component includes a slot opened on the bracket and a stabilizing plate that is snapped into the slot on the surface of the bracket. A reinforcing plate is provided on one side of the stabilizing plate.

2. The LED lamp bead structure of claim 1, wherein, The connecting plate, arc plate, placement plate, and heat dissipation fins are all made of aluminum.

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