Flexible Mini LED, display device and electronic equipment

Abstract

The utility model discloses a flexible Mini LED, a display device and an electronic device, and the flexible Mini LED comprises a substrate layer which is a nano-silver film layer; the wiring layer is arranged on the nano silver film layer; the white oil area surrounds the periphery of the wiring layer; the wafer area is arranged on one side, back on to the substrate layer, of the wiring layer; and the sealing glue layer covers the wafer area. And through the arrangement of the nano-silver film layer, the demand of the market on a curved-surface Mini LED product is met.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a flexible Mini LED, a display device, and an electronic device. Background Technology

[0002] Currently, most Mini LED substrates use rigid PCBs, resulting in a scarcity of curved Mini LED products on the market. Meeting the market demand for curved Mini LED products has become a pressing technical challenge for the industry. Summary of the Invention

[0003] In order to at least solve the above-mentioned technical problems, the purpose of this utility model is to provide a flexible Mini LED that meets the market demand for curved Mini LED products.

[0004] To achieve the above objectives, the flexible Mini LED provided in this application includes:

[0005] Substrate layer, which is a nano-silver film layer;

[0006] The wiring layer is laid on the silver nanofilm layer;

[0007] White paint area, the white paint area surrounds the wiring layer;

[0008] The wafer region is located on the side of the trace layer facing away from the substrate layer.

[0009] The encapsulation layer covers the wafer area.

[0010] Furthermore, it also includes:

[0011] Optical adhesive layer, which is disposed on the side of the sealant layer facing away from the substrate layer.

[0012] Furthermore, the optical adhesive layer covers the sealing layer.

[0013] Furthermore, the optical adhesive layer covers the white oil area.

[0014] Furthermore, the optical adhesive layer includes OCA optical adhesive.

[0015] Furthermore, the optical adhesive layer protrudes from the surface of the sealing layer with a thickness between 0.1 and 0.2 mm.

[0016] Furthermore, it also includes:

[0017] The FPC also has bonding positions on the substrate layer, which are used to bond the FPC.

[0018] Furthermore, the wiring layer is fabricated on a nano-silver film layer through exposure, etching, and development processes.

[0019] To achieve the above objectives, the display device provided in this application includes: the aforementioned flexible Mini LED.

[0020] To achieve the above objectives, the electronic device provided in this application includes: the aforementioned flexible Mini LED.

[0021] The flexible Mini LED of this application includes: a substrate layer, which is a nano-silver film layer; a wiring layer disposed on the nano-silver film layer; a white oil region surrounding the wiring layer; a wafer region disposed on the side of the wiring layer opposite to the substrate layer; and a sealing layer covering the wafer region. The nano-silver film layer satisfies market demand for curved Mini LED products. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of a flexible Mini LED structure according to an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] 101-Substrate layer; 102-Wire layer; 103-White oil area; 104-Wafer area; 105-Encapsulating layer; 106-Optical adhesive layer; 107-FPC. Detailed Implementation

[0026] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0027] It should be understood that the steps described in the method embodiments of this application may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this application is not limited in this respect.

[0028] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.

[0029] It should be noted that the terms "one" and "multiple" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be interpreted as "one or more". "Multiple" should be understood as two or more.

[0030] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0031] This application provides a flexible Mini LED, including:

[0032] Substrate layer, which is a nano-silver film layer;

[0033] The wiring layer is laid on the silver nanofilm layer;

[0034] White paint area, the white paint area surrounds the wiring layer;

[0035] The wafer region is located on the side of the trace layer facing away from the substrate layer.

[0036] The encapsulation layer covers the wafer area.

[0037] Example 1

[0038] Figure 1 This is a schematic diagram of the flexible Mini LED structure according to an embodiment of this application. The following will be combined with... Figure 1 The flexible Mini LED of the present application embodiments will be described in detail.

[0039] In one exemplary embodiment, the flexible Mini LED of this application includes a substrate layer 101.

[0040] In one exemplary embodiment, the substrate layer 101 is a nanosilver film layer.

[0041] In one exemplary embodiment, the flexible Mini LED of this application embodiment further includes: a wiring layer 102.

[0042] In one exemplary embodiment, the wiring layer 102 is disposed on the silver nanofilm layer.

[0043] In one exemplary embodiment, the wiring layer 102 is fabricated on a silver nanofilm layer by exposure, etching, and development processes.

[0044] In one exemplary embodiment, the flexible Mini LED of this application embodiment further includes: a white oil region 103.

[0045] In one exemplary embodiment, white oil area 103 surrounds the wiring layer 102.

[0046] In one exemplary embodiment, the flexible Mini LED of this application further includes: a wafer region 104.

[0047] In one exemplary embodiment, the wafer region 104 is disposed on the side of the wiring layer 102 facing away from the substrate layer 101.

[0048] In one exemplary embodiment, the flexible Mini LED of this application further includes an encapsulating layer 105.

[0049] In one exemplary embodiment, the encapsulating layer 105 covers the wafer region 104.

[0050] In one exemplary embodiment, the sealant layer 105 is connected to the white oil area 103.

[0051] In one exemplary embodiment, the flexible Mini LED of this application further includes an optical adhesive layer 106.

[0052] In one exemplary embodiment, the optical adhesive layer 106 is disposed on the side of the encapsulating layer 105 facing away from the substrate layer 101.

[0053] In one exemplary embodiment, the optical adhesive layer 106 covers the sealing layer 105.

[0054] In one exemplary embodiment, the optical adhesive layer 106 covers the white oil area 103.

[0055] In one exemplary embodiment, the optical adhesive layer 106 comprises OCA optical adhesive.

[0056] In one exemplary embodiment, to avoid damaging the LED, the optical adhesive layer 106 protrudes from the surface of the encapsulating layer 105 with a thickness between 0.1 and 0.2 mm.

[0057] In one exemplary embodiment, the flexible Mini LED of this application further includes: FPC107.

[0058] In one exemplary embodiment, the substrate layer 101 is further provided with bonding bits for bonding the FPC 107.

[0059] In one exemplary embodiment, the FPC107 may be provided with a component area as needed, which is used to set components.

[0060] In one exemplary embodiment, the components include capacitors and / or resistors and / or diodes.

[0061] In some exemplary implementations, the capacitor serves to stabilize voltage or filter.

[0062] In some exemplary embodiments, the resistor serves as a pull-up resistor or an electrostatic discharge protector.

[0063] In some exemplary embodiments, the diode serves as electrostatic protection or to prevent voltage reverse flow.

[0064] Example 2

[0065] Example 2 is a display device that includes the flexible Mini LED described in the above examples.

[0066] Example 3

[0067] Example 3 is an electronic device that includes the flexible Mini LED described in the above examples.

[0068] Although the embodiments disclosed in this utility model are as described above, the content is only for the purpose of facilitating understanding of this utility model and is not intended to limit this utility model. Any person skilled in the art to which this utility model pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this utility model, but the patent protection scope of this utility model shall still be determined by the scope defined in the appended claims.

Claims

1. A flexible Mini LED, characterized in that, include: A substrate layer, wherein the substrate layer is a nano-silver film layer; A wiring layer is disposed on the silver nanofilm layer; White oil area, the white oil area surrounding the wiring layer; A wafer region is disposed on the side of the trace layer facing away from the substrate layer; An encapsulating layer that covers the wafer region; The sealant layer is connected to the white oil area.

2. The flexible Mini LED of claim 1, wherein, It also includes: An optical adhesive layer is disposed on the side of the encapsulating layer facing away from the substrate layer.

3. The flexible Mini LED of claim 2, wherein, The optical adhesive layer covers the sealing layer.

4. The flexible Mini LED of claim 3, wherein, The optical adhesive layer covers the white oil area.

5. The flexible Mini LED of claim 4, wherein, The optical adhesive layer includes OCA optical adhesive.

6. The flexible Mini LED of claim 5, wherein, The optical adhesive layer protrudes from the surface of the sealing layer and has a thickness between 0.1 and 0.2 mm.

7. The flexible Mini LED of claim 1, wherein, It also includes: The FPC, the substrate layer is further provided with bonding positions, the bonding positions are used to bond the FPC.

8. The flexible Mini LED of claim 1, wherein, The wiring layer is fabricated on the nano-silver film layer through exposure, etching, and development processes.

9. A display device comprising: Includes the flexible Mini LED as described in any one of claims 1-8.

10. An electronic device, comprising: Includes the flexible Mini LED as described in any one of claims 1-8.

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