LED support structure

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED support structure, which comprises a terminal plate member comprising at least one terminal unit, and the terminal unit comprises a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each terminal assembly comprises two conductive terminals which are arranged at an interval in the first direction, and each conductive terminal is connected with the adjacent conductive terminal in the adjacent terminal assembly through a connecting part; the insulating plate is coated outside the terminal assembly so as to insulate the two conductive terminals; wherein the surfaces of the two ends, in the third direction, of each conductive terminal are exposed out of the insulating plate, and the third direction is perpendicular to the first direction and the second direction. According to the utility model, the product yield of the LED support structure is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED bracket structure. Background Technology

[0002] With the development of display panel technology, people's pursuit of thinner, lighter, and higher-definition flexible displays is becoming increasingly strong. However, traditional LED (Light Emitting Diode) displays have many problems and cannot meet market demands. Traditional LED displays have a large pixel pitch, resulting in limited image clarity and making it difficult to achieve high-definition display effects. Moreover, the backlight of traditional LED displays is usually quite thick and heavy, making it difficult to achieve a thinner and lighter overall display device, thus limiting the portability and design flexibility of the display device.

[0003] Given these shortcomings of traditional LED displays, mini LED technology emerged. Mini LEDs significantly reduce pixel pitch, enabling higher resolution and meeting the demands of high-definition displays. Furthermore, mini LED backlights are thinner and lighter, making them more suitable for slimmer display devices, meeting the demands of modern consumer electronics for product miniaturization. Despite these advantages, mini LED technology suffers from a smaller support structure, resulting in lower strength and a greater susceptibility to deformation during manufacturing, leading to lower product yields. Utility Model Content

[0004] Based on this, the present invention provides an LED bracket structure, comprising:

[0005] A terminal block includes at least one terminal unit, the terminal unit comprising a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each terminal assembly including two conductive terminals spaced apart along the first direction, each conductive terminal being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion; and

[0006] An insulating plate is used to cover the terminal assembly to insulate the two conductive terminals.

[0007] In this embodiment, each of the conductive terminals has its two ends exposed on the insulating plate in a third direction, which is perpendicular to the first direction and the second direction.

[0008] Furthermore, the two conductive terminals are a first conductive terminal and a second conductive terminal, and the connecting part includes a first connecting body, a second connecting body and a third connecting body. The first connecting body connects two adjacent first conductive terminals in two adjacent terminal assemblies, the second connecting body connects two adjacent first conductive terminals and two adjacent conductive terminals in two adjacent terminal assemblies, and the third connecting body connects two adjacent second conductive terminals in two adjacent terminal assemblies.

[0009] Furthermore, the two conductive terminals are a first conductive terminal and a second conductive terminal, and the first conductive terminal and the second conductive terminal are centrally symmetrically arranged about the central axis of the terminal assembly, and the central axis extends along the third direction.

[0010] Further, the conductive terminal includes:

[0011] The body has a first surface and a second surface disposed opposite to each other on the third side, the first surface of the body being used to connect an LED chip;

[0012] A protrusion, protruding from the second surface, the protrusion having a third surface in a third direction away from the second surface, the third surface being used to connect to a drive circuit board; and

[0013] A connecting arm connects the body and the connecting part.

[0014] Furthermore, the insulating plate has a fourth surface and a fifth surface disposed opposite to each other in the third direction, the fourth surface being located on the same plane as the first surface, and the fifth surface being located on the same plane as the third surface.

[0015] Furthermore, the thickness of the insulating plate in the third direction is equal to the thickness of the conductive terminal in the third direction.

[0016] Furthermore, the terminal block also includes a connecting frame surrounding the terminal unit, the connecting frame being connected to the adjacent conductive terminal via the connecting portion.

[0017] Furthermore, the terminal block includes a plurality of terminal units arranged in a rectangular array along the first direction and the second direction, and two adjacent terminal units are connected together by the connecting frame.

[0018] Furthermore, the connecting frame is provided with a plurality of tool-setting grooves arranged around the terminal unit, the plurality of tool-setting grooves being arranged along the first direction and the second direction and located on the same straight line as the corresponding connecting part.

[0019] Furthermore, the insulating plate is an integrally molded injection molded part, and the insulating plate includes a plurality of insulating bases connected together by a waste section. The insulating bases are arranged in a one-to-one correspondence with the terminal assemblies, and the insulating bases cover the corresponding terminal assemblies to insulate the two conductive terminals.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows: the LED bracket structure includes at least one terminal unit, the terminal unit includes multiple terminal assemblies arranged in a rectangular array, each terminal assembly includes two conductive terminals spaced apart in a first direction, and each conductive terminal is interconnected with adjacent conductive terminals in adjacent terminal assemblies through a connecting part, which improves the strength of the conductive terminals and can avoid deformation of the conductive terminals due to factors such as injection molding pressure when forming insulating plates, thereby improving the product yield of the LED bracket structure. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the terminal board structure in the LED bracket structure of this utility model embodiment;

[0022] Figure 2 for Figure 1 A magnified view of a portion of the A structure;

[0023] Figure 3 for Figure 2 A magnified view of the local B structure;

[0024] Figure 4 This is a schematic diagram of the terminal assembly structure in the LED bracket structure of this utility model embodiment;

[0025] Figure 5 for Figure 4 CC section view;

[0026] Figure 6 for Figure 4 DD sectional view;

[0027] Figure 7 for Figure 4 Rear view;

[0028] Figure 8 This is a schematic diagram of the LED bracket structure according to an embodiment of the present utility model;

[0029] Figure 9 for Figure 8 A magnified view of the local E-structure;

[0030] Figure 10 for Figure 9 A magnified view of the local F-structure;

[0031] Figure 11This is a schematic diagram of a single LED bracket in the LED bracket structure of this utility model embodiment;

[0032] Figure 12 for Figure 11 A bottom view;

[0033] Figure 13 for Figure 11 The right view;

[0034] Figure 14 for Figure 11 Rear view. Detailed Implementation

[0035] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0036] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0038] Please refer to Figures 1 to 14 The LED bracket structure of this utility model embodiment includes a terminal plate 100 and an insulating plate 200. The terminal plate 100 includes at least one terminal unit 101, and each terminal unit 101 includes multiple terminal assemblies 1. The multiple terminal assemblies 1 are arranged in a rectangular array along a first direction and a second direction, with the second direction perpendicular to the first direction. Each terminal assembly 1 includes two conductive terminals 11, which are spaced apart in the first direction. Each conductive terminal 11 is connected to an adjacent conductive terminal 11 in an adjacent terminal assembly 1 via a connecting portion 2. The insulating plate 200 includes multiple insulating bases 3, which are correspondingly arranged with the terminal assemblies 1 one-to-one. The insulating bases 3 cover the corresponding terminal assemblies 1 to insulate the two conductive terminals 11. The two ends of each conductive terminal 11 are exposed on the insulating base 3 in a third direction to facilitate electrical connection to the LED chip and the driver circuit board, wherein the third direction is perpendicular to the first and second directions.

[0039] The LED bracket structure of this utility model embodiment includes at least one terminal unit 101. The terminal unit 101 includes a plurality of terminal assemblies 1 arranged in a rectangular array. Each terminal assembly 1 includes two conductive terminals 11 spaced apart in a first direction. Each conductive terminal 11 is interconnected with adjacent conductive terminals 11 in adjacent terminal assemblies 1 through a connecting part 2, which improves the strength of the conductive terminals 11 and avoids deformation of the conductive terminals 11 due to factors such as injection pressure when forming the insulating plate 200, thereby improving the product yield of the LED bracket structure.

[0040] It should be noted that, in Figures 8 to 11 as well as Figure 14 In order to more intuitively show the insulating plate 200 and distinguish it from the terminal plate 100, the insulating plate 200 is marked with cross-sectional lines, which does not indicate that the surface of the insulating plate 200 has texture. It is understood that the surface of the insulating plate 200 can be processed into a smooth surface or a non-smooth surface with texture, markings or other structures, depending on the actual situation, and no limitation is made here.

[0041] In some preferred embodiments, the terminal plate 100 can be manufactured from a metal plate; for example, the metal plate can be a copper plate. The insulating plate 200 can be injection molded, with the terminal plate 100 used as an insert during injection molding, which can effectively improve the processing efficiency of the LED bracket structure. In some more preferred embodiments, the terminal plate 100 can be etched from a metal plate, which can also effectively improve the processing efficiency of the LED bracket structure.

[0042] In some preferred embodiments, please refer to Figure 3 The two conductive terminals 11 are respectively the first conductive terminal 11a and the second conductive terminal 11b, and each terminal assembly 1 has the same structure. That is, the conductive terminals located on both sides of the first conductive terminal 11a in the first direction are all second conductive terminals 11b, the conductive terminals located on both sides of the first conductive terminal 11a in the second direction are all first conductive terminals 11a, and the conductive terminals located on both sides of the second conductive terminal 11b in the second direction are all second conductive terminals 11b. The connecting part 2 includes a first connecting body 21, a second connecting body 22, and a third connecting body 23. The first connecting body 21 connects two adjacent first conductive terminals 11a in two adjacent terminal assemblies 1, the second connecting body 22 connects two adjacent first conductive terminals 11a and second conductive terminals 11b in two adjacent terminal assemblies 1, and the third connecting body 23 connects two adjacent second conductive terminals 11b in two adjacent terminal assemblies 1. In this embodiment, each conductive terminal 11 is connected to adjacent conductive terminals 11 in multiple adjacent terminal assemblies 1 through the connecting part 2, so that the conductive terminal 11 has sufficient strength to resist the influence of factors such as injection molding pressure.

[0043] As one implementation method, please refer to Figure 3 The conductive terminal 11 has a first end 111 and a second end 112 disposed opposite to each other in a first direction. The conductive terminal 11 also has a third end 113 and a fourth end 114 disposed opposite to each other in a second direction. The first end 111 of the first conductive terminal 11a is close to the second end 112 of the second conductive terminal 11b in the same terminal assembly 1, that is, the second end 112 of the first conductive terminal 11a is far away from the first end 111 of the second conductive terminal 11b in the same terminal assembly 1. The second end 112 of the first conductive terminal 11a is connected to the first end 111 of the adjacent second conductive terminal 11b in the adjacent terminal assembly 1 in the first direction through the second connector 22. The third end 113 and the fourth end 114 of the first conductive terminal 11a are respectively connected to the first conductive terminal 11a in the adjacent terminal assembly 1 in the second direction through the first connector 21. The third end 113 of the first conductive terminal 11a is also connected to the fourth end 114 of the second conductive terminal 11b in the adjacent terminal assembly 1 in the second direction through the second connector 22. The third end 113 and the fourth end 114 of the second conductive terminal 11b are respectively connected to the second conductive terminal 11b in the adjacent terminal assembly 1 in the second direction via the third connector 23.

[0044] As an example, please refer to Figure 3Terminal unit 101 includes terminal assembly 1a, terminal assembly 1b, terminal assembly 1c, terminal assembly 1d, and terminal assembly 1e. Terminal assembly 1b and terminal assembly 1c are respectively disposed on both sides of terminal assembly 1a in a first direction, and terminal assembly 1d and terminal assembly 1e are respectively disposed on both sides of terminal assembly 1a in a second direction. The second end 112 of the first conductive terminal 11a of terminal assembly 1a is connected to the first end 111 of the second conductive terminal 11b of terminal assembly 1b via a second connector 22a. The third end 113 of the first conductive terminal 11a of terminal assembly 1a is connected to the fourth end 114 of the first conductive terminal 11a of terminal assembly 1d via a first connector 21. The third end 113 of the first conductive terminal 11a of terminal assembly 1a is also connected to the fourth end 114 of the second conductive terminal 11b of terminal assembly 1d via a second connector 22b. The fourth end 114 of the first conductive terminal 11a of terminal assembly 1a is connected to the third end 113 of the first conductive terminal 11a of terminal assembly 1e via a first connector 21. The first end 111 of the second conductive terminal 11b of terminal assembly 1a is connected to the second end 112 of the first conductive terminal 11a of terminal assembly 1c via the second connector 22a. The third end 113 of the second conductive terminal 11b of terminal assembly 1a is connected to the fourth end 114 of the second conductive terminal 11b of terminal assembly 1d via the third connector 23. The fourth end 114 of the second conductive terminal 11b of terminal assembly 1a is connected to the third end 113 of the second conductive terminal 11b of terminal assembly 1e via the third connector 23. The fourth end 114 of the second conductive terminal 11b of terminal assembly 1a is also connected to the third end 113 of the first conductive terminal 11a of terminal assembly 1e via the second connector 22b. In this embodiment, each conductive terminal is cross-interconnected with four other conductive terminals, ensuring the strength of the conductive terminals.

[0045] In some examples, the length of the conductive terminal 11 in the second direction is greater than the length of the conductive terminal 11 in the first direction. To further increase the strength of the conductive terminal 11, adjacent first conductive terminals 11a and second conductive terminals 11b in two adjacent terminal assemblies 1 in the first direction are connected by a plurality of second connectors 22a. Please refer to [reference needed]. Figure 3 .

[0046] It should be noted that in some embodiments, each conductive terminal 11 may be cross-interconnected with five conductive terminals 11. As an example, the fourth end 114 of the first conductive terminal 11a is also connected via the second connector 22b to the third end 113 of the second conductive terminal 11b in an adjacent terminal assembly 1 in the second direction. For example, the fourth end 114 of the first conductive terminal 11a of the terminal assembly 1a is also connected via the second connector 22b to the third end 113 of the second conductive terminal 11b of the terminal assembly 1e.

[0047] In some preferred embodiments, please refer to Figures 1 to 3 The first conductive terminal 11a and the second conductive terminal 11b are arranged in a centrally symmetrical manner about the central axis of the terminal assembly 1. The central axis extends in a third direction, which can improve the utilization rate of the metal plate used to process the terminal plate 100 and save costs.

[0048] In some preferred embodiments, please refer to Figures 4 to 7 The conductive terminal 11 includes a body 115, a protrusion 116, and a connecting arm 117. The body 115 has a first surface 1151 and a second surface 1152 disposed opposite each other in a third-order direction. The first surface 1151 of the body 115 is used to connect an LED chip. The protrusion 116 protrudes from the second surface 1152 and has a third surface 1161 disposed away from the second surface 1152 in a third-order direction. The third surface 1161 of the protrusion 116 is used to connect a driver circuit board. The connecting arm 117 connects the body 115 and the connecting portion 2.

[0049] In this embodiment, the LED bracket structure is suitable for POB (Package on Board) packaging. The LED chip is directly fixed to the corresponding terminal assembly 1 and insulating base 3, and the LED chip is encapsulated by dispensing or other methods. The LED chip is electrically connected to the first surface 1151 of the body 115, and the third surface 1161 of the protrusion 116 is soldered to the drive circuit board using solder paste or other soldering materials. In addition, the protrusion 116 protrudes from the body 115, thereby allowing the insulating base 3 to more reliably enclose the terminal assembly 1, preventing the terminal assembly 1 from detaching from the insulating base 3, and ensuring the tight enclosure effect of the insulating base 3 on the terminal assembly 1.

[0050] In some preferred embodiments, please refer to Figures 11 to 14 The thickness of the insulating base 3 in the third direction is equal to the thickness of the conductive terminal 11 in the third direction. The insulating base 3 has a fourth surface 31 and a fifth surface 32 disposed opposite to each other in the third direction. The fourth surface 31 and the first surface 1151 are located on the same plane, and the fifth surface 32 and the third surface 1161 are located on the same plane.

[0051] In this embodiment, the thickness of the insulating base 3 is equal to the thickness of the conductive terminal 11, and there is no reflective cup structure. The amount of plastic required for the insulating base 3 is small, which not only reduces processing difficulty and cost but also lowers the requirements for injection molding production. Furthermore, the small amount of plastic required for the insulating base 3 minimizes the adverse effects of injection molding on the conductive terminal 11, allowing for a smaller spacing between adjacent terminal assemblies 1 and improving the material utilization rate of the metal sheet. The fact that the thickness of the insulating base 3 is equal to the thickness of the conductive terminal 11 also allows for a thinner LED bracket, making it suitable for small-sized, thin and light tablet computers and large-sized, thin and light LED displays.

[0052] As an example, the thickness of the conductive terminal 11 is the distance between the first surface 1151 and the third surface 1161 in the third direction. That is, the thickness of the conductive terminal 11 is the sum of the thicknesses of the body 115 and the protrusion 116 in the third direction. The ratio of the thickness of the body 115 in the third direction to the thickness of the protrusion 116 in the third direction can be 1:1, and the thickness of the connecting arm 117 in the third direction can be equal to the thickness of the body 115 in the third direction, thereby ensuring the strength of the terminal plate 100 and simplifying the processing technology and reducing processing costs.

[0053] In some preferred embodiments, the terminal block 100 further includes a connecting frame 102, which surrounds the terminal unit 101 and is connected to an adjacent conductive terminal 11 via a connecting portion 2. That is, please refer to... Figures 1 to 2 The conductive terminal 11 located at the edge of the terminal unit 101 is connected to the connecting frame 102 via the connecting part 2. For example, please refer to... Figure 10 The connecting part 2 also includes a fourth connector 24 and a fifth connector 25. The first end 111 and / or the second end 112 of the conductive terminal 11 located at the first direction edge of the terminal unit 101 are connected to the connecting frame 102 through the fourth connector 24, and the third end 113 and / or the fourth end 114 of the conductive terminal 11 located at the second direction edge of the terminal unit 101 are connected to the connecting frame 102 through the fifth connector 25.

[0054] In some preferred embodiments, please refer to Figure 1 The terminal block 100 includes a connecting frame 102 and a plurality of terminal units 101. The plurality of terminal units 101 are arranged in a rectangular array along a first direction and a second direction, and adjacent two terminal units 101 are connected together by the connecting frame 102. In this embodiment, the terminal block 100 includes a plurality of terminal units 101, which further improves processing efficiency. Furthermore, the connection of adjacent two terminal units 101 to the connecting frame 102 further improves the strength of the terminal block 100.

[0055] In some preferred embodiments, the insulating plate 200 is an integrally molded part, and the insulating base 3 is connected as a whole by the waste section 4. Please refer to [reference needed]. Figures 8 to 10 Waste section 4 refers to the waste material that needs to be removed after the LED chip is packaged onto the LED bracket structure. It can be understood that during injection molding, the plastic flows through the main runner to the branch runners and then into the cavity of the insulating base 3. Waste section 4 includes not only the plastic connecting two adjacent insulating bases 3, but also the main runner plastic waste located in the main runner and the branch runner plastic waste located in the branch runners, etc.

[0056] In this embodiment, the insulating base 3 is connected as one unit through the waste section 4. That is to say, the cavity of each insulating base 3 is connected to the cavity of the adjacent insulating base 3, which is more conducive to the flow of plastic during injection molding and improves the product yield.

[0057] In some preferred embodiments, the connecting frame 102 is provided with a plurality of tool-setting grooves surrounding the terminal unit 101. The plurality of tool-setting grooves are arranged along the first direction and the second direction and are located on the same straight line as the corresponding connecting part 2.

[0058] As an example, please refer to Figure 2 and Figure 10The tool slots are divided into a first pair of tool slots 1021 and a second pair of tool slots 1022. There are two sets of the first pair of tool slots 1021, symmetrically arranged in the first direction and close to the outer edge of the connecting frame 102. Each set of the first pair of tool slots 1021 includes multiple first pair of tool slots 1021 evenly spaced along the second direction. These multiple first pair of tool slots 1021 correspond to the first connecting body 21, the second connecting body 22b, and the third connecting body 23. That is, these multiple first pair of tool slots 1021 correspond to the gap between two adjacent terminal assemblies 1 in the second direction. There are also multiple first pair of tool slots 1021 corresponding to the fifth connecting body 25. The first pair of tool slots 1021 in the two sets of the first pair of tool slots 1021 are arranged one-to-one in the first direction. The straight path between two corresponding first pair of tool slots 1021 is constructed as a first cutting path 301. The width of the first cutting path 301 is equal to the width of the first pair of tool slots 1021 and equal to the width of the grinding wheel of the corresponding cutting device. There are two sets of second pairs of cutting grooves 1022. These two sets are symmetrically arranged in the second direction and close to the outer edge of the connecting frame 102. Each set of second pairs of cutting grooves 1022 includes multiple second pairs of cutting grooves 1022 evenly spaced along the first direction. These multiple second pairs of cutting grooves 1022 correspond to the second connecting body 22a, that is, they correspond to the gap between two adjacent terminal assemblies 1 in the first direction. There are also multiple second pairs of cutting grooves 1022 corresponding to the fourth connecting body 24. The second pairs of cutting grooves 1022 in the two sets are arranged one-to-one in the second direction. The straight path between two corresponding second pairs of cutting grooves 1022 is constructed as a second cutting path 302. The width of the second cutting path 302 is equal to the width of the second pair of cutting grooves 1022 and equal to the width of the grinding wheel of the corresponding cutting device. After the LED chip is packaged onto the LED bracket structure, the connecting portion 2 and the waste portion 4 are the waste materials that need to be removed. That is, the spacing between two adjacent terminal assemblies 1 is equal to the width of the corresponding cutting groove. After the LED chip is packaged onto the LED bracket structure, the grinding wheel of the cutting equipment is aligned with the first cutting groove 1021 and cuts off the corresponding connecting portion 2 and the waste portion 4 located in the first cutting groove 301 along the first cutting path 301. Then, the grinding wheel of the cutting equipment is aligned with the second cutting groove 1022 and cuts off the corresponding connecting portion 2 and the waste portion 4 located in the second cutting path 302 along the second cutting path 302 to obtain multiple packaged LED bracket units. The number of LED bracket units obtained is the same as the number of terminal assemblies 1. Figures 11 to 14 The LED chip is not shown in the LED bracket unit shown.

[0059] In some preferred embodiments, the processing method of the LED bracket structure of this utility model includes steps S11 to S16:

[0060] Step S11: Provide a metal sheet.

[0061] As an example, the metal sheet can be a copper sheet.

[0062] Step S12 involves etching the metal plate to form a terminal plate 100. The terminal plate 100 includes at least one terminal unit 101. Each terminal unit 101 includes a plurality of terminal assemblies 1 arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction. Each terminal assembly 1 includes two conductive terminals 11 spaced apart along the first direction. Each conductive terminal 11 is connected to an adjacent conductive terminal 11 in an adjacent terminal assembly 1 via a connecting portion 2. In this embodiment, etching is used to form the terminal plate 100, improving processing efficiency.

[0063] In one embodiment, the metal sheet has a sixth surface and a seventh surface disposed opposite to each other in a third direction. Step S12 specifically includes steps S121 to S124:

[0064] Step S121: A first photosensitive adhesive layer is formed on the sixth surface, a second photosensitive adhesive layer is formed on the seventh surface, and the first and second photosensitive adhesive layers are printed and exposed.

[0065] The first photosensitive emulsion layer completely covers the sixth surface, and the second photosensitive emulsion layer completely covers the seventh surface. During printing exposure, the preset pattern is printed onto the first and second photosensitive emulsion layers using methods such as laser printing. After exposure, the first and second photosensitive emulsion layers undergo photodegradation.

[0066] Step S122: Develop the first and second photosensitive layers after printing exposure to form patterned grooves, exposing the sixth and seventh surfaces that need to be etched.

[0067] In one implementation, a developer can be used to clean and remove the unexposed first and second photosensitive adhesive layers, forming patterned grooves on the first and second photosensitive adhesive layers. The areas of the metal plate to be etched are exposed in the patterned grooves, while the areas of the metal plate not to be etched are masked by either the first or second photosensitive adhesive layer. As an example, the developer can be a Na2CO3 solution, etc.

[0068] Step S123: Etch the metal plate area exposed in the patterned groove to form the terminal plate 100.

[0069] In one embodiment, the unetched sixth surface includes the first surface 1151, that is, the sixth surface that is still covered by the first photosensitive emulsion layer after development includes the first surface 1151. The unetched seventh surface includes the third surface 1161, that is, the seventh surface that is still covered by the second photosensitive emulsion layer after development includes the third surface 1161. In this embodiment, the sixth surface on the metal plate corresponding to the terminal assembly 1 and the connecting portion 2 is not etched, the seventh surface on the metal plate corresponding to the protrusion 116 is not etched, while the seventh surface on the metal plate corresponding to the connecting portion 2 and the terminal assembly 1 excluding the protrusion 116 is etched, so that the thickness of the metal plate in the third direction corresponding to the area of ​​the connecting portion 2 and the terminal assembly 1 excluding the protrusion 116 is reduced by half. Please refer to [reference needed]. Figure 5 and Figure 6 The area corresponding to the branch channel on the metal plate is completely etched away to form a through hole 1023 penetrating the metal plate in the third direction. The sixth surface of the area corresponding to the main channel on the metal plate is etched while the seventh surface of the area corresponding to the main channel on the metal plate is not etched, so that the thickness of the area corresponding to the main channel in the third direction is reduced by half to form a groove 1024, making the plastic easier to flow during injection molding.

[0070] In this embodiment, the terminal assembly 1, excluding the protrusion 116, includes a body 115 and a connecting arm 117. The ratio of the thickness of the body 115 in the third direction to the thickness of the protrusion 116 in the third direction is 1:1. The thickness of the connecting arm 117 in the third direction is equal to the thickness of the body 115 in the third direction. The thickness of the connecting portion 2 in the third direction is equal to the thickness of the body 115 in the third direction. This ensures the strength of the terminal plate 100, simplifies the processing technology, and reduces processing costs.

[0071] In one implementation, the metal sheet can be immersed in an etching solution for etching. As an example, the etching solution can be acidic copper chloride, etc. Alternatively, a spray etching machine can be used to etch the metal sheet.

[0072] Step S124: Remove the remaining photosensitive adhesive layer on the metal plate.

[0073] As an example, NaOH solution can be used to remove the remaining photosensitive adhesive layer.

[0074] It should be noted that in other embodiments, terminal plates 100 can also be formed by mechanical engraving, stamping, or other methods, which can be set according to the actual situation and will not be elaborated here.

[0075] In step S13, the terminal plate 100 is injection molded as an insert to form an insulating plate 200, resulting in an LED bracket structure including the terminal plate 100 and the insulating plate 200. The insulating plate 200 includes multiple insulating bases 3, which are arranged one-to-one with the terminal assemblies 1. The insulating bases 3 cover the corresponding terminal assemblies 1 to insulate the two conductive terminals 11. Each conductive terminal 11 has its two ends exposed on the insulating base 3 in a third direction, which is perpendicular to the first and second directions.

[0076] Step S14: Electroplating is performed on the first surface 1151 and the third surface 1161 to plate gold or silver and other metals to improve the conductivity, bonding performance and stability of the conductive terminal 11.

[0077] Step S15: The LED chip is encapsulated in the LED bracket structure, and the LED chip is set up in a one-to-one correspondence with the terminal assembly 1.

[0078] As one implementation method, the LED chip adopts the POB (Package on Board) packaging method, in which the LED chip is directly fixed on the corresponding terminal assembly 1 and insulating base 3, and the LED chip is encapsulated by means such as dispensing.

[0079] Step S16: Cut off the connecting part 2 and the waste part 4 to obtain multiple packaged LED bracket units.

[0080] In one implementation, after encapsulating the LED chip onto the LED bracket structure, the grinding wheel of the cutting equipment is aligned with the first pair of cutting grooves 1021 and cuts off the corresponding connecting portion 2 and the waste portion 4 located within the first cutting groove 301 along the first cutting path 301. Then, the grinding wheel of the cutting equipment is aligned with the second pair of cutting grooves 1022 and cuts off the corresponding connecting portion 2 and the waste portion 4 located within the second cutting path 302 along the second cutting path 302 to obtain multiple encapsulated LED bracket units. It should be noted that the cutting equipment in this embodiment is prior art and will not be described in detail here.

[0081] It should be noted that in other embodiments, the LED bracket structure in this utility model embodiment can also be obtained by other processing methods, which can be set according to the actual situation, and will not be elaborated here.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED support structure, characterized by, include: A terminal block includes at least one terminal unit, the terminal unit including a plurality of terminal assemblies arranged in a rectangular array along a first direction and a second direction perpendicular to the first direction, each terminal assembly including two conductive terminals spaced apart in the first direction, and each conductive terminal being connected to an adjacent conductive terminal in an adjacent terminal assembly via a connecting portion. and An insulating plate is used to cover the terminal assembly to insulate the two conductive terminals. In this embodiment, each of the conductive terminals has its two ends exposed on the insulating plate in a third direction, which is perpendicular to the first direction and the second direction.

2. The LED support structure of claim 1, wherein, The two conductive terminals are a first conductive terminal and a second conductive terminal. The connecting part includes a first connecting body, a second connecting body and a third connecting body. The first connecting body connects two adjacent first conductive terminals in two adjacent terminal assemblies. The second connecting body connects two adjacent first conductive terminals and two adjacent second conductive terminals in two adjacent terminal assemblies. The third connecting body connects two adjacent second conductive terminals in two adjacent terminal assemblies.

3. The LED support structure of claim 1, wherein, The two conductive terminals are a first conductive terminal and a second conductive terminal. The first conductive terminal and the second conductive terminal are centrally symmetrical about the central axis of the terminal assembly, and the central axis extends along the third direction.

4. The LED support structure of claim 1, wherein, The conductive terminal includes: The body has a first surface and a second surface disposed opposite to each other on the third side, the first surface of the body being used to connect an LED chip; A protrusion, protruding from the second surface, the protrusion having a third surface in a third direction away from the second surface, the third surface being used to connect to a drive circuit board; and A connecting arm connects the body and the connecting part.

5. The LED support structure of claim 4, wherein, The insulating plate has a fourth surface and a fifth surface disposed opposite to each other in the third direction, the fourth surface being located on the same plane as the first surface, and the fifth surface being located on the same plane as the third surface.

6. The LED support structure of claim 1, wherein, The thickness of the insulating plate in the third direction is equal to the thickness of the conductive terminal in the third direction.

7. The LED support structure of claim 1, wherein, The terminal block also includes a connecting frame surrounding the terminal unit, the connecting frame being connected to the adjacent conductive terminal via the connecting portion.

8. The LED support structure of claim 7, wherein, The terminal block includes multiple terminal units arranged in a rectangular array along the first direction and the second direction, and two adjacent terminal units are connected together by the connecting frame.

9. The LED support structure of claim 7, wherein, The connecting frame has multiple tool-setting slots arranged around the terminal unit. The multiple tool-setting slots are arranged along the first direction and the second direction and are located on the same straight line as the corresponding connecting part.

10. The LED support structure of claim 1, wherein, The insulating plate is an integrally molded injection molded part. The insulating plate includes multiple insulating bases connected together by a waste section. The insulating bases are arranged in a one-to-one correspondence with the terminal assemblies. The insulating bases cover the corresponding terminal assemblies to insulate the two conductive terminals.

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