Chip pickup head, transfer device and display device repair system

Abstract

The utility model relates to a chip pick-up head, a transfer device and a display device repair system, and the chip pick-up head comprises a mounting seat which is driven by an external movement mechanism to move; the adsorption head is arranged on the mounting seat in a lifting and sliding manner, and the adsorption head is communicated with an external positive and negative pressure device; the pressure sensing piece is installed on the installation base, and the adsorption head is connected with the measuring end of the pressure sensing piece. According to the chip pickup device, the pressure applied to the chip by the adsorption head is measured through the pressure sensing piece, so that damage to the chip and the adsorption head caused by too large pressure is avoided, the situation of infirm adsorption is also avoided, the chip pickup stability is improved, and the chip pickup effect is optimized.

Description

Technical Field

[0001] This application relates to the field of chip pickup technology, and in particular to a chip pickup head, a transfer device, and a display device repair system. Background Technology

[0002] MicroLED (micro-light-emitting diode) display devices are widely used due to their advantages such as small size, low power consumption, high brightness, high color saturation, fast response, and long lifespan. To improve the yield of MicroLED display devices, the current manufacturing process involves precise addressing detection and repair of the LED chips after transfer, eliminating any non-displayable chips and thus improving the overall yield.

[0003] Chips to be transferred are typically arranged in batches on a spare substrate. When a defective area of ​​the panel to be repaired needs to be fixed, the chip is picked up from the spare substrate and then transferred to the defective area on the substrate to be repaired. Generally, the chip is picked up using methods such as adhesive bonding, adsorption, or magnetism. After picking up the chip, it is placed at the defective area and fixed in place.

[0004] In related technologies, a motion mechanism or robotic arm drives the adsorption head to move, and negative pressure is applied to the adsorption head to adsorb and pick up the chip, thereby realizing the transfer of the chip.

[0005] Because of the small size of the chip, during the chip picking process, it is necessary to ensure that the adsorption surface of the adsorption head is in close contact with the chip surface to avoid gaps between the adsorption head and the chip, thus ensuring stable adsorption of the chip.

[0006] However, directly pressing down on the adsorption head and controlling its descent height to ensure it adheres tightly to the chip can lead to varying pressures on different chips due to slight height differences. This can result in excessive pressure damaging both the chip and the adsorption head, as well as weak chip adhesion and poor chip pickup performance. Utility Model Content

[0007] This application provides a chip pickup head, a transfer device, and a display device repair system to solve the technical problems in the related art where it is difficult to control the pickup head to press the chip with a specified pressure when picking up the chip, which can easily cause damage to the chip and the pickup head, as well as the chip not being firmly attached, resulting in poor chip pickup effect.

[0008] In a first aspect, a chip pickup head is provided, comprising:

[0009] The mounting base is moved by an external motion mechanism;

[0010] An adsorption head is slidably and vertically mounted on the mounting base, and the adsorption head is connected to an external positive and negative pressure device.

[0011] A pressure sensor is mounted on the mounting base, and the adsorption head is connected to the measuring end of the pressure sensor.

[0012] In some embodiments, the chip pickup head further includes a sliding seat, which is slidably mounted on the mounting base, the suction head is mounted on the sliding seat, and the sliding seat is connected to the measuring end of the pressure sensor.

[0013] In some embodiments, the chip pickup head further includes a connecting rod arranged horizontally, the adsorption head being fixed to one end of the connecting rod, and the end of the connecting rod away from the adsorption head being fixed to the sliding seat.

[0014] In some embodiments, the chip pickup head further includes an elastic element that connects the adsorption head and the mounting base, the elastic force of which counteracts part or all of the weight of the load-bearing component.

[0015] In some embodiments, the adsorption head comprises a glass needle.

[0016] In some embodiments, the inner diameter of the tip of the glass needle includes 5-15 micrometers.

[0017] The beneficial effects of the technical solution provided in this application include:

[0018] This application provides a chip pickup head. When picking up a chip, the adsorption head descends, bringing it into contact with the chip surface. As the adsorption head descends further, it presses firmly against the chip. Simultaneously, the adsorption head rises relative to a pressure sensor, pushing against the measuring end of the pressure sensor. Therefore, the pressure sensor measures the pressure applied to the chip by the adsorption head, ensuring that the adsorption head applies the required pressure to the chip, thus ensuring stable chip adsorption and guaranteeing chip transfer accuracy. Furthermore, using pressure measurement to control the descent distance of the adsorption head avoids applying excessive pressure to the chip, which could damage both the chip and the adsorption head, and also prevents the adsorption head from failing to adhere firmly to the chip, thereby improving the chip pickup effect of the adsorption head.

[0019] Secondly, a chip transfer apparatus is provided, including the chip pick-up head as described above.

[0020] In some embodiments, the chip transfer apparatus further includes:

[0021] Transfer rack;

[0022] A transfer drive assembly is mounted on the transfer frame, and the chip pickup head is mounted on the drive end of the transfer drive assembly. The transfer drive assembly drives the chip pickup head to move in the up-down, left-right, and front-back directions.

[0023] In some embodiments, the chip transfer device further includes a visual calibration element mounted on the drive end of the transfer drive element. The visual calibration element moves together with the chip pickup head, and the imaging direction of the visual calibration element is arranged vertically.

[0024] Another embodiment of this application provides a chip transfer device. Since the chip transfer device includes the chip pickup head described above, the beneficial effects of the chip transfer device are the same as those of the chip pickup head described above, and will not be repeated here.

[0025] Thirdly, a display device repair system is provided, including the chip pickup head as described above, and / or the chip transfer device as described above.

[0026] Another embodiment of this application provides a display device repair system. Since the display device repair system includes the chip pickup head and / or chip transfer device as described above, the beneficial effects of the display device repair system are consistent with the beneficial effects of the chip pickup head and chip transfer device described above, and will not be repeated here. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of a chip pickup head provided in an embodiment of this application;

[0029] Figure 2 A schematic diagram from another perspective of the chip pickup head provided in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of a chip transfer apparatus provided in another embodiment of this application.

[0031] In the diagram: 1. Mounting base; 2. Adsorption head; 3. Pressure sensor; 4. Sliding seat; 5. Connecting rod; 6. Elastic element; 7. Transfer frame; 8. Transfer drive assembly. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] This application provides a chip pickup head, a transfer device, and a display device repair system. The chip pickup head uses a pressure sensor to measure the pressure applied to the chip by the adsorption head, thus avoiding damage to both the chip and the adsorption head due to excessive pressure, and preventing weak adsorption, thereby improving the stability of chip pickup. This application solves the technical problems in related technologies where it is difficult to control the adsorption head to press the chip firmly at a specified pressure, easily causing damage to the chip and the adsorption head, as well as weak chip adsorption, resulting in poor chip pickup performance.

[0034] Reference Figure 1 and Figure 2 A chip pickup head includes a mounting base 1, an adsorption head 2, and a pressure sensor 3. Both the adsorption head 2 and the pressure sensor 3 are mounted on the mounting base 1. The mounting base 1 is driven by an external motion mechanism to move the adsorption head 2. The adsorption head 2 is used to adhere to the chip surface and adsorb and pick up the chip. The pressure sensor 3 is used to measure the pressure applied to the chip by the adsorption head 2, thereby controlling the pressure applied to the chip by the adsorption head 2 to a set process pressure.

[0035] This configuration allows the adsorption head 2 to descend during chip pickup, bringing it into contact with the chip surface. As it descends further, the adsorption head 2 presses firmly against the chip. Simultaneously, the adsorption head 2 rises relative to the pressure sensor 3, pushing against its measuring end. Therefore, the pressure sensor 3 measures the pressure applied to the chip by the adsorption head 2, ensuring the necessary pressure is applied and guaranteeing stable chip adhesion and accurate chip transfer. Furthermore, using pressure measurement to control the descent distance of the adsorption head 2 avoids applying excessive pressure that could damage the chip and the adsorption head 2, and also prevents weak adhesion between the adsorption head 2 and the chip, thus optimizing the chip pickup performance of the adsorption head 2.

[0036] Reference Figure 1 and Figure 2 The adsorption head 2 is slidably mounted on the mounting base 1 and moves vertically to pick up the chip. When the adsorption head 2 descends to contact the chip, due to its slidable and lifting configuration, it does not collide hard with the chip, thus avoiding damage to both the chip and the adsorption head 2.

[0037] The adsorption head 2 is connected to an external positive and negative pressure device. By applying negative pressure to the adsorption head 2, the adsorption head 2 adsorbs and picks up the chip. By applying positive pressure to the adsorption head 2, the vacuum between the adsorption head 2 and the chip is broken by airflow and positive pressure, thereby separating the adsorption head 2 and the chip. The positive and negative pressure device may include a positive pressure air source and a negative pressure air source.

[0038] Reference Figure 1 and Figure 2 In this configuration, the pressure sensor 3 is fixed to the mounting base 1, and the adsorption head 2 is connected to the measuring end of the pressure sensor 3. As the adsorption head 2 presses down on the chip, the pressure sensor 3 measures the pressure applied to the chip. Specifically, the pressure sensor 3 includes a pressure sensor element 3.

[0039] With this configuration, changes in the position of the adsorption head 2 will act as pressure or tension on the pressure sensor 3, which then measures the pressure exerted by the adsorption head 2 on the chip. When picking up chips at different positions, the adsorption head 2 can be controlled to apply the same pressure to different chips. This prevents inconsistencies in pressure applied to different chips due to their different heights, thus improving pick-up consistency.

[0040] Reference Figure 1 and Figure 2 In this embodiment, the chip pickup head also includes a sliding seat 4, which is arranged on the mounting base 1 via a guide rail assembly. The adsorption head 2 is mounted on the sliding seat 4, and can move together with the sliding seat 4. The sliding seat 4 is connected to the measuring end of the pressure sensor 3, so that the adsorption head 2 is connected to the measuring end of the pressure sensor 3.

[0041] This arrangement of the sliding seat 4 provides an installation position for the adsorption head 2 and facilitates its raising, lowering, and sliding using the sliding seat 4. Furthermore, the adsorption head 2 is connected to the pressure sensor 3 via the sliding seat 4. The sliding seat 4 acts as a connection extension dock for the adsorption head 2, facilitating its connection to other structures, simplifying its own structure, and making the adsorption head 2, as a consumable, easier to manufacture and replace.

[0042] Reference Figure 1 and Figure 2 The chip pickup head also includes a connecting rod 5, which is arranged horizontally. The adsorption head 2 is fixed to one end of the connecting rod 5, and the end of the connecting rod 5 away from the adsorption head 2 is fixed to the sliding seat 4.

[0043] Specifically, the connecting rod 5 is fixed to the sliding seat 4 by bolts or welding, and the adsorption head 2 is fixed to the connecting rod 5 by plugging.

[0044] This arrangement, with the connecting rod 5 staggered horizontally between the two adsorption heads 2, ensures unobstructed access above the adsorption heads 2, making them easier to move to various positions and expanding their environmental adaptability for chip pickup. Furthermore, after placing the chip at the defect location on the substrate to be repaired, the adsorption heads 2 are used to press the chip firmly while simultaneously irradiating it with a laser for soldering. By staggering the adsorption heads 2 from the sliding base 4 and mounting base 1, interference between the sliding base 4, mounting base 1, and the laser is less likely to occur when the adsorption heads 2 place the chip.

[0045] The chip pickup head also includes an elastic element 6, which connects the adsorption head 2 and the mounting base 1. The elastic force of the elastic element 6 offsets part or all of the weight of the load-bearing components. Preferably, the elastic force of the elastic element 6 offsets all of the weight of the load-bearing components.

[0046] In this embodiment, the elastic element 6 elastically connects the sliding seat 4 and the mounting base 1, so that the adsorption head 2 is elastically connected to the mounting base 1. At this time, the negative pressure component of the elastic element 6 includes the sliding seat 4, the connecting rod 5, and the adsorption head 2.

[0047] With this configuration, due to the arrangement of the elastic element 6, the elastic force of the elastic element 6 balances the weight of its load components. At this time, the weight of the sliding seat 4, connecting rod 5 and suction head 2 no longer acts on the pressure sensor 3, avoiding the pressure sensor 3 being under stress for a long time, ensuring the accuracy of the pressure sensor 3, protecting the pressure sensor 3, and extending the service life of the pressure sensor 3.

[0048] In addition, the elastic force of the elastic element 6 constrains the position of the sliding seat 4, preventing the adsorption head 2 from rising and falling arbitrarily, thus ensuring the stability of chip transfer during the chip transfer process. Furthermore, it facilitates the determination of the height of the adsorption head 2, allowing for precise control of its lifting and lowering height.

[0049] In other embodiments, the adsorption head 2 is directly slidably disposed on the mounting base 1. In this case, the elastic member 6 directly connects the adsorption head 2 and the mounting base 1. In this case, the load component of the elastic member 6 includes the adsorption head 2.

[0050] In other embodiments, the adsorption head 2 is connected to the sliding seat 4, in which case the load component of the elastic element 6 includes the sliding seat 4 and the adsorption head 2.

[0051] In this embodiment, the elastic element 6 includes one or more of a spring, an elastic sheet, and an elastic block.

[0052] The adsorption head 2 includes a glass needle tube.

[0053] This design makes it easier to process the inner and outer diameters of the glass needle tip to be small, given that the chip size is at the micrometer level. Using a glass needle, it is easy to completely press the tip onto the chip and ensure the vacuum between the chip and the glass needle, thus meeting the adsorption and pickup requirements.

[0054] In addition, because the chips are closely arranged, when the glass needle is pressed down to pick up the chip, the glass needle is only pressed onto the designated chip surface. The surrounding chips are less likely to interfere with the downward pressure of the glass needle, thus ensuring that the chip is pressed tightly and picked up stably.

[0055] In this embodiment, the inner diameter of the glass needle tip ranges from 5 to 15 micrometers, which can meet the pickup requirements of chips of different sizes.

[0056] This application provides a chip pickup head. When picking up a chip, the adsorption head 2 descends, bringing it into contact with the chip surface. As the adsorption head 2 descends further, it presses firmly against the chip. Simultaneously, the adsorption head 2 rises relative to the pressure sensor 3, pushing against its measuring end. Therefore, the pressure sensor 3 measures the pressure applied to the chip by the adsorption head 2, ensuring that the adsorption head 2 applies the required pressure, thus ensuring stable chip adsorption and guaranteeing chip transfer accuracy. Furthermore, using pressure measurement to control the descent distance of the adsorption head 2 avoids applying excessive pressure to the chip, which could damage both the chip and the adsorption head 2, and also prevents the adsorption head 2 from failing to adhere firmly to the chip, thereby improving the chip pickup effect of the adsorption head 2.

[0057] Reference Figure 3 Another embodiment of this application provides a chip transfer apparatus, including a chip pickup head as described above.

[0058] Reference Figure 3 The chip transfer device also includes a transfer frame 7 and a transfer drive assembly 8. The transfer drive assembly 8 is mounted on the transfer frame 7, and the chip pickup head is mounted on the drive end of the transfer drive assembly 8. The transfer drive assembly 8 drives the chip pickup head to move in the up-down, left-right, and front-back directions.

[0059] Specifically, the chip pickup head mounting base 1 is installed on the driving end of the transfer driving assembly 8, so that the adsorption head 2 is driven by the transfer driving assembly 8 to move in multiple directions. In this embodiment, the transfer driving assembly 8 is composed of multiple linear modules. Preferably, the transfer driving assembly 8 is composed of three linear modules, and the driving directions of the three linear modules are up and down, left and right, and front and back, respectively.

[0060] Specifically, the linear module includes a lead screw mechanism or a linear motor.

[0061] With this configuration, driven by the transfer drive component 8, the adsorption head 2 is moved to various positions, causing the pick-up head to descend, press, and pick up the chip, transferring it to the defect location on the substrate to be repaired, and pressing the chip firmly at the defect location. This achieves fully automated chip transfer.

[0062] The chip transfer device also includes a visual calibration component (not shown in the figure). The visual calibration component is installed on the drive end of the transfer drive assembly 8. The visual calibration component moves together with the chip pickup head, and the imaging direction of the visual calibration component is arranged vertically.

[0063] Specifically, the position of the visual calibration element remains unchanged from the position of the adsorption head 2 of the chip pickup head. Therefore, the position of the adsorption head 2 can be determined using the position of the visual calibration element. The position of the visual calibration element is determined by capturing calibration points on the substrate surface, thus revealing the position of the adsorption head 2. This allows for convenient and precise movement of the adsorption head 2.

[0064] In this embodiment, the visual calibration device includes a camera or a combination of multiple cameras.

[0065] Another embodiment of this application provides a chip transfer device. Since the chip transfer device includes the chip pickup head described above, the beneficial effects of the chip transfer device are the same as those of the chip pickup head described above, and will not be repeated here.

[0066] Another embodiment of this application provides a display device repair system, including a chip pickup head as described above, and / or a chip transfer device as described above.

[0067] Another embodiment of this application provides a display device repair system. Since the display device repair system includes the chip pickup head and / or chip transfer device as described above, the beneficial effects of the display device repair system are consistent with the beneficial effects of the chip pickup head and chip transfer device described above, and will not be repeated here.

[0068] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0069] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0070] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A chip pick-up head, characterized by It includes: The mounting base is moved by an external motion mechanism; An adsorption head is slidably and vertically mounted on the mounting base, and the adsorption head is connected to an external positive and negative pressure device; A pressure sensor is mounted on the mounting base, and the adsorption head is connected to the measuring end of the pressure sensor.

2. The chip pick-up head according to claim 1, wherein It also includes a sliding seat, which is slidably mounted on the mounting base, the suction head is mounted on the sliding seat, and the sliding seat is connected to the measuring end of the pressure sensor.

3. The chip pick-up head according to claim 2, wherein It also includes a connecting rod, which is arranged horizontally. The adsorption head is fixed to one end of the connecting rod, and the end of the connecting rod away from the adsorption head is fixed to the sliding seat.

4. The chip pick-up head according to any one of claims 1 to 3, characterized in that It also includes an elastic element that connects the adsorption head and the mounting base, the elastic force of which counteracts part or all of the weight of the load-bearing component.

5. The chip pick-up head of claim 1, wherein The adsorption head includes a glass needle tube.

6. The chip pick-up head according to claim 5, wherein The inner diameter of the tip of the glass needle tube ranges from 5 to 15 micrometers.

7. A chip transfer apparatus characterized by comprising: Includes the chip pickup head as described in any one of claims 1 to 6.

8. The chip transfer apparatus according to claim 7, wherein Also includes: Transfer rack; A transfer drive assembly is mounted on the transfer frame, and the chip pickup head is mounted on the drive end of the transfer drive assembly. The transfer drive assembly drives the chip pickup head to move in the up-down, left-right, and front-back directions.

9. The chip transfer apparatus according to claim 8, wherein It also includes a visual calibration component, which is installed on the driving end of the transfer driving component. The visual calibration component moves together with the chip pickup head, and the imaging direction of the visual calibration component is arranged vertically.

10. A display device repair system characterized by comprising: It includes a chip pickup head as described in any one of claims 1 to 6, and / or a chip transfer device as described in any one of claims 7 to 9.

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