Slurry etching machine
By introducing a cleaning frame, air blowing mechanism, and filtration circulation system into the slurry etching machine, the problem of incomplete cleaning of ceramic copper-clad substrates has been solved, achieving a comprehensive and efficient cleaning effect, and improving product quality and production safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI TAOXINKE SEMICON NEW MATERIALS CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-04-24
AI Technical Summary
Existing slurry etching equipment uses a single immersion or spray cleaning method, which makes it difficult to achieve comprehensive and efficient cleaning of ceramic copper-clad substrates. This results in poor cleaning of stubborn impurities and residual slurry, affecting the cleanliness of the substrate surface and the accuracy of subsequent circuit processing.
A slurry etching machine was designed, comprising a cleaning frame, an air blowing mechanism, filter holes, a drive structure, a filtration circulation system, and temperature and liquid sensors. The drive structure moves the cleaning frame, and the air blowing mechanism and filter hole design enable all-round cleaning. The filtration circulation system ensures the cleanliness of the cleaning solution. The temperature sensor works in conjunction with the heating and cooling devices, and the liquid level and concentration sensors monitor and regulate the state of the cleaning solution in real time.
It enables comprehensive and multi-angle cleaning of ceramic copper-clad substrates, ensuring the cleanliness of the cleaning solution and the appropriate temperature and concentration, thereby improving the cleaning effect, reducing equipment operation and maintenance costs, reducing the risk of production accidents, and improving product quality and production efficiency.
Smart Images

Figure CN224157414U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of etching machine technology, specifically a slurry etching machine. Background Technology
[0002] In the field of electronics manufacturing, ceramic copper-clad substrates are widely used in key components such as power devices and hybrid integrated circuits due to their excellent electrical insulation properties, high thermal conductivity and good mechanical strength. In the production process of ceramic copper-clad substrates, the etching process is the key link that determines the circuit accuracy and product quality. As the core equipment, the performance of the paste etching machine directly affects the processing effect and production efficiency of the substrate.
[0003] Currently, most of the existing paste etching machines on the market adopt a single immersion or spray cleaning method. Immersion cleaning involves immersing the ceramic copper-clad substrate in the cleaning solution for a long time, relying on the dissolving effect of the cleaning solution to remove surface impurities. Spray cleaning uses a nozzle to spray the cleaning solution onto the substrate surface at a certain pressure to wash away impurities.
[0004] However, a single cleaning method is insufficient for comprehensive and efficient cleaning of ceramic copper-clad substrates. It is not effective in cleaning some stubborn impurities and residual slurry, which can easily lead to substandard substrate surface cleanliness, affecting the accuracy of subsequent circuit processing and product quality. Utility Model Content
[0005] To overcome the above-mentioned defects, this utility model provides a slurry etching machine, which solves the problem that a single cleaning method is difficult to achieve all-round and efficient cleaning of ceramic copper-clad substrates, and is not effective in cleaning some stubborn impurities and residual slurry, which can easily lead to the substrate surface cleanliness not meeting the standards, affecting the accuracy of subsequent circuit processing and product quality.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a slurry etching machine, comprising an etching machine body, the etching machine body including a control panel and a cleaning tank, a cleaning frame and a movable frame movably installed in the cleaning tank, the movable frame being located above the inner side of the cleaning frame, a material clamping frame placed at the bottom of the movable frame, the material clamping frame having multiple sets of clamping slots, an air blowing mechanism for use with the material clamping frame being provided in the cleaning tank, multiple sets of filter holes for use with the air blowing mechanism being provided at the bottom of the cleaning frame, a drive structure for use with the cleaning frame being installed in the etching machine body, a temperature sensor and a liquid sensor being provided in the cleaning tank, the liquid sensor including a liquid level sensor and a concentration sensor, the liquid level sensor and a liquid replenishment device being connected to the control panel.
[0007] As a further embodiment of this utility model: a protective cover is rotatably connected to the top of the cleaning tank, a sealing gasket is provided between the protective cover and the cleaning tank, an observation window and a handle are provided on the protective cover, and the protective cover is made of transparent acid and alkali resistant material.
[0008] As a further embodiment of this utility model: an air guide block is snapped to the outside of the cleaning pool, an air inlet pipe is connected to the outside of the air guide block, an exhaust block is provided on the inside of the air guide block, the exhaust block is located inside the cleaning pool and has a symmetrical structure, and multiple sets of air outlets are opened on the inside of the exhaust block to cooperate with the material clamping frame.
[0009] As a further embodiment of this utility model: the cleaning tank is provided with a movable groove for use with the movable frame, and a base is installed at the bottom of the etching machine body.
[0010] As a further embodiment of this utility model: a filtration and circulation system is provided outside the cleaning tank. The filtration and circulation system includes a circulation pump, a filter, and a connecting pipe. The circulation pump is connected to the bottom and top of the cleaning tank through the connecting pipe. The filter is installed on the connecting pipe, and the flow rate of the circulation pump can be adjusted by the control panel.
[0011] As a further embodiment of this utility model: the cleaning tank is equipped with a heating device and a cooling device. The temperature sensor is connected to the heating device and the cooling device, and the control panel includes a controller, a display screen and operation buttons. The controller is equipped with a timing module, and the control panel is equipped with an alarm module. The alarm module is connected to the temperature sensor, the liquid sensor and the timing module.
[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0013] 1. The cleaning frame is driven by a drive structure, and with the air blowing mechanism, filter holes and symmetrical air outlet design, it can achieve all-round and multi-angle cleaning of ceramic copper-clad substrates. It can effectively remove both impurities on the substrate surface and residual cleaning fluid. At the same time, the filtration circulation system ensures that the cleaning fluid is always clean. The temperature sensor works with the heating and cooling devices to maintain the optimal cleaning temperature. The liquid level and concentration sensors monitor and regulate the state of the cleaning fluid in real time. The cooperation of multiple systems enables each substrate to be cleaned efficiently and accurately, which greatly ensures product quality.
[0014] 2. The control panel integrates multiple functional modules. The timing module precisely controls the cleaning time, while the alarm module, linked to temperature and liquid sensors, immediately issues an alarm in case of abnormal temperature, low liquid level, or insufficient concentration, facilitating timely handling by operators and effectively preventing production accidents. Precise guidance of the movable tank and frame, an enhanced base for improved equipment stability, and a sealed protective cover design reduce the risk of equipment failure. Furthermore, the filtration and circulation system enables the recycling of cleaning fluid, reducing production costs. Overall, the system achieves intelligent and safe management, significantly reducing equipment maintenance costs. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the structure for removing the protective cover according to this utility model;
[0017] Figure 3 This is a first-view schematic diagram of the disassembled structure of this utility model;
[0018] Figure 4 This is a second-view schematic diagram of the split structure of this utility model.
[0019] In the diagram: 1. Etching machine body; 2. Control panel; 3. Cleaning tank; 4. Base; 5. Protective cover; 6. Air guide block; 7. Air inlet pipe; 8. Exhaust block; 9. Cleaning frame; 10. Material clamping frame; 11. Clamping slot; 12. Movable slot; 13. Movable frame; 14. Filter hole; 15. Connecting pipe; 16. Circulation pump. Detailed Implementation
[0020] The technical solution of this patent will be further described in detail below with reference to specific embodiments.
[0021] like Figures 1-4 As shown, this utility model provides a technical solution:
[0022] A slurry etching machine includes an etching machine body 1, which includes a control panel 2 and a cleaning tank 3. A cleaning frame 9 and a movable frame 13 are movably installed in the cleaning tank 3. The movable frame 13 is located above the inner side of the cleaning frame 9. A material clamping frame 10 is placed at the bottom of the movable frame 13. Multiple sets of clamping slots 11 are provided in the material clamping frame 10. An air blowing mechanism is provided in the cleaning tank 3 to cooperate with the material clamping frame 10. Multiple sets of filter holes 14 to cooperate with the air blowing mechanism are provided at the bottom of the cleaning frame 9. A drive structure to cooperate with the cleaning frame 9 is installed in the etching machine body 1. A temperature sensor and a liquid sensor are provided in the cleaning tank 3. The liquid sensor includes a liquid level sensor and a concentration sensor. The liquid level sensor and a liquid replenishment device are connected to the control panel 2.
[0023] Specifically, firstly, the ceramic copper-clad substrate is precisely and sequentially placed into multiple slots 11 within the clamping frame 10 to ensure stable placement and prevent displacement or collision damage during subsequent cleaning. After loading, the clamping frame 10 is placed stably at the bottom of the movable frame 13. The movable frame 13, containing the clamping frame 10, is then slowly placed into the cleaning frame 9 within the cleaning tank 3. The movable frame 13 is positioned above and inside the cleaning frame 9, preparing for subsequent cleaning. The drive structure within the etching machine body 1, used in conjunction with the cleaning frame 9, is activated via the control panel 2. This drive structure causes the cleaning frame 9 to oscillate up and down within the cleaning tank 3, ensuring the substrate fully contacts the cleaning solution for comprehensive cleaning. During the cleaning process, the air blowing mechanism within the cleaning tank 3 is activated. Gas passes through the clamping frame 10 and, in conjunction with the filter holes 14 at the bottom of the cleaning frame 9, blows onto the surface of the ceramic copper-clad substrate, effectively removing impurities and residual cleaning solution from the substrate surface and improving cleaning efficiency. In effect, the liquid level sensor and concentration sensor in the cleaning tank 3 work in real time. The liquid level sensor monitors the liquid level of the cleaning solution. When the liquid level is lower than the set value, it automatically sends a signal to the control panel 2. The control panel 2 controls the liquid replenishment device to replenish the liquid, ensuring that the cleaning solution always maintains a suitable liquid level. The concentration sensor monitors the concentration of the cleaning solution. When the concentration drops to a certain level and affects the cleaning effect, it also sends a signal to the control panel 2 to remind the staff to replace the cleaning solution or add relevant reagents. The temperature sensor monitors the temperature of the cleaning solution in the cleaning tank 3 in real time to ensure that the cleaning process is carried out at a suitable temperature to achieve the best cleaning effect. If the temperature is abnormal, it can be adjusted through the control panel 2. After the cleaning work is completed, the drive structure and the blowing mechanism are turned off through the control panel 2, and the movable frame 13 together with the material clamping frame 10 is taken out of the cleaning tank 3. The ceramic copper-clad substrate is carefully taken out from the material clamping frame 10 to complete the entire cleaning process.
[0024] A protective cover 5 is rotatably connected to the top of the cleaning tank 3. A sealing gasket is provided between the protective cover 5 and the cleaning tank 3. An observation window and a handle are provided on the protective cover 5. The protective cover 5 is made of transparent acid and alkali resistant material. An air guide block 6 is snapped to the outside of the cleaning tank 3. An air inlet pipe 7 is connected to the outside of the air guide block 6. An exhaust block 8 is provided inside the air guide block 6. The exhaust block 8 is located inside the cleaning tank 3 and has a symmetrical structure. Multiple sets of air outlets are opened inside the exhaust block 8 to cooperate with the material clamping frame 10.
[0025] Specifically, the top of the protective cover 5 is rotatably connected to the cleaning tank 3, and a sealing gasket is set between the cover and the cleaning tank 3. This effectively prevents the cleaning solution from splashing out during the cleaning process, avoids operators coming into contact with corrosive cleaning solutions, and ensures personnel safety. It also prevents the cleaning solution from evaporating, reduces the pollution of the working environment by chemical reagents, and prevents external impurities from falling into the cleaning tank 3, ensuring the purity of the cleaning solution. The protective cover 5 is made of transparent acid and alkali resistant material and is equipped with an observation window. Operators can directly observe the cleaning status of the ceramic copper-clad substrate in the cleaning tank 3 without opening the protective cover 5, such as the cleaning progress and whether there are any abnormalities. This allows for timely adjustment of cleaning parameters, improving cleaning efficiency and quality, while reducing the impact of frequent opening of the cover on the stability of the cleaning process. The handle on the protective cover 5 makes it easy for operators to open and close the protective cover 5, reducing the difficulty of operation, improving the convenience of use, and making the entire cleaning process smoother.
[0026] After cleaning, the height of the movable frame 13 is raised by the drive mechanism, so that the material frame 10 is removed from the cleaning liquid. Then, the air guide block 6 connected to the outside of the cleaning tank 3, together with the air inlet pipe 7, the exhaust block 8 and the air outlet, form a complete air blowing system. The exhaust block 8 has a symmetrical structure and multiple air outlets, which can make the gas blow evenly from all directions to the ceramic copper-clad substrate in the material frame 10, which can more comprehensively and efficiently remove impurities and residual cleaning liquid from the substrate surface and improve the cleaning effect.
[0027] Optionally, a set of air extraction structure can be set above the cleaning tank 3 inside the etching machine body 1 to facilitate the extraction of chemical gases when the auxiliary exhaust block 8 and the air outlet blow air onto the copper-clad ceramic substrate in the material frame 10.
[0028] The cleaning tank 3 has a movable slot 12 for use with the movable frame 13. The bottom of the etching machine body 1 is equipped with a base 4. The cleaning tank 3 is equipped with a filtration and circulation system, which includes a circulation pump 16, a filter and a connecting pipe 15. The circulation pump 16 is connected to the bottom and top of the cleaning tank 3 through the connecting pipe 15. The filter is installed on the connecting pipe 15, and the flow rate of the circulation pump 16 can be adjusted by the control panel 2. The cleaning tank 3 is equipped with a heating device and a cooling device. The temperature sensor is connected to the heating device and the cooling device and the control panel 2. The control panel 2 includes a controller, a display screen and operation buttons. The controller is equipped with a timing module. The control panel 2 is equipped with an alarm module. The alarm module is connected to the temperature sensor, the liquid sensor and the timing module.
[0029] Specifically, the movable groove 12 inside the cleaning tank 3 works in conjunction with the movable frame 13 to provide precise guidance and positioning for the movement of the movable frame 13 within the cleaning tank 3. This prevents the movable frame 13 from shifting or shaking during movement, ensuring the stability of the ceramic copper-clad substrate during cleaning and avoiding damage to the substrate due to instability of the movable frame 13. This ensures the safety and reliability of the cleaning work. The base 4 installed at the bottom of the etching machine body 1 provides stable support for the entire etching machine, reducing vibration during operation and improving equipment stability. The filtration and circulation system, through the circulation pump 16, filter, and connecting pipe 15, draws the cleaning solution from the bottom of the cleaning tank 3, removes impurities through the filter, and then returns it from the top of the cleaning tank 3, achieving the recycling of the cleaning solution. The continuously circulating and filtered cleaning solution remains relatively clean, ensuring that the ceramic copper-clad substrate is effectively cleaned in clean cleaning solution throughout the entire cleaning process. The flow rate of the circulation pump 16 can be adjusted via the control panel 2, allowing operators to flexibly adjust the flow rate according to the material and degree of contamination of the ceramic copper-clad substrate. The circulation flow rate of the cleaning solution, the heating and cooling devices installed in the cleaning tank 3, and the precise temperature control achieved through the control panel 2 under the real-time monitoring of the temperature sensor, allow for quick and accurate adjustment of the appropriate temperature to the cleaning solution, whether it is necessary to heat the cleaning solution to improve cleaning efficiency or cool the cleaning solution to prevent damage to the substrate due to excessive temperature. This provides the optimal temperature environment for cleaning the ceramic copper-clad substrate, ensuring the cleaning effect and substrate quality. The control panel 2 integrates a controller, display screen, operation buttons, timing module, and alarm module, and is closely connected to the temperature sensor and liquid sensor. The timing module can accurately time the cleaning time. When the preset cleaning time is reached, the alarm module issues a reminder to avoid the cleaning time being too long or too short, which would affect the substrate quality. Once the temperature sensor and liquid sensor detect abnormal temperature, low liquid level, or insufficient cleaning solution concentration, the alarm module immediately issues an alarm to remind the operator to handle the situation in time. This effectively prevents production accidents caused by equipment failure or abnormal parameters, improves the safety and reliability of equipment operation, and also allows operators to monitor the equipment operating status in real time, improving equipment management efficiency.
[0030] The working principle of this utility model is as follows:
[0031] First, the substrate is precisely inserted into the slot 11 of the material box 10 in sequence. Then, the material box 10 is placed at the bottom of the movable frame 13. Subsequently, the movable frame 13 together with the material box 10 is placed into the cleaning frame 9 in the cleaning tank 3. The drive structure is started through the control panel 2 to drive the cleaning frame 9 to move in the cleaning tank 3, so that the substrate is fully in contact with the cleaning liquid and the basic cleaning process is started.
[0032] Secondly, during the cleaning process, the air blowing mechanism is activated, and the gas passes through the material clamping frame 10 and works with the filter holes 14 at the bottom of the cleaning frame 9 to evenly blow air to assist in cleaning the substrate. The filtration and circulation system operates simultaneously, and the circulation pump 16 draws the cleaning liquid from the bottom of the cleaning tank 3, filters impurities through the filter, and sends it back from the top to realize the recycling of the cleaning liquid. The flow rate of the circulation pump 16 can be adjusted as needed. The temperature sensor monitors the temperature of the cleaning liquid in real time, and the control panel 2 controls the heating or cooling device based on the monitoring data to accurately adjust the temperature. The liquid level sensor and concentration sensor monitor the liquid level and concentration of the cleaning liquid in real time. When the liquid level is insufficient, the control panel 2 controls the liquid replenishment device to replenish the liquid, and when the concentration is insufficient, it reminds the user to replace or add reagents.
[0033] It is worth mentioning that the protective cover 5 is sealed to the cleaning tank 3 through a sealing gasket to prevent the cleaning liquid from splashing out, evaporating, and external impurities from entering. The transparent material and observation window allow operators to observe the cleaning process in real time. The handle makes it easy to open and close. After cleaning, the drive mechanism raises the movable frame 13, causing the material clamping frame 10 to detach from the cleaning liquid. The air blowing system, consisting of the air guide block 6, air inlet pipe 7, air outlet block 8, and air outlet, blows air onto the substrate from multiple directions to further remove residual impurities and liquid. If an air extraction structure is set, the chemical gases generated during the blowing process can also be extracted in time to ensure a safe working environment.
[0034] Finally, the movable tank 12 in the cleaning tank 3 cooperates with the movable frame 13 to precisely guide and position the movement of the movable frame 13; the bottom base 4 of the etching machine body 1 enhances the stability of the equipment; the control panel 2 integrates a controller, display screen, operation buttons, timing module and alarm module. The timing module accurately controls the cleaning time, and the alarm module promptly alarms when abnormal temperature, low liquid level, insufficient concentration and other situations occur, so that operators can keep abreast of the equipment status and deal with abnormalities in real time, ensuring the safe and reliable operation of the equipment.
[0035] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.
Claims
1. A paste etching machine, comprising an etching machine body (1), characterized in that: The etching machine body (1) includes a control panel (2) and a cleaning tank (3). A cleaning frame (9) and a movable frame (13) are movably installed in the cleaning tank (3). The movable frame (13) is located above the inner side of the cleaning frame (9). A material clamping frame (10) is placed at the bottom of the movable frame (13). Multiple sets of clamping slots (11) are opened in the material clamping frame (10). An air blowing mechanism is provided in the cleaning tank (3) to cooperate with the material clamping frame (10). Multiple sets of filter holes (14) are opened at the bottom of the cleaning frame (9) to cooperate with the air blowing mechanism. A drive structure is installed in the etching machine body (1) to cooperate with the cleaning frame (9). A temperature sensor and a liquid sensor are provided in the cleaning tank (3). The liquid sensor includes a liquid level sensor and a concentration sensor. The liquid level sensor and the liquid replenishment device are connected to the control panel (2).
2. The slurry etching machine according to claim 1, characterized in that: The top of the cleaning tank (3) is rotatably connected to a protective cover (5), and a sealing gasket is provided between the protective cover (5) and the cleaning tank (3). The protective cover (5) is provided with an observation window and a handle, and the protective cover (5) is made of transparent acid and alkali resistant material.
3. The slurry etching machine according to claim 2, characterized in that: An air guide block (6) is snapped to the outside of the cleaning tank (3). An air inlet pipe (7) is connected to the outside of the air guide block (6). An exhaust block (8) is provided inside the air guide block (6). The exhaust block (8) is located inside the cleaning tank (3) and has a symmetrical structure. Multiple sets of air outlets are opened inside the exhaust block (8) to cooperate with the material clamping frame (10).
4. The slurry etching machine according to claim 3, characterized in that: The cleaning tank (3) is provided with a movable slot (12) for use with the movable frame (13), and a base (4) is installed at the bottom of the etching machine body (1).
5. A slurry etching machine according to claim 4, characterized in that: The cleaning tank (3) is equipped with a filtration and circulation system. The filtration and circulation system includes a circulation pump (16), a filter and a connecting pipe (15). The circulation pump (16) is connected to the bottom and top of the cleaning tank (3) through the connecting pipe (15). The filter is installed on the connecting pipe (15), and the flow rate of the circulation pump (16) can be adjusted by the control panel (2).
6. A paste etching machine according to claim 5, characterized in that: The cleaning tank (3) is equipped with a heating device and a cooling device. The temperature sensor is connected to the heating device and the cooling device and the control panel (2). The control panel (2) includes a controller, a display screen and operation buttons. The controller is equipped with a timing module and the control panel (2) is equipped with an alarm module. The alarm module is connected to the temperature sensor, the liquid sensor and the timing module.