Grinding clamping mounting table

By designing a grinding clamping mounting stage with side clamping components and a clamping drive mechanism, the problem of unstable clamping in the prior art is solved, and reliable clamping of the wafer surface and edges is achieved, improving the stability and efficiency of the grinding process.

CN224158207UActive Publication Date: 2026-04-24SICHUAN HAICHENG CHUANGTE TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SICHUAN HAICHENG CHUANGTE TECHNOLOGY CO LTD
Filing Date
2025-05-23
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing technologies lack simple and reliable clamping and mounting equipment, making it difficult to meet the needs of wafer surface and edge polishing.

Method used

A grinding clamping mounting table including a side clamping assembly and a clamping drive mechanism was designed. The cylinder drives the slide bar and crossbeam to drive the clamping plate for synchronous clamping, and the thrust assembly ensures clamping stability.

Benefits of technology

It achieves reliable wafer clamping, ensures the stability and reliability of the polishing process, and improves the efficiency and quality of wafer processing.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224158207U_ABST
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Abstract

The utility model discloses a polishing clamping mounting table which comprises a lower mounting table, two first side plates fixed on the lower mounting table, an upper mounting platform arranged on the first side plates, a wafer mounting table fixed on the upper mounting platform and side clamping assemblies arranged on the upper mounting platform in a one-to-one correspondence mode. The clamping driving mechanism is linked with the side clamping assembly to act; the clamping driving mechanism comprises two second side plates fixed to the lower mounting table, a first air cylinder mounting table arranged on the second side plates, a first air cylinder fixed to the lower portion of the first air cylinder mounting table and penetrating through the first air cylinder mounting table, a connecting rod arranged on the first air cylinder and a cross beam with the middle in shaft connection with the connecting rod. Each side clamping assembly comprises a sliding sleeve arranged in the upper mounting platform in a sleeved mode, a coupling base fixed to the upper mounting platform, a sliding rod arranged in the sliding sleeve in a sleeved mode, a clamping plate connected with the top of the sliding rod in a coupled mode and a crank arm arranged between the coupling base and the clamping plate, wherein the lower portion of the sliding rod is connected with the end of the cross beam in a coupled mode.
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Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a grinding clamping mounting table. Background Technology

[0002] During wafer fabrication, the wafer surface needs to be polished. Additionally, in the wafer rounding process, the wafer shape is changed from non-circular to circular, or the edges are rounded to meet the requirements of subsequent processing or use. All of these processes require clamping the wafer to facilitate the polishing of its surface and edges. Currently, there are no corresponding clamping and mounting devices in the existing technology.

[0003] Therefore, there is an urgent need to propose a grinding clamping and mounting table with a simple structure and reliable clamping. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a grinding clamping mounting table. The technical solution adopted by this utility model is as follows:

[0005] A grinding clamping mounting stage for clamping a wafer includes a lower mounting stage, two first side plates fixed on the lower mounting stage, an upper mounting platform disposed on the first side plates, a wafer mounting stage fixed on the upper mounting platform, side clamping components disposed on the upper mounting platform and located on both sides of the wafer mounting stage, and a clamping drive mechanism disposed on the lower mounting stage and acting in conjunction with the side clamping components.

[0006] The clamping drive mechanism includes two second side plates fixed on the lower mounting platform, a first cylinder mounting platform set on the second side plates, a first cylinder fixed to the lower part of the first cylinder mounting platform and passing through the first cylinder mounting platform, a connecting rod set on the first cylinder, and a crossbeam axially connected to the connecting rod in the middle; the crossbeam is connected to the side clamping assembly.

[0007] The side clamping assembly includes a sliding sleeve fitted inside the upper mounting platform, a shaft connector fixed to the upper mounting platform, a sliding rod fitted inside the sliding sleeve and shaft-connected to the end of the crossbeam at its lower part, a clamping plate shaft-connected to the top of the sliding rod, and a crank arm disposed between the shaft connector and the clamping plate; the first cylinder drives the sliding rod to slide upward and drives the clamping plate to clamp the wafer.

[0008] Furthermore, a groove is provided on the side of the first side plate; the end of the crossbeam passes through the groove; the crossbeam slides along the groove.

[0009] Furthermore, a second wedge is provided between the first cylinder and the connecting rod; a thrust assembly is provided on the first cylinder mounting platform; the thrust assembly includes a second cylinder mounting seat, a rear support seat and a front support seat fixed on the first cylinder mounting platform, a second cylinder fixed on the second cylinder mounting seat, and a first wedge that passes through the front support seat and is connected to the second cylinder; a U-shaped groove is provided at the front end of the first wedge; the first wedge presses against the lower part of the second wedge; the second wedge is placed between the rear support seat and the front support seat.

[0010] Furthermore, the first side panel is provided with a front guard plate, a side guard plate, and a guard plate.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] (1) This utility model sets two side clamping components and a clamping drive mechanism, and uses the clamping drive mechanism to drive the two side clamping components to perform synchronous clamping, thereby ensuring the reliability of its clamping action.

[0013] (2) By setting a thrust-stop component, the present invention provides a thrust-stopping limit for the clamping drive mechanism after it is lifted, thereby ensuring stable and reliable clamping.

[0014] In summary, this utility model has the advantages of simple structure and reliable clamping, and has high practical and promotional value in the field of wafer processing technology. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural schematic diagram of the present invention from a first angle.

[0017] Figure 2 This is a structural schematic diagram of the present invention from a second angle.

[0018] Figure 3 This is a schematic diagram of the structure of this utility model after the side shields have been removed.

[0019] Figure 4 This is a schematic diagram of the clamping drive mechanism, side clamping assembly, and thrust assembly of this utility model.

[0020] Figure 5 This is a schematic diagram of the clamping drive mechanism of this utility model.

[0021] Figure 6 This is a partial structural schematic diagram of the clamping drive mechanism of this utility model.

[0022] Figure 7 This is a schematic diagram of the thrust-stopping component of this utility model.

[0023] In the above figures, the component names corresponding to the reference numerals are as follows:

[0024] 1. Lower mounting platform; 2. First side plate; 3. Front protective cover plate; 4. Side protective cover; 5. Protective cover plate; 6. Upper mounting platform; 7. Wafer mounting platform; 8. Side clamping assembly; 9. Thrust assembly; 21. Slide groove; 81. Sliding sleeve; 82. Sliding rod; 83. Shaft connector; 84. Crank arm; 85. Clamping plate; 91. Rear support seat; 92. Front support seat; 93. Second cylinder mounting seat; 94. Second cylinder; 95. First wedge; 951. U-shaped groove; 101. Second side plate; 102. First cylinder mounting platform; 103. First cylinder; 104. Second wedge; 105. Connecting rod; 106. Crossbeam. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0026] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0027] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0028] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0029] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0030] like Figures 1 to 7 As shown, this embodiment provides a grinding and clamping mounting stage for clamping wafers. Specifically, the grinding and clamping mounting stage includes a lower mounting stage 1, two first side plates 2 fixed on the lower mounting stage 1, a front protective plate 3, a side protective plate 4, and a protective plate 5 disposed on the first side plates 2, an upper mounting platform 6 disposed on the first side plates 2, a wafer mounting stage 7 fixed on the upper mounting platform 6, side clamping assemblies 8 correspondingly disposed on the upper mounting platform 6 and positioned on both sides of the wafer mounting stage 7, and a clamping drive mechanism disposed on the lower mounting stage 1 and acting in conjunction with the side clamping assemblies 8. A sliding groove 21 is provided on the side of the first side plate 2, and the end of the crossbeam 106 of the clamping drive mechanism passes through the sliding groove 21, allowing the crossbeam 106 to slide along the sliding groove 21.

[0031] In this embodiment, the clamping drive mechanism includes two second side plates 101 fixed on the lower mounting platform 1, a first cylinder mounting platform 102 disposed on the second side plates 101, a first cylinder 103 fixed to the lower part of the first cylinder mounting platform 102 and passing through the first cylinder mounting platform 102, a connecting rod 105 disposed on the first cylinder 103, a second wedge block 104 disposed between the first cylinder 103 and the connecting rod 105, and a crossbeam 106 axially connected to the connecting rod 105 in the middle. The crossbeam 106 is connected to the side clamping assembly 8. In this embodiment, the first cylinder 103 drives the crossbeam 106 to slide along the slide groove 21.

[0032] In this embodiment, the side clamping assembly 8 includes a sliding sleeve 81 fitted inside the upper mounting platform 6, a shaft connector 83 fixed on the upper mounting platform 6, a sliding rod 82 fitted inside the sliding sleeve 81 and shaft-connected at its lower part to the end of the crossbeam 106, a clamping plate 85 shaft-connected to the top of the sliding rod 82, and a crank arm 84 disposed between the shaft connector 83 and the clamping plate 85. The first cylinder 103 drives the sliding rod 82 to slide upwards, thereby causing the clamping plate 85 to clamp the wafer.

[0033] After the clamping plate 85 clamps the object, to prevent the clamping plate 85 from loosening, this embodiment uses a thrust-stop assembly 9 for thrust support. The thrust-stop assembly 9 includes a second cylinder mounting seat 93, a rear support seat 91, and a front support seat 92 fixed on the first cylinder mounting platform 102; a second cylinder 94 fixed on the second cylinder mounting seat 93; and a first wedge 95 that passes through the front support seat 92 and is connected to the second cylinder 94. The front end of the first wedge 95 has a U-shaped groove 951. After the first cylinder 103 lifts the second wedge 104, the first wedge 95 presses against the lower part of the second wedge 104. When release is required, the second cylinder 94 drives the first wedge 95 to retract, allowing the first cylinder 103 to retract and release the clamping plate 85.

[0034] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. A grinding and clamping mounting stage for clamping wafers, characterized in that, It includes a lower mounting platform (1), two first side plates (2) fixed on the lower mounting platform (1), an upper mounting platform (6) set on the first side plates (2), a wafer mounting platform (7) fixed on the upper mounting platform (6), side clamping components (8) set on the upper mounting platform (6) and placed on both sides of the wafer mounting platform (7), and a clamping drive mechanism set on the lower mounting platform (1) and linked to the side clamping components (8). The clamping drive mechanism includes two second side plates (101) fixed on the lower mounting platform (1), a first cylinder mounting platform (102) set on the second side plate (101), a first cylinder (103) fixed to the lower part of the first cylinder mounting platform (102) and passing through the first cylinder mounting platform (102), a connecting rod (105) set on the first cylinder (103), and a crossbeam (106) axially connected to the connecting rod (105) in the middle; the crossbeam (106) is connected to the side clamping assembly (8); The side clamping assembly (8) includes a sliding sleeve (81) fitted inside the upper mounting platform (6), a shaft connector (83) fixed on the upper mounting platform (6), a sliding rod (82) fitted inside the sliding sleeve (81) and shaft-connected to the end of the crossbeam (106) at its lower part, a clamping plate (85) shaft-connected to the top of the sliding rod (82), and a crank arm (84) disposed between the shaft connector (83) and the clamping plate (85); the first cylinder (103) drives the sliding rod (82) to slide upward and drives the clamping plate (85) to clamp the wafer.

2. The grinding clamping mounting table according to claim 1, characterized in that, The first side plate (2) has a sliding groove (21) on its side; the end of the crossbeam (106) is provided through the sliding groove (21); the crossbeam (106) slides along the sliding groove (21).

3. A grinding clamping mounting table according to claim 1, characterized in that, A second wedge (104) is provided between the first cylinder (103) and the connecting rod (105); a thrust assembly (9) is provided on the first cylinder mounting platform (102); the thrust assembly (9) includes a second cylinder mounting seat (93), a rear support seat (91) and a front support seat (92) fixed on the first cylinder mounting platform (102), a second cylinder (94) fixed on the second cylinder mounting seat (93), and a first wedge (95) that passes through the front support seat (92) and is connected to the second cylinder (94); a U-shaped groove (951) is provided at the front end of the first wedge (95); the first wedge (95) presses against the lower part of the second wedge (104); the second wedge (104) is placed between the rear support seat (91) and the front support seat (92).

4. A grinding clamping mounting table according to claim 1, characterized in that, The first side plate (2) is provided with a front guard plate (3), a side guard plate (4) and a guard plate (5).