Chip transmission track device with self-cleaning function

Abstract

The utility model discloses a chip transmission track device with a self-cleaning function, and relates to the technical field of chip transmission. Comprising a mounting support, a conveying belt used for chip transmission is arranged in the mounting support, a guide mechanism used for chip transmission is arranged on the mounting support, and the distance between two sets of second guide plates is adjusted through a first electric push rod, so that transmission guide of chips with different widths can be flexibly adapted; the universality and applicability of the device are improved, subsequent processing of conveyed chips is facilitated, then two sets of guide plates are arranged, the first guide plate is always in an open structure, the conveyed chips can enter the second guide plate better, only the second guide plate needs to be adjusted, the two sets of guide plates are prevented from being opened and closed synchronously, and the production efficiency is improved. The opening of the first guide plate is reduced, the chip is conveyed, and the guide roller shaft adopts a rolling contact mode, so that the abrasion risk of the side edge of the chip is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip transmission technology, specifically a chip transmission track device with self-cleaning function. Background Technology

[0002] In the semiconductor industry, the transfer and handling of semiconductor chip materials is a crucial process. Traditional semiconductor transfer devices mainly use suction tubes and rubber nozzles to pick up semiconductor materials from the conveyor belt and then transport them to the placement board using a linear module. After that, operators can directly transfer the placement board to avoid damage to the semiconductor chip materials. However, existing semiconductor transfer devices have certain shortcomings and need to be improved.

[0003] Reference patent (Publication No.: CN222041779U; Publication Date: 2024-11-22) discloses a semiconductor transfer device with cleaning function, including a transfer machine. A mounting frame is installed on the top of the transfer machine, and a placement rack is installed on one side of the transfer machine. A limiting plate is horizontally connected to the bottom of the placement rack. A sliding plate is slidably installed between the placement rack and the limiting plate. A placement frame is installed on the top of the sliding plate. Two iron plates are installed on the side of the placement rack near the placement frame, and two magnets are installed on one side of the placement frame. A motor is installed on one side of the mounting frame. The gap between the two guide blocks can be adjusted by the size of the semiconductor chip material. The rotation of the screw drives both connecting plates to move inward, thereby adjusting the gap between the two guide blocks. The semiconductor chip material is guided by the two guide blocks to the middle position at the top of the transfer machine, facilitating the vacuum suction cup's pickup of the semiconductor chip material, improving transfer efficiency, reducing mechanical vibration, and minimizing damage to the semiconductor material.

[0004] Based on the aforementioned patent, during chip transmission, chips of different specifications have different widths, which requires the transmission track device to flexibly adapt to the transmission guidance of chips of various widths.

[0005] However, most existing chip transfer track devices have relatively fixed guide structures, usually using a single guide plate design. The spacing adjustment of the guide plates is complex or inflexible. Although some devices have adjustment functions, they require the simultaneous movement of two sets of guide plates during the adjustment process. This can easily lead to a smaller opening at the guide entrance, increasing the difficulty for the chip to enter the guide structure. Furthermore, the contact between the guide structure and the chip side is mostly a sliding contact. During high-speed chip transfer, this contact method generates significant friction, which can easily cause wear on the chip side. In addition, although some chip transfer track devices have certain cleaning functions, the cleaning method is relatively simple and the effect is limited. Therefore, this utility model provides a chip transfer track device with a self-cleaning function. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a chip transfer track device with a self-cleaning function. This solves the problem that during chip transfer, chips of different specifications have different widths, requiring the transfer track device to flexibly adapt to the transfer guidance of chips of various widths. However, most existing chip transfer track devices have relatively fixed guide structures, typically employing a single guide plate design. Furthermore, the adjustment methods for the guide plate spacing are complex or inflexible. While some devices have adjustment functions, the adjustment process requires the simultaneous movement of two sets of guide plates, which can easily lead to a smaller opening at the guide entrance, increasing the difficulty for the chip to enter the guide structure. Moreover, the contact method between the guide structure and the chip side is mostly sliding contact. During high-speed chip transfer, this contact method generates significant friction, easily causing wear on the chip side.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a chip transfer track device with a self-cleaning function, comprising a mounting bracket, wherein a conveyor belt for chip transfer is disposed inside the mounting bracket, and a guide mechanism for chip transfer is disposed on the mounting bracket, the guide mechanism comprising:

[0008] The adjustment assembly includes a first guide plate fixed to the upper end of the mounting bracket, a second guide plate connected to one end of the first guide plate via a push assembly, a slot at one end of the second guide plate, an installation plate connected to the slot via a locking assembly, and guide rollers evenly distributed inside the installation plate.

[0009] The cleaning component includes a fixed bracket fixed to the upper end of a mounting bracket, a support frame connected to the side wall of the fixed bracket via a lifting component, a transmission belt inside the support frame, brushes evenly distributed on the outer wall of the transmission belt, and a conduit connected to the side wall of the mounting bracket via a dust collection component, with dust collection shells evenly distributed on the lower end face of the conduit.

[0010] Preferably, the jacking assembly includes a first electric push rod rotatably connected to the side wall of a fixed bracket via a rotating shaft. The telescopic end of the first electric push rod is rotatably connected to a second guide plate via the rotating shaft, and the second guide plate is rotatably connected to one end of the first guide plate.

[0011] Preferably, the second guide plate is configured as two sets, with the two sets of second guide plates located on the upper sides of the conveyor belt respectively.

[0012] Preferably, the engaging assembly includes a card block bracket inserted inside the card slot, the mounting plate is fixedly connected to the side wall of the card block bracket, and a pair of bolts are provided on one side of the second guide plate for detachable connection between the card block bracket and the second guide plate.

[0013] Preferably, the lifting assembly includes a fixed plate fixed to the side wall of a fixed bracket, a second electric push rod is fixedly fixed through the interior of the fixed plate, a connecting bracket is provided at the lower telescopic end of the second electric push rod, and the support frame is fixedly connected to the lower end of the connecting bracket.

[0014] Preferably, the dust collection assembly includes a collection housing fixed to the side wall of the mounting bracket, a support tube is provided at the upper end of the collection housing, and the conduit is located at the other end of the support tube in a flow connection.

[0015] Beneficial effects

[0016] This invention provides a chip transfer track device with a self-cleaning function. Compared with the prior art, it has the following advantages:

[0017] Firstly, this invention adjusts the distance between the two sets of second guide plates using a first electric push rod, flexibly adapting to the transmission guidance of chips of different widths, improving the versatility and applicability of the device, and facilitating subsequent processing of the transported chips. Two sets of guide plates are provided; the first guide plate is always in an open structure, facilitating better entry of the transported chips into the second guide plate. Only the second guide plate needs adjustment, preventing the two sets of guide plates from opening and closing simultaneously, which would cause the opening of the first guide plate to become smaller, thus ensuring proper chip transport. Furthermore, the guide roller shaft uses a rolling contact method, reducing the risk of wear on the chip's side. When the guide roller shaft needs to be disassembled, first unscrew the bolts on one side of the second guide plate used to fix the clamping bracket, then pull the clamping bracket out of the slot. At this time, the mounting plate and guide roller shaft are removed together, facilitating disassembly of the mounting plate and guide roller shaft. During long-term operation, the guide roller shaft may accumulate impurities, making disassembly and cleaning easier.

[0018] Secondly, after chip transmission, this invention activates the transmission belt, causing the brushes on its outer wall to rotate. Simultaneously, a second electric push rod is activated. The telescopic end of the second electric push rod, through a connecting bracket, moves the support frame downwards, bringing the brushes into contact with the conveyor belt surface. As the transmission belt rotates, the brushes sweep the conveyor belt surface, removing dust and impurities. While the brushes are sweeping, a vacuum pump is activated, generating negative pressure that draws air from the vacuum casing into the duct, then through the support tube into the collection casing. The brushed-off dust and impurities are sucked into the vacuum casing by the airflow, and finally collected in the collection casing after passing through the duct and support tube. This completes the cleaning of the conveyor belt surface. Furthermore, the vacuum casings are evenly distributed along the duct, ensuring suction is generated throughout the conveyor belt. This combination of brush sweeping and vacuum collection comprehensively and thoroughly removes dust and impurities from the conveyor belt surface, ensuring the cleanliness of the chip transmission track. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the second guide plate structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the mounting plate structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the support frame structure of this utility model.

[0023] In the diagram: 1. Mounting bracket; 2. Conveyor belt; 3. First guide plate; 301. Second guide plate; 302. First electric push rod; 303. Fixed bracket; 4. Slot; 401. Slot bracket; 402. Mounting plate; 403. Guide roller; 5. Fixed plate; 501. Second electric push rod; 502. Connecting bracket; 503. Support frame; 504. Transmission belt; 6. Collection shell; 601. Support pipe; 602. Conduit; 603. Dust collection shell. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-4 This utility model provides a technical solution: a chip transfer track device with self-cleaning function, including a mounting bracket 1, a conveyor belt 2 for chip transfer inside the mounting bracket 1, and a guide mechanism for chip transfer on the mounting bracket 1, the guide mechanism including:

[0026] The adjustment assembly includes a first guide plate 3 fixed at the upper end of the mounting bracket 1, a second guide plate 301 connected to one end of the first guide plate 3 via a push assembly, a slot 4 at one end of the second guide plate 301, an mounting plate 402 connected via a locking assembly inside the slot 4, and guide rollers 403 evenly distributed inside the mounting plate 402.

[0027] The cleaning component includes a fixed bracket 303 fixed to the upper end of the mounting bracket 1, a support frame 503 connected to the side wall of the fixed bracket 303 via a lifting component, a transmission belt 504 inside the support frame 503, brushes evenly distributed on the outer wall of the transmission belt 504, and a conduit 602 connected to the side wall of the mounting bracket 1 via a dust collection component, with a dust collection shell 603 evenly distributed on the lower end face of the conduit 602.

[0028] In a preferred embodiment, the push assembly includes a first electric push rod 302 rotatably connected to the side wall of a fixed bracket 303 via a rotating shaft. The telescopic end of the first electric push rod 302 is rotatably connected to a second guide plate 301 via the rotating shaft. The second guide plate 301 is rotatably connected to one end of the first guide plate 301. The second guide plate 301 is configured as two sets, with the two sets of second guide plates 301 located on both sides above the conveyor belt 2. When it is necessary to adjust the guiding range according to the width of the chip, the first electric push rod 302 is activated. Since the two ends of the first electric push rod 302 are rotatably connected to the fixed bracket 303 and the second guide plate 301 via rotating shafts, and the second guide plate 301 is rotatably connected to the first guide plate 3, the first electric push rod 302 will push or pull the second guide plate 301 to rotate around the connection point with the first guide plate 3 when it extends or retracts, thereby changing the distance between the two sets of second guide plates 301 to adapt to the guiding requirements of chip transmission of different widths.

[0029] In a preferred embodiment, the engaging assembly includes a locking block bracket 401 inserted inside the locking slot 4, a mounting plate 402 fixedly connected to the side wall of the locking block bracket 401, and a pair of bolts provided on one side of the second guide plate 301 for detachable connection between the locking block bracket 401 and the second guide plate 301.

[0030] The guide roller 403 adopts a rolling contact method to reduce the risk of wear on the chip side.

[0031] When it is necessary to disassemble the guide roller shaft 403, first unscrew the bolts on one side of the second guide plate 301 used to fix the clamp bracket 401, and then pull the clamp bracket 401 out of the slot 4. At this time, the mounting plate 402 and the guide roller shaft 403 are taken out together, which makes it easy to disassemble the mounting plate 402 and the guide roller shaft 403. When working for a long time, the guide roller shaft 403 will be contaminated with impurities after long-term use, which makes it easy to disassemble and clean.

[0032] In a preferred embodiment, the lifting assembly includes a fixed plate 5 fixed to the side wall of a fixed bracket 303. A second electric push rod 501 is fixedly fixed through the inside of the fixed plate 5. A connecting bracket 502 is provided at the lower telescopic end of the second electric push rod 501. A support frame 503 is fixedly connected to the lower end of the connecting bracket 502. The dust collection assembly includes a collection shell 6 fixed to the side wall of a mounting bracket 1. A support tube 601 is provided at the upper end of the collection shell 6. A conduit 602 is connected to the other end of the support tube 601. A dust pump is provided on one side of the collection shell 6. After chip transmission, the transmission belt 504 is activated, causing the transmission belt 504 to drive the brush on its outer wall to rotate. At the same time, the second electric push rod 501 is activated. The telescopic end of the second electric push rod 501 drives the support frame 503 to move downward through the connecting bracket 502, so that the brush contacts the surface of the conveyor belt 2. As the transmission belt 504 rotates, the brush sweeps the surface of the conveyor belt 2, brushing off dust and impurities. At the same time as the brush sweeps, the dust pump is started, and the dust pump generates negative pressure, so that air enters the duct 602 from the dust collection housing 603, and then enters the collection housing 6 through the support pipe 601. The brushed-off dust and impurities are sucked into the dust collection housing 603 under the action of airflow, and finally enter the collection housing 6 for collection after passing through the duct 602 and the support pipe 601, thereby completing the cleaning work of the surface of the conveyor belt 2.

[0033] A motor is installed on one side of the support frame 503 to rotate the transmission belt 504.

[0034] The motor model mentioned above is 60BYG250, the electric actuator model is XTL100, and the dust pump model is HG010-12AD1. These are all existing technologies and will not be elaborated on further.

[0035] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0036] During operation, when the guide range needs to be adjusted according to the chip width, the first electric push rod 302 in the push assembly is activated. Since the two ends of the first electric push rod 302 are rotatably connected to the fixed bracket 303 and the second guide plate 301 respectively through the rotating shaft, and the second guide plate 301 is rotatably connected to the first guide plate 3, the first electric push rod 302 will push or pull the second guide plate 301 to rotate around the connection point with the first guide plate 3 when it extends or retracts, thereby changing the distance between the two sets of second guide plates 301 located on both sides above the conveyor belt 2 to adapt to the transmission guide requirements of chips of different widths. If the guide roller shaft 403 needs to be disassembled and cleaned due to impurities from long-term use, first unscrew the bolts on one side of the second guide plate 301 used to fix the clamp bracket 401, and then pull the clamp bracket 401 out of the slot 4. At this time, the mounting plate 402 and the guide roller shaft 403 are taken out together, and the disassembly is completed.

[0037] After chip transmission, the drive belt 504 inside the support frame 503 is activated, causing the brushes evenly distributed on the outer wall to rotate. At the same time, the second electric push rod 501 in the lifting assembly is activated. The telescopic end of the second electric push rod 501 drives the support frame 503 to move downward through the connecting bracket 502, allowing the brushes to contact the surface of the conveyor belt 2. As the drive belt 504 rotates, the brushes sweep the surface of the conveyor belt 2, brushing off dust and impurities. While the brushes are sweeping, the vacuum pump in the vacuum assembly is activated. The vacuum pump generates negative pressure, causing air to enter the vacuum housing 603, which is evenly distributed on the lower end face of the duct 602, and then enter the collection housing 6, which is fixed to the side wall of the mounting bracket 1, through the support tube 601. The brushed-off dust and impurities are sucked into the vacuum housing 603 under the action of airflow, and finally enter the collection housing 6 for collection through the duct 602 and the support tube 601, completing the cleaning of the surface of the conveyor belt 2.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip transfer track device with self-cleaning function, comprising a mounting bracket (1), wherein a conveyor belt (2) for chip transfer is disposed inside the mounting bracket (1), characterized in that: The mounting bracket (1) is provided with a guide mechanism for chip transmission, the guide mechanism including: The adjustment assembly includes a first guide plate (3) fixed at the upper end of the mounting bracket (1), a second guide plate (301) connected by a push assembly is provided at one end of the first guide plate (3), a slot (4) is provided at one end of the second guide plate (301), an mounting plate (402) connected by a locking assembly is provided inside the slot (4), and guide rollers (403) are evenly distributed inside the mounting plate (402). The cleaning component includes a fixed bracket (303) fixed at the upper end of the mounting bracket (1), a support frame (503) connected by a lifting component is provided on the side wall of the fixed bracket (303), a transmission belt (504) is provided inside the support frame (503), a brush is evenly distributed on the outer wall of the transmission belt (504), a conduit (602) connected by a dust collection component is provided on the side wall of the mounting bracket (1), and a dust collection shell (603) is evenly distributed on the lower end face of the conduit (602).

2. The chip transfer track device with self-cleaning function according to claim 1, characterized in that: The jacking assembly includes a fixed bracket (303) with a first electric push rod (302) rotatably connected to the side wall via a rotating shaft. The telescopic end of the first electric push rod (302) is rotatably connected to a second guide plate (301) via a rotating shaft. The second guide plate (301) is located at one end of the first guide plate (3) and is rotatably connected to it.

3. The chip transfer track device with self-cleaning function according to claim 1, characterized in that: The second guide plate (301) is configured in two sets, with the two sets of second guide plates (301) located on the upper sides of the conveyor belt (2).

4. A chip transfer track device with self-cleaning function according to claim 1, characterized in that: The locking assembly includes a locking block bracket (401) inserted inside the locking slot (4), and the mounting plate (402) is fixedly connected to the side wall of the locking block bracket (401). A pair of bolts are provided on one side of the second guide plate (301) for the detachable connection of the locking block bracket (401) and the second guide plate (301).

5. A chip transfer track device with self-cleaning function according to claim 1, characterized in that: The lifting assembly includes a fixed plate (5) fixed to the side wall of a fixed bracket (303), a second electric push rod (501) is fixedly fixed inside the fixed plate (5), a connecting bracket (502) is provided at the lower telescopic end of the second electric push rod (501), and the support frame (503) is fixedly connected to the lower end of the connecting bracket (502).

6. A chip transfer track device with self-cleaning function according to claim 1, characterized in that: The dust collection assembly includes a collection shell (6) fixed to the side wall of the mounting bracket (1), and a support tube (601) is provided at the upper end of the collection shell (6). The conduit (602) is located at the other end of the support tube (601) and is in a flow connection.

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