Integrated pipeline supply platform and semiconductor equipment

Abstract

According to the integrated pipeline supply platform and the semiconductor equipment, the integrated pipeline supply platform is characterized in that an auxiliary pipeline and a process gas pipeline are integrally arranged on the same platform main body and are arranged at intervals in the vertical direction, so that the auxiliary pipeline and the process gas pipeline can be orderly integrated on the platform main body; physical interference among the pipelines is reduced, and ordering and compact layout of the integrated pipeline supply platform can be achieved; in addition, a factory affair butt joint window in the butt joint structure establishes a connecting channel for the auxiliary pipeline and the process gas pipeline with the outside, and butt joint of the integrated pipeline supply platform and factory affair facilities is simplified; and the chamber butt joint window provides a pipeline connection interface between the integrated pipeline supply platform and the plurality of process chambers, so that rapid and accurate butt joint between the platform and the plurality of process chambers is realized, the installation efficiency of pipelines in the semiconductor equipment and the reliability of pipeline connection are improved, and the integration level and the connection efficiency of the semiconductor equipment are enhanced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and more particularly to an integrated pipeline supply platform and semiconductor equipment. Background Technology

[0002] In the semiconductor manufacturing field, with the increasing complexity of manufacturing processes and the continuous improvement of precision requirements, various types of semiconductor manufacturing equipment have emerged. As a key component of semiconductor equipment, the integrated transmission chamber platform plays a vital role.

[0003] As the core of the system, the integrated transfer chamber platform typically has multiple workstations, each of which can connect to a process chamber, enabling sequential processing of wafers between different process chambers to meet the requirements of multiple complex process steps in the semiconductor manufacturing process.

[0004] However, the complex wiring of current semiconductor devices increases the difficulty and cost of manufacturing them. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide an integrated pipeline supply platform and semiconductor equipment, which improves the installation efficiency and reliability of pipeline connections in semiconductor equipment, and enhances the integration and connection efficiency of semiconductor equipment.

[0006] To address the aforementioned problems, this utility model provides an integrated pipeline supply platform, comprising: a platform body; auxiliary pipelines disposed on the platform body; process gas pipelines disposed on the platform body and vertically spaced from the auxiliary pipelines; and a docking structure disposed on the platform body, the docking structure comprising: a plant docking window for docking the auxiliary pipelines and process gas pipelines with external facilities; and a chamber docking window for docking with the corresponding pipeline interface of a process chamber.

[0007] Optionally, the semiconductor device includes: a transmission chamber; the auxiliary pipeline includes: a plurality of spaced-apart auxiliary tube units, the auxiliary tube units being disposed around the transmission chamber on the platform body; and an auxiliary tube connector disposed between adjacent auxiliary tube units, the auxiliary tube connector being connected to two adjacent auxiliary tube units.

[0008] Optionally, the auxiliary pipe unit includes: a water pipe, a helium supply pipe, and a helium return pipe; the auxiliary pipe connecting parts include: a water pipe connecting part, connected to the water pipe; a helium supply pipe connecting part, connected to the helium supply pipe; and a helium return pipe connecting part, connected to the helium return pipe.

[0009] Optionally, the integrated pipeline supply platform further includes: a first pipeline fixing component, wherein there are multiple first pipeline fixing components arranged at intervals, and the first pipeline fixing components fix the auxiliary pipeline to the platform body; the first pipeline fixing component includes: a first fixing seat, fixedly disposed on the platform body, the first fixing seat having a first groove; a pipe partition block, disposed on the first fixing seat, and the bottom of the pipe partition block having a second groove, the second groove and the first groove forming a first pipeline channel through which the water pipeline passes; a third groove on the top of the pipe partition block; and a pipe clamp, located on the top of the pipe partition block, the bottom of the pipe clamp having a fourth groove, the fourth groove and the third groove forming a second pipeline channel through which the helium supply pipeline passes.

[0010] Optionally, the first pipeline fixing component further includes: a fifth groove located at the top of the first fixing seat; and a pipe partition block disposed at the top of the first fixing seat, which cooperates with the fifth groove to form a helium channel through which the helium return pipeline passes.

[0011] Optionally, the integrated pipeline supply platform further includes: multiple branch return water pipelines, each of which is connected to one of the process chambers for drawing return water from the process chambers, and each of the multiple branch return water pipelines guides the return water to the outside of the platform body.

[0012] Optionally, the semiconductor device includes: a transfer chamber; the process gas pipeline includes: a plurality of spaced-apart gas tube units, the gas tube units being arranged around the transfer chamber on the platform body; the number of gas tube units is two, and the gas tube unit closer to the plant docking window has a semi-circular structure, while the gas tube unit farther from the plant docking window has a full-circular structure; a gas tube connector is disposed between adjacent gas tube units, and the gas tube connector is connected to the two adjacent gas tube units.

[0013] Optionally, the integrated pipeline supply platform further includes: a second pipeline fixing component, wherein there are multiple second pipeline fixing components arranged at intervals, and the second pipeline fixing components fix the process gas pipeline on the platform body; the second pipeline fixing component includes: a second fixing base, the top of the second fixing base is provided with a first mounting groove; multiple fixing blocks are stacked on the top of the second fixing base, and each fixing block is provided with a second mounting groove at its top and bottom; wherein the second mounting groove at the bottom of the lowest fixing block and the first mounting groove at the top of the second fixing base cooperate to form a pipeline receiving hole for fixing the corresponding pipeline in the process gas pipeline; and in two adjacent stacked fixing blocks, the second mounting groove at the bottom of the upper fixing block and the second mounting groove at the top of the lower fixing block cooperate to form a pipeline receiving hole for fixing the process gas pipeline.

[0014] Optionally, the chamber docking window includes a network interface; the integrated pipeline supply platform further includes: multiple network communication lines disposed on the platform body, one end of each network communication line being connected to the network interface in the corresponding chamber docking window; a switch disposed on the platform body, and the other end of each network communication line being connected to a corresponding port of the switch; a front-end transmission module and a host computer disposed on the platform body, the front-end transmission module being connected to the host computer, and the front-end transmission module communicating with the switch.

[0015] This utility model provides a semiconductor device, including: a back-end transmission cavity; a plurality of process chambers arranged around the side of the back-end transmission cavity, each process chamber including a docking window; and an integrated pipeline supply platform, wherein the chamber docking windows of the integrated pipeline supply platform are docked with the docking windows of each chamber.

[0016] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0017] The integrated pipeline supply platform provided in this embodiment includes: a platform body, auxiliary pipelines and process gas pipelines disposed on the platform body, wherein the process gas pipelines and the auxiliary pipelines are spaced apart in the vertical direction. It also includes a docking structure disposed on the platform body, the docking structure including a plant docking window for docking the auxiliary pipelines and process gas pipelines with external components, and a chamber docking window for docking with corresponding pipeline interfaces of multiple process chambers. By integrating the auxiliary pipelines and process gas pipelines on the same platform body and arranging them spaced apart in the vertical direction, the auxiliary pipelines and process gas pipelines can be integrated into the platform body. The orderly integration of process gas pipelines on the main body of the platform reduces physical interference between various pipelines, which is conducive to the orderly and compact layout of the integrated pipeline supply platform. In addition, the plant docking window in the docking structure establishes a connection channel between auxiliary pipelines and process gas pipelines and the outside, simplifying the docking between the integrated pipeline supply platform and plant facilities. Meanwhile, the chamber docking window provides a pipeline connection interface between the integrated pipeline supply platform and multiple process chambers, realizing rapid and accurate docking between the platform and multiple process chambers, improving the installation efficiency and reliability of pipeline connections in semiconductor equipment, and enhancing the integration and connection efficiency of semiconductor equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the auxiliary pipeline structure in the integrated pipeline supply platform of this utility model embodiment;

[0019] Figure 2 This is a schematic diagram of the water pipeline structure of the auxiliary pipeline structure in the integrated pipeline supply platform of this utility model embodiment;

[0020] Figure 3 This is a schematic diagram of the branch return water pipeline of the auxiliary pipeline structure in the integrated pipeline supply platform of this utility model embodiment;

[0021] Figure 4 This is a schematic diagram of the structure of the first pipeline fixing component in the integrated pipeline supply platform of this utility model embodiment;

[0022] Figure 5 This is a schematic diagram of the process gas pipeline in the integrated pipeline supply platform of this utility model embodiment;

[0023] Figure 6 This is a schematic diagram of the structure of multiple first pipeline fixing components assembled together in the integrated pipeline supply platform of this utility model embodiment;

[0024] Figure 7 This is a schematic diagram of the structure of multiple second pipeline fixing components in the integrated pipeline supply platform of this utility model embodiment;

[0025] Figure 8This is a schematic diagram of the structure of the fixing block in the integrated pipeline supply platform of this utility model embodiment;

[0026] Figure 9 This is a schematic diagram of the plant management interface window in the integrated pipeline supply platform of this utility model embodiment;

[0027] Figure 10 This is a schematic diagram of the platform docking window in the integrated pipeline supply platform of this utility model embodiment;

[0028] Figure 11 This is a schematic diagram of the network transmission line structure in the integrated pipeline supply platform of this utility model embodiment;

[0029] Figure 12 This is a schematic diagram of the structure of the auxiliary pipeline and process gas pipeline assembled on the main body of the integrated pipeline supply platform according to an embodiment of this utility model;

[0030] Figure 13 This is a schematic diagram of the structure of a semiconductor device according to an embodiment of the present invention. Detailed Implementation

[0031] As is known from the background technology, however, the complex wiring of current semiconductor devices increases the difficulty and cost of manufacturing them.

[0032] To address the aforementioned technical problem, the integrated pipeline supply platform provided in this embodiment includes: a platform body, auxiliary pipelines and process gas pipelines disposed on the platform body, wherein the process gas pipelines and the auxiliary pipelines are vertically spaced apart. It also includes a docking structure disposed on the platform body, the docking structure comprising a plant docking window for docking the auxiliary pipelines and process gas pipelines with external components, and a chamber docking window for docking with corresponding pipeline interfaces of multiple process chambers. By integrating the auxiliary pipelines and process gas pipelines on the same platform body and arranging them vertically spaced apart, it is possible to... The orderly integration of auxiliary pipelines and process gas pipelines on the main body of the platform reduces physical interference between various pipelines, which is conducive to the orderly and compact layout of the integrated pipeline supply platform. In addition, the plant docking window in the docking structure establishes a connection channel between the auxiliary pipelines and process gas pipelines and the outside, simplifying the docking between the integrated pipeline supply platform and plant facilities. Meanwhile, the chamber docking window provides a pipeline connection interface between the integrated pipeline supply platform and multiple process chambers, realizing rapid and accurate docking between the platform and multiple process chambers, improving the installation efficiency and reliability of pipelines in semiconductor equipment, and enhancing the integration and connection efficiency of semiconductor equipment.

[0033] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] refer to Figures 1 to 12 This utility model embodiment provides an integrated pipeline supply platform for semiconductor equipment, including: a platform body 100 (such as...) Figure 12 (As shown); auxiliary pipeline 200, installed on the platform body 100; process gas pipeline 300, installed on the platform body 100, and vertically spaced from the auxiliary pipeline 200; docking structure, installed on the platform body 100, the docking structure including: plant docking window 601 (as shown) Figure 9 As shown), it is used to connect the auxiliary pipeline 200 and the process gas pipeline 300 to external facilities; the chamber docking window 602 (as shown) Figure 10 (As shown), it is used to connect with the corresponding pipeline interface of the process chamber.

[0035] The integrated pipeline supply platform provided in this embodiment includes: a platform body 100, auxiliary pipelines 200 and process gas pipelines 300 disposed on the platform body 100, wherein the process gas pipelines 300 and the auxiliary pipelines 200 are spaced apart in the vertical direction. It also includes a docking structure disposed on the platform body 100, the docking structure including a plant docking window 601 for docking the auxiliary pipelines 200 and the process gas pipelines 300 with external components, and a chamber docking window 602 for docking with corresponding pipeline interfaces of multiple process chambers. By integrating the auxiliary pipelines 200 and the process gas pipelines 300 on the same platform body 100 and arranging them spaced apart in the vertical direction, the auxiliary pipelines 200 and the process gas pipelines 300 can be connected together. The gas pipelines 300 are systematically integrated on the platform body 100, reducing physical interference between the various pipelines and facilitating the orderly and compact layout of the integrated pipeline supply platform. In addition, the plant docking window 601 in the docking structure establishes a connection channel between the auxiliary pipelines 200 and the process gas pipelines 300 and the outside, simplifying the docking between the integrated pipeline supply platform and plant facilities. Meanwhile, the chamber docking window 602 provides a pipeline connection interface between the integrated pipeline supply platform and multiple process chambers, enabling rapid and accurate docking between the platform and multiple process chambers. This improves the installation efficiency and reliability of pipeline connections in semiconductor equipment, enhances the integration and connection efficiency of semiconductor equipment, and provides a clear and convenient solution for the complex fluid supply in semiconductor equipment.

[0036] The main platform 100 serves as the structural carrier of the integrated pipeline supply platform, used to install auxiliary pipelines 200, process gas pipelines 300, and docking structures, providing installation references and spatial layout frameworks for these structures, which helps to improve the overall compactness, reliability, and ease of maintenance of semiconductor equipment.

[0037] In this embodiment, the platform body 100 includes: a frame 101 (e.g., ... Figure 12 (As shown); the auxiliary pipeline 200 and the process gas pipeline 300 are fixedly installed on the frame 101.

[0038] In this embodiment, an auxiliary pipeline 200 is disposed on the platform body 100. The auxiliary pipeline 200 is disposed on the platform body 100 and is used to carry and transport non-process fluids (such as cooling water, helium for cooling pumps, etc.) required for the operation of the semiconductor process chamber.

[0039] In this embodiment, the semiconductor device includes a transmission chamber; the auxiliary pipeline 200 includes a plurality of spaced-apart auxiliary tube units 201, the auxiliary tube units 201 being disposed around the transmission chamber on the platform body 100; and an auxiliary tube connector 202, disposed between adjacent auxiliary tube units 201, the auxiliary tube connector 202 being connected to two adjacent auxiliary tube units 201.

[0040] Multiple spaced auxiliary pipe units 201 in the auxiliary pipeline 200 are arranged around the transmission chamber and connected to adjacent auxiliary pipe units 201 through auxiliary pipe connectors 202, thereby forming a distributed main pipeline network around the transmission chamber. The layout of the auxiliary pipeline 200 can be adjusted according to the position of the transmission chamber, so that non-process fluids are distributed to each process chamber arranged around the transmission chamber.

[0041] It should be noted that the semiconductor device also includes a transition chamber located between adjacent transmission chambers. Correspondingly, the water conduit 2011 also includes a transition chamber water conduit 203 communicating with the transition chamber, the transition chamber water conduit 203 being used to provide the transition chamber with the water required for its operation.

[0042] Combination Figure 1 refer to Figure 2 The helium supply pipeline 2012 and the helium return pipeline 2013 have the same layout as the water pipeline 2011. Figure 2 Only a schematic diagram of the water pipe 2011 in the auxiliary pipeline structure is shown. The auxiliary pipe unit 201 has a semi-circular structure, which can shorten the total length of the auxiliary pipeline 200 while supplying non-process fluids to the various process chambers around each transmission chamber. This reduces the material cost and manufacturing and installation difficulty of the auxiliary pipeline 200, and optimizes the space utilization on the platform body 100.

[0043] As an example, in adjacent auxiliary pipe units 201, the middle pipe segment 201a of the auxiliary pipe unit 201 closest to the plant docking window 601 is connected to one end of the auxiliary pipe connector 202, and the end segment 201b of the auxiliary pipe unit 201 furthest from the plant docking window 601 is connected to the other end of the auxiliary pipe connector 202, so that the non-process fluid can flow more evenly to different auxiliary pipe units 201 after being introduced from the plant docking window 601.

[0044] like Figure 1 As shown, the auxiliary pipe unit 201 includes: a water pipe 2011, a helium supply pipe 2012, and a helium return pipe 2013; the auxiliary pipe connector 202 includes: a water pipe connector 2021, connected to the water pipe 2011; a helium supply pipe connector 2022, connected to the helium supply pipe 2012; and a helium return pipe connector 2023, connected to the helium return pipe 2013.

[0045] The auxiliary pipe unit 201 includes a water pipe 2011, a helium supply pipe 2012, and a helium return pipe 2013, and the corresponding auxiliary pipe connectors 202 include a water pipe connector 2021, a helium supply pipe connector 2022, and a helium return pipe connector 2023. This enables the parallel delivery of different types of non-process fluids (water, helium) within the platform, allowing the integrated pipe supply platform to simultaneously provide multiple non-process fluids to the process chamber, which is beneficial for meeting the semiconductor process's demand for multiple auxiliary fluids.

[0046] In this embodiment, the integrated pipeline supply platform further includes: multiple water supply branch pipes 2014, one end of each water supply branch pipe 2014 being connected to the water pipeline 2011, and the other end of each water supply branch pipe 2014 being connected to the water interface of the corresponding chamber docking window 602.

[0047] Multiple water supply branch pipes 2014 are set up, with one end of the water supply branch pipe 2014 connected to the water pipe 2011 in the auxiliary pipe 200, and the other end connected to the water interface of the corresponding chamber docking window 602, so as to distribute the water in the main water pipe to each process chamber, thereby realizing the flow path from centralized water supply to decentralized application.

[0048] It should be noted that the end of the water supply branch pipe 2014 connected to the water interface is provided with a water interface panel 2014a (e.g., Figure 2 (As shown). The water channel panel 2014a is connected to the water channel interface, so that the water pipe 2011 is connected to the process chamber.

[0049] like Figure 3As shown, the integrated pipeline supply platform further includes: multiple branch return water pipelines 2015, each of which is connected to one of the process chambers for drawing return water from the process chamber. Each of the multiple branch return water pipelines 2015 guides the return water to the platform body 100 (e.g., ...). Figure 12 (As shown) outside.

[0050] Multiple branch return water pipes 2015 are set up, and each branch return water pipe 2015 is independently connected to a process chamber and directly leads the return water to the outside of the platform body 100. This realizes the independent discharge of return water from each process chamber, avoids the mixing of return water in the main pipeline inside the platform, and is conducive to the smooth operation of semiconductor processes in semiconductor equipment.

[0051] It should be noted that the helium supply pipeline 2012 and helium return pipeline 2013 in the integrated pipeline supply platform accurately distribute high-purity helium from the external helium compressor to the cooling pumps in each process chamber, and recover the helium to the helium compressor after the cooling pumps have been used. This provides a continuous and stable helium flow for the cryogenic refrigeration cycle of the cooling pumps, thereby ensuring that the cooling pumps can effectively generate an ultra-high vacuum environment. This allows multiple cooling pumps to share a single helium supply and recovery system, which is beneficial for improving the utilization efficiency of helium resources and reducing costs.

[0052] In this embodiment, the integrated pipeline supply platform further includes: a first pipeline fixing component 400. There are multiple first pipeline fixing components 400 arranged at intervals. The first pipeline fixing components 400 fix the auxiliary pipeline 200 on the platform body 100 to prevent the auxiliary pipeline 200 from being displaced, deformed or damaged due to equipment vibration, fluid pressure fluctuation or external disturbance, and to ensure that the auxiliary pipeline 200 can maintain a stable position for a long time.

[0053] like Figure 4 As shown, the first pipeline fixing component 400 includes: a first fixing seat 401, fixedly disposed on the platform body 100, the first fixing seat 401 having a first groove 401a; a pipe partition 402, disposed on the first fixing seat 401, and the bottom of the pipe partition 402 having a second groove 402a, the second groove 402a and the first groove 401a forming a first pipeline channel through which the water pipeline 2011 passes; the top of the pipe partition 402 having a third groove 402b; and a pipe clamp 403, located at the top of the pipe partition 402, the bottom of the pipe clamp 403 having a fourth groove 403a, the fourth groove 403a and the third groove 402b forming a second pipeline channel through which the helium supply pipeline 2012 passes.

[0054] The first pipeline fixing component 400 forms a multi-layer pipeline channel through the combination of the first fixing seat 401, the pipe partition 402, and the pipe clamp 403: the first groove 401a of the first fixing seat 401 cooperates with the second groove 402a at the bottom of the pipe partition 402 to form the first pipeline channel through which the water supply pipeline 2011 passes; the third groove 402b at the top of the pipe partition 402 cooperates with the fourth groove 403a at the bottom of the pipe clamp 403 to form the second pipeline channel through which the helium supply pipeline 2012 passes. This achieves layered isolation and fixing of the water pipeline 2011 and the helium supply pipeline 2012 at the same fixing point, ensuring a safe distance between them, avoiding direct contact and physical interference, optimizing the space utilization of the integrated pipeline supply platform, and improving the integration of the integrated pipeline supply platform and the reliability of the pipeline system.

[0055] It should be noted that the first pipeline fixing component 400 further includes: a fifth groove 401b, located at the top of the first fixing seat 401; and a pipe partition 402, disposed at the top of the first fixing seat 401, which cooperates with the fifth groove 401b to form a helium channel through which the helium return pipeline 2013 passes.

[0056] A fifth groove 401b is provided on the top of the first fixing seat 401, and the pipe partition 402 cooperates with the fifth groove 401b to form a helium channel through which the helium return pipe 2013 passes. Therefore, in addition to fixing the water pipe 2011 and the helium supply pipe 2012, the first pipe fixing component 400 also fixes the helium return pipe 2013, which improves the space utilization efficiency of the first pipe fixing component 400. This allows multiple auxiliary pipes 200 to be fixed on the platform body 100 in an orderly and compact manner, which helps to simplify the pipe layout, reduce the number of fixing components, and improve the maintenance convenience of the integrated pipe supply platform.

[0057] As an example, the first groove 401a, the second groove 402a, the third groove 402b, the fourth groove 403a, and the fifth groove 401b are all semi-circular grooves. The first groove 401a and the second groove 402a are combined to form a circular channel for fitting with the outer diameter of the water pipe 2011, and the third groove 402b and the fourth groove 403a are combined to form a circular channel for fitting with the outer diameter of the helium supply pipe 2012.

[0058] It should be noted that the first pipeline fixing component 400 is mounted on the frame 101.

[0059] like Figure 6 As shown, the process gas pipeline 300 is installed on the platform body 100 and is vertically spaced from the auxiliary pipeline 200.

[0060] The process gas pipeline 300 is installed on the platform body 100 and is vertically spaced from the auxiliary pipeline 200, which can avoid direct contact, heat exchange or potential cross-contamination risks between the process gas pipeline 300 and the auxiliary pipeline 200.

[0061] In this embodiment, there are multiple process gas pipelines 300.

[0062] In this embodiment, the docking structure is set on the platform body 100. The docking structure includes: a plant docking window 601, used to dock the auxiliary pipeline 200 and process gas pipeline 300 with external facilities; and a chamber docking window 602, used to dock with the corresponding pipeline interface of the process chamber.

[0063] The docking structure establishes a connection interface between the integrated pipeline supply platform and external plant facilities, as well as internal process chambers, by setting up a plant docking window 601 and a chamber docking window 602. This enables centralized management of the input (from the plant) and output (to the process chamber) of the auxiliary pipeline 200 and the process gas pipeline 300, thereby simplifying the connection and disconnection between the plant facilities and the integrated pipeline supply platform, as well as the connection and disconnection between the process chambers and the integrated pipeline supply platform.

[0064] In this embodiment, the semiconductor device includes: a transmission chamber; such as Figure 5 As shown, the process gas pipeline 300 includes: a plurality of spaced-apart gas pipe units 301, the gas pipe units 301 being arranged around the transmission chamber on the platform body 100; and a gas pipe connector 302 (such as...). Figure 6 As shown in the figure, it is disposed between adjacent gas pipe units 301, and the gas pipe connector 302 is connected to the two adjacent gas pipe units 301.

[0065] Multiple spaced gas pipe units 301 in the process gas pipeline 300 are arranged around the transmission chamber and connected to adjacent gas pipe units 301 through gas pipe connectors 302, thereby forming a distributed process gas pipeline network around the transmission chamber. The layout of the process gas pipeline 300 can be adjusted according to the position of the transmission chamber, so that the process gas is distributed to each process chamber arranged around the transmission chamber.

[0066] refer to Figure 9The plant connection window 601 includes: a helium supply pipe structure 2012F, located at the end of the helium supply pipe 2012 and connected to it; a water pipe interface 2011F, located at the end of the water pipe 2011 and connected to it; and a helium return pipe 2013F, located at the end of the helium return pipe 2013 and connected to it. In addition, the plant connection window 601 also includes: multiple process gas pipe interfaces 300F, each process gas pipe interface 300F connected to a corresponding process gas pipe 300.

[0067] refer to Figure 10 The chamber docking window 602 includes: a helium supply pipe structure 2012F, located at the end of the helium supply pipe 2012 and connected to the helium supply pipe 2012; a water pipe interface 2011F, located at the end of the water pipe 2011 and connected to the water pipe 2011; and a helium return pipe 2013F, located at the end of the helium return pipe 2013 and connected to the helium return pipe 2013. Furthermore, the chamber docking window 602 also includes: multiple process gas pipe interfaces 300F, each process gas pipe interface 300F connected to a corresponding process gas pipe 300.

[0068] As an example, there are two gas pipe units 301, and the gas pipe unit 301 closer to the plant docking window 601 has a semi-circular structure, while the gas pipe unit 301 farther away from the plant docking window 601 has a full-circular structure.

[0069] The gas pipe unit segments closer to the plant connection window 601 adopt a semi-circular structure, while those farther away from the plant connection window 601 adopt a full-circular structure, thus differentiating the structures of the gas pipe units 301 in different areas. The semi-circular structure helps reduce material costs and installation difficulty for the gas pipe units 301, optimizing space utilization on the platform body 100; the full-circular structure provides good structural stability and uniform fluid distribution for the gas pipe units 301 farther from the inlet end. Therefore, this combined semi-circular and full-circular structure balances installation convenience and material economy.

[0070] It should be noted that the semiconductor device also includes a transition chamber located between adjacent transmission chambers. Correspondingly, the gas tube unit 301 also includes a transition chamber gas disk surface 304 (e.g., [missing information]) communicating with the transition chamber. Figure 5 As shown), the transition chamber gas plate surface 304 is used to supply the transition chamber with process gases or gases for environmental control as it may require.

[0071] like Figure 12 As shown, the auxiliary pipeline 200 is located below the process gas pipeline 300.

[0072] By placing auxiliary pipelines 200 (such as water pipeline 2011 or helium pipeline) below process gas pipeline 300, under the influence of gravity, in the event of a minor leak in the process gas pipeline 300 above, the leaked material is unlikely to drip directly onto or contaminate the auxiliary pipeline 200 below. At the same time, if condensation or minor leakage occurs in the auxiliary pipeline 200 (especially water pipeline 2011), it is unlikely to affect the sensitive process gas pipeline 300 above. This ensures that the auxiliary pipeline 200 and process gas pipeline 300 can operate safely and are isolated from each other, reducing the potential risk of cross-contamination.

[0073] In this embodiment, the integrated pipeline supply platform further includes: multiple gas supply branches 303 (such as...) Figure 5 As shown, one end of each gas supply branch 303 is connected to the process gas pipeline 300, and the other end of the gas supply branch 303 is connected to the gas interface of the corresponding chamber docking window 602.

[0074] Multiple gas supply branches 303 are set up. One end of the gas supply branch 303 is connected to the process gas pipeline 300, and the other end is connected to the gas interface of the corresponding chamber docking window 602, so as to accurately deliver the process gas in the process gas pipeline 300 to each process chamber, thereby realizing the distribution from the centralized gas supply process gas pipeline 300 to each process chamber.

[0075] In this embodiment, the integrated pipeline supply platform further includes: a second pipeline fixing component 500. There are multiple second pipeline fixing components 500 arranged at intervals. The second pipeline fixing components 500 fix the process gas pipeline 300 on the platform body 100 to prevent the process gas pipeline 300 from being displaced, deformed or damaged due to equipment vibration, fluid pressure fluctuation or external disturbance, and to ensure that the process gas pipeline 300 can maintain a stable position for a long time.

[0076] like Figure 7 As shown, the second pipeline fixing component 500 further includes: a second fixing base 501, the top of which is provided with a first mounting groove 501a; and a plurality of fixing blocks 502, stacked on top of the second fixing base 501, each fixing block 502 having a second mounting groove 502a at both its top and bottom. Specifically, the second mounting groove 502a at the bottom of the lowest fixing block 502 and the first mounting groove 501a at the top of the second fixing base 501 cooperate to form a pipeline receiving hole for fixing the corresponding pipeline in the process gas pipeline 300; and in two adjacent stacked fixing blocks 502, the second mounting groove 502a at the bottom of the upper fixing block 502 and the second mounting groove 502a at the top of the lower fixing block 502 cooperate to form a pipeline receiving hole for fixing the process gas pipeline 300.

[0077] By setting a second fixing seat 501 with a first mounting groove 501a as the bottom support, and stacking multiple fixing blocks 502 with second mounting grooves 502a on the top and bottom, an expandable multi-layer process gas pipeline 300 fixing structure is constructed, thereby realizing the orderly arrangement and fixing of the process gas pipeline 300 in the vertical direction. Therefore, by stacking the fixing blocks 502, the number of fixed process gas pipelines 300 can be flexibly adjusted, which is beneficial to improving the integration density of the integrated pipeline supply platform.

[0078] like Figure 7 and Figure 8 As shown, the fixing block 502 includes: a body structure 5021; a first protruding structure 5022 located on the side wall of the first end of the body structure 5021; a second protruding structure 5023 located at the top of the second end of the body structure 5021, the second end being disposed opposite to the first end; and a second mounting groove 502a located at the top and bottom of the body structure 5021.

[0079] It should be noted that when multiple fixing blocks 502 are stacked, the first protruding structure 5022 in the upper fixing block 502 is disposed on the top of the second protruding structure 5023 in the lower fixing block 502, and the upper fixing block 502 contacts one side of the second protruding structure 5023 in the lower fixing block 502, and the bottom of the first protruding structure 5022 in the upper fixing block 502 contacts the top of the lower fixing block 502.

[0080] It should be noted that the second pipeline fixing component 500 is fixedly installed on the frame 101.

[0081] like Figure 11 As shown, the chamber docking window 602 includes a network interface 6021 (e.g., Figure 10 (as shown); the integrated pipeline supply platform also includes: multiple network communication lines (not shown), which are set on the platform body 100, with one end of each network communication line connected to the network interface 6021 in the corresponding chamber docking window 602; and a switch 700, which is set on the platform body 100, with the other end of each network communication line connected to a corresponding port of the switch 700.

[0082] The integrated pipeline supply platform further includes a front-end transmission module 900 and a host computer 800, which are mounted on the platform body 100. The front-end transmission module 900 is connected to the host computer 800 and can communicate with the switch 700. The front-end transmission module 900 includes multiple data acquisition and control units 901, each of which is connected to a corresponding process chamber 20 for handling data acquisition and control tasks for that process chamber. In this embodiment, the data acquisition and control unit 901 includes a programmable logic controller (PLC).

[0083] The chamber docking window 602 includes a network interface 6021, and one end of each network communication line on the platform body 100 is connected to the network interface 6021 in the corresponding chamber docking window 602, and the other end is connected to a corresponding port of the switch 700. This enables reliable transmission of control signals and data information between the switch 700 and each process chamber 20. These signals and information can be generated or received by sensors or actuators inside the process chamber 20 and transmitted through the network interface 6021. This allows network signals from all process chambers 20 to be converged at the switch 700 for centralized management and routing, forming an efficient communication network. The switch 700, as the core node of the network communication, communicates directly with each process chamber 20 and enables communication between each process chamber 20 and the front-end transmission module 900. Ultimately, the front-end transmission module 900 facilitates data exchange and command transmission with the upper control system or other network devices.

[0084] Specifically, sensor data and status information from each process chamber 20 are uploaded to the main switch 700 via the network interface 6021 of its chamber interface window 602, through the corresponding network communication line. The main switch 700 routes these data streams from different process chambers to the front-end transmission module 900. Inside the front-end transmission module 900, the data corresponding to each process chamber is received and processed by its dedicated data acquisition and control unit 901 (such as a PLC). These data acquisition and control units 901 can perform localized data analysis, status judgment, early warning, and closed-loop control logic. At the same time, the data acquisition and control unit 901 also reports key data and status summaries to the host computer 800 and receives global instructions or parameter settings from the host computer 800.

[0085] The switch 700 establishes a data communication link with the network interface 6021 in the chamber docking window 602 on each process chamber 20 through a network communication line, and works in conjunction with the front-end transmission module 900 (and its multiple data acquisition and control units 901, such as PLCs) to realize real-time monitoring of the operating status of each process chamber 20, remote parameter setting, and precise control of the process flow. For example, the host computer can send control commands or update process recipes to a specific process chamber 20 through the PLC in the front-end transmission module 900, and then through the main switch 700 and the network communication line. This ensures the coordinated operation of each process step and the effective management of data, making the network communication system composed of the switch 700 and the front-end transmission module 900 (including the data acquisition and control units 901) the hub connecting the host computer 800 and the process chamber execution units for information transmission. This enables the entire semiconductor equipment to perform efficient and reliable data interaction and automated control, which is beneficial to improving production efficiency, process stability, and fault diagnosis capabilities.

[0086] In this embodiment, a water control valve (not shown) is provided at the connection interface of the chamber docking window 602.

[0087] A water control valve is provided at the connection interface of the chamber docking window 602, which allows for convenient control of the water supply to the process chamber 20 when it is connected to or removed from the platform, or when a specific process chamber 20 is being maintained. This enables independent control and isolation of the water circuit of a single process chamber 20, allowing operation of the water system of a specific process chamber 20 without affecting the operation of other chambers. This simplifies the maintenance process and improves the maintainability of the equipment.

[0088] In this embodiment, a gas path control valve (not shown) is provided at the connection interface of the chamber docking window 602.

[0089] A gas path (including auxiliary gases such as helium and process gases) control valve is provided at the connection interface of the chamber docking window 602, which allows for independent control of the supply and cut-off of various gases to each process chamber 20 when connecting or disconnecting the process chamber 20 or when performing chamber maintenance, thereby improving the flexibility and controllability of gas supply.

[0090] Accordingly, refer to Figure 13 and in conjunction with references Figures 1 to 12This utility model embodiment also provides a semiconductor device, including: a back-stage transmission cavity 10; a plurality of process chambers 20, which are arranged around the side of the back-stage transmission cavity 10, the process chambers 20 including docking windows 602; and the integrated pipeline supply platform, wherein the chamber docking windows 602 in the integrated pipeline supply platform are docked with each chamber docking window 602.

[0091] By arranging multiple process chambers 20 around the side of the back-stage transmission chamber 10 and connecting them to each process chamber 20 via the chamber docking window 602 of the integrated piping supply platform, a highly efficient and compact semiconductor device is formed. The integrated piping supply platform provides at least a unified supply of water, gas, etc. to all connected process chambers 20, simplifying the piping layout and resource allocation of the entire semiconductor device. Therefore, the semiconductor device of this utility model embodiment achieves a high degree of integration and rapid docking of the process chambers 20 and the integrated piping supply platform, improving the installation efficiency and reliability of piping connections in the semiconductor device, enhancing the integration and connection efficiency of the semiconductor device, and providing a clear and convenient solution for the complex fluid supply in the semiconductor device.

[0092] In this embodiment, the semiconductor device includes: a front-stage transmission cavity 30, which is spaced apart from the rear-stage transmission cavity 10; a process chamber 20, which is also arranged around the side of the front-stage transmission cavity 30; and a plurality of transition chambers 40, each of which is located between the front-stage transmission cavity 30 and the rear-stage transmission cavity 10.

[0093] By setting a transition chamber 40 between the front-stage transfer cavity 30 and the rear-stage transfer cavity 10, and with the process chamber 20 arranged around the sides of the front-stage transfer cavity 30 and the rear-stage transfer cavity 10, a complex, multi-region semiconductor structure is formed. The transition chamber 40 mainly serves as a wafer transfer center. For example, when a wafer is transferred from the robot in the rear-stage transfer cavity 10 to the robot in the front-stage transfer cavity 30, the wafer provided by the rear-stage transfer cavity 10 can be placed in the transition chamber 40 first, and then the robot in the front-stage transfer cavity 30 can take it away from the transition chamber 40. This achieves safe and efficient transfer of wafers between different regions. Therefore, this extended system architecture enhances the process compatibility and flow flexibility of semiconductor equipment, enabling the equipment to adapt to more complex semiconductor manufacturing process chains, which is conducive to improving the throughput and process integration capabilities of the overall production line.

[0094] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An integrated piping supply platform for semiconductor equipment, characterized in that, include: Platform entity; Auxiliary pipelines are installed on the main body of the platform; Process gas pipelines are installed on the main body of the platform and are vertically spaced from the auxiliary pipelines; A docking structure is disposed on the platform body, and the docking structure includes: The plant access window is used to connect the auxiliary pipelines and process gas pipelines to external facilities. The chamber docking window is used to connect with the corresponding pipeline interface of the process chamber.

2. The integrated pipeline supply platform as described in claim 1, characterized in that, The semiconductor device includes: a transmission chamber; The auxiliary pipeline includes: a plurality of phase-spaced auxiliary pipe units, which are arranged around the transmission chamber on the platform body; An auxiliary pipe connector is disposed between adjacent auxiliary pipe units, and the auxiliary pipe connector is connected to two adjacent auxiliary pipe units.

3. The integrated pipeline supply platform as described in claim 2, characterized in that, The auxiliary piping unit includes: a water pipe, a helium supply pipe, and a helium return pipe; The auxiliary pipe connection includes: a water pipe connection, connected to the water pipe; a helium supply pipe connection, connected to the helium supply pipe; and a helium return pipe connection, connected to the helium return pipe.

4. The integrated pipeline supply platform as described in claim 3, characterized in that, The integrated pipeline supply platform also includes: The first pipe fixing component is a plurality of the first pipe fixing components, which are arranged at intervals, and the first pipe fixing component fixes the auxiliary pipe to the platform body; The first pipeline fixing component includes: A first fixing seat is fixedly mounted on the platform body and has a first groove; a pipe partition is mounted on the first fixing seat and has a second groove at its bottom, the second groove and the first groove forming a first pipe channel through which the water pipe passes; and a third groove is provided at the top of the pipe partition. A pipe clamp is located at the top of the pipe block, and a fourth groove is provided at the bottom of the pipe clamp. The fourth groove and the third groove form a second pipeline channel for the helium supply pipeline to pass through.

5. The integrated pipeline supply platform as described in claim 4, characterized in that, The first pipeline fixing component also includes: The fifth groove is located on top of the first fixing base; The tube spacer is located on top of the first fixing seat and cooperates with the fifth groove to form a helium channel through which the helium return pipeline passes.

6. The integrated pipeline supply platform as described in claim 3, characterized in that, The integrated pipeline supply platform also includes: Multiple branch return water pipes, each of which is connected to one of the process chambers, are used to draw return water from the process chambers, and each of the multiple branch return water pipes guides the return water to the outside of the platform body.

7. The integrated pipeline supply platform as described in claim 1, characterized in that, The semiconductor device includes: a transmission chamber; The process gas pipeline includes: multiple spaced-apart gas pipe units, which are arranged around the transmission chamber on the platform body; the number of gas pipe units is two, and the gas pipe unit closer to the plant docking window has a semi-circular structure, while the gas pipe unit farther from the plant docking window has a full-circular structure. A gas tube connector is disposed between adjacent gas tube units, and the gas tube connector is connected to two adjacent gas tube units.

8. The integrated pipeline supply platform as described in claim 1, characterized in that, The integrated pipeline supply platform also includes: The second pipeline fixing component is a plurality of the second pipeline fixing components and is arranged at intervals. The second pipeline fixing component fixes the process gas pipeline to the platform body. The second pipeline fixing component includes: The second fixing seat has a first mounting groove on its top. Multiple fixing blocks are stacked on top of the second fixing base, and each fixing block has a second mounting groove at its top and bottom; The second mounting groove at the bottom of the lowest fixing block and the first mounting groove at the top of the second fixing seat cooperate to form a pipe receiving hole for fixing the corresponding pipeline in the process gas pipeline; and in two adjacent fixing blocks stacked together, the second mounting groove at the bottom of the upper fixing block and the second mounting groove at the top of the lower fixing block cooperate to form a pipe receiving hole for fixing the process gas pipeline.

9. The integrated pipeline supply platform as described in claim 1, characterized in that, The chamber docking window includes a network interface; The integrated pipeline supply platform also includes: Multiple network communication lines are installed on the platform body, with one end of each network communication line connected to the network interface in the corresponding chamber docking window; A switch is installed on the main body of the platform, and the other end of each of the network communication lines is connected to a corresponding port of the switch; The front-end transmission module and the host computer are installed on the main body of the platform. The front-end transmission module is connected to the host computer and communicates with the switch.

10. A semiconductor device, characterized in that, include: Post-transmission cavity; Multiple process chambers are arranged around the side of the subsequent transmission chamber, and each process chamber includes a docking window; The integrated pipeline supply platform according to any one of claims 1 to 9, wherein the chamber docking window of the integrated pipeline supply platform docks with each chamber docking window.

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