Air conditioner control panel, electric control box and air conditioner

Abstract

The utility model discloses an air conditioner control panel, an electric control box and an air conditioner. The air conditioner control panel comprises a substrate, and the substrate is provided with a power input end, a power input circuit, a PFC rectifying circuit, an inverter circuit and a power output end. Wherein the power supply input end, the power supply input circuit, the PFC rectifying circuit, the inverter circuit and the power supply output end are connected in sequence; and a conductive path formed by connecting the inverter circuit and the power supply output end extends on the substrate in a trend of being far away from the PFC rectifying circuit. The working stability and reliability of the air conditioner control panel are effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of circuit board design, and more particularly to an air conditioner control board, electrical control box, and air conditioner. Background Technology

[0002] Air conditioner control boards often incorporate multiple voltage processing circuits, such as filter circuits, PFC circuits, and inverter circuits. However, because the voltage signals in these different circuits have varying frequencies and significant differences (e.g., the simultaneous presence of ultra-high frequency and high frequency signals), severe electromagnetic interference can easily occur when these circuits are integrated onto the same control board. This affects the reliability and stability of the control board, and consequently, the reliability and stability of the entire air conditioner. Utility Model Content

[0003] The main purpose of this application is to provide an air conditioner control board, an electrical control box, and an air conditioner, with the aim of improving the stability and reliability of the air conditioner control board.

[0004] To achieve the above objectives, this application proposes an air conditioner control board, comprising:

[0005] A substrate, wherein a power input terminal, a power input circuit, a PFC rectifier circuit, an inverter circuit and a power output terminal are disposed on the substrate;

[0006] The power input terminal, power input circuit, PFC rectifier circuit, inverter circuit and power output terminal are connected in sequence; the conductive path formed by the connection of the inverter circuit and the power output terminal extends on the substrate in a direction away from the PFC rectifier circuit.

[0007] Optionally, the PFC rectifier circuit, the inverter circuit, and the power output terminal are arranged on the substrate along the length direction of the substrate;

[0008] The power input circuit, the PFC rectifier circuit, the inverter circuit, and the power output terminal are arranged on the substrate along the length of the substrate; the power input terminal is located near the power input circuit, and the power output terminal is located near the inverter circuit.

[0009] Optionally, the power input circuit includes an EMI filter circuit, and the EMI filter circuit, the PFC rectifier circuit, and the inverter circuit are arranged in parallel along the length of the substrate.

[0010] Optionally, the PFC rectifier circuit includes a rectifier bridge module;

[0011] On the substrate, a first electrical path is provided between the first input terminal of the rectifier bridge module and the first output terminal of the EMI filter circuit, and a second electrical path is provided between the second input terminal of the rectifier bridge module and the second output terminal of the EMI filter circuit.

[0012] In this configuration, at least one segment of the first electrical path is parallel to the projection of at least one segment of the second electrical path onto the plane of the substrate.

[0013] Optionally, the substrate has at least one wiring layer, and two parallel paths in the first electrical path and the second electrical path are simultaneously disposed on the same wiring layer of the substrate; or,

[0014] The substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate.

[0015] Optionally, two parallel paths in the first electrical path and the second electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other.

[0016] Optionally, the EMI filter circuit includes a common-mode inductor; the PFC rectifier circuit includes a PFC circuit and a rectifier bridge module, wherein the PFC circuit includes a PFC inductor and multiple power devices;

[0017] The common-mode inductor, the PFC inductor, and the rectifier bridge module are arranged in parallel along the length of the substrate on the substrate; a plurality of the power devices are arranged on the substrate near the PFC inductor or near the rectifier bridge module.

[0018] Optionally, the PFC circuit includes a PFC inductor; the PFC inductor and the rectifier bridge module are arranged in parallel along the length of the substrate on the substrate.

[0019] The first electrical path has a first segment, a second segment, and a third segment connected to each other. The first segment of the first electrical path extends from the first output terminal of the EMI filter circuit along the width direction of the substrate. The second segment of the first electrical path is arranged along the length direction of the substrate. The third segment of the first electrical path is arranged along the width direction of the substrate and connected to the first input terminal of the rectifier bridge module.

[0020] The second electrical path has a first segment, a second segment, and a third segment connected to each other. The first segment of the second electrical path extends from the second output terminal of the EMI filter circuit along the width direction of the substrate. The second segment of the second electrical path is arranged along the length direction of the substrate. The third segment of the second electrical path is arranged along the width direction of the substrate and connected to the second input terminal of the rectifier bridge module.

[0021] The projections of the second segment of the first electrical path and the second segment of the second electrical path on the plane where the substrate is located are parallel to each other, and are disposed on the substrate from the position corresponding to the PFC inductor.

[0022] Optionally, the second segment of the first electrical path and the second segment of the second electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of their projections on the plane of the substrate overlap each other.

[0023] Optionally, the plurality of power devices include a power transistor module, a diode module, and an electrolytic capacitor, wherein the PFC inductor and the electrolytic capacitor are arranged in parallel along the width direction of the substrate;

[0024] The rectifier bridge module and the power transistor module are arranged in parallel along the length of the substrate, and the rectifier bridge module and the diode module are arranged in parallel along the width of the substrate.

[0025] Alternatively, the diode module, the power transistor module, and the rectifier bridge module are arranged in parallel along the length of the substrate.

[0026] Optionally, the positive output terminal of the rectifier bridge module is electrically connected to the positive terminal of the electrolytic capacitor via the PFC inductor and the diode module, the negative output terminal of the rectifier bridge module is connected to the negative terminal of the electrolytic capacitor, the first conducting terminal of the power transistor module is connected to the common terminal of the PFC inductor and the diode module, and the second conducting terminal of the power transistor module is connected to the negative output terminal of the rectifier bridge module.

[0027] On the substrate, a third electrical path is provided between the negative output terminal of the rectifier bridge module, the second conducting terminal of the power transistor, and the negative terminal of the electrolytic capacitor; a fourth electrical path is provided between the PFC inductor, the anode of the diode module, and the first conducting terminal of the power transistor; and a fifth electrical path is provided between the cathode of the diode module and the positive terminal of the electrolytic capacitor.

[0028] Wherein, at least one segment of the fourth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane where the substrate is located; and / or, at least one segment of the fifth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane where the substrate is located.

[0029] Optionally, if at least one segment of the fourth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane of the substrate; the substrate has at least one wiring layer, and the two segments of the fourth electrical path that are parallel to each other and the third electrical path are simultaneously disposed on the same wiring layer of the substrate; or, the substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate.

[0030] In the case where at least one segment of the fifth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane of the substrate; the substrate has at least one wiring layer, and two segments of the fifth electrical path and the third electrical path that are parallel to each other are simultaneously disposed on the same wiring layer of the substrate; or, the substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate.

[0031] Optionally, the two parallel paths in the fourth electrical path and the third electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other.

[0032] The two parallel paths in the fifth electrical path and the third electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other.

[0033] Optionally, the third electrical path has a first segment, a second segment, and a third segment. The first segment of the third electrical path extends from the negative terminal of the electrolytic capacitor along the width direction of the substrate and is connected to the second segment of the third electrical path. The second segment of the third electrical path extends along the length direction of the substrate and is connected to the second conducting terminal of the power transistor. The third segment of the third electrical path extends from the negative output terminal of the rectifier bridge module along the width direction and is electrically connected to the second segment of the third electrical path.

[0034] The fourth electrical path has a first segment and a second segment. The first segment of the fourth electrical path extends from the second end of the PFC inductor along the length direction of the substrate and is connected to the first conducting end of the power transistor. The second segment of the fourth electrical path extends from the anode of the diode module along the width direction of the substrate and is electrically connected to the first segment of the fourth electrical path.

[0035] The fifth electrical path extends from the cathode of the diode module along the length of the substrate to connect with the positive terminal of the electrolytic capacitor;

[0036] The projections of the second segment of the third electrical path, the first segment of the fourth electrical path, and the fifth electrical path onto the plane of the substrate are arranged parallel to each other.

[0037] Optionally, the second segment of the third electrical path is disposed on the substrate from the position corresponding to the PFC inductor, the rectifier bridge module and the power transistor module;

[0038] The rectifier bridge module and the power transistor module are arranged in parallel along the length direction of the substrate, and the rectifier bridge module and the diode module are arranged in parallel along the width direction of the substrate; on the substrate, the first segment of the fourth electrical path is arranged to pass through the area between the rectifier bridge module and the diode module.

[0039] Optionally, the positive and negative terminals of the electrolytic capacitor are arranged along the length of the substrate, so that the projections of the first segment of the third electrical path and the fifth electrical path on the substrate intersect.

[0040] Optionally, the first electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; the second electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate.

[0041] Optionally, the third electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; the fourth electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; and the fifth electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate.

[0042] Optionally, the EMI filter circuit further includes a first safety X / Y capacitor, and the power input circuit further includes a protection circuit.

[0043] The first safety X / Y capacitor, the common-mode inductor of the EMI filter circuit, and the protection circuit are disposed on the substrate along the width direction of the substrate; the protection circuit includes a lightning protection circuit, a second safety X / Y capacitor, and an anti-intrusion current circuit disposed on the substrate along the width direction of the substrate.

[0044] Optionally, the substrate is provided with a first region and a second region along the length direction, and the second region is provided with a third region and a fourth region along the width direction of the substrate. The first region and the third region are high-voltage circuit regions, and the fourth region is a low-voltage circuit region.

[0045] The air conditioner control board also includes a low-voltage circuit, which includes a switching power supply circuit and a control circuit. The switching power supply circuit is electrically connected to the PFC rectifier circuit and the control circuit, respectively. The control circuit is electrically connected to the PFC rectifier circuit and the inverter circuit, respectively.

[0046] The switching power supply circuit and control circuit are located in the fourth zone; the inverter circuit, the rectifier bridge module, diode module and power transistor module of the PFC rectifier circuit are located in the third zone; the power input circuit, the electrolytic capacitor and PFC inductor of the PFC rectifier circuit are located in the first zone.

[0047] Optionally, a moisture-proof oil is coated on the substrate corresponding to the low-voltage circuit area.

[0048] Optionally, the air conditioner control board further includes multiple interfaces, which are arranged along the edge of the substrate.

[0049] Optionally, the substrate has a first side and a second side opposite to each other along the length direction, and a third side and a fourth side opposite to each other along the width direction. The control circuit and the switching power supply circuit are arranged in parallel along the length direction on the substrate and are adjacent to the fourth side. The power input circuit includes an EMI filter circuit.

[0050] In this circuit, the common-mode inductor of the EMI filter circuit, the PFC inductor, the rectifier bridge module, the power transistor module, and the inverter circuit are sequentially arranged along the first to the second side of the substrate, and adjacent to the third side; the diode module is disposed on the substrate in the region of the rectifier bridge module away from the third side; the switching power supply circuit is disposed adjacent to the electrolytic capacitor of the PFC rectifier circuit and the diode module; the electrolytic capacitor is disposed on the substrate in the region of the PFC inductor away from the third side; the PFC inductor is also connected to the... The diode module and the rectifier bridge module are arranged adjacent to each other; the first power module and the second power module of the inverter circuit are arranged sequentially from the first side to the second side of the substrate and adjacent to the third side, the second power module is arranged adjacent to the second side of the substrate, and the first power module is arranged adjacent to the power transistor module and the control circuit respectively; the first safety X / Y capacitor of the EMI filter circuit is disposed on the substrate in the region between the third side and the common mode inductor, and the first safety X / Y capacitor is arranged adjacent to the common mode inductor and the PFC inductor respectively;

[0051] Alternatively, the common-mode inductor, PFC inductor, diode module, power transistor module, rectifier bridge module, and inverter circuit of the EMI filter circuit are arranged sequentially from the first side to the second side of the substrate, and adjacent to the third side; the switching power supply circuit is arranged adjacent to the electrolytic capacitor and diode module of the PFC rectifier circuit; the electrolytic capacitor is disposed on the substrate in the region of the PFC inductor away from the third side; the PFC inductor is arranged adjacent to the diode module; the first power module and the second power module of the inverter circuit are arranged in parallel from the third side to the fourth side of the substrate, the first power module is arranged adjacent to the rectifier bridge module and the second side of the substrate, and the second power module is arranged adjacent to the control circuit and the fourth side of the substrate; the first safety X / Y capacitor of the EMI filter circuit is disposed on the substrate in the region of the common-mode inductor away from the third side, and the first safety X / Y capacitor is arranged adjacent to the common-mode inductor and the PFC inductor.

[0052] Optionally, the power input terminal is disposed on a first side of the substrate adjacent to the substrate; the power output terminal includes a fan interface and a compressor interface disposed adjacent to a second side of the substrate.

[0053] The power input circuit includes a protection circuit. The power input terminal, the surge protection circuit of the protection circuit, the second safety X / Y capacitor, and the anti-inrush current circuit are arranged sequentially along the first side to the second side of the substrate. The EMI filter circuit is arranged adjacent to the power input terminal, the surge protection circuit, the second safety X / Y capacitor, and the anti-inrush current circuit, respectively. The anti-inrush current circuit is arranged adjacent to the electrolytic capacitor.

[0054] Optionally, the air conditioner control board further includes a heat dissipation component; the heat dissipation component is attached to the inverter circuit, the rectifier bridge module, the diode module, and the power transistor module.

[0055] Optionally, the aspect ratio of the heat dissipation component is 2:1.

[0056] Optionally, the length of the substrate is less than or equal to 350 mm, and the width of the substrate is less than or equal to 250 mm.

[0057] Optionally, the aspect ratio of the substrate is 2:1.

[0058] This application also proposes an electrical control box, including a box body and an air conditioner control board as described in any of the above claims, wherein the air conditioner control board is disposed within the box body;

[0059] The base plate of the air conditioner control board has multiple heat dissipation areas, and the housing is provided with a corresponding air duct for each heat dissipation area.

[0060] Optionally, the heat dissipation area has a first heat dissipation area, a second heat dissipation area, and a third heat dissipation area; the base plate of the air conditioner control board has a first side and a second side opposite to each other along the length direction, and a third side and a fourth side opposite to each other along the width direction; the first heat dissipation area and the second heat dissipation area are arranged in parallel in sequence along the direction from the third side to the fourth side of the base plate, the third heat dissipation area and the first heat dissipation area are arranged in sequence along the direction from the first side to the second side of the base plate, and the third heat dissipation area and the second heat dissipation area are arranged in sequence along the direction from the first side to the second side of the base plate;

[0061] A first air duct corresponding to the first heat dissipation area and a third air duct corresponding to the third heat dissipation area extend along the width direction of the substrate, and a second air duct corresponding to the second heat dissipation area extends along the length direction of the substrate; the ventilation volume of the first air duct is greater than the ventilation volume of the third air duct; and / or, the ventilation volume of the third air duct is greater than the ventilation volume of the second air duct.

[0062] The power input terminal, power input circuit, PFC inductor, and electrolytic capacitor of the air conditioner control board are located in the third heat dissipation area; the diode module, power transistor module, rectifier bridge module, and inverter circuit of the air conditioner control board are located in the first heat dissipation area; and the switching power supply circuit, control circuit, and power output terminal of the air conditioner control board are located in the second heat dissipation area.

[0063] Alternatively, the power input terminal, power input circuit, PFC inductor, and electrolytic capacitor of the air conditioner control board are located in the third heat dissipation area; the diode module, power transistor module, rectifier bridge module, and first power module of the air conditioner control board are located in the first heat dissipation area; and the switching power supply circuit, control circuit, second power module, and power output terminal of the air conditioner control board are located in the second heat dissipation area.

[0064] This application also proposes an air conditioner, including a housing and an electrical control box as described in any of the above claims;

[0065] The inner cavity of the housing is divided into a compressor cavity and a fan cavity by a middle partition; an air inlet is provided on the housing, and the air inlet, the compressor cavity and the fan cavity form an air intake path;

[0066] The electrical control box is located on the air intake path.

[0067] This application discloses an air conditioner control board, comprising: a substrate, on which a power input terminal, a power input circuit, a PFC rectifier circuit, an inverter circuit, and a power output terminal are disposed. The power input terminal, power input circuit, PFC rectifier circuit, inverter circuit, and power output terminal are connected sequentially; the conductive path formed by the connection between the inverter circuit and the power output terminal extends on the substrate away from the PFC rectifier circuit. This arrangement effectively reduces electromagnetic interference from the ultra-high frequency voltage signal in the PFC rectifier circuit to high frequency voltage signals, as the high-frequency voltage signal output by the inverter circuit gradually moves further away from the PFC rectifier circuit during transmission along the conductive path.

[0068] Meanwhile, the higher the frequency of the ultra-high frequency signal in the PFC rectifier circuit, the greater its impact on high-frequency signals. The aforementioned circuit layout effectively reduces the influence of the ultra-high frequency voltage signal in the PFC rectifier circuit on the high-frequency voltage signal. In other words, this circuit setup, to a certain extent, meets the needs of air conditioner control board software developers to appropriately increase the signal frequency of the PFC rectifier circuit, for example, increasing the frequency from 50kHz to 70kHz. It should be noted that for the PFC rectifier circuit, the higher the internal voltage signal frequency, the smaller the volume of the high-frequency inductor and electrolytic capacitor required in the circuit, thus reducing the area occupied by the PFC rectifier circuit on the substrate. The reduced area occupied by the PFC rectifier circuit on the substrate further reduces the area of ​​its internal electrical signal loop, thereby further reducing the electromagnetic interference it generates.

[0069] Therefore, in summary, the circuit layout of the air conditioner control board described in this application not only reduces the interference of the PFC rectifier circuit on the output signal of the inverter circuit, thereby improving the stability and reliability of the air conditioner control board, but also provides a basis and possibility for improving the frequency of the PFC rectifier circuit, reducing the circuit area of ​​the PFC rectifier circuit, and reducing the overall area of ​​the air conditioner control board. This is beneficial for improving the reliability, stability, and integration of the air conditioner control board. Attached Figure Description

[0070] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0071] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0072] Figure 1 This is a schematic diagram of the structure of an embodiment of the air conditioner control board of this application;

[0073] Figure 2 This is a schematic diagram of the substrate layout of an embodiment of the air conditioner control board of this application;

[0074] Figure 3 For the air conditioner control board of this application Figure 2 The diagram shows a three-dimensional schematic diagram and an air intake schematic diagram of the embodiment shown;

[0075] Figure 4 This is a schematic diagram of the substrate layout of another embodiment of the air conditioner control board of this application;

[0076] Figure 5 For the air conditioner control board of this application Figure 4 The diagram shows a three-dimensional schematic diagram and an air intake schematic diagram of the embodiment shown;

[0077] Figure 6 This is a schematic diagram of the aspect ratio and temperature simulation of the heat dissipation component inside the air conditioner control board of this application;

[0078] Figure 7 This is a schematic diagram of the structure of an embodiment of the air conditioner of this application;

[0079] Figure 8 This is a schematic diagram of the structure of the control box equipped with the control board of the air conditioner according to one embodiment of the present application;

[0080] Figure 9 This is a schematic diagram of the air ducts inside an air conditioner according to one embodiment of the present application, which are formed by the electrical control box, forming a first air duct, a second air duct, and a third air duct.

[0081] Figure 10 For the air conditioner control board of this application Figure 2 The diagram shows a heat dissipation area and an air duct inside the electrical control box in the embodiment shown.

[0082] Figure 11 For the air conditioner control board of this application Figure 4 The diagram shows a heat dissipation area and an air duct inside the electrical control box in the embodiment shown.

[0083] Figure 12 For the air conditioner control board of this application Figure 2 The diagram shows the structure of the first electrical path in the embodiment shown.

[0084] Figure 13 For the air conditioner control board of this application Figure 2 The diagram shows the structure of the second electrical path in the embodiment shown.

[0085] Figure 14 For the air conditioner control board of this application Figure 2 The schematic diagram of the first and second electrical paths in the embodiment shown;

[0086] Figure 15 For the air conditioner control board of this application Figure 2 The schematic diagram of the third electrical path corresponding to a portion of the circuit in the illustrated embodiment;

[0087] Figure 16 For the air conditioner control board of this application Figure 2 The schematic diagrams of the fourth and fifth electrical paths in some circuits of the illustrated embodiment are shown.

[0088] Figure 17 For the air conditioner control board of this application Figure 2 The illustrated embodiment shows schematic diagrams of the third, fourth, and fifth electrical paths in some circuits.

[0089] Figure Labels

[0090]

[0091]

[0092] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0093] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0094] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0095] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0096] Air conditioner control boards often incorporate multiple voltage processing circuits, such as input filter circuits, PFC rectifier circuits, and inverter circuits. However, because the voltage signals in these circuits have varying frequencies and significant differences (e.g., both ultra-high frequency and high frequency signals may coexist), the simultaneous presence of these different voltage processing circuits on the same control board can easily lead to severe electromagnetic interference. This affects the reliability and stability of the control board, and consequently, the reliability and stability of the entire air conditioner.

[0097] Therefore, refer to Figure 1 This application proposes an air conditioner control board, including: a base plate 00, on which a power input terminal 10, a power input circuit 20, a PFC rectifier circuit 30, an inverter circuit 40 and a power output terminal 50 are disposed;

[0098] The power input terminal 10, power input circuit 20, PFC rectifier circuit 30, inverter circuit 40 and power output terminal 50 are connected in sequence; the conductive path formed by the connection of inverter circuit 40 and power output terminal 50 is arranged on the substrate 00 in a trend away from PFC rectifier circuit 30.

[0099] In this embodiment, the air conditioner control board processes the external voltage and outputs it to the corresponding electrical equipment inside the air conditioner. It also adjusts the operating status of the corresponding electrical equipment by controlling the parameters of the output voltage. The power input terminal 10, power input circuit 20, PFC rectifier circuit 30, inverter circuit 40, and power output terminal 50 can all be located on the same side of the substrate 00, or they can be located on different sides of the substrate 00. Optionally, the substrate 00 can be made of copper substrate 00, aluminum substrate 00, fiberglass board, etc. Optionally, the power input terminal 10 and power output terminal 50 can be implemented using a standard interface, or using pads on the substrate 00 for soldering external electrical connection lines; wherein, the power input terminal 10 is used to connect to an external power supply, such as mains power. Optionally, the power input circuit 20 processes the voltage connected to the power input terminal 10 and outputs it, for example, through filtering; furthermore, the power input circuit 20 may also include a protection circuit 22 to provide circuit protection, such as lightning protection and overcurrent protection. Optionally, the PFC rectifier circuit 30 includes a rectifier circuit and a PFC circuit. The rectifier circuit is used to rectify the external power supply connected to the power input terminal 10 and output it. After voltage processing by the PFC circuit, such as voltage processing by the PFC boost circuit, it is output to the inverter circuit 40 to improve the overall power factor and improve the overall power utilization rate. Optionally, the inverter circuit 40 can be implemented using multiple power modules. The inverter circuit 40 is used to invert the DC voltage output by the PFC rectifier circuit 30 and output it through the power output terminal 50 to other electrical equipment in the air conditioner, such as the compressor, motor, etc. in the air conditioner, to supply power to the external electrical equipment and control the working status of the electrical equipment.

[0100] It's important to understand that on the air conditioner control board, the voltage flowing through the power input circuit 20, such as mains voltage, is generally a low-frequency voltage. The voltage signal processed in the PFC rectifier circuit 30 is an ultra-high-frequency voltage signal, such as 60kHz or 70kHz. The voltage signal output by the inverter circuit 40 is a high-frequency voltage signal, such as 5kHz or 6kHz. In other words, on the entire substrate 00, there are simultaneously low-frequency circuit modules, high-frequency circuit modules, and ultra-high-frequency circuit modules, corresponding to low-frequency voltage signals, high-frequency voltage signals, and ultra-high-frequency voltage signals. However, during the actual operation of the above circuits on the air conditioner control board, the ultra-high-frequency voltage signal will cause interference to be trapped between the other two through electromagnetic field coupling. Especially for the high-frequency voltage signal output by the inverter circuit 40, which is directly output to the electrical equipment inside the air conditioner via the power output terminal 50, if the ultra-high-frequency voltage signal causes too much electromagnetic interference to this high-frequency voltage signal, it will easily affect the working state of the electrical equipment, and may even cause abnormal operation of the electrical equipment.

[0101] Therefore, in this application, in order to reduce the electromagnetic interference of ultra-high frequency voltage signals on the high frequency voltage signals output by the inverter circuit 40, when the designer arranges the positions of the above-mentioned circuit modules on the substrate 00 and lays the transmission paths between them, such as lead frames, copper traces on the substrate 00, etc., the conductive path formed by the connection between the inverter circuit 40 and the power output terminal 50 will be extended on the substrate 00 in a trend away from the PFC rectifier circuit 30.

[0102] Optionally, refer to Figure 1 In one embodiment, the PFC rectifier-inverter circuit 40, the inverter circuit 40, and the power output terminal 50 are disposed on the substrate 00 along the length direction of the substrate 00.

[0103] In this embodiment, the substrate 00 has a length direction and a width direction, which are perpendicular to each other. The dimension of the substrate 00 in the length direction can be greater than or equal to the dimension in the width direction, or it can be smaller than the dimension in the width direction; no limitation is made here. (Reference) Figure 1It is understood that the PFC rectifier-inverter circuit 30, the inverter circuit 40, and the power output terminal 50 are arranged on the substrate 00 along the length direction of the substrate 00. Optionally, any two adjacent PFC rectifier circuits 30, inverter circuits 40, and power output terminals 50 in the length direction may have a partially overlapping area in the width direction, or they may not have an overlapping area. Since the PFC rectifier circuit 30, inverter circuit 40, and power output terminal 50 are arranged along the length direction of the substrate 00, and the energy is output from the PFC rectifier circuit 30 to the inverter circuit 40 and then to the power output terminal 50, when the designer arranges the conductive path between the inverter circuit 40 and the power output terminal 50, it can be directly led out from the output terminal of the inverter circuit 40 and extended away from the PFC rectifier circuit 30 to the power output terminal 50. With this configuration, the high-frequency voltage signal output by the inverter circuit 40 will gradually move further and further away from the PFC rectifier circuit 30 as it is transmitted along the conductive path. Therefore, the electromagnetic interference of the ultra-high frequency voltage signal in the PFC rectifier circuit 30 to the high-frequency voltage signal can be effectively reduced.

[0104] Meanwhile, as mentioned above, the higher the frequency of the ultra-high frequency signal in the PFC rectifier circuit 30, the greater its impact on the high-frequency signal. However, the circuit layout described above effectively reduces the impact of the ultra-high frequency voltage signal in the PFC rectifier circuit 30 on the high-frequency voltage signal. In other words, the circuit setup, to a certain extent, meets the needs of software developers of the air conditioner control board to appropriately increase the signal frequency in the PFC rectifier circuit 30, for example, increasing the frequency from 50kHz to 70kHz. It should be noted that for the PFC rectifier circuit 30, the higher the frequency of the internal voltage signal, the smaller the volume of the high-frequency inductor and electrolytic capacitor 312 required in the circuit, thus reducing the area occupied by the PFC rectifier circuit 30 on the substrate 00. The reduced area occupied by the PFC rectifier circuit 30 on the substrate 00 further reduces the area of ​​its internal electrical signal loop, thereby further reducing the electromagnetic interference it brings.

[0105] Therefore, in summary, the circuit layout of the air conditioner control board described in this application not only reduces the interference of the PFC rectifier circuit 30 on the output signal of the inverter circuit 40, thereby improving the stability and reliability of the air conditioner control board, but also provides a basis and possibility for improving the frequency of the PFC rectifier circuit 30, reducing its circuit area, and reducing the overall area of ​​the air conditioner control board. This is beneficial for improving the reliability, stability, and integration of the air conditioner control board.

[0106] Optionally, in one embodiment, in conjunction with any of the above and following embodiments, refer to Figures 2-4The air conditioner control board also includes multiple interfaces, which are arranged along the edge of the base plate 00. These interfaces are used to connect external devices, such as external communication modules, heating modules, external motors, and external sensors. It is understood that arranging the interfaces along the board edge effectively reduces the wiring length of external devices, facilitating wiring for these devices.

[0107] Optionally, in one embodiment, in combination with any of the above and following embodiments, the length of the substrate 00 is less than or equal to 350 mm, and the width of the substrate 00 is less than or equal to 250 mm. Furthermore, the aspect ratio of the substrate 00 is 2:1. It is understood that a length twice the width is beneficial for device arrangement, thereby achieving a balance between reasonable device arrangement and the size of the substrate 00.

[0108] refer to Figure 1 In one embodiment of this application, the power input circuit 20, the PFC rectifier circuit 30, the inverter circuit 40 and the power output terminal 50 are disposed on the substrate 00 along the length direction of the substrate 00; the power input terminal 10 is disposed near the power input circuit 20 and the power output terminal 50 is disposed near the inverter circuit 40.

[0109] Based on the above-mentioned PFC rectifier circuit 30, inverter circuit 40, and power output terminal 50 being arranged along the length direction of the substrate 00, in this embodiment, the power input circuit 20 is also arranged along the length direction of the substrate 00 along with the above-mentioned circuits. With this arrangement, since the power input circuit 20 and inverter circuit 40 are spaced apart by the PFC rectifier circuit 30 along the length direction, i.e., spaced far apart from each other, when the power input terminal 10 is located near the power input circuit 20 and the power output terminal 50 is located near the inverter circuit 40, the power input terminal 10 and the power output terminal 50 will also be spaced far apart on the substrate 00, thereby reducing the interference of the high-frequency voltage signal output by the power output terminal 50 on the low-frequency voltage signal input to the power input terminal 10. For example, refer to... Figure 2 and Figure 4 In the circuit, the power input terminal 10 includes a power input interface, and the power output terminal 50 includes a fan interface and a compressor interface. The power input interface is located on one side of the substrate 00 and is close to the power input circuit 20. The fan interface and compressor interface are located on the other side of the substrate 00 and are close to the inverter circuit 40. In this way, the high-frequency voltage signal of the output line of the fan interface and compressor interface will not be coupled to the low-frequency voltage signal of the input line connected to the power input terminal, realizing the zero magnetic ring effect of the input line, thereby effectively improving the stability and reliability of the air conditioner control board.

[0110] Meanwhile, through the above settings, it can be confirmed that when the air conditioner control board starts working, since the power input circuit 20, PFC rectifier circuit 30, and inverter circuit 40 are arranged along the length direction, the electrical signal energy flow from the power input terminal 10 to the power output terminal 50 is also transmitted along the length direction on the board, and will not be interspersed back and forth along the length or width direction on the substrate 00. This not only reduces the electromagnetic interference between the internal circuits, but also reduces the electromagnetic interference of the entire circuit to other circuits on the air conditioner control board, such as the low-voltage circuit mentioned in the following embodiment, further improving the stability and reliability of the air conditioner control board, and thus improving the stability and reliability of the air conditioner.

[0111] Furthermore, optionally, in one embodiment, reference is made to Figures 2-4 The power input circuit 20 includes an EMI filter circuit 21, and the EMI filter circuit 21 and the PFC rectifier circuit 30 are arranged in parallel along the length direction of the substrate 00.

[0112] In this embodiment, the EMI filter circuit 21 and the PFC rectifier circuit 30 are electrically connected. The voltage input to the power input terminal 10 is filtered by the EMI filter circuit 21 and then output to the PFC rectifier circuit 30. It is understood that arranging them in parallel effectively reduces the distance of the transmission path between them, and also reduces the number of bends in the transmission path, thereby effectively ensuring the quality of the signal transmitted between the EMI filter circuit 21 and the PFC rectifier circuit 30. Furthermore, since the EMI filter circuit 21 and the PFC rectifier circuit 30 are arranged in parallel, there is no obstruction between them, which effectively improves the overall heat dissipation efficiency. For example, refer to... Figure 4 , Figure 6 and Figures 8-11 In the following embodiments, when the air conditioner control board is disposed in the air intake path inside the air conditioner, when the air blown along the width direction of the substrate 00 blows toward the substrate 00, it can simultaneously act on the EMI filter circuit 21 and the PFC rectifier circuit 30. There is no air intake obstruction between the two, which effectively ensures the heat dissipation efficiency of both.

[0113] Optionally, refer to Figure 2 and Figure 4 In one embodiment, the EMI filter circuit 21 includes a common-mode inductor 211; the PFC rectifier circuit 30 includes a PFC circuit and a rectifier bridge module 32, the PFC circuit includes a PFC inductor 311 and a plurality of power devices; wherein, the common-mode inductor 211, the PFC inductor 311 and the rectifier bridge module 32 are arranged in parallel along the length direction of the substrate 00; the plurality of power devices are arranged on the substrate 00 near the PFC inductor 311 or near the rectifier bridge module 32.

[0114] In this embodiment, multiple power devices include an electrolytic capacitor 312, a power transistor module 313, and a diode module 314. The PFC circuit boosts the DC voltage output from the rectifier circuit using these power devices and the PFC inductor 311 before outputting it. The first terminal of the electrolytic capacitor 312 is the positive output terminal of the PFC circuit, and the second terminal is the negative output terminal. The voltage output by the PFC circuit is the DC bus voltage, and the electrolytic capacitor 312 is the bus capacitor. On the substrate 00, the multiple power devices are positioned close to the PFC inductor 311 or close to the rectifier bridge module 32. This arrangement reduces the area occupied by the internal loops of the entire PFC rectifier circuit 30, thereby effectively reducing electromagnetic interference generated by ultra-high frequency voltage signals in the PFC rectifier circuit 30. Meanwhile, by arranging the common-mode inductor 211, PFC inductor 311, multiple power devices, and rectifier bridge module 32 in parallel, the distance between passive devices (common-mode inductor 211, electrolytic capacitor 312, and PFC inductor 311) and active devices (rectifier bridge module 32, power transistor module 313, and diode module 314) can be effectively reduced. This ensures the quality of signal transmission between them while reducing the loop area of ​​high-frequency signals on the air conditioner control board, thereby effectively suppressing electromagnetic interference generated in the circuit and ensuring the reliability and stability of the entire air conditioner control board.

[0115] Furthermore, in one embodiment, reference is made to... Figure 2 and Figure 4 The PFC inductor 311 and electrolytic capacitor 312 are arranged in parallel along the width direction of the substrate 00. It is understood that since the electrolytic capacitor 312 is cylindrical and generates less heat than the PFC inductor 311, when the electrolytic capacitor 312 and PFC inductor 311 are arranged in parallel along the width direction and the air conditioner control board is located inside the air conditioner, the airflow used for cooling the board inside the air conditioner will first blow towards the electrolytic capacitor 312 and, due to the Coanda effect, pass along the circular surface of the electrolytic capacitor 312, thus concentrating the airflow towards the parallel-arranged PFC inductor 311. This optimizes the size of the air conditioner control board while satisfying the heat dissipation performance of the PFC inductor 311.

[0116] Optionally, in one embodiment, reference is made to... Figure 2 The rectifier bridge module 32 and the power transistor module 313 are arranged in parallel along the length of the substrate 00, and the rectifier bridge module 32 and the diode module 314 are arranged in parallel along the width of the substrate 00. This arrangement can further reduce the loop area of ​​the ultra-high frequency signal in the entire PFC rectifier circuit 30, thereby reducing the impact of electromagnetic interference generated by it.

[0117] Alternatively, in another embodiment, reference is made to... Figure 4 The diode module 314, power transistor module 313, and rectifier bridge module 32 are arranged in parallel along the length of the substrate 00. This arrangement ensures that when the air conditioner control board is cooled through the air duct within the air conditioner, the parallel arrangement of the diode module 314, power transistor module 313, and rectifier bridge module 32 does not interfere with each other's heat dissipation, effectively improving the heat dissipation efficiency of the PFC rectifier circuit 30. Furthermore, in the embodiments described below where a heat dissipation component 80 is provided, this layout allows for smoother surface contact between the heat dissipation component 80 and the surfaces of the multiple power devices, facilitating subsequent production and assembly.

[0118] In summary, during the actual operation of the circuit, the ultra-high frequency electrical signal of the PFC rectifier circuit 30 will have two loops. One is the energy storage loop of the PFC inductor 311 when the power transistor module 313 is turned on: energy flows from the mains power → rectifier bridge → PFC inductor 311 → IGBT → rectifier bridge → mains power. The second is the energy release loop of the inductor when the power transistor module 313 is turned off: mains power → rectifier bridge → PFC inductor 311 → diode → high voltage electrolytic capacitor 312 → rectifier bridge → mains power. The above-mentioned devices and the circuit board traces connecting the above devices form the minimum loop, thereby effectively reducing the electromagnetic interference on the entire air conditioner control board.

[0119] Optionally, an embodiment based on the above-described EMI filter circuit 21 and PFC rectifier circuit 30 arranged in parallel along the length direction of the substrate 00. (See reference...) Figure 2 and Figure 4 In one embodiment of this application, the EMI filter circuit 21 further includes a first safety X / Y capacitor, and the power input circuit 20 further includes a protection circuit 22; wherein the first safety X / Y capacitor, the common mode inductor 211 and the protection circuit 22 are disposed on the substrate 00 along the width direction of the substrate 00.

[0120] In this embodiment, the protection circuit 22 can be implemented using a surge protection circuit, a second safety X / Y capacitor, and a surge current protection circuit, etc. The surge protection circuit, the second safety X / Y capacitor, and the surge current protection circuit are arranged on the substrate 00 along the width direction of the substrate 00. It is understood that the above-mentioned devices are relatively low in height and generate less heat during operation. Therefore, by arranging them along the width direction of the substrate 00 with the common-mode inductor 211, heat dissipation can be provided simultaneously for both the common-mode inductor 211 and the devices in the protection circuit 22 when there is an air duct in the air conditioner along the width direction of the substrate 00. Furthermore, compared to arranging them all along the length direction, this arrangement also provides room for improvement and optimization of the dimensions of the substrate 00 in the length direction, thereby helping to optimize the size of the air conditioner control board.

[0121] refer to Figure 2 and Figure 4In one embodiment of this application, the inverter circuit 40 and the PFC rectifier circuit 30 are arranged in parallel along the length direction of the substrate 00.

[0122] Based on the embodiment described above where the EMI filter circuit 21 and the PFC rectifier circuit 30 are arranged in parallel along the length of the substrate 00, it can be seen that in this embodiment, the EMI filter circuit 21, the PFC rectifier circuit 30, and the inverter circuit 40 are arranged in parallel along the length of the substrate 00. For the transmission path between the EMI filter circuit 21, the PFC rectifier circuit 30, and the inverter circuit 40, for example, in the design of copper traces on the substrate 00, the transmission path can be shortened as much as possible, especially the length of the transmission path between the PFC rectifier circuit 30 and the inverter circuit 40. Meanwhile, since the inverter circuit 40 and the PFC rectifier circuit 30 are arranged in parallel, the bends in the transmission path between them can be minimized. This allows the DC bus voltage signal output from the PFC rectifier circuit 30 to be transmitted to the inverter circuit 40 along a relatively straight path, effectively reducing EMI (Electromagnetic Interference) generated during power signal transmission and minimizing its impact on other circuits on the air conditioner control board. This indirectly improves the stability and reliability of the air conditioner control board. Furthermore, this arrangement effectively reduces the transmission impedance of the DC bus voltage signal, thereby reducing heat loss, reflection, and attenuation during transmission and ensuring the efficiency of the inverter circuit 40. Furthermore, it is understandable that since the inverter circuit 40 and the PFC rectifier circuit 30 are arranged in parallel along the length of the substrate 00, and both the inverter circuit 40 and the PFC rectifier circuit 30 are circuits that generate a lot of heat, when heat dissipation design is required for both on the air conditioner control board, the R&D personnel can set up only one heat sink to dissipate heat for both at the same time. Therefore, the above-mentioned parallel arrangement provides a reliable and feasible basis for reducing the structural complexity of the heat sink and reducing the volume of the heat sink in the air conditioner control board of this application.

[0123] Optionally, refer to Figure 4 In one embodiment, the inverter circuit 40 includes a first power module 41 and a second power module 42. The first power module 41 and the second power module 42 are arranged in parallel along the length direction of the substrate 00, so that in the subsequent heat sink design, it is convenient to use the same heat sink to dissipate heat on the two power modules at the same time, thereby indirectly reducing the size and structural complexity of the heat sink.

[0124] Optionally, refer to Figure 2In another embodiment, the first power module 41 and the second power module 42 are arranged in parallel along the width direction of the substrate 00. In practical circuit design, this provides more redundancy space for the power input circuit 20 and the PFC rectifier circuit 30 to be arranged in parallel along the length direction of the substrate 00. For example, refer to... Figure 2 Multiple power devices in the PFC circuit of the PFC rectifier circuit 30 can also be arranged in parallel with the rectifier bridge module 32 along the length of the substrate 00 on the substrate 00, so that they will not affect each other's heat dissipation effect. In the following embodiment, when the heat dissipation component 80 is provided, the heat dissipation component 80 can make more flat contact with the multiple power devices in the PFC circuit, which is beneficial to improving the efficiency of subsequent assembly.

[0125] It's important to understand that in actual air conditioner circuit board design, electrical paths are set on the substrate 00 to establish electrical connections between circuit modules. These electrical paths can include signal traces on the substrate 00, such as copper traces, conductive vias, conductive blind vias, conductive connectors, etc. The design of these electrical paths also has a significant impact on the circuit board's performance.

[0126] Optionally, based on the above-described power input circuit 20 including an EMI filter circuit 21, the EMI filter circuit 21, the PFC rectifier circuit 30, and the inverter circuit 40 are arranged in parallel along the length direction of the substrate 00, and the PFC rectifier circuit 30 includes a rectifier bridge module 32. (See also...) Figures 12-14 In one embodiment of this application, a first electrical path 100 is provided between the first input terminal of the rectifier bridge module 32 and the first output terminal of the EMI filter circuit 21 on the substrate 00, and a second electrical path 200 is provided between the second input terminal of the rectifier bridge module 32 and the second output terminal of the EMI filter circuit 21.

[0127] In this circuit, at least one segment of the first electrical path 100 is parallel to the projection of at least one segment of the second electrical path 200 onto the plane where the substrate 00 is located.

[0128] In this embodiment, the EMI filter circuit 21 outputs an electrical signal to the rectifier bridge module 32 via the first electrical path 100 and the second electrical path 200. For example, it filters the external AC voltage connected to the power input terminal 10 and outputs it to the rectifier bridge module 32 via the first electrical path 100 and the second electrical path 200, so that the rectifier bridge module 32 rectifies it before outputting it. It is understood that, as described above, the AC signal transmitted on the first electrical path 100 and the second electrical path 200 between the EMI filter circuit 21 and the rectifier bridge module 32 is an AC signal with a certain frequency. Therefore, both the first electrical path 100 and the second electrical path 200 will generate a certain magnetic field. Therefore, for paths in the first electrical path 100 and the second electrical path 200 whose projections on the plane where the substrate 00 is located are parallel to each other, such as path segments whose projections on the top wiring layer on the substrate 00 are also parallel to each other, the magnetic fields generated by the AC signals on the two parallel paths will at least partially cancel each other out. This effectively reduces the impact of the magnetic fields generated by the first electrical path 100 and the second electrical path 200 on other circuit modules and / or electrical paths on the substrate 00, thereby ensuring the reliability and stability of the air conditioner control board. At the same time, since there is at least one set of parallel segments as described in the above embodiments on the first electrical path 100 and the second electrical path 200, the loop area formed by the electrical circuit between the EMI filter circuit 21 and the rectifier bridge module 32, or other loops on the air conditioner control board that include this loop, can be reduced, thereby further reducing the impact on other circuit modules and / or electrical paths on the substrate 00.

[0129] Optionally, the first electrical path 100 includes at least one of a connector, via, blind via, and metal trace disposed on the substrate 00; the second electrical path 200 includes at least one of a connector, via, blind via, and metal trace disposed on the substrate 00. The connector can be a fly wire, such as a wire bonding cable or ribbon cable, or an electronic component, such as a ferrite bead or resistor, and the metal trace can be a copper-clad trace.

[0130] Optionally, the substrate 00 has at least one wiring layer. For example, the substrate 00 may have only one wiring layer, such as a top wiring layer or a bottom wiring layer, or the substrate 00 may have multiple wiring layers, such as a substrate 00 with a top wiring layer and a bottom wiring layer, a multilayer board with a top wiring layer, a bottom wiring layer, and at least one intermediate wiring layer, etc. Optionally, in one embodiment, two parallel paths in the first electrical path 100 and the second electrical path 200 are simultaneously disposed on the same wiring layer of the substrate 00. This minimizes the area of ​​the loop formed between the first electrical path 100 and the second electrical path 200, reducing circulating current. Furthermore, the parallel paths can more effectively cancel out some or all of the magnetic fields generated by both paths, further reducing interference to other surrounding circuit modules or electrical paths, thereby improving the reliability and stability of the air conditioner circuit board. Alternatively, in another embodiment, the substrate 00 has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate 00. This arrangement not only allows the parallel line segments to cancel out some or all of the magnetic fields generated by the two, but also saves wiring space on the substrate 00 because the parallel segments are not on the same wiring layer, thereby contributing to the miniaturization of the substrate 00.

[0131] Furthermore, in one embodiment, two parallel segments of the first electrical path 100 and the second electrical path 200 are respectively disposed on different wiring layers of the substrate 00, and at least a portion of their projections on the plane of the substrate 00 overlap with each other. For example, the parallel segment of the first electrical path 100 is disposed on the top wiring layer, and the corresponding parallel segment of the second electrical path 200 is disposed on the bottom wiring layer, and their projections on the top wiring layer completely overlap. This arrangement can further help to reduce the area of ​​the loop containing the first electrical path 100 and the second electrical path 200, and further improve the degree of cancellation between the magnetic fields generated by the first electrical path 100 and the second electrical path 200.

[0132] In one embodiment, reference Figure 2 The embodiments shown and Figures 12-14 The electrical path diagram shows that the PFC circuit includes a PFC inductor 311; the PFC inductor 311 and the rectifier bridge module 32 are arranged in parallel along the length direction of the substrate 00; wherein, the first electrical path 100 has a first segment, a second segment and a third segment connected to each other, the first segment 110 of the first electrical path extends from the first output terminal of the EMI filter circuit 21 along the width direction of the substrate 00, the second segment 120 of the first electrical path is arranged along the length direction of the substrate 00, and the third segment 130 of the first electrical path is arranged along the width direction of the substrate 00 and connected to the first input terminal of the rectifier bridge module 32.

[0133] The second electrical path 200 has a first segment, a second segment, and a third segment connected to each other. The first segment 210 of the second electrical path extends from the second output terminal of the EMI filter circuit 21 along the width direction of the substrate 00. The second segment 220 of the second electrical path is arranged along the length direction of the substrate 00. The third segment 230 of the second electrical path is arranged along the width direction of the substrate 00 and connected to the second input terminal of the rectifier bridge module 32.

[0134] The projections of the second segment 120 of the first electrical path and the second segment 220 of the second electrical path on the plane where the substrate 00 is located are parallel to each other, and are disposed on the substrate 00 passing through the position of the corresponding PFC inductor 311.

[0135] In this embodiment, Figure 12 for Figure 2 The diagram shown is a schematic representation of the structure of the first electrical path 100 on the substrate 00 in the embodiment shown. Figure 12 The circuit modules shown are all disposed on the same basic layer, such as the top wiring layer. The first segment 110 of the first electrical path is a metal trace on the top wiring layer, extending from the first output terminal of the EMI filter circuit 21 toward the third side 08 of the substrate 00 and connecting to the first end of the second segment 120 of the first electrical path. The second segment 120 of the first electrical path is also a metal trace on the top wiring layer. The second segment 120 of the first electrical path starts from the second end of the first segment 110 of the first electrical path, passes through the position corresponding to the PFC inductor 311 on the substrate 00, and extends along the direction from the first side 06 to the second side 07. Among them, the part of the second segment of the first electrical path 100 that passes through the PFC inductor 311 passes through the position below the PFC inductor 311 on the substrate 00. The third segment of the first electrical path 100 is a metal trace on the bottom wiring layer. Multiple vias are provided at the second end of the second segment 120 of the first electrical path to establish an electrical connection path with the first end of the third segment 130 of the first electrical path. The third segment 130 of the first electrical path extends along the direction from the third side 08 to the fourth side 09 of the substrate 00 until it is connected to the first input terminal of the rectifier bridge module 32.

[0136] Figure 13 for Figure 2 The diagram shown is a schematic representation of the structure of the second electrical path 200 on the substrate 00 in the embodiment. Figure 13The circuit modules shown are all disposed on the same basic layer, such as the top wiring layer. The first segment 210 of the second electrical path is a metal trace on the bottom wiring layer, extending from the second output terminal of the EMI filter circuit 21 towards the third side 08 of the substrate 00 and connecting to the first end of the second segment 220 of the second electrical path. The second segment 220 of the second electrical path is also a metal trace on the bottom wiring layer. The second segment 220 of the second electrical path starts from the second end of the first segment 210 of the second electrical path, passes through the position corresponding to the PFC inductor 311 on the substrate 00, and extends along the direction from the first side 06 to the second side 07, connecting to the first end of the third segment 230 of the second electrical path. The part of the second segment of the first electrical path 100 that passes through the PFC inductor 311 passes through the position below the PFC inductor 311 on the substrate 00. The third segment of the first electrical path 100 is a metal trace on the bottom wiring layer. The third segment 130 of the first electrical path extends from the third side 08 to the fourth side 09 and is connected to the second input terminal of the rectifier bridge module 32.

[0137] Figure 14 for Figure 13 and Figure 12 A schematic diagram showing that the first electrical path 100 and the second electrical path 200 are simultaneously disposed on the substrate 00. From the above... Figures 12-14 It is easy to see that the projections of the second segment 120 of the first electrical path and the second segment 220 of the second electrical path on the top / bottom wiring layers of the substrate 00 are both parallel to each other. Simultaneously, the second segment 120 of the first electrical path and the second segment 220 of the second electrical path are respectively disposed on different wiring layers of the substrate 00, and at least a portion of their projections on the plane of the substrate 00 overlap. Thus, not only can the aforementioned effects of reducing loop size and decreasing magnetic field influence be achieved, but also, because the second segment 120 of the first electrical path and the second segment 220 of the second electrical path are parallel and overlapping on the plane of the substrate 00, they can pass through the PFC inductor 311 on the substrate 00 without affecting the PFC inductor 311. Compared to bypassing the PFC inductor 311 on the substrate 00, this effectively saves the wiring area of ​​the substrate 00 and reduces the area occupied by the loop, greatly contributing to the operational stability and miniaturization of the air conditioner control board.

[0138] Optionally, the EMI filter circuit 21 includes a common-mode inductor 211; the PFC rectifier circuit 30 includes a PFC circuit and a rectifier bridge module 32, the PFC circuit including a PFC inductor 311 and multiple power devices; wherein the common-mode inductor 211, the PFC inductor 311, and the rectifier bridge module 32 are arranged in parallel along the length direction of the substrate 00; the multiple power devices are arranged on the substrate 00 near the PFC inductor 311 or near the rectifier bridge module 32. The multiple power devices include a power transistor module 313, a diode module 314, and an electrolytic capacitor 312, with the PFC inductor 311 and the electrolytic capacitor 312 arranged in parallel along the width direction of the substrate 00. In another embodiment of this application, refer to... Figures 15-17 The positive output terminal of the rectifier bridge module 32 is electrically connected to the positive terminal of the electrolytic capacitor 312 via the PFC inductor 311 and the diode module 314. The negative output terminal of the rectifier bridge module 32 is connected to the negative terminal of the electrolytic capacitor 312. The first conducting terminal of the power transistor module 313 is connected to the common terminal of the PFC inductor 311 and the diode module 314. The second conducting terminal of the power transistor module 313 is connected to the negative output terminal of the rectifier bridge module 32.

[0139] On the substrate 00, a third electrical path 300 is provided between the negative output terminal of the rectifier bridge module 32, the second conducting terminal of the power transistor and the negative terminal of the electrolytic capacitor 312; a fourth electrical path 400 is provided between the anode of the PFC inductor 311 and the diode module 314 and the first conducting terminal of the power transistor; and a fifth electrical path 500 is provided between the cathode of the diode module 314 and the positive terminal of the electrolytic capacitor 312.

[0140] Wherein, the fourth electrical path 400 has at least one path whose projection on the plane where the substrate 00 is located is parallel to that of at least one path in the third electrical path 300; and / or, the fifth electrical path 500 has at least one path whose projection on the plane where the substrate 00 is located is parallel to that of at least one path in the third electrical path 300.

[0141] In this embodiment, it is understood that in the PFC rectifier circuit 30, the fourth electrical path 400 and the fifth electrical path 500 are both on the positive circuit of the electrical circuit between the rectifier bridge module 32 and the electrolytic capacitor 312. A PFC inductor 311 and a diode module 314 are connected in series on this circuit. The fifth electrical path 500 is the negative circuit of the above-mentioned electrical circuit. Based on the same reasoning as the embodiments of the first electrical path 100 and the second electrical path 200, at least one set of parallel path segments in the third electrical path 300 and the fourth electrical path 400 can cancel out part of the magnetic field generated by the electrical signals on the two electrical paths. Similarly, at least one set of parallel path segments in the third electrical path 300 and the fifth electrical path 500 can cancel out part of the magnetic field generated by the electrical signals on the two electrical paths, thereby effectively reducing the influence of the magnetic field generated by the third electrical path 300, the fourth electrical path 400 and the fifth electrical path 500 on other circuit modules and / or electrical paths on the substrate 00. Meanwhile, since there are parallel segments between the third electrical path 300 and the fourth electrical path 400, and / or between the third electrical path 300 and the fourth electrical path 400, the loop area formed between the rectifier bridge module 32 and the electrolytic capacitor 312 circuit can be effectively reduced, thereby further reducing the impact on other circuit modules and / or electrical paths on the substrate 00.

[0142] Optionally, the third electrical path 300 includes at least one of a connector, via, blind via, and metal trace disposed on the substrate 00; the fourth electrical path 400 includes at least one of a connector, via, blind via, and metal trace disposed on the substrate 00; and the fifth electrical path 500 includes at least one of a connector, via, blind via, and metal trace disposed on the substrate 00. The connector can be a fly wire, such as a wire bonding cable or ribbon cable; the metal trace can be an electronic component, such as a ferrite bead or resistor; and the metal trace can be a copper-clad trace.

[0143] Optionally, if at least one segment of the fourth electrical path 400 is parallel to the projection of at least one segment of the third electrical path 300 onto the plane of the substrate 00, the substrate 00 has at least one wiring layer, and the two parallel segments of the fourth electrical path 400 and the third electrical path 300 are simultaneously disposed on the same wiring layer of the substrate 00. This minimizes the loop area of ​​the electrical circuit between the rectifier bridge module 32 and the electrolytic capacitor 312 circuit to reduce circulating current, and the parallel paths can more effectively cancel out some or all of the magnetic fields generated by both, further reducing interference to other surrounding circuit modules or electrical paths, thereby improving the reliability and stability of the air conditioner circuit board. Alternatively, the substrate 00 has multiple wiring layers, with the two segments disposed on different wiring layers of the substrate 00. This not only cancels out some or all of the magnetic fields generated by the two segments due to the presence of parallel segments, but also saves wiring space on the substrate 00 because the parallel segments are not on the same wiring layer, thus contributing to the miniaturization of the substrate 00.

[0144] Furthermore, in one embodiment, two parallel segments of the fourth electrical path 400 and the third electrical path 300 are respectively disposed on different wiring layers of the substrate 00, and at least a portion of their projections on the plane of the substrate 00 overlap with each other. For example, the parallel segment in the third electrical path 300 is disposed on the top wiring layer, and the corresponding parallel segment in the fourth electrical path 400 is disposed on the bottom wiring layer, and their projections on the top wiring layer completely overlap. This arrangement can further help to reduce the loop area of ​​the electrical circuit between the rectifier bridge module 32 and the electrolytic capacitor 312 circuit to reduce circulating current, and further improve the degree of cancellation between the magnetic fields generated by the third electrical path 300 and the fourth electrical path 400.

[0145] Optionally, if at least one segment of the fifth electrical path 500 is parallel to the projection of at least one segment of the third electrical path 300 onto the plane of the substrate 00, the substrate 00 has at least one wiring layer, and the two parallel segments of the fifth electrical path 500 and the third electrical path 300 are simultaneously disposed on the same wiring layer of the substrate 00; or, the substrate 00 has multiple wiring layers, each disposed on a different wiring layer of the substrate 00. This minimizes the loop area of ​​the electrical circuit between the rectifier bridge module 32 and the electrolytic capacitor 312 circuit, reducing circulating current, and the parallel paths can more effectively cancel out some or all of the magnetic fields generated by both, further reducing interference to other surrounding circuit modules or electrical paths, thereby improving the reliability and stability of the air conditioner circuit board. Alternatively, the substrate 00 has multiple wiring layers, each disposed on a different wiring layer of the substrate 00. Thus, not only can the presence of parallel line segments cancel out some or all of the magnetic fields generated by both, but also the fact that the parallel segments are not on the same wiring layer saves wiring space on the substrate 00, thereby contributing to the miniaturization of the substrate 00.

[0146] Furthermore, the two parallel segments of the fifth electrical path 500 and the third electrical path 300 are respectively disposed on different wiring layers of the substrate 00, and at least a portion of their projections on the plane of the substrate 00 overlap with each other. For example, the parallel segment in the third electrical path 300 is disposed on the top wiring layer, and the corresponding parallel segment in the fifth electrical path 500 is disposed on the bottom wiring layer, and their projections on the top wiring layer completely overlap. This arrangement can further help to reduce the loop area of ​​the electrical circuit between the rectifier bridge module 32 and the electrolytic capacitor 312 circuit to reduce circulating current, and further improve the degree of cancellation between the magnetic fields generated by the third electrical path 300 and the fifth electrical path 500.

[0147] In one embodiment, reference Figure 2 The embodiments shown and Figures 15-17 The electrical path diagram shows that the third electrical path 300 has a first segment, a second segment, and a third segment. The first segment 310 of the third electrical path extends from the negative terminal of the electrolytic capacitor 312 along the width direction of the substrate 00 and is connected to the second segment 320 of the third electrical path. The second segment 320 of the third electrical path extends along the length direction of the substrate 00 and is connected to the second conducting terminal of the power transistor. The third segment 330 of the third electrical path extends from the negative output terminal of the rectifier bridge module 32 along the width direction and is electrically connected to the second segment 320 of the third electrical path. The rectifier bridge module 32 and the power transistor module 313 are arranged in parallel along the length direction of the substrate 00, and the rectifier bridge module 32 and the diode module 314 are arranged in parallel along the width direction of the substrate 00.

[0148] The fourth electrical path 400 has a first segment and a second segment. The first segment 410 of the fourth electrical path extends from the second end of the PFC inductor 311 along the length direction of the substrate 00 and is connected to the first conducting end of the power transistor. The second segment 420 of the fourth electrical path extends from the anode of the diode module 314 along the width direction of the substrate 00 and is electrically connected to the first segment 410 of the fourth electrical path.

[0149] The fifth electrical path 500 extends from the cathode of the diode module 314 along the length of the substrate 00 to connect with the positive terminal of the electrolytic capacitor 312.

[0150] The projections of the second segment 320 of the third electrical path, the first segment 410 of the fourth electrical path, and the fifth electrical path 500 onto the plane where the substrate 00 is located are arranged parallel to each other.

[0151] In this embodiment, as described above Figures 12-14 The same applies to the embodiments. Figures 15-17 It is also corresponding Figure 2 The diagram shows the wiring diagrams of the third electrical path 300, the fourth electrical path 400, and the fifth electrical path 500 on the baseboard 00 of the air conditioner control board circuit layout schematic. For ease of viewing, Figures 15-17 The embodiments shown are only identified Figure 2 The embodiment shown includes PFC inductor 311, electrolytic capacitor 312, rectifier bridge module 32, diode module 314, and power transistor module 313, as well as their electrical paths.

[0152] refer to Figure 15 The first segment 310 of the third electrical path is a metal trace disposed on the top wiring layer. The first segment 310 of the third electrical path extends from the negative terminal of the electrolytic capacitor 312 along the third side 08 toward the substrate 00 and passes through the PFC inductor 311 on the substrate 00 to connect with the first end of the second segment 320 of the third electrical path. The first end of the second segment 320 of the third electrical path extends toward the second side 07 and passes through the positions corresponding to the PFC inductor 311, the rectifier bridge module 32 and the power module, and is connected to the second conducting terminal of the power transistor module 313. The third segment 330 of the third electrical path includes a resistor disposed on the top wiring layer. One end of the resistor is connected to the second segment 320 of the third electrical path, and the other end of the resistor is connected to the negative output terminal of the rectifier bridge module 32.

[0153] refer to Figure 16The first segment 410 of the fourth electrical path is a metal trace disposed on the bottom wiring layer. The first segment 410 extends from the second end of the PFC inductor 311 along the length of the substrate 00 and connects to the first conducting end of the power transistor. The second segment 420 of the fourth electrical path is a metal trace disposed on the bottom wiring layer. The second segment 420 extends from the anode of the diode module 314 along the width of the substrate 00 and connects to the first segment 410. The first segment 410 passes through the area between the rectifier bridge module 32 and the diode module 314, thereby shortening the distance between the diode module 314 and the second segment 420 and reducing wiring complexity. The second segment 420 is positioned on the substrate 00 at the location where it passes through the diode module 314. Compared to routing it around the outside of the diode module 314, this effectively reduces the loop area and saves wiring space on the substrate 00.

[0154] refer to Figure 16 The fifth electrical path 500 includes a first part disposed on the top wiring layer and a second part disposed on the bottom wiring layer. The first part of the fifth electrical path 500 extends from the cathode of the diode module 314 toward the first side 06 of the substrate 00 and passes through a via to the first end of the second part of the fifth electrical path 500. The second part of the first electrical path 100 continues to extend toward the first side 06 of the substrate 00 to connect with the positive terminal of the electrolytic capacitor 312.

[0155] Depend on Figures 15-17 As can be seen from the above description, the projections of the second segment 320 of the third electrical path, the first segment 410 of the fourth electrical path, and the fifth electrical path 500 onto the plane where the substrate 00 is located are arranged parallel to each other. Thus, the arrangement of the third electrical path 300, the fourth electrical path 400, and the fifth electrical path 500 in this application can achieve the aforementioned effects of reducing loop size and decreasing the influence of the magnetic field.

[0156] Furthermore, in another embodiment, reference Figure 2 and Figures 15-17The positive and negative terminals of electrolytic capacitor 312 are arranged along the length of substrate 00 so that the projections of the first segment 310 of the third electrical path and the fifth electrical path 500 on substrate 00 intersect. In this embodiment, the positive terminal of electrolytic capacitor 312 is located near the first side 06 of substrate 00, while the negative terminal of electrolytic capacitor 312 is located near the second side 07 of substrate 00. Thus, since in the above embodiment, the first segment 310 of the third electrical path is closer to the first side 06 of substrate 00 than the diode module 314, when the positive terminal of electrolytic capacitor 312 is located near the first side 06 of substrate 00 and the negative terminal of electrolytic capacitor 312 is located near the second side 07 of substrate 00, the projections of the first segment 310 of the third electrical path and the fifth electrical path 500 on substrate 00 will intersect. Thus, compared to the scheme where the negative terminal of the electrolytic capacitor 312 is close to the first side 06 and the negative terminal is close to the second side 07, the loop area of ​​the electrical circuit formed between the rectifier bridge module 32 and the electrolytic capacitor 312 can be further reduced, which greatly contributes to the working stability and miniaturization of the air conditioner control board.

[0157] refer to Figure 2 and Figure 4 Based on any of the above embodiments and the technical effects brought about by the embodiments, in one embodiment of this application, the substrate 00 is provided with a first region 001 and a second region 002 along the length direction, the second region 002 is provided with a third region 003 and a fourth region 004 along the width direction of the substrate 00, the first region 001 and the third region 003 are high voltage circuit regions, and the fourth region 004 is a low voltage circuit region.

[0158] The air conditioner control board also includes a low-voltage circuit, which includes a switching power supply circuit 60 and a control circuit 70. The switching power supply circuit 60 is electrically connected to the PFC rectifier circuit 30 and the control circuit 70, respectively. The control circuit 70 is electrically connected to the PFC rectifier circuit 30 and the inverter circuit 40, respectively.

[0159] The switching power supply circuit 60 and the control circuit 70 are located in the fourth zone 004; the inverter circuit 40, the rectifier bridge module 32 of the PFC rectifier circuit 30, the diode module 314 and the power transistor module 313 are located in the third zone 003; the power input circuit 20, the electrolytic capacitor 312 of the PFC rectifier circuit 30 and the PFC inductor 311 are located in the first zone 001.

[0160] In this embodiment, the circuit board can be configured with a low-voltage circuit area and a high-voltage circuit area based on the design requirements of the R&D designers. The low-voltage circuit area may include low-voltage circuits on the control board, such as a control circuit 70 module with the main controller as its core, a switching circuit for implementing switch control, a sensor module for detecting the status on the circuit board and / or the status of equipment inside the air conditioner, and a voltage conversion module for performing voltage conversion to provide operating voltage for the aforementioned low-voltage circuits, etc. (See reference) Figure 2 and Figure 4 In one example, the low-voltage circuit includes a switching power supply loop 60 and a control circuit 70. The control circuit 70 can be implemented using a main controller, such as an MCU, DSP (Digital Signal Processor), FPGA (Field Programmable Gate Array), PLC, or SOC (System-on-Chip), along with its corresponding peripheral circuits. The control circuit 70 controls the PFC rectifier circuit 30 and / or the inverter circuit 40 to control the voltage parameters output from the power output terminal 50 to external devices. The switching power supply loop 60 can be implemented using a voltage conversion circuit composed of switching transistors, capacitors, inductors, etc., such as a buck converter circuit or a boost converter circuit. Alternatively, the switching power supply loop 60 can also be implemented using a voltage conversion chip and its peripheral circuits, such as a buck converter chip and its peripheral circuits. In one example, the switching power supply circuit 60 can be a step-down circuit to step down the DC bus voltage output by the PFC rectifier circuit 30 and output the operating voltage required by the control circuit 70 to power the control circuit 70. It can be understood that the voltage output by the step-down switching power supply circuit 60 can also power external access devices through the external interface on the substrate 00, such as powering external sensor devices.

[0161] By setting low-voltage and high-voltage circuit areas on the substrate 00, multiple circuit modules in the low-voltage circuit can be grouped together, shortening the propagation distance of signals, especially digital signals, between these modules and effectively ensuring the stability and anti-interference capability of signal transmission in the low-voltage circuit. For example, this applies to signal transmission between the control circuit 70 and the sensor module. Furthermore, compared to mixing low-voltage and high-voltage circuits on the substrate 00, this application's partitioning of high and low voltage circuits effectively reduces interference from higher-voltage power signals to signal transmission between different circuit modules in the low-voltage circuit, further improving the stability and reliability of the entire air conditioner control board.

[0162] Furthermore, since the inverter circuit 40 and the control circuit 70 are arranged on the substrate 00 along the width direction of the substrate 00, in conjunction with the embodiment where the power input circuit 20, the PFC rectifier circuit 30, and the inverter circuit 40 are arranged on the substrate 00 along the length direction of the substrate 00, the device height of the low-voltage circuit is relatively higher than that of the device height in the high-voltage circuit area. Therefore, with this arrangement, when the air conditioner circuit board is installed inside the air conditioner, a duct for airflow to the air conditioner heat sink can blow from the low-voltage circuit area to the high-voltage circuit area, thereby simultaneously meeting the heat dissipation requirements of the circuit devices in both circuit areas and effectively improving the heat dissipation performance of the air conditioner control board.

[0163] Furthermore, in another embodiment, an isolation zone can be provided between the low-voltage circuit area and the high-voltage circuit area. The isolation zone can be provided with grounded copper plating, hollow slots, metal isolation components, etc., to further improve the isolation between the low-voltage circuit and the high-voltage circuit, thereby further ensuring the stability and reliability of the air conditioner control board.

[0164] Optionally, in one embodiment, in order to further ensure the stability and reliability of the low-voltage circuit operation in the low-voltage circuit area, a moisture-proof oil is also coated on the substrate 00 corresponding to the low-voltage circuit area to prevent the low-voltage circuit from getting damp, especially the control circuit from getting damp and causing abnormal circuit operation.

[0165] Furthermore, based on the above-mentioned switching power supply circuit 60 being electrically connected to the PFC rectifier circuit 30 and the control circuit 70 respectively, and the control circuit 70 being electrically connected to the PFC rectifier circuit 30 and the inverter circuit 40 respectively; the switching power supply circuit 60 and the control circuit 70 are disposed in the fourth region 004, the inverter circuit 40, the rectifier bridge module 32 of the PFC rectifier circuit 30, the diode module 314 and the power transistor module 313 are disposed in the third region 003; and the power input circuit 20, the electrolytic capacitor 312 of the PFC rectifier circuit 30 and the PFC inductor 311 are disposed in the first region 001. In one embodiment of this application, the substrate 00 has a first side 06 and a second side 07 opposite each other along the length direction, and a third side 08 and a fourth side 09 opposite each other along the width direction. The control circuit 70 and the switching power supply circuit 60 are arranged in parallel along the length direction on the substrate 00 and are adjacent to the fourth side 09. Thus, since the switching power supply circuit 60 and the control circuit 70 are arranged in parallel along the direction from the first side 06 to the second side 07 of the substrate 00, the routing distance between them can be minimized when designing the routing between them, thereby ensuring the stability and reliability of signal transmission.

[0166] Furthermore, optionally, see reference Figure 2In one embodiment, the power input circuit 20 includes an EMI filter circuit 21. The common-mode inductor 211, PFC inductor 311, rectifier bridge module 32, power transistor module 313, and inverter circuit 40 of the EMI filter circuit 21 are sequentially arranged along the first side 06 to the second side 07 of the substrate 00, and are adjacent to the third side 08. A diode module 314 is disposed on the substrate 00 in a region on the side of the rectifier bridge module 32 facing away from the third side 08. The switching power supply circuit 60 is disposed adjacent to the electrolytic capacitor 312 of the PFC rectifier circuit 30 and the diode module 314, respectively. The electrolytic capacitor 312 is disposed on the substrate 00 in a region on the side of the PFC inductor 311 facing away from the third side 08. The PFC inductor 311 is also adjacent to the diode module 314 and the rectifier bridge module 32; the first power module 41 and the second power module 42 of the inverter circuit 40 are arranged sequentially along the first side 06 to the second side 07 of the substrate 00 and are adjacent to the third side 08. The second power module 42 is adjacent to the second side 07 of the substrate 00, and the first power module 41 is adjacent to the power transistor module 313 and the control circuit 70, respectively; the first safety X / Y capacitor of the EMI filter circuit 21 is disposed on the substrate 00 in the area between the third side 08 and the common mode inductor 211, and the first safety X / Y capacitor is adjacent to the common mode inductor 211 and the PFC inductor 311, respectively.

[0167] In this embodiment, since the electrolytic capacitor 312, the switching power supply circuit 60, and the control circuit 70 are arranged in parallel along the direction from the first side 06 to the second side 07 of the substrate 00, the distance of the transmission path on the board between the output terminal of the PFC rectifier circuit 30 and the input terminal of the switching power supply circuit 60 can be effectively shortened during the routing design. This reduces the impact of the DC bus voltage signal on other low-voltage circuits, thereby further improving the stability of the air conditioner control board. Meanwhile, in the above layout, the control circuit 70 is surrounded by a power transistor module 313, a switching power supply circuit 60, a first power module 41, and a second power module 42. It should be understood that in the corresponding circuit on the air conditioner control board, the control circuit 70 is electrically connected to at least one of the above circuit modules to control its operation. Therefore, the above... Figure 2 The layout shown, combined with the actual circuit connections, can effectively reduce the wiring complexity of the control circuit output from the control circuit 70 to the circuit module. Furthermore, since inductive devices such as the PFC inductor 311 and the common-mode inductor 211 are not close to the control circuit 70, the stability of the control signal transmitted from the control circuit 70 to the circuit module can also be guaranteed, thereby ensuring the reliability and stability of the entire air conditioner circuit board.

[0168] Optionally, refer to Figure 4In another embodiment, the power input circuit 20 includes an EMI filter circuit 21. The common-mode inductor 211, PFC inductor 311, diode module 314, power transistor module 313, rectifier bridge module 32, and inverter circuit 40 of the EMI filter circuit 21 are sequentially arranged along the first side 06 to the second side 07 on the substrate 00, and are adjacent to the third side 08. The switching power supply circuit 60 is arranged adjacent to the electrolytic capacitor 312 and diode module 314 of the PFC rectifier circuit 30. The electrolytic capacitor 312 is disposed on the substrate 00 in the region of the PFC inductor 311 facing away from the third side 08. 1. The first power module 41 and the second power module 42 of the inverter circuit 40 are arranged in parallel along the third side 08 to the fourth side 09 of the substrate 00. The first power module 41 is arranged adjacent to the rectifier bridge module 32 and the basic second side 07, respectively. The second power module 42 is arranged adjacent to the control circuit 70 and the fourth side 09 of the substrate 00, respectively. The first safety X / Y capacitor of the EMI filter circuit 21 is disposed on the substrate 00 in the region of the common mode inductor 211 away from the third side 08, and the first safety X / Y capacitor is arranged adjacent to the common mode inductor 211 and the PFC inductor 311, respectively.

[0169] In this embodiment, as described above Figure 2 The embodiments shown are the same as those described above. Figure 4 The intermediate layout shortens the transmission path between the switching power supply loop 60 and the control circuit 70, and effectively ensures the stability of signal transmission between the control circuit 70 and its connected circuit modules, such as at least one of the power transistor module 313, the switching power supply loop 60, the first power module 41, and the second control module. Furthermore, it should be understood that... Figure 4 In the illustrated embodiment, the diode module 314, power transistor module 313, and rectifier bridge module 32 are arranged in parallel along the length of the substrate 00. This arrangement ensures that when the air conditioner control board is cooled through the air duct within the air conditioner, the parallel arrangement of the diode module 314, power transistor module 313, and rectifier bridge module 32 does not interfere with each other's heat dissipation, effectively improving the heat dissipation efficiency of the PFC rectifier circuit 30. Furthermore, in the embodiments described below where a heat dissipation component 80 is provided, this layout allows for smoother surface contact between the heat dissipation component 80 and the surfaces of the multiple power devices, facilitating subsequent production and assembly.

[0170] Furthermore, based on any of the above embodiments, refer to Figure 2 and Figure 4In one embodiment, the power input terminal 10 is disposed on the substrate 00 adjacent to the first side 06 of the substrate 00; the power output terminal 50 includes a fan interface and a compressor interface disposed adjacent to the second side 07 of the substrate 00; the power input circuit 20 includes a protection circuit 22, and the power input terminal 10, the surge protection circuit of the protection circuit 22, the second safety X / Y capacitor, and the anti-inrush current circuit are disposed sequentially along the first side 06 to the second side 07 of the substrate 00; the EMI filter circuit 21 is disposed adjacent to the power input terminal 10, the surge protection circuit, the second safety X / Y capacitor, and the anti-inrush current circuit, respectively, and the anti-inrush current circuit is disposed adjacent to the electrolytic capacitor 312. With this arrangement, since the multiple circuit modules in the power input circuit 20 are disposed close to each other, it effectively reduces the complexity of routing between the circuits in the power input circuit 20 on the substrate 00 for researchers, shortens the signal transmission distance between circuit modules, and improves the stability of signal transmission.

[0171] refer to Figure 2 and Figure 4 In one embodiment of this application, the air conditioner control board further includes a heat dissipation assembly 80; the heat dissipation assembly 80 is attached to the inverter circuit 40 and the rectifier bridge module 32, diode module 314 and power transistor module 313.

[0172] In this embodiment, the heat dissipation component 80 can be implemented using a metal radiator, such as aluminum or copper. The radiator may also have multiple heat dissipation fins to increase the contact area between the heat dissipation component 80 and the air. The heat dissipation component 80 may include at least one radiator. Optionally, the heat dissipation component 80 may be attached to the side of the circuit or to the upper surface of the components in the circuit. It is understood that during the actual operation of the air conditioner control board, the inverter circuit 40 and the PFC rectifier circuit 30 are the main heat-generating circuits. Therefore, attaching the heat dissipation component 80 only to the inverter circuit 40 and the PFC rectifier circuit 30 can minimize the size of the heat dissipation component 80 while meeting the heat dissipation requirements of the air conditioner control board, thereby reducing the overall size of the air conditioner control board.

[0173] Furthermore, for the PFC rectifier circuit 30, the main heat-generating components are the rectifier bridge module 32 and multiple power devices. Therefore, in one embodiment, based on the above-mentioned embodiment where the PFC rectifier circuit 30 includes a PFC circuit and a rectifier bridge module 32, and the PFC circuit includes a PFC inductor 311 and multiple power devices, the heat dissipation assembly 80 is attached to the multiple power devices, the rectifier bridge module 32, and the inverter circuit 40. In this embodiment, as can be seen from the above embodiments, the PFC inductor 311, the rectifier bridge module 32, the multiple power devices, and the inverter circuit 40 are arranged along the length direction of the substrate 00 and are close to each other. Therefore, the above device arrangement allows the heat dissipation assembly 80 to simultaneously attach to the rectifier bridge module 32, the multiple power devices, and the inverter circuit 40 to provide heat dissipation for all three. In one example, referring to… Figure 2 and Figure 3 In the inverter circuit 40, the first power module 41 and the second power module 42 are arranged in parallel along the length of the substrate 00. The heat dissipation assembly 80 includes a first heat sink 81, which is simultaneously attached to the rectifier bridge module 32, multiple power devices in the PFC circuit, the first power module 41, and the second power module 42 to improve the heat dissipation efficiency of the aforementioned devices. In another example, refer to... Figure 4 and Figure 5 The heat dissipation assembly 80 includes a first heat sink 81 and a second heat sink 82. The first heat sink 81 is simultaneously attached to the rectifier bridge module 32, multiple power devices in the PFC circuit, and the first power module 41. The second heat sink 82 is attached to the second power module 42. The height of the second heat sink 82 is less than that of the first heat sink 81 to ensure that when the air conditioner control board is positioned within the air intake path for heat dissipation in the air conditioner, the second heat sink 82 will not obstruct the airflow blowing onto the first heat sink 81, effectively ensuring the heat dissipation performance of the first heat sink 81.

[0174] Optionally, in one embodiment, the heat dissipation component 80 can be implemented as a rectangular heat dissipation component 80 with an aspect ratio of 2:1. For example, Figure 3 and Figure 5 The first heatsink in the middle is 81. (Reference) Figure 6 ,Depend on Figure 6 The simulation results show that L / W is the aspect ratio. Figure 6 The figures show the operating temperatures of the circuits attached to the heat sink component 80 under different aspect ratios. As can be seen from the simulation figures above, an aspect ratio of 2:1 ensures efficient heat dissipation while also fitting the width of the attached components, achieving a good balance between heat dissipation efficiency and the size of the heat sink component 80.

[0175] This application also proposes an electrical control box 1400, including a box body and an air conditioner control board as described above, wherein the air conditioner control board is disposed in the box body; the base plate 00 of the air conditioner control board has multiple heat dissipation areas, and the box body is provided with a corresponding air duct for each heat dissipation area.

[0176] Optionally, the direction of the air ducts can be at least one, for example, set along the length of the substrate 00 or along the width of the substrate 00. Optionally, the ventilation volume of the multiple air ducts can be at least two different types to match the heat dissipation requirements of different heat dissipation areas on the substrate 00. Optionally, the ventilation volume of each air duct can be achieved by setting an air inlet and / or air outlet of a corresponding size on the housing corresponding to the air duct. In this way, by setting multiple air ducts on the housing of the electrical control box 1400 used to mount the air conditioner control board, the heat dissipation performance of the air conditioner control board can be effectively improved to ensure the stability and reliability of the operation of multiple circuit modules on the air conditioner control board. At the same time, setting different air ducts for different heat dissipation areas can achieve matching between the air duct ventilation volume and the heat generation of the circuit modules in the heat dissipation area, thereby further ensuring the stability and reliability of the air conditioner control board.

[0177] Optionally, in one embodiment, reference is made to... Figure 10 and Figure 11 The heat dissipation area has a first heat dissipation area 03, a second heat dissipation area 04, and a third heat dissipation area 05; the base plate 00 of the air conditioner control board has a first side 06 and a second side 07 opposite to each other along the length direction, and a third side 08 and a fourth side 09 opposite to each other along the width direction; the first heat dissipation area 03 and the second heat dissipation area 04 are arranged in parallel along the direction from the third side 08 to the fourth side 09 of the base plate 00, the third heat dissipation area 05 and the first heat dissipation area 03 are arranged in parallel along the direction from the first side 06 to the second side 07 of the base plate 00, and the third heat dissipation area 05 and the second heat dissipation area 04 are arranged in parallel along the direction from the first side 06 to the second side 07 of the base plate 00.

[0178] The first air duct corresponding to the first heat dissipation area 03 and the third air duct corresponding to the third heat dissipation area 05 are provided to extend along the width direction of the substrate 00, and the second air duct corresponding to the second heat dissipation area 04 is provided to extend along the length direction of the substrate 00; the ventilation volume of the first air duct is greater than the ventilation volume of the third air duct; and / or, the ventilation volume of the third air duct is greater than the ventilation volume of the second air duct.

[0179] In this embodiment, a first air inlet corresponding to the first air duct and a third air inlet corresponding to the third air duct are provided on one of the third side 08 and the fourth side 09 of the substrate 00 on the housing, and a corresponding first air outlet and a third air outlet are provided on the other side, so as to form a first air duct and a third air duct arranged along the width direction, for example. Figure 10 and Figure 11 The first and third air ducts shown extend from the fourth side 09 to the third side 08 of the substrate 00. Airflow in the first air duct enters through the first air inlet and exits through the second air inlet to dissipate heat from the circuit modules on the first heat dissipation area 03. Airflow in the third air duct enters through the third air inlet and exits through the third air outlet to dissipate heat from the circuit modules on the third heat dissipation area 05. The area of ​​the first air inlet is larger than the area of ​​the third air inlet, and / or the area of ​​the first air outlet is larger than the area of ​​the third air outlet, thus ensuring that the ventilation volume of the first air duct is greater than that of the third air duct. A second air inlet corresponding to the second air duct is provided on the housing at a position corresponding to one of the first side 06 and the second side 07 of the substrate 00, forming a second air duct extending along its length, for example, from the second side 07 to the first side 06 of the substrate 00. The area of ​​the third air inlet is larger than the area of ​​the second air inlet, thus ensuring that the ventilation volume of the third air duct is greater than that of the second air duct. The airflow in the second air duct enters through the second air inlet and combines with the airflow in the third air duct, exiting through the third air outlet, thereby dissipating heat for the circuit modules on the second heat dissipation area 04. Optionally, the housing can also be provided with corresponding cavity walls for different heat dissipation areas to partially and / or completely separate the different air ducts. For example, the first heat dissipation area 03 is completely separated from the second heat dissipation area 04 and the third heat dissipation area 05, while the third heat dissipation area 05 is partially separated from the second heat dissipation area 04. The aforementioned cavity wall configuration effectively reduces heat conduction and thermal coupling between circuit modules on the air conditioner control board, resulting in lower air temperature passing through the circuit modules. This allows for the removal of more heat at the same airflow rate, improving air heat exchange efficiency and further enhancing the heat dissipation performance of the air conditioner control board.

[0180] In one example, based on the above Figure 2 The illustrated embodiment, with reference to Figure 10 The power input terminal 10, power input circuit 20, PFC inductor 311 and electrolytic capacitor 312 of the air conditioner control board are located in the third heat dissipation area 05; the diode module 314, power transistor module 313, rectifier bridge module 32 and inverter circuit 40 of the air conditioner control board are located in the first heat dissipation area 03; the switching power supply circuit 60, control circuit 70 and power output terminal 50 of the air conditioner control board are located in the second heat dissipation area 04.

[0181] In this embodiment, combined with Figure 2 As can be clearly seen in the embodiments shown, the second heat dissipation area 04 and the low-voltage circuit area basically overlap, and the first heat dissipation area 03 and the third area 003 in the high-voltage circuit area overlap (as described above). Figure 2 In the embodiment, the third region 003 and the first region 001 form a high-voltage circuit region, and the third heat dissipation region 05 overlaps with the first region 001 in the high-voltage circuit region. Figure 2The first heat sink 81 in the heat dissipation assembly 80 shown is located precisely within the first heat dissipation zone 03. As described above, the multiple circuit modules (diode module 314, power transistor module 313, rectifier bridge module 32, and inverter circuit 40 of the air conditioner control board) in the area corresponding to the first heat sink 81 are among the circuit modules on the air conditioner control board that generate the most heat. Therefore, when the air conditioner control board is located within the electrical control box 1400, the first air duct with the largest ventilation volume passes precisely through the first heat dissipation zone 03, which overlaps with the area corresponding to the first heat sink 81. In particular, passing through the first heat sink 81 further improves the heat dissipation efficiency for the circuit modules on the air conditioner control board that generate the most heat, thereby ensuring the reliability and stability of the aforementioned circuit modules. Similarly, since the heat generated by the circuit module in the first zone 001 of the high-voltage circuit area on the base plate 00 of the air conditioner control board is less than the heat generated by the circuit module in the third zone 003 of the high-voltage circuit area, but greater than the heat generated by the circuit module in the low-voltage circuit area, the ventilation volume of the corresponding third air duct is also greater than the ventilation volume of the second air duct and less than the ventilation volume of the first air duct, so that the air volume of each air duct matches the heat generated by the circuit module in the corresponding heat dissipation area.

[0182] Similarly, in another example, based on the above... Figure 4 The illustrated embodiment, with reference to Figure 11 The power input terminal 10, power input circuit 20, PFC inductor 311, and electrolytic capacitor 312 of the air conditioner control board are located in the third heat dissipation area 05; the diode module 314, power transistor module 313, rectifier bridge module 32, and first power module 41 of the air conditioner control board are located in the first heat dissipation area 03; the switching power supply circuit 60, control circuit 70, second power module 42, and power output terminal 50 of the air conditioner control board are located in the second heat dissipation area 04. In this embodiment, the first heat dissipation area 03 and the third area 003 in the high-voltage circuit area partially overlap, specifically overlapping with the area on the substrate 00 corresponding to the first heat sink 81. The second heat dissipation area 04 overlaps with the low-voltage circuit area and the remaining part of the third area 003 in the high-voltage circuit area. The third heat dissipation area 05 overlaps with the first area 001 in the high-voltage circuit area. Similarly, in this embodiment, the heat generated by the circuit module in the first heat dissipation zone 03 is greater than that in the third heat dissipation zone 05, and the heat generated by the circuit module in the third heat dissipation zone 05 is greater than that in the second heat dissipation zone 04. Therefore, the ventilation volume of the corresponding first air duct is greater than that of the third air duct, which in turn is greater than that of the second air duct, thus matching the airflow of each air duct with the heat generated by the circuit module in the corresponding heat dissipation zone. It should be noted that, due to... Figure 4In the embodiment shown, the second power module 42 is disposed in the second heat dissipation area 04. Therefore, in order to ensure the heat dissipation performance of the second power module 42, a second heat sink 82 is provided on the second power module 42, so that the airflow in the second air duct passes through the second heat sink 82.

[0183] In summary, through the above settings, the electrical control box 1400 adapts to the heat generation of different circuit modules on the air conditioner control board by setting up three corresponding heat dissipation zones in the high-voltage circuit zone and the low-voltage circuit zone, and matching them with air ducts of corresponding ventilation volume. This achieves uniform heat dissipation in different areas of the air conditioner control board, improves the overall electrical control ventilation and heat dissipation capacity, and further ensures the stability and reliability of the circuit modules on the air conditioner control board.

[0184] This application also proposes an air conditioner, see reference. Figure 7 The device includes a housing 1000 and an electrical control box 1400 as described above; the inner cavity of the housing 1000 is divided into a compressor cavity 1100 and a fan cavity 1200 by a partition 1300; an air inlet is provided on the housing 1000, and the air inlet, the compressor cavity 1100 and the fan cavity 1200 form an air intake path; wherein, the electrical control box 1400 is disposed on the air intake path.

[0185] In this embodiment, the air conditioner can be a standalone outdoor unit, an integrated unit, or any device within an air conditioning system. When the fan inside the fan cavity 1200 is operating, ventilation is created along the air intake path. Thus, when the fan is operating, the generated airflow passes through multiple air ducts in the electrical control box 1400 located along the air intake path, thereby providing auxiliary heat dissipation for the air conditioning control board within the electrical control box 1400. This arrangement not only improves the heat dissipation efficiency of the air conditioning control board but also saves space for component placement within the air conditioner, contributing to a reduction in the size of the air conditioning control board and the volume of the electrical control box 1400.

[0186] Optionally, the control box 1400 can be disposed outside the housing 1000, for example, at a position corresponding to the air inlet on the housing 1000, so that the control box 1400 is positioned in the air intake path. When airflow passes through the air intake path, it will pass through multiple air ducts in the control box 1400 to dissipate heat from the components on the air conditioner control board. Optionally, the control box 1400 can also be disposed inside the housing 1000, for example, in the air intake path inside the compressor cavity 1100, or in the air intake path inside the fan cavity 1200. Furthermore, optionally, when the control box 1400 is disposed inside the compressor cavity 1100, the partition plate 1300 can be provided with an opening in the air intake path, and the control box 1400 is disposed on the partition plate 1300 and positioned corresponding to the opening, so that it is positioned in the air intake path. Alternatively, the partition 1300 may not have additional openings, and the electrical control box 1400 may be positioned within the housing 1000 at a location corresponding to the air inlet, thus placing itself within the air intake path. Optionally, in one embodiment, the electrical control box 1400 includes multiple interfaces, including a fan interface and a compressor interface. The fan in the fan chamber 1200 can be connected to the fan interface via an electrical connection cable, and the compressor in the compressor chamber 1100 can also be connected to the compressor interface via an electrical connection cable, allowing the air conditioner control board to provide power and / or control signals to both respectively.

[0187] It is worth noting that, since the air conditioner of this application includes the aforementioned electrical control box 1400, all technical solutions of the air conditioner of this application including the electrical control box 1400 also possess at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0188] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. An air conditioner control board, characterized by, include: A substrate, wherein a power input terminal, a power input circuit, a PFC rectifier circuit, an inverter circuit and a power output terminal are disposed on the substrate; The power input terminal, power input circuit, PFC rectifier circuit, inverter circuit and power output terminal are connected in sequence; the conductive path formed by the connection of the inverter circuit and the power output terminal extends on the substrate in a direction away from the PFC rectifier circuit.

2. The air conditioner control board of claim 1, wherein The PFC rectifier circuit, the inverter circuit, and the power output terminal are arranged on the substrate along the length direction of the substrate. The power input circuit, the PFC rectifier circuit, the inverter circuit, and the power output terminal are arranged on the substrate along the length of the substrate; the power input terminal is located near the power input circuit, and the power output terminal is located near the inverter circuit.

3. The air conditioner control board of claim 2, wherein The power input circuit includes an EMI filter circuit, and the EMI filter circuit, the PFC rectifier circuit, and the inverter circuit are arranged in parallel along the length of the substrate.

4. The air conditioner control board of claim 3, wherein The PFC rectifier circuit includes a rectifier bridge module; On the substrate, a first electrical path is provided between the first input terminal of the rectifier bridge module and the first output terminal of the EMI filter circuit, and a second electrical path is provided between the second input terminal of the rectifier bridge module and the second output terminal of the EMI filter circuit. In this configuration, at least one segment of the first electrical path is parallel to the projection of at least one segment of the second electrical path onto the plane of the substrate.

5. The air conditioner control board of claim 4, wherein The substrate has at least one wiring layer, and two paths that are parallel to each other in the first electrical path and the second electrical path are simultaneously disposed on the same wiring layer of the substrate. or, The substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate.

6. The air conditioner control board of claim 5, wherein The two parallel paths in the first electrical path and the second electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other.

7. The air conditioner control board of claim 3, wherein The EMI filter circuit includes a common-mode inductor; the PFC rectifier circuit includes a PFC circuit and a rectifier bridge module, and the PFC circuit includes a PFC inductor and multiple power devices; The common-mode inductor, the PFC inductor, and the rectifier bridge module are arranged in parallel along the length of the substrate on the substrate; a plurality of the power devices are arranged on the substrate near the PFC inductor or near the rectifier bridge module.

8. The air conditioner control board of claim 6, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The PFC rectifier circuit includes a PFC circuit, which includes a PFC inductor; the PFC inductor and the rectifier bridge module are arranged in parallel along the length of the substrate on the substrate. The first electrical path has a first segment, a second segment, and a third segment connected to each other. The first segment of the first electrical path extends from the first output terminal of the EMI filter circuit along the width direction of the substrate. The second segment of the first electrical path is arranged along the length direction of the substrate. The third segment of the first electrical path is arranged along the width direction of the substrate and connected to the first input terminal of the rectifier bridge module. The second electrical path has a first segment, a second segment, and a third segment connected to each other. The first segment of the second electrical path extends from the second output terminal of the EMI filter circuit along the width direction of the substrate. The second segment of the second electrical path is arranged along the length direction of the substrate. The third segment of the second electrical path is arranged along the width direction of the substrate and connected to the second input terminal of the rectifier bridge module. The projections of the second segment of the first electrical path and the second segment of the second electrical path on the plane where the substrate is located are parallel to each other, and are disposed on the substrate from the position corresponding to the PFC inductor.

9. The air conditioner control board of claim 8, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The second segment of the first electrical path and the second segment of the second electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the projections of the two onto the plane of the substrate overlap each other.

10. The air conditioner control board of claim 7, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The plurality of power devices include a power transistor module, a diode module and an electrolytic capacitor, wherein the PFC inductor and the electrolytic capacitor are arranged in parallel along the width direction of the substrate; The rectifier bridge module and the power transistor module are arranged in parallel along the length of the substrate, and the rectifier bridge module and the diode module are arranged in parallel along the width of the substrate. Alternatively, the diode module, the power transistor module, and the rectifier bridge module are arranged in parallel along the length of the substrate.

11. The air conditioner control board of claim 10, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The positive output terminal of the rectifier bridge module is electrically connected to the positive terminal of the electrolytic capacitor via the PFC inductor and the diode module. The negative output terminal of the rectifier bridge module is connected to the negative terminal of the electrolytic capacitor. The first conducting terminal of the power transistor module is connected to the common terminal of the PFC inductor and the diode module. The second conducting terminal of the power transistor module is connected to the negative output terminal of the rectifier bridge module. On the substrate, a third electrical path is provided between the negative output terminal of the rectifier bridge module, the second conducting terminal of the power transistor, and the negative terminal of the electrolytic capacitor; a fourth electrical path is provided between the PFC inductor, the anode of the diode module, and the first conducting terminal of the power transistor; and a fifth electrical path is provided between the cathode of the diode module and the positive terminal of the electrolytic capacitor. Wherein, at least one segment of the fourth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane where the substrate is located; and / or, at least one segment of the fifth electrical path is parallel to the projection of at least one segment of the third electrical path onto the plane where the substrate is located.

12. The air conditioner control board of claim 11, wherein The fourth electrical path has at least one segment whose projection on the plane where the substrate is located is parallel to that of at least one segment of the third electrical path. The substrate has at least one wiring layer, and two parallel paths in the fourth electrical path and the third electrical path are simultaneously disposed on the same wiring layer of the substrate; or, the substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate. The fifth electrical path has at least one segment whose projection on the plane where the substrate is located is parallel to that of at least one segment of the third electrical path. The substrate has at least one wiring layer, and two parallel paths in the fifth electrical path and the third electrical path are simultaneously disposed on the same wiring layer of the substrate; or, the substrate has multiple wiring layers, which are respectively disposed on different wiring layers of the substrate.

13. The air conditioner control board as described in claim 12, characterized in that, The two parallel paths in the fourth electrical path and the third electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other. The two parallel paths in the fifth electrical path and the third electrical path are respectively disposed on different wiring layers of the substrate, and at least a portion of the two paths are projected onto the plane of the substrate and overlap each other.

14. The air conditioner control board as described in claim 11, characterized in that, The third electrical path has a first segment, a second segment, and a third segment. The first segment of the third electrical path extends from the negative terminal of the electrolytic capacitor along the width direction of the substrate and is connected to the second segment of the third electrical path. The second segment of the third electrical path extends along the length direction of the substrate and is connected to the second conducting terminal of the power transistor. The third segment of the third electrical path extends from the negative output terminal of the rectifier bridge module along the width direction and is electrically connected to the second segment of the third electrical path. The fourth electrical path has a first segment and a second segment. The first segment of the fourth electrical path extends from the second end of the PFC inductor along the length direction of the substrate and is connected to the first conducting end of the power transistor. The second segment of the fourth electrical path extends from the anode of the diode module along the width direction of the substrate and is electrically connected to the first segment of the fourth electrical path. The fifth electrical path extends from the cathode of the diode module along the length of the substrate to connect with the positive terminal of the electrolytic capacitor; The projections of the second segment of the third electrical path, the first segment of the fourth electrical path, and the fifth electrical path onto the plane of the substrate are arranged parallel to each other.

15. The air conditioner control board of claim 14, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The second segment of the third electrical path is disposed on the substrate from the positions corresponding to the PFC inductor, the rectifier bridge module, and the power transistor module; The rectifier bridge module and the power transistor module are arranged in parallel along the length direction of the substrate, and the rectifier bridge module and the diode module are arranged in parallel along the width direction of the substrate; on the substrate, the first segment of the fourth electrical path is arranged to pass through the area between the rectifier bridge module and the diode module.

16. The air conditioner control board of claim 14, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the ground. The positive and negative terminals of the electrolytic capacitor are arranged along the length of the substrate, so that the projections of the first segment of the third electrical path and the fifth electrical path on the substrate intersect.

17. The air conditioner control board of claim 4, wherein The first electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; the second electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate.

18. The air conditioner control board of claim 11, wherein the control board is configured to operate the air conditioner in a cooling mode, a heating mode, and a fan mode. The third electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; the fourth electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate; the fifth electrical path includes at least one of a connector, via, blind via, and metal trace disposed on the substrate.

19. The air conditioner control board as described in claim 3, characterized in that, The EMI filter circuit also includes a first safety X / Y capacitor, and the power input circuit also includes a protection circuit. The first safety X / Y capacitor, the common-mode inductor of the EMI filter circuit, and the protection circuit are disposed on the substrate along the width direction of the substrate; the protection circuit includes a lightning protection circuit, a second safety X / Y capacitor, and an anti-intrusion current circuit disposed on the substrate along the width direction of the substrate.

20. The air conditioner control board according to any one of claims 1-19, characterized in that, The substrate has a first region and a second region along its length, and the second region has a third region and a fourth region along its width. The first region and the third region are high-voltage circuit regions, and the fourth region is a low-voltage circuit region. The air conditioner control board also includes a low-voltage circuit, which includes a switching power supply circuit and a control circuit. The switching power supply circuit is electrically connected to the PFC rectifier circuit and the control circuit, respectively. The control circuit is electrically connected to the PFC rectifier circuit and the inverter circuit, respectively. The switching power supply circuit and control circuit are located in the fourth zone; the inverter circuit, the rectifier bridge module, diode module and power transistor module of the PFC rectifier circuit are located in the third zone; the power input circuit, the electrolytic capacitor and PFC inductor of the PFC rectifier circuit are located in the first zone.

21. The air conditioner control board of claim 20, wherein the control board further comprises a second capacitor connected between the second terminal of the second transistor and the first terminal of the third transistor. The substrate has a first side and a second side opposite to each other along the length direction, and a third side and a fourth side opposite to each other along the width direction. The control circuit and the switching power supply circuit are arranged in parallel along the length direction of the substrate and are adjacent to the fourth side. The power input circuit includes an EMI filter circuit. In this circuit, the common-mode inductor of the EMI filter circuit, the PFC inductor, the rectifier bridge module, the power transistor module, and the inverter circuit are sequentially arranged along the first to the second side of the substrate, and adjacent to the third side; the diode module is disposed on the substrate in the region of the rectifier bridge module away from the third side; the switching power supply circuit is disposed adjacent to the electrolytic capacitor of the PFC rectifier circuit and the diode module; the electrolytic capacitor is disposed on the substrate in the region of the PFC inductor away from the third side; the PFC inductor is also connected to the... The diode module and the rectifier bridge module are arranged adjacent to each other; the first power module and the second power module of the inverter circuit are arranged sequentially from the first side to the second side of the substrate and adjacent to the third side, the second power module is arranged adjacent to the second side of the substrate, and the first power module is arranged adjacent to the power transistor module and the control circuit respectively; the first safety X / Y capacitor of the EMI filter circuit is disposed on the substrate in the region between the third side and the common mode inductor, and the first safety X / Y capacitor is arranged adjacent to the common mode inductor and the PFC inductor respectively; Alternatively, the common-mode inductor, PFC inductor, diode module, power transistor module, rectifier bridge module, and inverter circuit of the EMI filter circuit are arranged sequentially from the first side to the second side of the substrate, and adjacent to the third side; the switching power supply circuit is arranged adjacent to the electrolytic capacitor and diode module of the PFC rectifier circuit; the electrolytic capacitor is disposed on the substrate in the region of the PFC inductor away from the third side; the PFC inductor is arranged adjacent to the diode module; the first power module and the second power module of the inverter circuit are arranged in parallel from the third side to the fourth side of the substrate, the first power module is arranged adjacent to the rectifier bridge module and the second side of the substrate, and the second power module is arranged adjacent to the control circuit and the fourth side of the substrate; the first safety X / Y capacitor of the EMI filter circuit is disposed on the substrate in the region of the common-mode inductor away from the third side, and the first safety X / Y capacitor is arranged adjacent to the common-mode inductor and the PFC inductor.

22. The air conditioner control board as described in claim 21, characterized in that, The power input terminal is disposed on the substrate adjacent to a first side of the substrate; the power output terminal includes a fan interface and a compressor interface disposed adjacent to a second side of the substrate; The power input circuit includes a protection circuit. The power input terminal, the surge protection circuit of the protection circuit, the second safety X / Y capacitor, and the anti-inrush current circuit are arranged sequentially along the first side to the second side of the substrate. The EMI filter circuit is arranged adjacent to the power input terminal, the surge protection circuit, the second safety X / Y capacitor, and the anti-inrush current circuit, respectively. The anti-inrush current circuit is arranged adjacent to the electrolytic capacitor.

23. The air conditioner control board as described in claim 20, characterized in that, The air conditioner control board also includes a heat dissipation component; the heat dissipation component is attached to the inverter circuit, the rectifier bridge module, the diode module, and the power transistor module.

24. The air conditioner control board as described in claim 23, characterized in that, The aspect ratio of the heat dissipation component is 2:

1.

25. The air conditioner control board of any of claims 1-19, wherein, The substrate has a length of less than or equal to 350 mm and a width of less than or equal to 250 mm.

26. The air conditioner control board as described in claim 25, characterized in that, The aspect ratio of the substrate is 2:

1.

27. An electric control box characterized by comprising: It includes a housing and an air conditioner control board as described in any one of claims 1-26, wherein the air conditioner control board is disposed within the housing; The base plate of the air conditioner control board has multiple heat dissipation areas, and the housing is provided with a corresponding air duct for each heat dissipation area.

28. The electrically controlled box of claim 27, wherein, The heat dissipation area includes a first heat dissipation area, a second heat dissipation area, and a third heat dissipation area; the base plate of the air conditioner control board has a first side and a second side opposite to each other along the length direction, and a third side and a fourth side opposite to each other along the width direction; the first heat dissipation area and the second heat dissipation area are arranged in parallel along the direction from the third side to the fourth side of the base plate, the third heat dissipation area and the first heat dissipation area are arranged in parallel along the direction from the first side to the second side of the base plate, and the third heat dissipation area and the second heat dissipation area are arranged in parallel along the direction from the first side to the second side of the base plate; A first air duct corresponding to the first heat dissipation area and a third air duct corresponding to the third heat dissipation area extend along the width direction of the substrate, and a second air duct corresponding to the second heat dissipation area extends along the length direction of the substrate; the ventilation volume of the first air duct is greater than the ventilation volume of the third air duct; and / or, the ventilation volume of the third air duct is greater than the ventilation volume of the second air duct. The power input terminal, power input circuit, PFC inductor, and electrolytic capacitor of the air conditioner control board are located in the third heat dissipation area; the diode module, power transistor module, rectifier bridge module, and inverter circuit of the air conditioner control board are located in the first heat dissipation area; and the switching power supply circuit, control circuit, and power output terminal of the air conditioner control board are located in the second heat dissipation area. Alternatively, the power input terminal, power input circuit, PFC inductor, and electrolytic capacitor of the air conditioner control board are located in the third heat dissipation area; the diode module, power transistor module, rectifier bridge module, and first power module of the air conditioner control board are located in the first heat dissipation area; and the switching power supply circuit, control circuit, second power module, and power output terminal of the air conditioner control board are located in the second heat dissipation area.

29. An air conditioner characterized by comprising: Includes a housing and an electrical control box as described in any one of claims 27-28; The inner cavity of the housing is divided into a compressor cavity and a fan cavity by a middle partition; an air inlet is provided on the housing, and the air inlet, the compressor cavity and the fan cavity form an air intake path; The electrical control box is located on the air intake path.

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