Refrigeration assembly and refrigeration water tank

Abstract

The utility model relates to the technical field of semiconductors, in particular to a refrigeration assembly and a refrigeration water tank. Comprising a semiconductor assembly, a first base layer, a second base layer and a cold conduction piece, the first base layer is arranged at the hot end of the semiconductor assembly, the second base layer is arranged at the cold end of the semiconductor assembly, the cold conduction piece is connected with the second base layer, and the first base layer, the second base layer and the cold conduction piece are all made of ceramic materials. And the ceramic cold conduction piece is used, so that the influence of an aluminum piece in water on the water quality is avoided, and a healthy environment is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a refrigeration component and a refrigeration water tank. Background Technology

[0002] A thermoelectric cooler is a highly efficient cooling component. It typically integrates thermocouples and other devices onto an aluminum substrate, utilizing the thermoelectric effect to generate a temperature difference under the influence of current, achieving efficient cooling and heat dissipation for microelectronic devices. Aluminum substrate coolers can stably lower the device temperature, ensuring optimal operation and thus improving performance, reliability, and extending lifespan. In applications, the cold end of the thermoelectric cooler is connected to an aluminum heat-conducting plate to transfer cooling. This plate is typically inserted directly into a water tank. In applications such as water purifiers, the water in the tank is directly cooled to achieve a cooling effect. However, prolonged immersion of the aluminum heat-conducting plate in water increases the aluminum ion concentration over time and can also lead to scale buildup, negatively impacting the water environment and potentially affecting the health of drinkers. Utility Model Content

[0003] The purpose of this invention is to provide a refrigeration component that uses a ceramic heat-conducting element, thus avoiding the impact on water quality caused by aluminum components and ensuring a healthy environment.

[0004] To achieve the above objectives, the present invention adopts the following solution:

[0005] A cooling component includes a semiconductor component, a first base layer, a second base layer, and a cooling conductor. The first base layer is disposed on the hot end of the semiconductor component, the second base layer is disposed on the cold end of the semiconductor component, and the cooling conductor is connected to the second base layer. The first base layer, the second base layer, and the cooling conductor are all made of ceramic material.

[0006] As described above, in a refrigeration assembly, the cooling conductor includes a connecting portion and a plurality of cooling fins disposed on the connecting portion. The cooling conductor is connected to the second base layer through the connecting portion. Both the connecting portion and the cooling fins are integrally made of ceramic material.

[0007] In the refrigeration assembly described above, the refrigeration fins include multiple fins, one end of the connecting portion connected to the semiconductor assembly is a plane, and the multiple refrigeration fins are disposed at the other end of the connecting portion and extend outward.

[0008] In the refrigeration component described above, a single refrigeration fin is arranged vertically, and multiple refrigeration fins are arranged at equal intervals.

[0009] As described above, in a refrigeration component, the two sides of the connecting portion are provided with outwardly extending connecting wings, and the connecting wings are provided with a docking structure.

[0010] In one type of refrigeration assembly as described above, the connecting portion protrudes from the connecting side wings on both sides.

[0011] As described above, the connecting side wing is further provided with a vertically arranged positioning groove.

[0012] In a cooling component as described above, the first substrate is attached to the semiconductor component.

[0013] In a cooling component as described above, the second base layer is attached to the semiconductor component, and the second base layer is bonded and connected to the cooling conductive element.

[0014] This utility model also provides a cooling water tank, including a water tank, on which the above-mentioned integrated ceramic cooling component is provided, the cooling conductive component extends into the water tank, and a heat dissipation component is provided on the first base layer.

[0015] In summary, the advantages of this utility model over the prior art are:

[0016] This utility model provides a cooling component that adopts a structure of a semiconductor cooling chip with a double-sided ceramic substrate. Moreover, the cooling component is made of ceramic material in one piece, which can be directly applied to water. While conducting cooling, it reduces the pollution of water quality caused by the use of metal materials, thereby reducing water pollution problems and ensuring a healthy environment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a refrigeration component according to the present invention;

[0019] Figure 2 This is an exploded view of the refrigeration components;

[0020] Figure 3 This is a cross-sectional view of the refrigeration component;

[0021] Figure 4 This is a schematic diagram of a water tank;

[0022] Figure 5 This is a schematic diagram of the interior of the water tank. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figures 1 to 5 As shown, this utility model provides a cooling component, including a semiconductor component 1, a first base layer 2, a second base layer 4, and a cooling conductor 3. The first base layer 2 is disposed on the hot end of the semiconductor component 1, and the second base layer 4 is disposed on the cold end of the semiconductor component 1. The cooling conductor 3 is connected to the second base layer 4. The first base layer 2, the second base layer 4, and the cooling conductor 3 are all made of ceramic material. It adopts a structure with double-sided ceramic base layers for the semiconductor cooling chip. Furthermore, the cooling conductor is integrally made of ceramic material, allowing it to be directly applied to water. While conducting cooling, it reduces the pollution of water quality caused by the use of metal materials, thereby reducing water pollution problems and ensuring a healthy environment.

[0025] The first base layer 2 and the second base layer 4 in this solution can also be made of ceramic materials. Using a ceramic substrate allows for rapid heat dissipation of the cooling chip. Ceramic plates retain the advantages of the material itself, and unlike traditional PCBs which require an insulating dielectric layer, ceramic itself is the insulating layer. They also offer high frequency response and a low dielectric constant, and their manufacturing process is easier in terms of lightweight, thinness, and miniaturization. Ceramic materials also benefit from high thermal conductivity, good chemical stability, thermal stability, and a high melting point.

[0026] In this scheme, the semiconductor component 1 includes a plurality of staggered P-type semiconductors and N-type semiconductors, and the copper foil, the first copper foil, and the second copper foil are arranged in a "bow" shape. One end of the P-type semiconductor is connected to one end of the copper foil, and the other end of the P-type semiconductor is connected to one end of the first copper foil or one end of the second copper foil. One end of the N-type semiconductor is connected to the other end of the copper foil, and the other end of the N-type semiconductor is connected to the other end of the first copper foil or the other end of the second copper foil. The copper foil and the first copper foil are connected through the P-type semiconductor and the N-type semiconductor, or the copper foil and the second copper foil are connected through the P-type semiconductor and the N-type semiconductor.

[0027] When one end of a P-type semiconductor is connected to a copper foil, and the other end of the P-type semiconductor is connected to one end of a first copper foil, the other end of the first copper foil is connected to an N-type semiconductor, and the other end of the N-type semiconductor is connected to one end of an adjacent copper foil, the charge carriers belong to different energy levels in different materials. The N-type semiconductor is larger than a metallic conductor, which is larger than a P-type semiconductor. When electrons move from a higher energy level to a lower energy level, excess heat is released; conversely, heat needs to be absorbed from the outside for cooling. When electricity is applied, electrons flow from the copper foil to the P-type semiconductor. The movement of electrons from a higher energy level to a lower energy level releases heat, meaning heat is released at one end of the copper foil. Electrons continue to move from the P-type semiconductor... Electrons flow from the semiconductor to one end of the first copper foil, moving from a low energy level to a high energy level. This means the end of the first copper foil connected to the P-type semiconductor absorbs heat, achieving a cooling effect. Electrons then flow from the first copper foil to the N-type semiconductor, moving from a low energy level to a high energy level. Again, this end absorbs heat, achieving a cooling effect. Finally, electrons flow from the N-type semiconductor to the adjacent copper foil, moving from a high energy level to a low energy level. This causes the copper foil to continue releasing heat, resulting in heat release on one side of the first copper foil assembly, which is then dissipated to the external environment through the first substrate, while the second copper foil assembly experiences cooling. Similarly, the connection principle between the copper foil and the second copper foil is the same as that between the copper foil and the first copper foil.

[0028] Preferably, in this solution, the first base layer 2 is attached to the semiconductor component 1. This connection method eliminates the need for additional mounting slots to fix the copper foil components, effectively solving the problem that, during substrate manufacturing, mounting slots are typically created on the base layer to fix the circuit layer. However, this method is particularly inconvenient and difficult to operate, especially when the substrate is small, as accurately creating mounting slots is challenging, leading to low production efficiency and low yield.

[0029] Specifically, in one of the optional embodiments of the utility model, the semiconductor component 1 and the first base layer 2 can be tightly bonded together by high temperature and pressure. Alternatively, the semiconductor component 1 and the first base layer 2 can be tightly bonded together by welding.

[0030] In addition, in this embodiment of the utility model, the first base layer 2 and the second base layer 4 can be single-layer boards, double-layer boards, and multi-layer boards.

[0031] In this embodiment of the utility model, a ceramic heat-conducting component is used, which directly serves as the base layer of the cold end of the semiconductor component 1 and also as a conductor of cold energy. Its structure is simple, thereby greatly improving the cooling efficiency. Specifically, a cooling component is characterized in that the heat-conducting component 3 includes a connecting part 31 and a plurality of cooling fins 32 disposed on the connecting part 31. The heat-conducting component 3 is connected to the second base layer 4 through the connecting part 31. The connecting part 31 and the cooling fins 32 are both integrally made of ceramic material.

[0032] The cooling fins 32 comprise multiple fins. One end of the connecting portion 31, which connects to the semiconductor component 1, is planar. The multiple cooling fins 32 are located at the other end of the connecting portion 31 and extend outwards. Furthermore, each cooling fin 32 is vertically oriented, and the multiple cooling fins 32 are arranged at equal intervals. This effectively integrates the traditional fins and base layer into a single unit, and by using ceramic material, its inherent insulation eliminates the need for an additional insulating layer. It also avoids the contamination problem caused by the decomposition of metal ions from long-term immersion of the cooling fins 32 in water.

[0033] In this embodiment of the present invention, for ease of installation, connecting wings 33 extending outward are provided on both sides of the connecting portion 31, and the connecting wings 33 are provided with a mating structure 330. Preferably, the connecting wings 33 are also integrally formed with the connecting portion 31 using ceramic material, resulting in a simple overall structure and convenient installation and use. Of course, as described above, the semiconductor component 1 is bonded to the second base layer, and the connecting portion 31 of the cooling conductive component is bonded to the second base layer 4. This also eliminates the need for additional mounting grooves for fixing the copper foil component, effectively solving the problem of low production efficiency and low yield caused by the usual practice of creating mounting grooves on the connecting portion to fix the circuit layer during the manufacturing process of the cooling conductive component.

[0034] In addition, for ease of installation, the connecting portion 31 protrudes from the connecting wings 33 on both sides. That is, the connecting portion 31 forms a raised positioning step to facilitate direct mating and connection with the semiconductor component.

[0035] Furthermore, in this embodiment of the invention, the connecting wing 33 is also provided with a vertically arranged positioning groove 331, which provides an additional alignment structure during installation, resulting in higher installation accuracy and greater convenience. Specifically, the mating structure 330 on the connecting wing 33 of this solution is a connecting hole, and the positioning groove 331 is arranged vertically and passes through multiple connecting holes.

[0036] like Figure 4 , Figure 5 As shown, this utility model also provides a cooling water tank, including a water tank 9, on which the integrated ceramic cooling component is provided, the cooling fins 32 of the cooling conductor 3 extend into the water tank 9, and the heat dissipation component 8 is provided on the first base layer 2.

[0037] This utility model provides a cooling component that adopts a structure of a semiconductor cooling chip with a double-sided ceramic substrate. Moreover, the cooling component is made of ceramic material in one piece, which can be directly applied to water. While conducting cooling, it reduces the pollution of water quality caused by the use of metal materials, thereby reducing water pollution problems and ensuring a healthy environment.

[0038] The foregoing has shown and described the basic principles and main features of this utility model, as well as its advantages. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A cooling component, characterized in that, It includes a semiconductor component (1), a first base layer (2), a second base layer (4) and a cooling element (3). The first base layer (2) is disposed on the hot end of the semiconductor component (1), the second base layer (4) is disposed on the cold end of the semiconductor component (1), and the cooling element (3) is connected to the second base layer (4). The first base layer (2), the second base layer (4) and the cooling element (3) are all made of ceramic material.

2. A refrigeration component according to claim 1, characterized in that, The cooling component (3) includes a connecting part (31) and a plurality of cooling fins (32) disposed on the connecting part (31). The cooling component (3) is connected to the second base layer (4) through the connecting part (31). The connecting part (31) and the cooling fins (32) are both integrally made of ceramic material.

3. A refrigeration component according to claim 2, characterized in that, The cooling fins (32) include multiple fins. One end of the connecting part (31) connected to the semiconductor component (1) is a plane, and the multiple cooling fins (32) are disposed at the other end of the connecting part (31) and extend outward.

4. A refrigeration component according to claim 3, characterized in that, The cooling fins (32) described in a single piece are arranged vertically, and the cooling fins (32) described in multiple pieces are arranged at equal intervals.

5. A refrigeration component according to claim 4, characterized in that, The connecting part (31) is also provided with outwardly extending connecting wings (33) on both sides, and the connecting wings (33) are provided with docking structures (330).

6. A refrigeration component according to claim 5, characterized in that, The connecting part (31) protrudes from the connecting wings (33) on both sides.

7. A refrigeration component according to claim 6, characterized in that, The connecting wing (33) is also provided with a vertically arranged positioning groove (331).

8. A refrigeration component according to claim 1, characterized in that, The first substrate (2) is attached to the semiconductor component (1).

9. A refrigeration component according to claim 8, characterized in that, The second base layer (4) is attached to the semiconductor component (1), and the second base layer (4) is bonded to the cooling conductor (3).

10. A cooling water tank, characterized in that, Includes a water tank (9), on which is provided an integrated ceramic refrigeration component as described in any one of claims 1-9, the cooling conductor (3) extends into the water tank (9), and the first base layer (2) is provided with a heat dissipation component (8).

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