EMC (Electro Magnetic Compatibility) testing device

Abstract

The embodiment of the utility model relates to the technical field of EMC testing, and discloses an EMC testing device which comprises a shell, a supporting plate and a plurality of first fasteners, a containing cavity is formed in the shell, the supporting plate is arranged in the containing cavity and fixedly connected with the inner wall of the shell, a plurality of mounting holes are formed in the supporting plate, the mounting holes comprise various combinations, and the first fasteners are arranged in the containing cavity and fixedly connected with the inner wall of the shell. When the first fastener is connected with a plurality of mounting holes in different combinations, different types of mainboards can be fixed on the supporting plate, so that EMC (Electro Magnetic Compatibility) tests can be carried out on the different types of mainboards. Through the mode, different types of mainboards can be mounted through the mounting holes in different combinations on the supporting plate so as to carry out EMC test on the mainboards, and the shell only needs to be provided with a structure for fixing the supporting plate and does not need to be provided with redundant mounting holes, so that leakage of electromagnetic waves is effectively prevented.

Description

Technical Field

[0001] This application relates to the field of EMC testing technology, specifically to an EMC testing device. Background Technology

[0002] EMC (Electromagnetic Compatibility) testing is a crucial step in evaluating whether electronic devices can function properly in an electromagnetic environment without interfering with other devices. To ensure that motherboards function correctly in an electromagnetic environment without interfering with other devices, EMC testing is typically performed on motherboards during the manufacturing process.

[0003] Currently, EMC testing is primarily performed by mounting the motherboard onto a test fixture and then using that fixture. However, traditional general-purpose test fixtures mainly use an empty chassis with conductive cloth and conductive copper foil to secure the motherboard inside. This connection method cannot stably secure the motherboard, resulting in low reliability of the electrical connection between the motherboard and the chassis, which in turn affects the EMC test results. Utility Model Content

[0004] In view of the above problems, this application provides an EMC testing device to solve the problem that existing general-purpose test fixtures cannot stably fix the motherboard, thus affecting the test results.

[0005] According to one aspect of the embodiments of this application, an EMC testing device is provided. The device includes a housing, a tray, and a plurality of first fasteners. An accommodating cavity is formed inside the housing, and the tray is disposed in the accommodating cavity and fixedly connected to the inner wall of the housing. A plurality of mounting holes are provided on the tray, and the plurality of mounting holes include multiple combinations. When the first fasteners are connected to multiple mounting holes in different combinations, different types of motherboards can be fixed on the tray, thereby performing EMC testing on different types of motherboards.

[0006] In one alternative embodiment, the device further includes a second fastener, and a fixing post is provided on the inner wall of the housing, with the support plate fixedly connected to the fixing post by the second fastener.

[0007] In one alternative embodiment, the edge of the tray is fixed to the fixing post by a second fastener, and the middle area of ​​the tray is recessed to form a mounting groove, with mounting holes opened at the bottom of the mounting groove.

[0008] In one alternative embodiment, the first fastener includes a support post and a locking member. One end of the support post has a connecting hole, and the other end has a connecting part. The connecting part is detachably connected to the mounting hole on the side of the tray away from the inner wall of the housing. The locking member is connected to the connecting hole to fix the main board to the tray.

[0009] In one alternative, the edge of the tray is provided with a bracket, and the bracket is provided with a fixing hole for connection with a third fastener to secure an expansion card inserted into the motherboard.

[0010] In one alternative embodiment, the housing has openings on at least two side walls for removable mounting of baffles.

[0011] In one alternative embodiment, an opening on the sidewall is used to install a baffle with a first micropore; a fan module is provided inside the accommodating cavity to draw in gas from the first micropore on one side and discharge it from the first micropore on the other side to dissipate heat from the accommodating cavity.

[0012] In one alternative embodiment, a power module is disposed within the accommodating cavity. The power module is connected to the motherboard for power supply, and an isolation cover is provided on the power module to separate the power module from the motherboard.

[0013] In one alternative approach, the isolation cover has multiple second micro-holes for heat dissipation of the power module.

[0014] In one alternative embodiment, the housing has an installation opening for the motherboard to be installed into the receiving cavity; a cover plate covers the installation opening, and the cover plate and the housing are connected by multiple fasteners. An abutment is provided between two adjacent fasteners on the housing, and the abutment is used to abut against the cover plate when the cover plate is connected to the housing.

[0015] This application embodiment utilizes a plurality of mounting holes on a tray, forming various combinations, to allow different types of motherboards to be fixed onto the tray using different combinations of mounting holes. This enables EMC testing of different types of motherboards, improving the compatibility and practicality of the EMC testing device. Furthermore, the motherboard is fixed within the accommodating cavity via the tray, rather than being directly connected to the housing. On one hand, the housing only needs a structure for fixing the tray, eliminating the need for additional mounting holes to accommodate different types of motherboards, effectively preventing electromagnetic wave leakage and improving the shielding effect of the EMC testing device. On the other hand, after fixing the motherboard to the tray, components such as the processor and graphics card can be installed on the motherboard first, and then the motherboard can be inserted into the accommodating cavity via the tray. This facilitates integrated disassembly and assembly of the motherboard, avoiding disassembly and assembly operations within the confined space of the housing.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of the EMC testing device provided in an embodiment of the present invention is shown;

[0019] Figure 2 This is a perspective view of the EMC testing device provided in an embodiment of the present invention from another angle;

[0020] Figure 3 A perspective view of the tray in the EMC testing device provided in this embodiment of the present invention is shown;

[0021] Figure 4 A cross-sectional view of the EMC testing apparatus provided in an embodiment of the present invention is shown;

[0022] Figure 5 An exploded view of the housing in the EMC testing device provided in this embodiment of the present invention is shown;

[0023] Figure 6 A partial structural schematic diagram of the EMC testing device provided in an embodiment of the present invention is shown;

[0024] Figure 7 A partial cross-sectional view of the EMC testing device provided in an embodiment of the present invention is shown;

[0025] Figure 8 This diagram shows another partial structural schematic of the EMC testing device provided in an embodiment of the present invention;

[0026] Figure 9 This illustration shows another partial structural diagram of the EMC testing device provided in an embodiment of the present invention;

[0027] Figure 10 An exploded view of a partial structure of the EMC testing device provided in an embodiment of this utility model is shown.

[0028] The reference numerals in the detailed embodiments are as follows:

[0029] 100. EMC testing equipment; 200. Motherboard; 300. Expansion card;

[0030] 110. Housing; 120. Tray; 130. Fan module; 140. Hard drive; 150. Power supply module;

[0031] 111. Receiving cavity; 112. Cover plate; 113. Abutment component; 114. Fixing post; 115. Side wall; 116. Baffle; 117. Isolation cover;

[0032] 121. Mounting slot; 122. Bracket;

[0033] 151. Redundant power supply; 152. Power supply interface;

[0034] 21. First fastener; 22. Fixture; 23. Second fastener; 24. Third fastener;

[0035] 211. Support column; 2111. Connecting part; 212. Locking element;

[0036] 31. Mounting hole; 32. Connecting hole; 33. Fixing hole; 34. First micro-hole; 35. Second micro-hole;

[0037] 41. Installation port; 42. Opening. Detailed Implementation

[0038] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0040] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0043] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple groups" refers to two or more (including two groups), and "multiple pieces" refers to two or more (including two pieces).

[0044] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0045] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0046] When performing EMC testing on a motherboard using an empty chassis, the motherboard, power supply, hard drive, and other components are typically placed directly inside the chassis. The motherboard is then elevated using a combination of studs and screws to prevent direct contact between the components on the bottom of the motherboard and the chassis, which could cause a short circuit. To ensure compatibility with various motherboard types, the studs are not usually directly fixed to the chassis. Instead, they are attached to the chassis during testing using conductive cloth or adhesive backing of conductive copper foil. The motherboard is then secured to the studs with screws, establishing an electrical connection between the motherboard and the chassis.

[0047] In such a structure, not only is it necessary to use conductive cloth or conductive copper foil to glue the motherboard and the chassis together for overlapping, which is cumbersome, but it also relies on the adhesive backing of the conductive cloth or conductive copper foil for fixation. The connection between the motherboard and the chassis is prone to loosening, which leads to poor overlap and affects the test results.

[0048] Of course, to ensure the stability of the connection between the motherboard and the chassis, mounting holes can be made on the chassis to connect and fix the studs to the chassis. However, to be compatible with various types of motherboards, multiple mounting holes need to be made on the chassis. First, the studs are fixed to the corresponding mounting holes on the motherboard, and then the motherboard is fixed to the studs with screws. At this time, the back of the motherboard faces the extra mounting holes, which can easily cause electromagnetic wave leakage during EMC testing, reduce the electromagnetic shielding effect of the chassis, and thus affect the test results.

[0049] Therefore, to prevent electromagnetic wave leakage while ensuring compatibility with various motherboard types, this application provides an EMC testing device. Instead of directly fixing the motherboard to the chassis, the device first fixes the motherboard to a tray, and then the tray is fixed to the chassis. Since the tray has a fixed size, only a fixing structure for securing the tray is needed on the chassis; multiple holes are not required on the chassis to accommodate different motherboard types. This effectively prevents electromagnetic wave leakage, ensures the overall shielding effect of the EMC testing device, and thus guarantees the accuracy of the test results.

[0050] Specifically, by creating several mounting holes on the tray, it is compatible with various motherboard types. Users can select the appropriate combination of mounting holes based on the motherboard's size and specifications, and then secure the motherboard using fasteners that mate with the mounting holes, ensuring stable connections. Furthermore, the tray allows for integrated motherboard disassembly and assembly. After the motherboard is fixed to the tray, all electronic components can be secured to it first, and then the tray can be used to fix the entire motherboard inside the chassis. This avoids disassembly and assembly operations within the confined space of the chassis, improving testing efficiency.

[0051] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 and Figure 2 The three-dimensional structure of the EMC testing device is shown from two different perspectives. Figure 3 The three-dimensional structure of the tray in the EMC testing apparatus is shown. Figure 4 A cross-sectional view of the EMC testing apparatus 100 is shown. The EMC testing apparatus 100 includes a housing 110, a support plate 120, and a plurality of first fasteners 21. A receiving cavity 111 is formed inside the housing 110, and the support plate 120 is disposed within the receiving cavity 111 and fixedly connected to the inner wall of the housing 110. The support plate 120 has a plurality of mounting holes 31, which include multiple combinations. When the first fasteners 21 are connected to multiple mounting holes 31 in different combinations, different types of motherboards 200 can be fixed on the support plate 120, thereby enabling EMC testing of different types of motherboards 200.

[0052] The housing 110 is the main structure of the EMC testing device 100. The housing 110 can be integrally formed by bending a metal sheet (e.g., stainless steel sheet, iron sheet, etc.) or by injection molding. The accommodating cavity 111 is the space inside the housing 110 used to accommodate various functional components (e.g., motherboard 200, fan module 130, hard drive 140, etc.) to simulate the operating environment of the motherboard 200, thereby performing EMC testing on the motherboard 200.

[0053] Furthermore, to facilitate the installation of functional components such as the motherboard 200, fan module 130, and hard drive 140 into the accommodating cavity 111, such as... Figure 5 and Figure 6 As shown, Figure 5 The exploded structure of the housing in the EMC testing apparatus is shown. Figure 6 A partial structure of the EMC testing device is shown. The housing 110 has a mounting port 41 for inserting the motherboard 200 into the receiving cavity 111. A cover plate 112 covers the mounting port 41 to ensure the shielding effect of the housing 110. When it is necessary to install or remove the motherboard 200, the cover plate 112 can be opened, and the support plate 120 can be fixedly connected to the inner wall of the housing 110 through the mounting port 41 to complete the installation of the motherboard 200. Alternatively, the support plate 120 can be removed from the inner wall of the housing 110 through the mounting port 41 to complete the removal of the motherboard 200.

[0054] Furthermore, to ensure the stability of the connection between the cover plate 112 and the housing 110, the cover plate 112 and the housing 110 are connected by multiple fasteners 22. The fasteners 22 can be bolt and nut combinations, screws, or other threaded connection structures, or they can be snap-fit, pins, magnetic attraction, or other connection structures. Further, since the cover plate 112 and the housing 110 may not fit perfectly due to processing errors or other factors, resulting in a gap between them, to prevent electromagnetic waves from leaking through the gap between the cover plate 112 and the housing 110, the housing 110 is provided with an abutment member 113 between two adjacent fasteners 22. The abutment member 113 is used to abut against the cover plate 112 when the cover plate 112 is connected to the housing 110.

[0055] Specifically, since the propagation of electromagnetic waves follows Maxwell's equations, in a finite space (such as a waveguide or aperture), the electromagnetic field must satisfy specific boundary conditions. When the aperture (such as the waveguide width or aperture size) is less than half the wavelength (i.e., the cutoff aperture), the electromagnetic wave cannot form a complete standing wave mode, resulting in energy not being able to propagate effectively, thus effectively suppressing electromagnetic wave leakage. After the cover plate 112 is connected to the housing 110, the abutment member 113, by abutting against the cover plate 112, divides the gap between two adjacent fixing members 22 into multiple segments, thereby making the gap between the cover plate 112 and the housing 110 less than half the wavelength of the electromagnetic wave, i.e., the critical size for electromagnetic wave propagation or leakage, effectively avoiding electromagnetic wave leakage and improving the shielding effect of the EMC testing device 100. The abutment member 113 can be a spring, telescopic rod, or other structure, so that it is compressed by the cover plate 112 when the cover plate 112 and the housing 110 are connected, avoiding interference between the abutment member 113 and the cover plate 112.

[0056] The tray 120 is used to fix the motherboard 200 within the receiving cavity 111 for EMC testing. Specifically, the tray 120 has multiple mounting holes 31, and these mounting holes 31 can be combined in various ways to fix different types of motherboards 200 onto the tray 120 through different combinations of mounting holes 31. When performing EMC testing on the motherboard 200, firstly, the corresponding combination of mounting holes 31 is selected according to the type of motherboard 200. As an example, such as... Figure 3 As shown, the tray 120 in the figure can be used to install server motherboards, ATX motherboards, MicroATX motherboards, FlexATX motherboards, Mini-ITX motherboards, etc. Specifically, the combination of nine mounting holes 31 (A, C, D, K, L, M, R, S, T) is used to fix the server motherboard onto the tray 120; the combination of ten mounting holes 31 (A, B, C, E, F, I, J, N, P, Q) is used to fix the ATX motherboard onto the tray 120; the combination of nine mounting holes 31 (B, C, E, G, I, J, O, P, Q) is used to fix the MicroATX motherboard onto the tray 120; the combination of six mounting holes 31 (B, C, E, H, I, J) is used to fix the FlexATX motherboard onto the tray 120; and the combination of four mounting holes 31 (C, E, I, J) is used to fix the Mini-ITX motherboard onto the tray 120.

[0057] Then, the motherboard 200 is secured to the tray 120 by connecting the first fastener 21 to the mounting hole 31. The first fastener 21 can be a combination of bolts and nuts, screws, spring pins, etc. Furthermore, since the back of the motherboard 200 may have electronic components or soldered leads for electronic components, if the back of the motherboard 200 is directly attached to the tray 120, it may cause a short circuit in the electronic components. Therefore, to ensure that the electronic components on the motherboard 200 can operate normally, such as... Figure 4 and Figure 7 As shown, Figure 7 A partial cross-sectional view of the EMC testing device is shown. The first fastener 21 includes a support column 211 and a locking member 212. The support column 211 is used to support the motherboard 200 to elevate the motherboard 200, so that there is a gap between the motherboard 200 and the support plate 120.

[0058] Specifically, one end of the support column 211 has a connecting part 2111, which is detachably connected to the mounting hole 31 on the side of the support plate 120 away from the inner wall of the housing 110, so as to fix the support column 211 on the support plate 120. The connecting part 2111 and the mounting hole 31 can be connected by means of threaded connection, plug-in connection, etc. The other end of the support column 211 has a connecting hole 32, which is connected to the locking member 212 to fix the main plate 200 on the support plate 120. The connecting hole 32 and the locking member 212 can be connected by means of threaded connection, plug-in connection, etc. The support column 211 can be a threaded connection column, an adjustable support leg, a rivet nut column, etc.

[0059] As an example, the mounting hole 31 can adopt the structure of a press-fit nut, the support column 211 is a hexagonal nut column, and the locking element 212 is a screw. When testing different types of motherboards 200, it is only necessary to unscrew the hexagonal nut column from the original mounting hole 31, move it to the corresponding mounting hole 31 of the motherboard 200, and then use the screw to install the motherboard 200 on the support plate 120.

[0060] In this structure, the support column 211 and the mounting hole 31 are detachably connected. When installing the motherboard 200, on the one hand, the corresponding mounting hole 31 can be selected to connect the support column 211 according to the type of the motherboard 200, so as to avoid interference between the support column 211 and the motherboard 200; on the other hand, the support column 211 of the corresponding height can be selected according to the height of the electronic components on the back of the motherboard 200, so as to avoid the electronic components from contacting the tray 120, while minimizing the distance between the motherboard 200 and the tray 120, and improving the space utilization rate in the accommodating cavity 111.

[0061] Finally, the tray 120 and the main board 200 are placed as a whole into the receiving cavity 111, and the tray 120 is fixedly connected to the inner wall of the housing 110. The tray 120 and the housing 110 can be connected by a combination of bolts and nuts, screws, spring pins, etc. Furthermore, to facilitate fixing the tray 120 in the receiving cavity 111, as follows... Figure 4 and Figure 7 As shown, the EMC testing device 100 also includes a second fastener 23, and a fixing post 114 is provided on the inner wall of the housing 110. The support plate 120 is fixedly connected to the fixing post 114 by the second fastener 23.

[0062] The fixing post 114 can be integrally injection molded with the housing 110, or fixedly connected by means of adhesion, welding, threaded connection, snap-fit, etc. The fixing post 114 may have holes, and the tray 120 is fixedly connected to the fixing post 114 by inserting the second fastener 23 into the holes on the fixing post 114. The second fastener 23 can be a screw, spring pin, pin, etc. When installing the tray 120, the second fastener 23 and the fixing post 114 can be directly connected through the mounting port 41 to quickly complete the installation of the tray 120.

[0063] Furthermore, in order to improve the space utilization of the accommodating cavity 111, such as Figure 4 and Figure 7 As shown, the edge of the support plate 120 is fixed to the fixing post 114 by the second fastener 23. The middle area of ​​the support plate 120 is recessed downward to form a mounting groove 121, and the mounting hole 31 is opened at the bottom of the mounting groove 121. Figure 7 As shown, if the tray 120 is a flat plate, after the tray 120 is fixed to the fixing post 114, the distance between the bottom of the tray 120 and the inner wall of the housing 110 is equal to the height of the fixing post 114 x 1. Furthermore, this space is located on the side of the tray 120 away from the main board 200 and is usually unusable, easily resulting in wasted space. If the middle area of ​​the tray 120 is recessed downwards to form a mounting groove 121, the distance x2 between the bottom of the tray 120 (i.e., the bottom of the mounting groove 121) and the inner wall of the housing 110 is less than the height x 1 of the fixing post 114. This reduces the wasted space between the tray 120 and the inner wall of the housing 110, improving the space utilization of the accommodating cavity 111. In addition, the sidewalls of the mounting groove 121 can improve the structural strength of the tray 120, effectively preventing the tray 120 from deforming due to the weight of the main board 200 and electronic components.

[0064] In the above embodiments, by opening a plurality of mounting holes 31 on the tray 120 and forming various combinations, different types of motherboards 200 can be fixed on the tray 120 through different combinations of mounting holes 31, thereby enabling EMC testing of different types of motherboards 200 and improving the compatibility and practicality of the EMC testing device. Furthermore, the motherboard 200 is fixed within the accommodating cavity 111 via the tray 120, rather than being directly connected to the housing 110. On the one hand, the housing 110 only needs to have a structure for fixing the tray 120, without the need for additional mounting holes 31 to accommodate different types of motherboards 200, effectively preventing electromagnetic wave leakage and improving the shielding effect of the EMC testing device 100. On the other hand, after fixing the motherboard 200 on the tray 120, components such as the processor and graphics card can be installed on the motherboard 200 first, and then the motherboard 200 can be inserted into the accommodating cavity 111 via the tray 120. This facilitates the overall disassembly and assembly of the motherboard 200, avoiding disassembly and assembly operations within the confined space of the housing 110.

[0065] Furthermore, the motherboard 200 may need to be connected to expansion cards 300 such as GPU cards or graphics cards to expand the functionality and improve the performance of the motherboard 200. Specifically, the expansion card 300 can be installed by inserting its gold fingers into a slot on the motherboard 200. However, the expansion card 300 may be relatively large, and since it is only connected to the motherboard 200 via its gold fingers, if the expansion card 300 is inserted into the motherboard 200 to form a single unit, and then the motherboard 200 is installed into the receiving cavity 111 via the tray 120, the expansion card 300 may wobble during installation and removal, affecting the stability of the connection between the expansion card 300 and the motherboard 200, and potentially even damaging the expansion card 300 or the motherboard 200. If the motherboard 200 is first installed in the receiving cavity 111 via the tray 120, and then the expansion card 300 is inserted into the motherboard 200, the installation and removal operations must be performed within the confined space of the housing 110.

[0066] Therefore, in order to facilitate the installation and removal of the expansion card 300, in some embodiments, such as Figure 6 and Figure 8 As shown, Figure 8 Another partial structure of the EMC testing device is shown. The edge of the tray 120 is provided with a bracket 122, and the bracket 122 is provided with a fixing hole 33 for connecting with a third fastener 24 to fix the expansion card 300 inserted on the motherboard 200.

[0067] The bracket 122 is used to support and fix the expansion card 300 on the motherboard 200. The bracket 122 and the tray 120 can be detachably connected using screws, pins, nuts, and bolts. The bracket 122 is fixed to the tray 120 so that it can be positioned according to the structure of the motherboard 200 on the tray 120, thus ensuring the compatibility of the tray 120. As an example, such as... Figure 8 As shown, when installing the motherboard 200, first, the motherboard 200 is fixed on the tray 120. Then, according to the position of the interface on the motherboard 200 used to insert the expansion card 300, the bracket 122 is fixed on the tray 120 near these interfaces. Then, the expansion card 300 is inserted into the motherboard 200 so that the fixing structure on the expansion card 300 is attached to the bracket 122. Finally, the third fastener 24 is connected to the fixing hole 33 to fix the expansion card 300.

[0068] In the above embodiment, the expansion card 300 is fixed on the tray 120 by the bracket 122, which not only realizes the integration of the motherboard 200, but also ensures the stability of the connection between the expansion card 300 and the motherboard 200, and prevents the expansion card 300 from shaking during the process of installing or removing the motherboard 200.

[0069] Furthermore, different electronic devices have different chassis structures. For example, some chassis have ventilation openings to improve heat dissipation, while others do not to ensure sealing. Therefore, to simulate different chassis structures and ensure the accuracy of test results, in some embodiments, such as... Figure 5 As shown, openings 42 are provided on at least two side walls 115 of the housing 110, and the openings 42 on the side walls 115 are used for the detachable installation of baffles 116.

[0070] The baffle 116 can be installed on the side wall 115 by means of screws, clips, pins, adhesive, etc. Specifically, if the chassis in which the motherboard 200 actually operates does not have ventilation openings, a baffle 116 without through holes is installed at the opening 42 to block the opening 42; if the chassis in which the motherboard 200 actually operates has ventilation openings, a baffle 116 with through holes is installed at the opening 42 to dissipate heat from the accommodating cavity 111 through the through holes in the baffle 116.

[0071] As an example, such as Figure 5As shown, openings 42 are provided on all four side walls 115 of the housing 110. A baffle 116 without through holes can be installed at each of the openings 42 to simulate a chassis without ventilation openings. Alternatively, a baffle 116 with through holes can be installed at only two of the openings 42 on opposite side walls 115, while a baffle 116 without through holes can be installed at the openings 42 on the other two side walls 115 to simulate a chassis with ventilation openings on opposite side walls 115. Alternatively, baffles 116 with through holes can be installed at all four openings 42 to simulate a chassis with ventilation openings on all four side walls.

[0072] It should be noted that, in order to prevent electromagnetic waves from leaking through the through holes on the baffle 116 during the EMC test, the through holes on the baffle 116 are first micro-holes 34, and the aperture of the first micro-hole 34 is smaller than the cutoff aperture of the electromagnetic waves. This prevents the electric field and magnetic field from effectively establishing a complete oscillation mode, thereby preventing energy from passing through effectively. This effectively suppresses or significantly attenuates the propagation of electromagnetic waves, ensuring the shielding effect of the EMC test device 100 and improving the accuracy of the test results.

[0073] This structure can not only simulate chassis with different structures, effectively improving the practicality of the EMC testing device 100, but also test the impact of ventilation openings with different apertures on the electromagnetic shielding effect and heat dissipation performance of the chassis by changing different baffles 116. In this way, while ensuring that the chassis has a good electromagnetic shielding effect, the heat dissipation performance of the chassis can be improved as much as possible.

[0074] Furthermore, in practical applications, the chassis typically includes a fan cooling module to dissipate heat from the motherboard 200, preventing it from operating in a high-temperature environment and affecting its lifespan. Therefore, to better simulate the actual application scenarios of the motherboard 200, in some embodiments, such as... Figure 4 and Figure 6 As shown, the opening 42 on the side wall 115 is used to install a baffle 116 with a first micro-hole 34. A fan module 130 is provided in the accommodating cavity 111. The fan module 130 is used to draw in gas from the first micro-hole 34 on one side and discharge it from the first micro-hole 34 on the other side to dissipate heat from the accommodating cavity 111.

[0075] The fan module 130 is used to drive the flow of gas within the accommodating cavity 111. The fan module 130 can be a cooling device such as an axial fan, centrifugal fan, or mixed-flow fan. When performing EMC testing on the motherboard 200, the fan module 130 is turned on, drawing gas from outside the housing 110 into the accommodating cavity 111 through the first micro-hole 34 on one side. This allows the gas to contact and absorb the heat generated by the motherboard 200, hard drive 140, and other devices within the accommodating cavity 111. Simultaneously, the heat-absorbing gas is discharged through the first micro-hole 34 on the other side, thus carrying away the heat generated by the motherboard 200, hard drive 140, and other devices.

[0076] In the above embodiments, by setting a fan module 130 in the accommodating cavity 111 to simulate the fan cooling device in the actual chassis used by the motherboard 200, the operating environment in the EMC testing device 100 is as close as possible to the operating environment in the actual chassis used, thereby improving the accuracy of the test results.

[0077] Furthermore, in existing testing setups, the power supply module is typically placed directly in an empty space inside the chassis, with conductive cloth used to create a conductive connection between the module and the chassis. This lack of protection and isolation for the power supply module makes it susceptible to interference with the motherboard 200, significantly impacting test results. Additionally, the power cable passes directly through a hole in the chassis to the power supply module, requiring copper foil to seal the opening – a cumbersome process.

[0078] Therefore, in order to improve the accuracy of test results, in some embodiments, such as Figure 6 , Figure 9 and Figure 10 As shown, Figure 9 This illustrates another partial structure of the EMC testing apparatus. Figure 10 An exploded view of a partial structure of an EMC testing device is shown. A power module 150 is disposed inside the accommodating cavity 111. The power module 150 is used to connect to the motherboard 200 for power supply. An isolation cover 117 is covered on the power module 150 to separate the power module 150 from the motherboard 200.

[0079] The accommodating cavity 111 has a specially designed mounting position for the power module 150 to securely mount the power module and form a good conductive connection. Specifically, as an example, such as... Figure 6 and Figure 10As shown, the power module 150 includes a redundant power supply 151 and a power supply interface 152. The redundant power supply 151 is fixed in the corresponding position inside the accommodating cavity 111, and the redundant power supply 151 is electrically connected to the power supply interface 152 on the housing 110. During the test, it is only necessary to connect the power cord to the power supply interface 152 on the housing 110 to supply power to the redundant power supply 151 through the power supply interface 152. It is not necessary to pass the power cord through the hole on the housing 110 to the power module, which makes the operation convenient and quick.

[0080] In addition, such as Figure 6 and Figure 9 As shown, after the isolation cover 117 is placed over the power module 150, it can isolate the installation areas of the power module 150 and the motherboard 200, effectively reducing the interference of the power module 150 to the motherboard 200, thereby improving the accuracy of the test results. Furthermore, the power supply interface 152 can use a power filter to effectively reduce the interference of power input to EMC testing, further improving the accuracy of the test results.

[0081] Furthermore, since the power module 150 generates heat during operation, in order to effectively dissipate heat from the power module 150, in some embodiments, such as... Figure 9 and Figure 10 As shown, the isolation cover 117 has multiple second micro-holes 35, which are used for heat dissipation of the power module 150. Similarly, in order to prevent electromagnetic waves from passing through the second micro-holes 35 and interfering with the motherboard 200, the aperture of the second micro-holes 35 is smaller than the cutoff aperture of electromagnetic waves, effectively suppressing or significantly attenuating the propagation of electromagnetic waves.

[0082] The second micro-hole 35 on the isolation cover 117 not only blocks the propagation of electromagnetic waves, but also connects the installation space of the power module 150 and the installation space of the motherboard 200. During ECM testing, if the housing 110 has ventilation holes, the heat generated by the power module 150 can be conducted to other locations within the accommodating cavity 111 through the second micro-hole 35, and then conducted to the external environment through the ventilation holes on the housing 110, thereby achieving heat dissipation for the power module 150. If the housing 110 does not have ventilation holes, the heat generated by the power module 150 and the motherboard 200 can be transferred to each other through the second micro-hole 35, ensuring that the temperature of each location within the accommodating cavity 111 remains consistent, preventing uneven heating of the electronic components within the accommodating cavity 111 due to temperature differences within the accommodating cavity 111.

[0083] Furthermore, traditional hard drive brackets install hard drives using screws, and then the brackets are fixed to the computer case. When testing with different operating systems, it's necessary to reinstall the system on the hard drive or remove the hard drive from the bracket and replace it with the one already containing the operating system. Both methods are cumbersome. Therefore, in some embodiments, EMC testing equipment can use tool-less, quick-release hard drive brackets to easily replace hard drives with operating systems, eliminating the tedious disassembly and reassembly process of traditional hard drive brackets and effectively improving testing efficiency.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An EMC testing device, characterized in that, The device includes: a housing, a support plate, and a plurality of first fasteners; The housing has an internal cavity, and the tray is disposed in the cavity and fixedly connected to the inner wall of the housing. The tray has a plurality of mounting holes, which include various combinations. When the first fastener is connected to a plurality of mounting holes in different combinations, different types of motherboards can be fixed on the tray, thereby enabling EMC testing of different types of motherboards.

2. The EMC testing apparatus according to claim 1, characterized in that, The device further includes a second fastener, and a fixing post is provided on the inner wall of the housing. The support plate is fixedly connected to the fixing post by the second fastener.

3. The EMC testing apparatus according to claim 2, characterized in that, The edge of the tray is fixed to the fixing post by the second fastener, and the middle area of ​​the tray is recessed to form a mounting groove, and the mounting hole is opened at the bottom of the mounting groove.

4. The EMC testing apparatus according to claim 1, characterized in that, The first fastener includes a support column and a locking member. One end of the support column has a connecting hole, and the other end has a connecting part. The connecting part is detachably connected to the mounting hole on the side of the tray away from the inner wall of the housing. The locking member is connected to the connecting hole to fix the main board to the tray.

5. The EMC testing apparatus according to claim 1, characterized in that, The edge of the tray is provided with a bracket, and the bracket is provided with a fixing hole for connecting with a third fastener to fix the expansion card inserted on the motherboard.

6. The EMC testing apparatus according to claim 1, characterized in that, The housing has openings on at least two side walls, and the openings on the side walls are used for the detachable installation of baffles.

7. The EMC testing apparatus according to claim 6, characterized in that, The opening on the sidewall is used to install a baffle with a first micro-hole; A fan module is provided inside the accommodating cavity. The fan module is used to draw in gas from the first micropore on one side and discharge it from the first micropore on the other side to dissipate heat from the accommodating cavity.

8. The EMC testing apparatus according to claim 1, characterized in that, A power module is provided inside the cavity. The power module is used to connect to the motherboard to provide power. An isolation cover is provided on the power module to separate the power module from the motherboard.

9. The EMC testing apparatus according to claim 8, characterized in that, The isolation cover has multiple second micro-holes, which are used for heat dissipation of the power module.

10. The EMC testing apparatus according to claim 1, characterized in that, The housing has an installation port for the motherboard to be inserted into the accommodating cavity; The mounting opening is covered by a cover plate, and the cover plate and the housing are connected by multiple fasteners. The housing is provided with an abutment between two adjacent fasteners, and the abutment is used to abut against the cover plate when the cover plate is connected to the housing.

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