Power capacitor easy to dissipate heat

Abstract

The utility model relates to a power capacitor easy to dissipate heat, and belongs to the technical field of power capacitors, the power capacitor comprises a capacitor bottom shell, a capacitor core is arranged in the capacitor bottom shell, and a radiator is arranged on the outer side of the capacitor bottom shell; the mold opening upper shell is detachably arranged at the upper end of the capacitor bottom shell, an integrated circuit board is arranged in the mold opening upper shell, and heat dissipation holes and a cleaning mechanism used for cleaning the heat dissipation holes are arranged on the mold opening upper shell. The power capacitor is cooled in the mode that the radiator is fixed to the outer side of the capacitor bottom shell and the heat dissipation holes are formed in the mold opening upper shell, in addition, the heat dissipation holes can be cleaned by arranging the cleaning mechanism, and therefore the situation that the heat dissipation holes are blocked is avoided, it is guaranteed that the heat dissipation holes are communicated with the interior of the mold opening upper shell, and the service life of the power capacitor is prolonged. And the heat dissipation effect of the power capacitor can be improved.

Description

Technical Field

[0001] This application relates to the field of power capacitors, and more particularly to a power capacitor that is easy to dissipate heat. Background Technology

[0002] With the improvement of economic level, various electrical equipment are increasingly entering people's lives, resulting in a rapid increase in electricity consumption. Power capacitors are used in low-voltage power supply systems to ensure the reduction of reactive power in the power grid and improve the system power supply efficiency and voltage quality.

[0003] In related technologies, a power capacitor includes an open-mold upper shell and a capacitor bottom shell. The open-mold upper shell contains an intelligent measurement and control unit, a zero-crossing switching circuit, and a line protection unit. Heat dissipation holes are provided on both sides of the open-mold upper shell. This power capacitor integrates advanced technologies such as modern measurement and control, power electronics, network communication, automation control, and power capacitors. It changes the outdated controller technology and outdated mechanical contactors or electromechanical switches used in traditional reactive power compensation devices for switching capacitors, and also changes the bulky and cumbersome structure of traditional reactive power compensation devices, adapting to the higher requirements of modern power grids for reactive power compensation.

[0004] In the aforementioned related technologies, during the operation of a power capacitor, the heat dissipation holes on the side of the casing alone cannot effectively reduce the temperature of the capacitor surface. Furthermore, the capacitor generates a large amount of static electricity during operation, which easily attracts dust. A large amount of dust accumulates on the capacitor, and after long-term use, the heat dissipation holes are prone to blockage, thereby affecting the heat dissipation effect of the power capacitor. Utility Model Content

[0005] To improve heat dissipation, this application provides a power capacitor that is easy to dissipate heat.

[0006] This application provides a power capacitor that is easy to dissipate heat, employing the following technical solution:

[0007] A power capacitor that facilitates heat dissipation, comprising:

[0008] A capacitor base shell, wherein a capacitor core is disposed inside the capacitor base shell, and a heat sink is disposed on the outside of the capacitor base shell;

[0009] The molded upper shell is detachably mounted on the upper end of the capacitor bottom shell. The molded upper shell contains an integrated circuit board and has heat dissipation holes and a cleaning mechanism for cleaning the heat dissipation holes.

[0010] Optionally, the heat sink includes a heat sink base and a heat sink fan mounted on the heat sink base, and the heat sink base is provided with multiple heat sink vertical plates.

[0011] Optionally, the heat sink and the heat sink vertical plate are provided with a heat dissipation coating.

[0012] Optionally, the heat dissipation holes are arranged in a strip shape, and the length direction of the heat dissipation holes is the same as the length direction of the upper shell of the mold. There are multiple heat dissipation holes, and the multiple heat dissipation holes are arranged linearly along the height direction of the upper shell of the mold. The cleaning mechanism includes a movable plate and a cleaning component disposed on the movable plate. The movable plate is slidably disposed on the outside of the upper shell of the mold along the length direction of the upper shell of the mold. The cleaning component is disposed on the side of the movable plate close to the upper shell of the mold. The cleaning component is disposed in a one-to-one correspondence with the heat dissipation holes and the cleaning component extends into the corresponding heat dissipation hole.

[0013] Optionally, a plurality of heat dissipation holes arranged linearly along the height direction of the upper shell of the mold opening form a heat dissipation area. Two heat dissipation areas and two cleaning mechanisms are symmetrically arranged. A driving mechanism is provided on the upper shell of the mold opening. The driving mechanism is connected to the two cleaning mechanisms respectively to drive the movable plates of the two cleaning mechanisms to move synchronously in the center.

[0014] Optionally, the driving mechanism includes a driving gear and two transmission racks. The driving gear is rotatably disposed on the outside of the mold opening upper shell, and the two transmission racks are slidably disposed on the outside of the mold opening upper shell along the length direction of the mold opening upper shell. The tooth surfaces of the two transmission racks are arranged opposite to each other, and each transmission rack is connected to the movable plate of the corresponding cleaning mechanism.

[0015] Optionally, a drive rocker arm is provided on the outer side of the drive gear.

[0016] Optionally, the bottom of the capacitor housing is provided with a fixing foot, and the fixing foot is provided with a mounting hole.

[0017] In summary, this application includes at least one of the following beneficial technical effects:

[0018] 1. This application dissipates heat from the power capacitor by fixing a heat sink to the outside of the capacitor bottom shell and by opening heat dissipation holes on the upper shell of the mold. In addition, a cleaning mechanism can be set to clean the heat dissipation holes, thereby avoiding blockage of the heat dissipation holes and ensuring that the heat dissipation holes are connected to the inside of the upper shell of the mold, which is beneficial to improving the heat dissipation effect of the power capacitor.

[0019] 2. The application of a heat-dissipating coating helps to improve the thermal conductivity of the heat sink and the heat dissipation plate, thereby further improving the heat dissipation efficiency of the heat sink and thus improving the heat dissipation effect of the power capacitor.

[0020] 3. By setting up the drive mechanism, the movable plates of the two cleaning mechanisms can be driven to move synchronously in the center, thereby cleaning the heat dissipation holes of the two heat dissipation areas at the same time, which helps to improve the cleaning efficiency of the heat dissipation holes. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a power capacitor that is easy to dissipate heat, according to an embodiment of this application.

[0022] Figure 2 This is a cross-sectional view illustrating an embodiment of this application.

[0023] Figure 3 This is a schematic diagram illustrating the specific structure of the molded upper shell in the embodiments of this application.

[0024] Figure 4 This is a schematic diagram illustrating the specific structure of the cleaning mechanism in the embodiments of this application.

[0025] Figure 5 This is a schematic diagram illustrating the specific structure of the heat sink in the embodiments of this application.

[0026] Explanation of reference numerals in the attached drawings: 1. Capacitor bottom shell; 2. Mold-opening upper shell; 21. Heat dissipation hole; 22. Heat dissipation area; 3. Capacitor core; 4. Integrated circuit board; 5. Cleaning mechanism; 51. Movable plate; 52. Cleaning component; 6. Drive mechanism; 61. Drive gear; 611. Drive crank; 62. Transmission rack; 7. Heat sink; 71. Heat sink base; 711. Heat dissipation vertical plate; 72. Heat dissipation fan; 73. Heat dissipation coating; 8. Fixing foot; 81. Mounting hole. Detailed Implementation

[0027] The following combination Figures 1-5 This application will be described in further detail below.

[0028] Example:

[0029] This application discloses a power capacitor that is easy to dissipate heat. (See also...) Figures 1-2 A power capacitor that is easy to dissipate heat includes a capacitor base shell 1 and an open molded upper shell 2 that is detachably fixed to the capacitor base shell 1 by bolts. A capacitor core 3 is fixed inside the capacitor base shell 1, and an integrated circuit board 4 is fixed inside the open molded upper shell 2. This power capacitor can be used as a single unit or multiple units can be networked to form a compensation system. It can easily realize local, distributed and centralized automatic compensation functions, and can also meet the mixed compensation requirements in three-phase unbalanced situations.

[0030] Reference Figure 1 To ensure the heat dissipation effect of the molded upper shell 2 in the power capacitor and to guarantee the service life of the integrated circuit board 4, heat dissipation holes 21 are provided on the outer side of the molded upper shell 2. Since the heat dissipation holes 21 are prone to blockage after long-term use of the power capacitor, in order to ensure that the heat dissipation holes 21 are connected to the inside of the molded upper shell 2 and thus ensure that the molded upper shell 2 has a stable heat dissipation effect, a cleaning mechanism 5 for cleaning the heat dissipation holes 21 is also provided on the molded upper shell 2.

[0031] Reference Figure 1 , Figure 3 and Figure 4 To facilitate cleaning of the heat dissipation holes 21 by the cleaning mechanism 5, the heat dissipation holes 21 are arranged in a strip shape, with their length direction being the same as that of the upper mold shell 2. Multiple heat dissipation holes 21 are provided, arranged linearly along the height direction of the upper mold shell 2. The cleaning mechanism 5 includes a movable plate 51 and a cleaning component 52. The movable plate 51 is slidably disposed on the outside of the upper mold shell 2 along its length direction. The cleaning component 52 is fixed to the side of the movable plate 51 near the upper mold shell 2, and each cleaning component 52 corresponds to one of the heat dissipation holes 21, extending into the corresponding heat dissipation hole 21. In this embodiment, the cleaning component 52 is a cleaning brush.

[0032] Reference Figure 3 To further improve the heat dissipation effect of the mold-opening upper shell 2, multiple heat dissipation holes 21 arranged linearly along the height direction of the mold-opening upper shell 2 form a heat dissipation area 22. Two heat dissipation areas 22 and two cleaning mechanisms 5 are symmetrically arranged. A drive mechanism 6 is provided on the mold-opening upper shell 2, which is connected to the two cleaning mechanisms 5 respectively, to drive the movable plates 51 of the two cleaning mechanisms 5 to move synchronously towards the center. Thus, through the arrangement of the drive mechanism 6, the movable plates 51 of the two cleaning mechanisms 5 can be driven to move synchronously towards the center, thereby enabling simultaneous cleaning of the heat dissipation holes 21 in the two heat dissipation areas 22, which is beneficial to improving the cleaning efficiency of the heat dissipation holes 21.

[0033] Reference Figure 3 The drive mechanism 6 includes a drive gear 61 and two transmission racks 62. The two transmission racks 62 mesh with the drive gear 61. The drive gear 61 is rotatably mounted on the outside of the mold-opening upper shell 2. The two transmission racks 62 are slidably mounted on the outside of the mold-opening upper shell 2 along its length. The tooth surfaces of the two transmission racks 62 are opposite to each other. Each transmission rack 62 is connected to the movable plate 51 of the corresponding cleaning mechanism 5. To facilitate the rotation of the drive gear 61, a drive handle 611 is fixed to the outside of the drive gear 61. By shaking the drive handle 611, the drive gear 61 can be rotated. The rotation of the drive gear 61 causes the two transmission racks 62 to move synchronously in the center. The movement of the transmission racks 62 causes the corresponding movable plate 51 to move. The movement of the movable plate 51 causes the corresponding cleaning component 52 to move, thereby cleaning the heat dissipation holes 21 and ensuring the heat dissipation effect of the heat dissipation holes 21.

[0034] Reference Figure 1 and Figure 5To improve the heat dissipation of the capacitor base 1, a heat sink 7 is installed on the capacitor base 1. The heat sink 7 includes a heat sink base 71 and a cooling fan 72 mounted on the heat sink base 71. The heat sink base 71 is fixed to the outer wall of the capacitor base 1 by thermally conductive adhesive. Multiple heat dissipation vertical plates 711 are fixed on the side of the heat sink base 71 away from the capacitor base 1 to ensure that the heat sink 7 has a large heat dissipation area.

[0035] Reference Figure 2 The outer surfaces of the heat sink 71 and the heat sink vertical plate 711 are coated with a heat dissipation coating 73. The heat dissipation coating 73 helps to improve the thermal conductivity of the heat sink 71 and the heat sink vertical plate 711, thereby further improving the heat dissipation efficiency of the heat sink 7 and thus improving the heat dissipation effect of the power capacitor. In this embodiment, the heat dissipation coating 73 is a graphene heat dissipation coating 73.

[0036] Reference Figure 1 To facilitate the installation of the power capacitor at the designated location, a fixing foot 8 is fixed to the bottom of the capacitor base 1, and a mounting hole 81 is provided on the fixing foot 8. In this embodiment, the mounting hole 81 is an oblong hole.

[0037] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A power capacitor that facilitates heat dissipation, characterized in that, include: A capacitor base (1) is provided inside the capacitor base (1), and a heat sink (7) is provided on the outside of the capacitor base (1). The upper shell (2) is detachably mounted on the upper end of the capacitor bottom shell (1). The upper shell (2) is provided with an integrated circuit board (4). The upper shell (2) is provided with heat dissipation holes (21) and a cleaning mechanism (5) for cleaning the heat dissipation holes (21).

2. The power capacitor with easy heat dissipation according to claim 1, characterized in that: The radiator (7) includes a heat sink (71) and a heat dissipation fan (72) disposed on the heat sink (71). The heat sink (71) is provided with a plurality of heat dissipation vertical plates (711).

3. The power capacitor with easy heat dissipation according to claim 2, characterized in that: The heat sink (71) and the heat sink vertical plate (711) are provided with a heat dissipation coating (73).

4. The power capacitor with easy heat dissipation according to claim 1, characterized in that: The heat dissipation holes (21) are arranged in a strip shape. The length direction of the heat dissipation holes (21) is the same as the length direction of the mold opening upper shell (2). There are multiple heat dissipation holes (21), and the multiple heat dissipation holes (21) are arranged linearly along the height direction of the mold opening upper shell (2). The cleaning mechanism (5) includes a movable plate (51) and a cleaning component (52) provided on the movable plate (51). The movable plate (51) is slidably arranged on the outside of the mold opening upper shell (2) along the length direction of the mold opening upper shell (2). The cleaning component (52) is provided on the side of the movable plate (51) close to the mold opening upper shell (2). The cleaning component (52) is arranged in a one-to-one correspondence with the heat dissipation holes (21), and the cleaning component (52) extends into the corresponding heat dissipation hole (21).

5. A power capacitor with easy heat dissipation according to claim 4, characterized in that: Multiple heat dissipation holes (21) arranged linearly along the height direction of the upper shell (2) form a heat dissipation area (22). There are two heat dissipation areas (22) and two cleaning mechanisms (5) symmetrically arranged. A driving mechanism (6) is provided on the upper shell (2). The driving mechanism (6) is connected to the two cleaning mechanisms (5) respectively to drive the movable plates (51) of the two cleaning mechanisms (5) to move synchronously in the center.

6. The heat-dissipating power capacitor according to claim 5, characterized in that: The driving mechanism (6) includes a driving gear (61) and two transmission racks (62) that mesh with the driving gear (61). The driving gear (61) is rotatably disposed on the outside of the mold opening upper shell (2). The two transmission racks (62) are slidably disposed on the outside of the mold opening upper shell (2) along the length direction of the mold opening upper shell (2). The tooth surfaces of the two transmission racks (62) are arranged opposite to each other. Each transmission rack (62) is connected to the movable plate (51) of the corresponding cleaning mechanism (5).

7. A power capacitor with easy heat dissipation according to claim 6, characterized in that: A drive rocker arm (611) is provided on the outside of the drive gear (61).

8. The power capacitor with easy heat dissipation according to claim 1, characterized in that: The bottom of the capacitor base (1) is provided with a fixing foot (8), and the fixing foot (8) is provided with a mounting hole (81).

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