Heat conduction type multilayer long electrode capacitor

Abstract

The utility model discloses a heat conduction type multilayer long electrode capacitor, which relates to the technical field of capacitors, and comprises a connecting base and two groups of outer layer electrode plates fixedly connected to the top of the connecting base, the top of the connecting base is also fixedly connected with a protective body, the protective body is arranged between the two groups of outer layer electrode plates, and the protective body is fixedly connected with the connecting base. According to the utility model, through the arrangement of the first capacitor sheet, the second capacitor sheet, the inner side electrode and the protection body, the change of load current can be quickly responded, and the heat dissipation performance of the capacitor sheet can be improved, so that the service life of the capacitor sheet can be prolonged, and the service life of the capacitor sheet can be prolonged, and the service life of the capacitor sheet can be prolonged. According to the multi-layer capacitor, the effect of voltage fluctuation in a power supply network is reduced, the power supply stability of a chip is ensured, and the problems that in the using process of an existing multi-layer capacitor, due to the fact that insertion loss of a high-frequency and decoupling circuit is large, when external signal interference occurs, the using efficiency of the capacitor is prone to being reduced, and then using is not facilitated are solved.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, specifically to a thermally conductive multilayer long electrode capacitor. Background Technology

[0002] Multilayer capacitors, also known as multilayer ceramic capacitors, are a type of capacitor with a unique structure. Their manufacturing process involves stacking ceramic dielectric films with printed electrodes in a staggered manner, followed by high-temperature sintering to form a ceramic chip. Due to their excellent performance, they are widely used in the electronics industry. However, existing multilayer capacitors still encounter some problems in practical applications.

[0003] For example, application number CN201620082271.0 discloses a heat-resistant capacitor, including a capacitor shell, a thermally conductive rubber layer on the inner wall of the capacitor shell, multiple heat dissipation baffles on the outer wall of the capacitor shell, a pressure relief groove at the bottom of the capacitor shell, and a pressure relief screw in the pressure relief groove. It has the characteristics of efficient heat dissipation and pressure relief of the capacitor shell. In the process of use, existing multilayer capacitors have large insertion losses in high frequency and decoupling circuits, which can easily cause the capacitor efficiency to decrease when encountering external signal interference, thus making it unsuitable for use.

[0004] To address the aforementioned problems, a thermally conductive multilayer long electrode capacitor is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a thermally conductive multilayer long electrode capacitor. By using this device, the problem of high insertion loss in high-frequency and decoupling circuits in existing multilayer capacitors during use is solved. This leads to a decrease in capacitor efficiency when encountering external signal interference, which is detrimental to their use.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thermally conductive multilayer long electrode capacitor, comprising a connecting base and an outer electrode sheet fixedly connected to the top of the connecting base. A protective body is also fixedly connected to the top of the connecting base. Two sets of outer electrode sheets are provided, and the protective body is located between the two sets of outer electrode sheets. An inner electrode is provided between the two sets of outer electrode sheets. A heat dissipation vent is provided at the bottom of the connecting base, and a second heat dissipation vent is also provided at the bottom of the connecting base.

[0007] Preferably, a capacitor sheet is fixedly connected to the bottom of the protective body, and two sets of capacitor sheets are provided, with a capacitor sheet second fixedly connected between the two sets of capacitor sheets.

[0008] The design of the above structure, through the arrangement of capacitor sheet one and capacitor sheet two, improves the integration of the overall structure and facilitates its use.

[0009] Preferably, a third capacitor is fixedly connected between the two sets of capacitor sheets, and there are two sets of both capacitor sheets.

[0010] With the above-described structure, the overall structural dimensions are longer than wide due to the arrangement of capacitor sheet three. Shortening the electrode length can reduce the inductance value.

[0011] Preferably, the two sets of capacitor plates two and the two sets of capacitor plates three are arranged alternately, and the multiple sets of inner electrodes are respectively fixedly connected to the corresponding capacitor plates two and three.

[0012] The above-described structure, through the alternating arrangement of capacitors two and three, enables a rapid response to changes in load current and reduces voltage fluctuations in the power supply network.

[0013] Preferably, the first heat dissipation port is connected to the second heat dissipation port, and a heat-conducting plate is fixedly connected inside the first heat dissipation port. Multiple sets of the heat-conducting plate are provided, and a contact plate is fixedly connected to the top of the heat-conducting plate.

[0014] With the above-described structural design, the heat generated during operation can be dissipated in a timely manner through the placement of the heat-conducting plate.

[0015] Preferably, a heat-conducting plate two is fixedly connected inside the heat dissipation port two, and a connecting plate is fixedly connected to the top of the heat-conducting plate two. The connecting plate and the contact plate are both in contact with the capacitor plate one.

[0016] The above-described structure, with its connecting plate, allows related components to be connected to the connecting plate, thus improving the space utilization of the device.

[0017] Preferably, heat dissipation fins are fixedly connected to both sides of the contact plate and one side of the heat-conducting sheet, and multiple sets of heat dissipation fins are provided.

[0018] The above-described structure, through the arrangement of heat dissipation fins, achieves the effect of improving the overall heat dissipation performance.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] 1. This application achieves rapid response to load current changes and reduces voltage fluctuations in the power supply network by setting up capacitor sheet one, capacitor sheet two, inner electrodes and protective body, thus ensuring the stability of chip power supply. It solves the problem that existing multilayer capacitors have large insertion losses in high frequency and decoupling circuits, which easily leads to a decrease in capacitor efficiency when encountering external signal interference, thus making them unsuitable for use.

[0021] 2. This application achieves the effect of improving the heat dissipation of the overall structure by setting up heat-conducting plate one, heat-conducting plate two, heat dissipation port one and heat dissipation port two, and at the same time improves the working efficiency of the capacitor. It solves the problem that most existing multilayer capacitors have a simple structure and often lack effective heat dissipation means during use, which easily leads to a decrease in the working efficiency of the overall structure. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a structural diagram of the protective body and capacitor sheet of this utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the inner electrode and capacitor sheet of this utility model;

[0025] Figure 4 This is a structural diagram of heat-conducting sheet one and heat-conducting sheet two of this utility model.

[0026] In the diagram: 1. Connecting base; 11. Outer electrode sheet; 12. Protective body; 121. Capacitor sheet one; 122. Capacitor sheet two; 123. Capacitor sheet three; 13. Inner electrode; 14. Heat dissipation port one; 141. Heat-conducting sheet one; 142. Contact plate; 143. Heat dissipation fins; 15. Heat dissipation port two; 151. Heat-conducting sheet two; 152. Connecting plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings.

[0029] Combination Figures 1-3A thermally conductive multilayer long electrode capacitor includes a connecting base 1 and an outer electrode sheet 11 fixedly connected to the top of the connecting base 1. A protective body 12 is also fixedly connected to the top of the connecting base 1. Two sets of outer electrode sheets 11 are provided, and the protective body 12 is located between the two sets of outer electrode sheets 11. An inner electrode 13 is provided between the two sets of outer electrode sheets 11. A heat dissipation vent 14 is provided at the bottom of the connecting base 1, and a heat dissipation vent 15 is also provided at the bottom of the connecting base 1.

[0030] The present invention will be further described below with reference to the embodiments.

[0031] Example 1:

[0032] To address the issue that existing multilayer capacitors suffer from high insertion loss in high-frequency and decoupling circuits, leading to decreased efficiency when exposed to external signal interference, and thus hindering their use, the following solution is disclosed. Please refer to the following for details. Figures 1-3 The bottom of the protective body 12 is fixedly connected to a capacitor sheet 121, and there are two sets of capacitor sheets 121. A capacitor sheet 122 is fixedly connected between the two sets of capacitor sheets 121, and a capacitor sheet 123 is also fixedly connected between the two sets of capacitor sheets 121. There are two sets of capacitor sheets 122 and two sets of capacitor sheets 123. The two sets of capacitor sheets 122 and two sets of capacitor sheets 123 are arranged alternately. Multiple sets of inner electrodes 13 are fixedly connected to the corresponding capacitor sheets 122 and 123. When the entire structure needs to be used, the connecting base 1 can be installed in the designated position, and the outer electrodes can be connected through the wire structure. The chip 11 and the protective body 12 are used by stacking capacitor chip 121 and capacitor chip 122. The electrode printing is flush with the left or right ends. Because it is to connect the terminal electrode, the low ESL is a long electrode, which is printed flush with the front or back. The overall structure is longer than wide. Shortening the electrode length can reduce the inductance value. The equivalent inductance is only one-tenth of that of a normal capacitor. The impedance curve is flatter in high-frequency scenarios, effectively expanding the self-resonant frequency range. At the same time, it extends the life of the device and reduces the need for external filtering components. It can quickly respond to changes in load current, reduce voltage fluctuations in the power supply network, and ensure the stability of the chip power supply.

[0033] Example 2:

[0034] To address the issue that most existing multilayer capacitors have a simple structure and often lack effective heat dissipation methods, which can easily lead to a decrease in overall structural efficiency, the following solution is disclosed. Please refer to the following for details. Figure 1 , Figure 2 and Figure 4Heat dissipation vent 14 is connected to heat dissipation vent 15. A heat-conducting plate 141 is fixedly connected inside heat dissipation vent 14, and multiple sets of heat-conducting plates 141 are provided. A contact plate 142 is fixedly connected to the top of heat-conducting plate 141. A heat-conducting plate 151 is fixedly connected inside heat dissipation vent 15, and a connecting plate 152 is fixedly connected to the top of heat-conducting plate 151. Both the connecting plate 152 and the contact plate 142 are in contact with capacitor sheet 121. Heat dissipation fins 143 are fixedly connected to the left and right sides of the contact plate 142 and one side of heat-conducting plate 151, and multiple sets of heat dissipation fins 143 are provided. When in use, capacitor sheet 121 generates… The heat can be transferred to the contact plate 142 inside the heat dissipation port 14, and then the contact plate 142 transfers the heat to the heat dissipation fins 143 inside the heat dissipation port 14 through the heat-conducting plate 141. At this time, the heat generated by the overall structure can be dissipated. At the same time, due to the setting of the connecting plate 152 and the heat-conducting plate 151 inside the heat dissipation port 15, the heat can also be transferred to the connecting plate 152, and then transferred to the heat dissipation fins 143 inside the heat dissipation port 15 through the heat-conducting plate 151. This further dissipates the heat generated by the overall structure, thereby improving the heat dissipation effect of the overall structure and improving the working efficiency of the capacitor.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermally conductive multilayer long electrode capacitor, comprising a connecting base (1) and an outer electrode sheet (11) fixedly connected to the top of the connecting base (1), wherein a protective body (12) is also fixedly connected to the top of the connecting base (1), characterized in that: Two sets of outer electrode sheets (11) are provided, and the protective body (12) is located between the two sets of outer electrode sheets (11). An inner electrode (13) is provided between the two sets of outer electrode sheets (11). A heat dissipation port one (14) is provided at the bottom of the connecting base (1), and a heat dissipation port two (15) is also provided at the bottom of the connecting base (1).

2. The thermally conductive multilayer long electrode capacitor according to claim 1, characterized in that: The bottom of the protective body (12) is fixedly connected to a capacitor sheet (121), and there are two sets of capacitor sheets (121). A capacitor sheet (122) is fixedly connected between the two sets of capacitor sheets (121).

3. A thermally conductive multilayer long electrode capacitor according to claim 2, characterized in that: A capacitor third (123) is fixedly connected between the two sets of capacitor sheet one (121), and two sets of capacitor sheet two (122) and capacitor sheet three (123) are provided.

4. A thermally conductive multilayer long electrode capacitor according to claim 3, characterized in that: The two sets of capacitor plates two (122) and the two sets of capacitor plates three (123) are arranged alternately, and the multiple sets of inner electrodes (13) are respectively fixedly connected to the corresponding capacitor plates two (122) and capacitor plates three (123).

5. A thermally conductive multilayer long electrode capacitor according to claim 4, characterized in that: The heat dissipation port one (14) is connected to the heat dissipation port two (15). A heat-conducting plate one (141) is fixedly connected inside the heat dissipation port one (14), and multiple sets of heat-conducting plates one (141) are provided. A contact plate (142) is fixedly connected to the top of the heat-conducting plate one (141).

6. A thermally conductive multilayer long electrode capacitor according to claim 5, characterized in that: A heat-conducting plate two (151) is fixedly connected inside the heat dissipation port two (15), and a connecting plate (152) is fixedly connected to the top of the heat-conducting plate two (151). The connecting plate (152) and the contact plate (142) are in contact with the capacitor plate one (121).

7. A thermally conductive multilayer long electrode capacitor according to claim 6, characterized in that: Heat dissipation fins (143) are fixedly connected to both sides of the contact plate (142) and one side of the heat-conducting plate (151), and multiple sets of heat dissipation fins (143) are provided.

Images