Power module assembly, motor controller and vehicle

Abstract

The embodiment of the utility model relates to a power module assembly, a motor controller and a vehicle, and the power module assembly comprises a driving module, a power module and a capacitor module. The driving module comprises a main control board, and a driving chip, a power supply device and a connector which are arranged on the main control board; the power module is arranged on one side, in the first direction, of the main control board, the power module comprises an insulating substrate, a power chip arranged on the insulating substrate and a heat dissipation piece with a plurality of heat dissipation pin fins, the power chip is located on one side, close to the main control board, of the insulating substrate, and the heat dissipation piece is located on one side, away from the main control board, of the insulating substrate; the capacitor module is arranged on the side, deviating from the main control board in the first direction, of the power module, the capacitor module comprises a shell and a capacitor core package, the side, close to the power module, of the shell is provided with a heat dissipation flow channel for containing heat dissipation pin fins and a cooling medium, and the capacitor core package is arranged on the side, deviating from the heat dissipation flow channel in the first direction, of the shell. The power module assembly is compact in structure and good in heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of automotive parts technology, specifically to a power module assembly, a motor controller, and a vehicle. Background Technology

[0002] With the development of new energy vehicle technology, long driving range, high power output, and multiple drive systems have become the main trends in new energy vehicles. Long driving range means more battery space, and high power and multiple drive systems mean a greater number of electric drive systems are needed. However, the size of a vehicle is limited. Without a revolutionary change in battery technology, the overall size of the battery cannot be further reduced. The only solution is to improve the overall size of the electric drive system.

[0003] An electric drive system mainly consists of a housing, a reducer, a motor, and a motor controller. The motor controller is the most crucial component, primarily responsible for power control and output, and occupies a significant amount of space. Traditional motor controllers are independent components, mainly including a power module, drive board, capacitors, control board, current sensor, three-phase copper busbar, filter assembly, heat dissipation assembly, and housing. Because assembling these components requires considerable space, the motor controller suffers from significant internal space waste, a large overall size, and poor heat dissipation. Utility Model Content

[0004] In view of this, embodiments of this application aim to provide a power module assembly, a motor controller, and a vehicle that are compact in structure and have good heat dissipation.

[0005] To achieve the above objectives, one embodiment of this application provides a power module assembly, including:

[0006] A drive module, comprising a main control board and a drive chip, power supply device and connector disposed on the main control board;

[0007] A power module is disposed on one side of the main control board along the first direction. The power module includes an insulating substrate, a power chip disposed on the insulating substrate, and a heat sink with multiple heat dissipation pins. The power chip is located on the side of the insulating substrate close to the main control board, and the heat sink is located on the side of the insulating substrate away from the main control board.

[0008] A capacitor module is disposed on the side of the power module away from the main control board along the first direction. The capacitor module includes a housing and a capacitor core. The side of the housing near the power module has a heat dissipation channel for accommodating the heat dissipation pins and cooling medium. The capacitor core is disposed on the side of the housing away from the heat dissipation channel along the first direction.

[0009] In one embodiment, the driver chip has at least two independent drive channels; and / or,

[0010] The power supply device is a planar transformer; and / or,

[0011] The connector is a floating connector.

[0012] In one embodiment, the heat sink includes a heat sink base plate that contacts the insulating substrate, and a plurality of heat sink pins are disposed on the side of the heat sink base plate away from the insulating substrate.

[0013] In one embodiment, the heat dissipation channel has a width direction perpendicular to its own extension direction, and a plurality of heat dissipation pins are arranged along the extension direction and the width direction, and the arrangement area of ​​a portion of the heat dissipation pins protrudes from the opposite sides of the arrangement area of ​​another portion of the heat dissipation pins along the width direction.

[0014] In one embodiment, along the extending direction, the arrangement width of the plurality of heat dissipation pins alternates according to a pattern of gradually increasing and then gradually decreasing; and / or,

[0015] The width dimension of the heat dissipation channel along the width direction and the arrangement width of the plurality of heat dissipation pins along the width direction vary according to the same rule.

[0016] In one embodiment, the power module includes an AC copper busbar electrically connected to the insulating substrate, the AC copper busbar having a through-hole, the power module assembly including a current sensor, the current sensor including a circuit board, a Hall chip disposed on the circuit board and electrically connected to the circuit board, and a pin electrically connected to the Hall chip, the pin being plugged into the main control board, the Hall chip extending into the through-hole and having a clearance fit with the through-hole.

[0017] In one embodiment, the number of pins is plurality of, the circuit board includes a first portion and a second portion, the first portion having opposing first and second sidewalls, the second portion protruding from the first sidewall, each of the pins protruding from the second sidewall, and the Hall chip disposed in the second portion; and / or,

[0018] The current sensor includes a positioning post, and the main control board has a positioning hole, with the positioning post and the positioning hole being inserted into each other.

[0019] In one embodiment, the power module includes a frame, a DC copper busbar, and an AC copper busbar. The frame is located on the outer periphery of the insulating substrate, and the DC copper busbar and the AC copper busbar are disposed on the frame and connected to the insulating substrate.

[0020] In one embodiment, the frame includes a first crossbeam and a second crossbeam, the first crossbeam and the second crossbeam being located on opposite sides of the insulating substrate along a second direction perpendicular to the first direction, the DC copper busbar being disposed on the first crossbeam and the AC copper busbar being disposed on the second crossbeam.

[0021] In one embodiment, the housing has a receiving groove on the side opposite to the heat dissipation channel, the capacitor module further includes an insulating component and a potting material, the capacitor core is disposed in the receiving groove, the insulating component is located between the capacitor core and the groove wall of the receiving groove, and the potting material is potted in the receiving groove.

[0022] Another embodiment of this application provides a motor controller, including a housing and the power module assembly described above, wherein the power module assembly is disposed within the housing.

[0023] Another embodiment of this application provides a vehicle including the power module assembly described above.

[0024] This application provides a power module assembly, a motor controller, and a vehicle. The power module assembly reduces the space occupied by the drive module, power module, and capacitor module by placing the power module on one side of the main control board of the drive module along a first direction and placing the capacitor module on the side of the power module away from the main control board along the first direction. This results in a compact power module assembly. Furthermore, by providing a heat sink with multiple heat dissipation fins on the power module and a housing with heat dissipation channels on the capacitor module, heat dissipation can be achieved simultaneously for both the power module and the capacitor module, thus enabling the power module assembly to have a better heat dissipation effect. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a power module assembly according to an embodiment of this application;

[0026] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0027] Figure 3 for Figure 1 An exploded view of the power module assembly shown;

[0028] Figure 4 for Figure 1 The diagram shows the structure of the driver module.

[0029] Figure 5 for Figure 4 The circuit diagram of the driver chip shown;

[0030] Figure 6 for Figure 1The diagram shows the structure of the power module, omitting the power chip.

[0031] Figure 7 for Figure 6 The power module shown is a front view.

[0032] Figure 8 for Figure 7 Top view of the power module shown;

[0033] Figure 9 for Figure 7 The rear view of the power module shown;

[0034] Figure 10 for Figure 1 The diagram shows the structure of the capacitor module.

[0035] Figure 11 for Figure 10 The front view of the capacitor module shown;

[0036] Figure 12 for Figure 11 The rear view of the capacitor module shown;

[0037] Figure 13 for Figure 3 The diagram shows the structure of the current sensor.

[0038] Explanation of reference numerals in the attached figures

[0039] 10. Driver module; 11. Main control board; 11a. Signal pinhole; 11b. Socket; 11c. Positioning hole; 12. Driver chip; 121. Driver channel; 13. Power supply device; 14. Connector; 15. Resistor / capacitor device; 20. Power module; 21. Insulating substrate; 22. Power chip; 23. Heat sink; 231. Heat sink fins; 232. Heat sink base plate; 24. Frame; 241. First crossbeam; 242. Second crossbeam; 25. DC copper busbar; 26. AC copper busbar; 26a. Through-hole; 27. Signal... 30. Capacitor module; 31. Housing; 31a. Heat dissipation channel; 31b. Liquid inlet; 31c. Liquid outlet; 31d. Flow port; 31e. Receiving tank; 32. Capacitor core; 33. Positive copper busbar; 34. Negative copper busbar; 35. Insulating component; 40. Sealing ring; 50. Current sensor; 51. Circuit board; 511. First part; 511a. First side wall; 511b. Second side wall; 512. Second part; 52. Hall effect chip; 53. Pin; 54. Positioning post; 60. Fastener. Detailed Implementation

[0040] In this application, the "first direction" orientation or positional relationship is based on the appendix. Figure 3The orientation or positional relationship shown, the "second direction" orientation or positional relationship is based on the attached... Figure 7 The orientation or positional relationship shown, the orientation or positional relationship of "extension direction" and "width direction" is based on the attached... Figure 11 The orientation or positional relationship shown is for illustrative purposes only and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0041] This application provides a vehicle that includes a motor controller. The motor controller includes a housing and a power module assembly disposed within the housing.

[0042] Please see Figure 1 and Figure 3 The power module assembly in this application embodiment includes a drive module 10, a power module 20, and a capacitor module 30.

[0043] Please see Figure 4 The drive module 10 includes a main control board 11 and a drive chip 12, a power supply device 13 and a connector 14 disposed on the main control board 11. The drive chip 12, the power supply device 13 and the connector 14 are all electrically connected to the main control board 11.

[0044] The main control board 11 includes a driver board and a control board. The driver board is used to drive the power module 20 to work, and the control board is used to control the motor controller to work.

[0045] The main control board 11 can be composed of two independent PCB circuit boards, a driver board and a control board. The main control board 11 can also be a two-in-one board, which means that the driver board and the control board are integrated on one panel. The two-in-one board can not only save the space occupied by the main control board 11, but also reduce the manufacturing cost of the main control board 11.

[0046] The driver chip 12, power supply device 13 and connector 14 can be soldered to the main control board 11 and electrically connected to the internal circuitry of the main control board 11.

[0047] Please continue reading. Figure 4 The drive module 10 may also include components such as a resistor / capacitor 15, which is mounted on the main control board 11 and electrically connected to it. The resistor / capacitor 15 may also be soldered to the main control board 11 and electrically connected to its internal circuitry.

[0048] Please see Figure 3 , Figures 6 to 9The power module 20 is disposed on one side of the main control board 11 along the first direction. The power module 20 includes an insulating substrate 21, a power chip 22 disposed on the insulating substrate 21, and a heat sink 23 having multiple heat dissipation pins 231. The power chip 22 is located on the side of the insulating substrate 21 close to the main control board 11, and the heat sink 23 is located on the side of the insulating substrate 21 away from the main control board 11.

[0049] The number of power modules 20 can be one or more, for example... Figure 3 The motor controller shown has two power modules 20. When there are multiple power modules 20, they can be arranged side by side on the same side of the main control board 11 along the first direction.

[0050] Please see Figure 3 , Figures 10 to 12 The capacitor module 30 is disposed on the side of the power module 20 away from the main control board 11 along the first direction. The capacitor module 30 includes a housing 31 and a capacitor core 32. The housing 31 has a heat dissipation channel 31a that accommodates heat dissipation fins 231 and cooling medium on the side of the housing 31 near the power module 20. The capacitor core 32 is disposed on the side of the housing 31 away from the heat dissipation channel 31a along the first direction.

[0051] In other words, the drive module 10, power module 20, and capacitor module 30 are stacked along the first direction. The power module 20 and drive module 10, the capacitor module 30 and drive module 10, and the capacitor module 30 and power module 20 can all be securely connected using fasteners 60 such as screws and bolts. For example, please refer to... Figure 6 and Figure 7 The power module 20 can be equipped with a frame 24, which is fastened to the main control board 11 of the drive module 10 and / or the housing 31 of the capacitor module 30. The main control board 11 of the drive module 10 can also be fastened to the housing 31 of the capacitor module 30, so that the three modules of drive module 10, power module 20 and capacitor module 30 can be integrated into a whole.

[0052] The insulating substrate 21 serves to dissipate heat, provide electrical insulation, and provide mounting support for the power chip 22 and other devices in the power module 20.

[0053] There are usually multiple power chips 22 connected in parallel. The power chips 22 can be soldered to the insulating substrate 21.

[0054] Please see Figure 4 and Figure 6The main control board 11 can be provided with signal pinholes 11a, and the power module 20 can be provided with signal pins 27. The signal pins 27 can be soldered to the insulating substrate 21. The signal pins 27 are inserted into the signal pinholes 11a on the main control board 11 to achieve electrical connection with the main control board 11. The signal pins 27 and the main control board 11 can also be further fixed by soldering.

[0055] The specific manner in which the capacitor core 32 is disposed on the side of the housing 31 facing away from the heat dissipation channel 31a along the first direction is not limited. For example, please refer to [link to relevant documentation]. Figure 12 The housing 31 has a receiving groove 31e on the side opposite to the heat dissipation channel 31a. The capacitor module 30 also includes an insulating component 35 and a potting material (not shown). The insulating component 35 includes, but is not limited to, insulating paper, and the potting material includes, but is not limited to, epoxy resin. The capacitor core package 32 is disposed in the receiving groove 31e. The insulating component 35 is located between the capacitor core and the groove wall of the receiving groove 31e to provide insulation, while the potting material is filled into the receiving groove 31e so that the capacitor core can be fixed in the receiving groove 31e.

[0056] In addition, the capacitor core 32 can adopt a multilayer busbar structure to reduce stray inductance.

[0057] Please see Figures 6 to 9 The power module 20 has a DC copper busbar 25 and an AC copper busbar 26, and the capacitor module 30 has a positive copper busbar 33 and a negative copper busbar 34 that are electrically connected to the capacitor core 32. The DC copper busbar 25 is electrically connected to the positive copper busbar 33 and the negative copper busbar 34 respectively.

[0058] For example, please refer to Figure 11 and Figure 12 A portion of the positive copper busbar 33 and a portion of the negative copper busbar 34 can be located on the side of the housing 31 where the capacitor core 32 is provided. Another portion of the positive copper busbar 33 and another portion of the negative copper busbar 34 can be located on the side of the housing 31 where the heat dissipation channel 31a is provided. The portion of the positive copper busbar 33 on the same side as the heat dissipation channel 31a and the portion of the negative copper busbar 34 on the same side as the heat dissipation channel 31a are respectively electrically connected to the DC copper busbar 25.

[0059] The DC copper busbar 25 is located on one side of the heat dissipation channel 31a, along with the positive copper busbar 33 and the negative copper busbar 34.

[0060] To reduce assembly space, the capacitor core 32 can be welded to the positive copper busbar 33 and the negative copper busbar 34 respectively, and the DC copper busbar 25 can also be electrically connected to the positive copper busbar 33 and the negative copper busbar 34 respectively.

[0061] For ease of arranging the DC copper busbar 25 and AC copper busbar 26, please refer to the example provided. Figure 6 and Figure 7For the power module 20 with frame 24, frame 24 can be located on the outer periphery of insulating substrate 21. DC copper busbar 25 and AC copper busbar 26 can be disposed on frame 24. For example, DC copper busbar 25 and AC copper busbar 26 can be integrated on frame 24 to form an integral structure with frame 24. DC copper busbar 25 and AC copper busbar 26 are also connected to insulating substrate 21. For example, DC copper busbar 25 and AC copper busbar 26 can be soldered to insulating substrate 21.

[0062] Please see Figure 6 and Figure 7 The frame 24 includes a first crossbeam 241 and a second crossbeam 242. The first crossbeam 241 and the second crossbeam 242 are respectively located on opposite sides of the insulating substrate 21 along a second direction perpendicular to the first direction. A DC copper busbar 25 can be disposed on the first crossbeam 241, and an AC copper busbar 26 can be disposed on the second crossbeam 242. That is, the DC copper busbar 25 and the AC copper busbar 26 can be disposed on opposite sides of the insulating substrate 21.

[0063] Please continue reading. Figures 8 to 11 The heat sink 23 cooperates with the heat dissipation channel 31a on the housing 31 of the capacitor module 30 to dissipate heat from the power chip 22 and other devices in the power module 20.

[0064] The specific structure of the heat sink 23 is not limited; for example, please refer to [link to relevant documentation]. Figure 8 and Figure 9 The heat sink 23 may include a heat sink base plate 232, which contacts the insulating substrate 21. Preferably, the heat sink base plate 232 may be welded to the insulating substrate 21. A plurality of heat sink fins 231 are disposed on the side of the heat sink base plate 232 away from the insulating substrate 21. The heat absorbed by the insulating substrate 21 is transferred to the heat sink fins 231 through the heat sink base plate 232.

[0065] Please see Figure 3 , Figure 11 and Figure 12 The heat dissipation channel 31a faces the heat dissipation component 23. The housing 31 is provided with an inlet 31b and an outlet 31c that are connected to the heat dissipation channel 31a. The cooling medium flows into the heat dissipation channel 31a from the inlet 31b and then flows out from the outlet 31c.

[0066] The number of heat dissipation channels 31a can be one or more.

[0067] For example, Figure 10 and Figure 11 The housing 31 shown is provided with two heat dissipation channels 31a, which correspond one-to-one with the power module 20. In other embodiments, multiple power modules 20 may share the same heat dissipation channel 31a.

[0068] Figure 11 Of the two heat dissipation channels 31a shown, one heat dissipation channel 31a is connected to the liquid inlet 31b, and the other heat dissipation channel 31a is connected to the liquid outlet 31c. At the same time, the housing 31 is also provided with two flow ports 31d, which are connected to the heat dissipation channels 31a one by one. The cooling medium flows from the liquid inlet 31b into the heat dissipation channel 31a connected to the liquid inlet 31b, and then flows out from the flow port 31d connected to the heat dissipation channel 31a. Then it flows from the other flow port 31d into the heat dissipation channel 31a connected to the liquid outlet 31c, and then out from the liquid outlet 31c. It is equivalent to the cooling medium flowing through the two heat dissipation channels 31a in sequence.

[0069] In other embodiments, each heat dissipation channel 31a may be provided with a corresponding connected liquid inlet 31b and liquid outlet 31c, which is equivalent to the cooling medium flowing through two heat dissipation channels 31a respectively.

[0070] Please see Figure 3 The power module assembly can also provide a sealing ring 40 between the power module 20 and the capacitor module 30. The sealing ring 40 surrounds the heat dissipation channel 31a to seal the heat dissipation channel 31a.

[0071] The heat dissipation pins 231 of the heat sink 23 extend into the heat dissipation channel 31a and exchange heat with the cooling medium, so that the cooling medium can carry away the heat absorbed by the heat dissipation pins 231.

[0072] In addition, the capacitor core 32 of the capacitor module 30 is disposed on the side of the housing 31 away from the heat dissipation channel 31a along the first direction. It can also be cooled by the cooling medium flowing through the heat dissipation channel 31a. In other words, the cooling medium in the heat dissipation channel 31a can be used to cool the power module 20 and the capacitor module 30 at the same time.

[0073] The power module assembly of this application embodiment reduces the space occupied by the drive module 10, power module 20 and capacitor module 30 by placing the power module 20 on one side of the main control board 11 of the drive module 10 along the first direction and placing the capacitor module 30 on the side of the power module 20 away from the main control board 11 along the first direction. This results in a compact power module assembly. Furthermore, by providing a heat sink 23 with multiple heat dissipation fins 231 in the power module 20 and a housing 31 with heat dissipation channels 31a in the capacitor module 30, heat dissipation can be provided for both the power module 20 and the capacitor module 30 simultaneously, thus enabling the power module assembly to have a better heat dissipation effect.

[0074] In addition, since the cooling medium in the heat dissipation channel 31a can directly dissipate heat to the capacitor core 32, the heat dissipation effect of the capacitor core 32 is good. Therefore, the capacitor module 30 of this application embodiment can use a capacitor core 32 with a relatively low capacitance value. The relatively low capacitance value of the capacitor core 32 can make the volume of the capacitor core 32 relatively small, which is also conducive to reducing the overall size of the capacitor module 30.

[0075] Furthermore, the power module assembly in this embodiment can be directly installed inside the housing of the motor controller without the need for a separate mounting housing. This not only reduces the materials used in the power module assembly and saves production costs, but also reduces the installation space of the power module assembly inside the housing of the motor controller, making the overall structure of the motor controller more compact.

[0076] In some embodiments, please refer to Figure 5 The driver chip 12 can be a chip with at least two independent driver channels 121, for example, Figure 5 The driver chip 12 shown has two independent drive channels 121. In other embodiments, the driver chip 12 may also have more than two independent drive channels 121.

[0077] For a driver chip 12 with two independent drive channels 121, depending on the operating conditions, any one of the drive channels 121 can be selected to control the corresponding load, or all drive channels 121 can be selected to control the corresponding load at the same time. For a driver chip 12 with more than two independent drive channels 121, depending on the operating conditions, any one of the drive channels 121 can be selected to control the corresponding load, or a portion (at least two) of the drive channels 121 can be selected to control the corresponding load, or all drive channels 121 can be selected to control the corresponding load at the same time, which helps to reduce losses and improve efficiency.

[0078] In some embodiments, please refer to Figure 4 The power supply device 13 can be a planar transformer, which is a type of transformer with high frequency, low profile, small height, and high operating frequency. Using a planar transformer not only helps to reduce the height dimension of the drive module 10 along the first direction, making the structure of the power module assembly more compact, but also helps to increase the power density of the power supply device 13.

[0079] In some embodiments, please refer to Figure 4Connector 14 can be a floating connector, which is a type of connector 14 with a floating mechanism. It is mainly used to absorb minor positional deviations and errors generated during installation, ensuring the stability and reliability of the connection. Through its internal elastic structure, the floating connector can float within a certain range (typically ±0.5mm) in the X and Y directions. Using a floating connector can improve the vibration resistance of the power module assembly, which not only facilitates automated assembly of the power module assembly but also improves assembly efficiency and quality control.

[0080] In some embodiments, please refer to Figure 7 The power chip 22 can be a larger and more technologically advanced power chip 22. A larger power chip 22 reduces the total number of power chips 22, thereby reducing the total heat dissipation area of ​​the power chips 22 and consequently reducing the total area of ​​the insulating substrate 21, thus reducing the size of the power module 20. Furthermore, using a more technologically advanced power chip 22 reduces power chip losses and improves efficiency.

[0081] Please continue reading. Figure 11 The heat dissipation channel 31a has a width direction perpendicular to its own extension direction. The extension direction is equivalent to the flow direction of the cooling medium within the heat dissipation channel 31a. Multiple heat dissipation pins 231 can be arranged along both the extension direction and the width direction, which is equivalent to arranging several heat dissipation pins in both the extension direction and the width direction. In some embodiments, please refer to... Figure 9 The arrangement area of ​​some heat dissipation pins 231 can protrude from the arrangement area of ​​other heat dissipation pins 231 on opposite sides along the width direction of the heat dissipation channel 31a. In other words, the arrangement width of some heat dissipation pins 231 along the width direction of the heat dissipation channel 31a is greater than the arrangement width of other heat dissipation pins 231, so that the entire arrangement area of ​​heat dissipation pins 231 presents a shape with concave sides on opposite sides along the width direction of the heat dissipation channel 31a.

[0082] Specifically, based on the flow characteristics of the cooling medium, when the arrangement width of the heat dissipation pins 231 remains unchanged (equivalent to the entire arrangement area of ​​the heat dissipation pins 231 being of equal width), the flow velocity of the cooling medium near the middle region of the heat dissipation channel 31a will be greater than the flow velocity of the cooling medium on the opposite sides of the heat dissipation channel 31a along the width direction. By protruding part of the arrangement area of ​​the heat dissipation pins 231 from the opposite sides of the arrangement area of ​​the other part of the heat dissipation pins 231 along the width direction of the heat dissipation channel 31a, the flow velocity of the cooling medium on the opposite sides of the width direction in this region can be increased when the cooling medium flows through the arrangement area of ​​the heat dissipation pins 231 with a relatively smaller arrangement width. This allows the overall flow velocity of the cooling medium on the opposite sides of the width direction in the heat dissipation channel 31a to approach the flow velocity of the cooling medium in the middle region. As a result, the cooling medium can flow through the entire arrangement area of ​​the heat dissipation pins 231 at a more uniform flow velocity, thereby improving the uniformity of heat dissipation of the heat sink 23.

[0083] For example, please refer to Figure 9 Along the extension direction, the width of the multiple heat dissipation pins 231 can alternately increase and then decrease according to a pattern. In other words, the width of the multiple heat dissipation pins 231 changes in a pattern of gradually increasing, then decreasing, then increasing again, and then decreasing again, so that the outermost heat dissipation pins 231 can be arranged in a wave shape along the extension direction. This arrangement allows the flow velocity of the cooling medium on opposite sides of the width direction to change smoothly and regularly, thus making the overall flow velocity of the cooling medium on opposite sides of the width direction within the heat dissipation channel 31a closer to the flow velocity of the cooling medium in the middle region.

[0084] Further, please refer to Figure 11 The width of the heat dissipation channel 31a along the width direction can vary according to the same rule as the width of the multiple heat dissipation pins 231 along the width direction. That is, in the position where the width of the heat dissipation pins 231 is larger, the width of the heat dissipation channel 31a along the width direction is also relatively larger, and in the position where the width of the heat dissipation pins 231 is smaller, the width of the heat dissipation channel 31a along the width direction is also relatively smaller. This allows the heat dissipation pins 231 to fill the space in the heat dissipation channel 31a as much as possible, which is also conducive to improving the heat dissipation effect of the heat sink 23.

[0085] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 13The AC copper busbar 26 of the power module 20 can be provided with a through-hole 26a, which is an opening through the AC copper busbar 26. The power module assembly also includes a current sensor 50, which includes a circuit board 51, a Hall chip 52, and a pin 53. The Hall chip 52 is disposed on the circuit board 51 and electrically connected to the circuit board 51, and the pin 53 is electrically connected to the Hall chip 52. The pin 53 is plugged into the main control board 11, and the Hall chip 52 extends into the through-hole 26a and is clearance-fitted with the through-hole 26a.

[0086] The current sensor 50 is used to detect the current signal of the AC copper busbar 26. The Hall chip 52 can be soldered to the circuit board 51. A portion of the pin 53 can be embedded inside the circuit board 51 and electrically connected by soldering it to the Hall chip 52.

[0087] Please see Figure 2 and Figure 13 The main control board 11 is provided with a socket 11b, and the pin 53 is inserted into the socket 11b to achieve electrical connection with the main control board 11.

[0088] To improve the stability of the connection between pin 53 and the main control board 11, please refer to... Figure 2 and Figure 13 The current sensor 50 may include a positioning post 54, and the main control board 11 has a positioning hole 11c. The positioning post 54 is inserted into the positioning hole 11c to position the pin 53.

[0089] The current sensor 50 can be equipped with one positioning post 54 or multiple positioning posts 54. When there are multiple positioning posts 54, the positioning hole 11c corresponds to the positioning post 54 one by one.

[0090] The current sensor 50 in this embodiment is a coreless current sensor 50. The Hall chip 52 extends into the through-hole 26a and is gap-fitted with the through-hole 26a to realize the function of a magnetic core.

[0091] Compared with current sensors with magnetic cores, the current sensor 50 without magnetic cores in this embodiment has a smaller overall size and occupies less installation space. Therefore, using the current sensor 50 in this embodiment is beneficial to further reduce the volume of the power module assembly and make the power module assembly structure more compact.

[0092] Further, please refer to Figure 13The circuit board 51 includes a first portion 511 and a second portion 512. The first portion 511 has opposing first sidewalls 511a and second sidewalls 511b. The second portion 512 protrudes from the first sidewall 511a, meaning that the width of the second portion 512 is smaller than the width of the first portion 511. Each pin 53 protrudes from the second sidewall 511b, and a Hall effect chip 52 is disposed in the second portion 512.

[0093] The circuit board 51 is configured as a first part 511 and a second part 512 protruding from the first sidewall 511a, which can minimize the area of ​​the circuit board 51 and thus make the overall size of the current sensor 50 smaller.

[0094] In the description of this application, the references to terms such as "in some embodiments," "in some embodiments," "in other embodiments," "in yet other embodiments," or "exemplary," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0095] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A power module assembly, characterized by include: A drive module, comprising a main control board and a drive chip, power supply device and connector disposed on the main control board; A power module is disposed on one side of the main control board along the first direction. The power module includes an insulating substrate, a power chip disposed on the insulating substrate, and a heat sink with multiple heat dissipation pins. The power chip is located on the side of the insulating substrate close to the main control board, and the heat sink is located on the side of the insulating substrate away from the main control board. A capacitor module is disposed on the side of the power module away from the main control board along the first direction. The capacitor module includes a housing and a capacitor core. The side of the housing near the power module has a heat dissipation channel for accommodating the heat dissipation pins and cooling medium. The capacitor core is disposed on the side of the housing away from the heat dissipation channel along the first direction.

2. The power module assembly of claim 1, wherein, The driver chip has at least two independent driver channels; and / or, The power supply device is a planar transformer; and / or, The connector is a floating connector.

3. The power module assembly of claim 1 or 2, wherein, The heat dissipation component includes a heat dissipation base plate that contacts the insulating substrate, and a plurality of heat dissipation pins are disposed on the side of the heat dissipation base plate away from the insulating substrate.

4. The power module assembly of claim 1 or 2, wherein, The heat dissipation channel has a width direction perpendicular to its own extension direction, and a plurality of heat dissipation pins are arranged along the extension direction and the width direction, and the arrangement area of ​​a portion of the heat dissipation pins protrudes from the opposite sides of the arrangement area of ​​another portion of the heat dissipation pins along the width direction.

5. The power module assembly of claim 4, wherein, Along the extending direction, the width of the plurality of heat dissipation pins alternates in a pattern of gradually increasing and then gradually decreasing; and / or, The width dimension of the heat dissipation channel along the width direction and the arrangement width of the plurality of heat dissipation pins along the width direction vary according to the same rule.

6. The power module assembly of claim 1 or 2, wherein, The power module includes an AC copper busbar electrically connected to the insulating substrate. The AC copper busbar has a through-hole. The power module assembly includes a current sensor. The current sensor includes a circuit board, a Hall chip disposed on the circuit board and electrically connected to the circuit board, and a pin electrically connected to the Hall chip. The pin is plugged into the main control board. The Hall chip extends into the through-hole and is gap-fitted with the through-hole.

7. The power module assembly of claim 6, wherein, The number of pins is multiple, the circuit board includes a first part and a second part, the first part has a first sidewall and a second sidewall opposite to each other, the second part protrudes from the first sidewall, each of the pins protrudes from the second sidewall, and the Hall chip is disposed in the second part; And / or, The current sensor includes a positioning post, and the main control board has a positioning hole, with the positioning post and the positioning hole being inserted into each other.

8. The power module assembly of claim 1 or 2, wherein, The power module includes a frame, a DC copper busbar, and an AC copper busbar. The frame is located on the outer periphery of the insulating substrate, and the DC copper busbar and the AC copper busbar are disposed on the frame and connected to the insulating substrate.

9. The power module assembly of claim 8, wherein, The frame includes a first crossbeam and a second crossbeam, which are located on opposite sides of the insulating substrate along a second direction perpendicular to the first direction. The DC copper busbar is disposed on the first crossbeam, and the AC copper busbar is disposed on the second crossbeam.

10. The power module assembly of claim 1 or 2, wherein, The housing has a receiving groove on the side opposite to the heat dissipation channel. The capacitor module also includes an insulating component and a potting material. The capacitor core is disposed in the receiving groove. The insulating component is located between the capacitor core and the groove wall of the receiving groove. The potting material is filled into the receiving groove.

11. An electric machine controller characterized by It includes a housing and a power module assembly as described in any one of claims 1-10, wherein the power module assembly is disposed within the housing.

12. A vehicle characterized by comprising: Includes the power module assembly as described in claim 11.

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