VPX edge computing card module

Abstract

The utility model discloses a VPX edge computing card module. The module comprises an upper shell part, a lower shell part, a PCB (Printed Circuit Board), a first edge strip and a second edge strip, a PCB is arranged on the lower shell part; a VPX edge computing card module is arranged on the PCB; the upper shell part covers the lower shell part through the PCB; the upper shell part comprises a cold guide plate, a first fixing sub-part, a second fixing sub-part and a shell interface sub-part; the cold guide plate is coupled and connected with the shell interface sub-part along a first direction; the cold guide plate comprises a plurality of heat dissipation protruding parts. A plurality of grooves are formed in the shell interface sub-part; the first and second fixing sub-parts are arranged on the two sides of the cold guide plate in the second direction; the PCB is provided with a first hole site; the cold guide plate and the shell interface sub-part are provided with second hole sites; the lower shell part is provided with a third hole site; the first, second and third holes are fixedly connected through a first connecting piece; and the hole sites on the first and second fixing sub-parts are fixedly connected with the hole sites on the first and second edgings through second connecting pieces respectively and correspondingly.

Description

Technical Field

[0001] This utility model relates to the field of edge computing card technology, and more particularly to a VPX edge computing card module. Background Technology

[0002] With the rapid development of technologies such as cloud computing and the Internet of Things (IoT), edge computing has gradually become a popular technology in fields such as artificial intelligence, industry, and healthcare. The core advantage of edge computing lies in its ability to bring data processing closer to the network edge. By moving computing and data storage to the edge of the network, data transmission latency can be significantly reduced, and data security and privacy protection can be improved. At the same time, edge computing can also provide more powerful real-time analysis and processing capabilities, making devices and systems more intelligent and efficient.

[0003] VPX-based edge computing cards are high-performance computing platforms designed for harsh environments, featuring high reliability, high scalability, and powerful computing capabilities. Because edge computing cards need to adapt to harsh environments, they support a wide operating temperature range, typically from -40°C to +85°C. Therefore, it is crucial to design VPX edge computing card modules with good heat dissipation capabilities, while also preventing damage to the edge computing card under harsh conditions. This ensures that the edge computing card can adapt to harsh environments and meet the needs of complex computing and real-time processing. Utility Model Content

[0004] This utility model provides a VPX edge computing card module, which improves the protection and heat dissipation performance of the edge computing card by designing upper and lower shells, with the upper shell having a heat-conducting plate.

[0005] To achieve the above objectives, this utility model provides a VPX edge computing card module, which includes: an upper shell, a lower shell, a PCB board, a first side strip, and a second side strip; the PCB board is disposed on the lower shell; the VPX edge computing card module is disposed on the PCB board; the upper shell covers the lower shell through the PCB board;

[0006] The upper shell includes a cold-conducting plate, a first fixing sub-part, a second fixing sub-part, and a shell interface sub-part; the cold-conducting plate and the shell interface sub-part are coupled and connected along a first direction; the cold-conducting plate includes multiple heat dissipation protrusions; the shell interface sub-part has multiple grooves; the first fixing sub-part and the second fixing sub-part are disposed on both sides of the cold-conducting plate along a second direction.

[0007] The PCB board has a first hole; the cooling plate and the housing interface sub-part have a second hole; the lower housing part has a third hole; the first hole, the second hole and the third hole are fixedly connected by a first connector; the hole on the first fixing sub-part and the hole on the first side strip are fixedly connected by a second connector; the hole on the second fixing sub-part and the hole on the second side strip are fixedly connected by a third connector.

[0008] Optionally, the heat dissipation protrusions are evenly distributed; the distance l between the heat dissipation protrusions satisfies: 2cm≤l≤6cm.

[0009] Optionally, the width of each heat dissipation protrusion satisfies: 18mm≤l≤20mm; and the height of each heat dissipation protrusion satisfies: 2mm≤l≤4.8mm.

[0010] Optionally, the VPX edge computing card module further includes: a first handle pull-out module and a second handle pull-out module; the housing interface sub-part includes a first housing interface sub-part and a second housing interface sub-part;

[0011] The first handle pull-out module is connected to the first sub-part of the housing interface via a lever assembly; the second handle pull-out module is connected to the second sub-part of the housing interface via a lever assembly.

[0012] Optionally, the VPX edge computing card module further includes an oxide layer; the oxide layer is disposed on the side of the upper shell portion opposite to the lower shell portion.

[0013] Optionally, the first connector includes a first positioning pin; the second connector includes a second positioning pin; and the third connector includes a third positioning pin.

[0014] Optionally, the first connector includes a first screw; the first hole, the second hole, and the third hole are all threaded holes; the first screw passes through the first hole and the second hole and is threadedly connected to the third hole;

[0015] The second connector includes a second screw; the holes on the first fixing part and the holes on the first side strip are both threaded holes; the second screw passes through the holes on the first fixing part and the holes on the first side strip for threaded connection;

[0016] The third connector includes a third screw; the holes on the second fixing part and the holes on the second side strip are both threaded holes; the third screw passes through the holes on the second fixing part and the holes on the second side strip and is threadedly connected.

[0017] Optionally, the height h1 of the upper shell portion satisfies: 3mm≤h1≤4.3mm.

[0018] Optionally, the height h2 of the lower shell portion satisfies: 2.3mm≤h2≤4.5mm.

[0019] Optionally, the PCB board includes: a first sub-PCB board and a second sub-PCB board; the VPX edge computing card module includes: a main control chip, multiple front panel interfaces, an MCU chip, and multiple VPX interfaces;

[0020] The second sub-PCB board is mounted on the first sub-PCB board via a connector; the first sub-PCB board includes a first sub-section and a second sub-section; the first sub-section carries the MCU chip and multiple front panel interfaces; the second sub-PCB board carries the main control chip; multiple VPX interfaces are provided on the second sub-section; the upper shell covers the lower shell through the first sub-section.

[0021] In this embodiment of the utility model, a PCB board is disposed on the lower shell portion; a VPX edge computing card module is disposed on the PCB board; the upper shell portion is covered by the PCB board on the lower shell portion; wherein, the upper shell portion includes a cooling plate and a shell interface sub-part; the cooling plate and the shell interface sub-part are coupled and connected along a first direction; the PCB board has a first hole; the shell interface sub-part and the cooling plate have a second hole; the lower shell portion has a third hole; the first hole, the second hole and the third hole are fixedly connected by a first connector, so that when the upper shell portion and the lower shell portion are closed, The edge computing module on the PCB board is surrounded, thus protecting the edge computing card. The upper shell also includes a first fixing sub-part and a second fixing sub-part. These two fixing sub-parts are positioned along a second direction on both sides of the cooling plate. Holes on the first fixing sub-part are fixedly connected to holes on the first edge strip via a second connector; holes on the second fixing sub-part are fixedly connected to holes on the second edge strip via a third connector. This further enhances the connection between the upper shell, the PCB board, and the lower shell, thereby improving the protection performance of the edge computing card. Furthermore, the cooling plate on the upper shell includes multiple heat dissipation protrusions. Thus, in addition to protecting the edge computing card through the upper and lower shells, the multiple heat dissipation protrusions also provide heat dissipation for the internal VPX edge computing card module.

[0022] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of a VPX edge computing card module provided in an embodiment of this utility model;

[0025] Figure 2 This is a front view of the upper shell of the VPX edge computing card module provided in this embodiment of the utility model.

[0026] Figure 3 This is a schematic diagram of the back structure of the upper shell of the VPX edge computing card module provided in this embodiment of the utility model;

[0027] Figure 4 This is a schematic diagram of the specific structure of the VPX edge computing card module provided in this embodiment of the invention, after removing the upper shell portion;

[0028] Figure 5 This is a schematic diagram of the PCB board structure in the edge computing card module provided in this embodiment of the utility model. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] Figure 1 This is a schematic diagram of the overall structure of a VPX edge computing card module provided in an embodiment of this utility model; Figure 2 This is a front view of the upper shell of the VPX edge computing card module provided in this embodiment of the utility model. Figure 3 This is a schematic diagram of the back structure of the upper shell of the VPX edge computing card module provided in this embodiment of the utility model; Figure 4 This is a schematic diagram of the specific structure of the VPX edge computing card module provided in this embodiment of the invention, after removing the upper shell portion; as shown. Figures 1-4 As shown, the VPX edge computing card module includes: an upper shell 10, a PCB board 20, a lower shell 30, a first side strip 40, and a second side strip 50; the PCB board 20 is disposed on the lower shell 30; an edge computing module 60 is disposed on the PCB board 20; the upper shell 10 is covered on the lower shell 30 through the PCB board 20.

[0032] The upper shell 10 includes a cooling plate 11, a first fixing sub-part 12, a second fixing sub-part 13, and a shell interface sub-part 14; the cooling plate 11 and the shell interface sub-part 14 are coupled and connected along a first direction; the cooling plate 11 includes a plurality of heat dissipation protrusions 111; the shell interface sub-part 14 has a plurality of grooves 141; the first fixing sub-part 12 and the second fixing sub-part 13 are disposed on both sides of the cooling plate 11 along a second direction;

[0033] The PCB board 20 has a first hole 201; the cooling plate 11 and the shell interface sub-part 14 have a second hole 101; the lower shell 30 has a third hole (not shown in the figure); the first hole 201, the second hole 101 and the third hole are fixedly connected by a first connector (not shown in the figure); the hole on the first fixing sub-part 12 and the hole on the first side strip 40 are fixedly connected by a second connector (not shown in the figure); the hole on the second fixing sub-part 13 and the hole on the second side strip 50 are fixedly connected by a third connector (not shown in the figure).

[0034] Specifically, the upper shell 10 and the lower shell 30 can be made of high-strength alloy material; in this embodiment, a PCB board 20 is provided on the lower shell 30; a VPX edge computing card module 60 is provided on the PCB board 20; the upper shell 10 is covered on the lower shell 30 by the PCB board 20; wherein, the upper shell 10 includes a cooling plate 11 and a shell interface sub-part 14; the cooling plate 11 and the shell interface sub-part 14 are coupled and connected along a first direction; the PCB board 20 has a first hole 201; the shell interface sub-part 14 and the cooling plate 11 both have second holes 101; the lower shell 10... The shell portion 30 has a third hole; the first hole 201, the second hole 101, and the third hole are fixedly connected by a first connector. In this way, when the upper shell portion 10 and the lower shell portion 30 are closed, they can surround the VPX edge computing card module on the PCB board 20, thereby protecting the VPX edge computing card module and improving its reliability. The shell interface sub-portion 14 has multiple grooves 141, which can fit into multiple signal interfaces inside the edge computing module 60 to meet the signal transmission needs of the edge computing module 60.

[0035] Meanwhile, the upper shell 10 also includes a first fixing sub-part 12 and a second fixing sub-part 13; the first fixing sub-part 12 and the second fixing sub-part 13 are disposed on both sides of the cooling plate 11 along the second direction; the holes on the first fixing sub-part 12 are fixedly connected to the holes on the first side strip 40 through a second connector; the holes on the second fixing sub-part 13 are fixedly connected to the holes on the second side strip 50 through a third connector, thus further fixing the upper shell 10, the PCB board 20 and the lower shell 30 together, thereby further improving the protection performance of the VPX edge computing card module. Based on the protection performance of the VPX edge computing card module, the cooling plate 11 on the upper shell 10 includes multiple heat dissipation protrusions 111; thus, the contact area between the heat dissipation protrusions 111 and the air, and the sum of the contact area between the groove between any two heat dissipation protrusions 111 and the air, are significantly greater than the contact area between the planar structure without heat dissipation protrusions and the air, thus improving the heat dissipation of the internal VPX edge computing card module through multiple heat dissipation protrusions 111.

[0036] It is understandable that, since the internal VPX edge computing card module generates a lot of heat, preferably, the multiple heat dissipation protrusions on the heat conduction plate 11 are set at the corresponding positions of the internal VPX edge computing card module 60; multiple heat dissipation protrusions do not need to be set at the housing interface sub-part 14.

[0037] Optional, refer to Figure 1-2 Each heat dissipation protrusion 111 is evenly distributed; the distance l between each heat dissipation protrusion 111 satisfies: 2mm≤l≤6mm; the width of each heat dissipation protrusion 111 satisfies: 18mm≤l≤20mm; the height of each heat dissipation protrusion 111 satisfies: 2mm≤l≤4.8mm.

[0038] In this embodiment, the distance l between each heat dissipation protrusion 111 satisfies: 2mm≤l≤6mm; the distance l between each heat dissipation protrusion 111 satisfies: 2mm≤l≤6mm; the width of each heat dissipation protrusion 111 satisfies: 18mm≤l≤20mm; and the height of each heat dissipation protrusion 111 satisfies: 2mm≤l≤4.8mm. This balances the weight of the upper shell 10, the complexity of the manufacturing process of the upper shell 10, and the heat dissipation efficiency of the cold conduction plate 11.

[0039] Optional, refer to Figure 1 and Figure 4 The VPX edge computing card module also includes: a first handle-assisted pull-out module 70 and a second handle-assisted pull-out module 80; the housing interface sub-part 14 includes a first housing interface sub-part 142 and a second housing interface sub-part 143; the first handle-assisted pull-out module 70 is connected to the first housing interface sub-part 142 via a lever assembly; the second handle-assisted pull-out module 80 is connected to the second housing interface sub-part 143 via a lever assembly. The first handle-assisted pull-out module 70 and the second handle-assisted pull-out module 80, utilizing the lever principle, allow the entire VPX edge computing card module to be moved from one position to another. In practical scenarios, the VPX edge computing card module is housed within a casing, allowing it to be pulled out entirely from the casing using the first handle-assisted pull-out module 70 and the second handle-assisted pull-out module 80.

[0040] Optional, refer to Figure 1-2 The VPX edge computing card module also includes an oxide layer 90; the oxide layer 90 is disposed on the side of the upper shell 10 opposite to the lower shell 30. The oxide layer 90 prevents the entire VPX edge computing card module from being damaged by prolonged oxidation, thus protecting the VPX edge computing card module.

[0041] Optionally, in some embodiments, the first connector includes a first positioning pin; the second connector includes a second positioning pin; and the third connector includes a third positioning pin. The first hole 201, the second hole 101, and the third hole can be fixedly connected by the first positioning pin; the hole on the first fixing sub-part 12 is fixedly connected to the hole on the first side strip 40 by the second positioning pin; and the hole on the second fixing sub-part 13 is fixedly connected to the hole on the second side strip 50 by the third positioning pin.

[0042] Optionally, in other embodiments, the first connector includes a first screw; the first hole 201, the second hole 101, and the third hole are all threaded holes; the first screw passes through the first hole 201, the second hole 101, and is threadedly connected to the third hole;

[0043] The second connector includes a second screw; the holes on the first fixing part 12 and the holes on the first side strip 40 are both threaded holes; the second screw passes through the holes on the first fixing part 12 and the holes on the first side strip 40 for threaded connection.

[0044] The third connector includes a third screw; the holes on the second fixing part 13 and the holes on the second side strip 50 are both threaded holes; the third screw passes through the holes on the second fixing part 13 and the holes on the second side strip 50 for threaded connection.

[0045] Optional, refer to Figure 1-4 The height h1 of the upper shell satisfies: 3mm≤h1≤4.3mm. Specifically, the height h1 of the upper shell 10 satisfies: 3mm≤h1≤4.3mm, thus satisfying the lightweight and miniaturized design of the VPX edge computing card module.

[0046] Optional, refer to Figure 1-4 The height h2 of the lower shell 30 satisfies: 2.3mm≤h2≤4.5mm. Specifically, satisfying the height h2 of the lower shell 30 as 2.3mm≤h2≤4.5mm fulfills the requirements for lightweight and miniaturized design of the VPX edge computing card module.

[0047] Optional, Figure 5 This is a schematic diagram of the PCB board structure in the computing card module provided in this embodiment of the utility model; see reference. Figure 4-5 The PCB board 20 includes a first sub-PCB board 21 and a second sub-PCB board 22; the VPX edge computing card module 60 includes a main control chip 61, multiple front panel interfaces 62, an MCU chip 63, and multiple VPX interfaces 64; the second sub-PCB board 22 is mounted on the first sub-PCB board 21 via a connector A (exemplarily, connector A can be a BTB connector); the first sub-PCB board 21 includes a first sub-section 211 and a second sub-section 212; the first sub-section 211 has an onboard MCU chip 63 and multiple front panel interfaces 62; the second sub-PCB board 22 has an onboard main control chip 61; multiple VPX interfaces 64 are provided on the second sub-section 212; the upper shell 10 is covered on the lower shell 30 via the first sub-section 211.

[0048] The front panel interface 62 includes: a USB 2.0 interface; a USB 3.0 interface; an HDMI input interface; an HDMI output interface; an ETH interface; a power interface; and a DEBUG interface. Correspondingly, the multiple recesses 141 opened on the housing interface sub-part 14 include: a USB 2.0 interface recess; a USB 3.0 interface recess; an HDMI input interface recess; an HDMI output interface recess; an ETH interface recess; a power interface recess; and a DEBUG interface recess. The housing interface sub-part 14 has a USB 2.0 interface recess; a USB 3.0 interface recess, an HDMI input interface recess, an HDMI output interface recess, an ETH interface recess, a power interface recess, and a DEBUG interface recess, which are correspondingly fitted with the USB 2.0 interface, USB 3.0 interface, HDMI input interface, HDMI output interface, ETH interface, power interface, and DEBUG interface; the USB 2.0 interface, USB 3.0 interface, HDMI input interface, HDMI output interface, ETH interface, power interface, and DEBUG interface are all front panel interfaces output by the main control chip 61; it can be understood that since the second sub-PCB board 22 of the onboard main control chip 61 is connected to the first sub-PCB board 21 through a connector, the interfaces output by the main control chip 61 can be set on the first sub-PCB board 21; the main control chip 61 can be an embedded main control chip; its model can be RK3588.

[0049] The VPX interface 64 may include a GPI interface, a GPO interface, and a debug interface; the GPI interface, GPO interface, and debug interface in the VPX interface 64 are the interfaces output by the MCU chip 63; the MCU chip 63 can be an STM32F103C8T6.

[0050] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A VPX edge computing card module, characterized in that, include: The system comprises an upper shell, a lower shell, a PCB board, a first side strip, and a second side strip; the PCB board is disposed on the lower shell; a VPX edge computing card module is disposed on the PCB board; the upper shell is covered by the PCB board on the lower shell. The upper shell includes a cold-conducting plate, a first fixing sub-part, a second fixing sub-part, and a shell interface sub-part; the cold-conducting plate and the shell interface sub-part are coupled and connected along a first direction; the cold-conducting plate includes multiple heat dissipation protrusions; the shell interface sub-part has multiple grooves; the first fixing sub-part and the second fixing sub-part are disposed on both sides of the cold-conducting plate along a second direction. The PCB board has a first hole; the cooling plate and the housing interface sub-part have a second hole; the lower housing part has a third hole; the first hole, the second hole and the third hole are fixedly connected by a first connector; the hole on the first fixing sub-part and the hole on the first side strip are fixedly connected by a second connector; the hole on the second fixing sub-part and the hole on the second side strip are fixedly connected by a third connector.

2. The VPX edge computing card module according to claim 1, characterized in that, The heat dissipation protrusions are evenly distributed; the distance l between the heat dissipation protrusions satisfies: 2cm≤l≤6cm.

3. The VPX edge computing card module according to claim 1, characterized in that, The width of each heat dissipation protrusion satisfies: 18mm≤l≤20mm; the height of each heat dissipation protrusion satisfies: 2mm≤l≤4.8mm.

4. The VPX edge computing card module according to claim 1, characterized in that, Also includes: The first handle pull-out module and the second handle pull-out module; the housing interface sub-part includes a first housing interface sub-part and a second housing interface sub-part; The first handle pull-out module is connected to the first sub-part of the housing interface via a lever assembly; the second handle pull-out module is connected to the second sub-part of the housing interface via a lever assembly.

5. The VPX edge computing card module according to claim 1, characterized in that, Also includes: Oxide layer; the oxide layer is disposed on the side of the upper shell portion opposite to the lower shell portion.

6. The VPX edge computing card module according to claim 1, characterized in that, The first connector includes a first positioning pin; the second connector includes a second positioning pin; and the third connector includes a third positioning pin.

7. The VPX edge computing card module according to claim 1, characterized in that, The first connector includes a first screw; the first hole, the second hole, and the third hole are all threaded holes; the first screw passes through the first hole and the second hole and is threadedly connected to the third hole; The second connector includes a second screw; the holes on the first fixing part and the holes on the first side strip are both threaded holes; the second screw passes through the holes on the first fixing part and the holes on the first side strip for threaded connection; The third connector includes a third screw; the holes on the second fixing part and the holes on the second side strip are both threaded holes; the third screw passes through the holes on the second fixing part and the holes on the second side strip and is threadedly connected.

8. The VPX edge computing card module according to claim 1, characterized in that, The height h1 of the upper shell satisfies: 3mm≤h1≤4.3mm.

9. The VPX edge computing card module according to claim 1, characterized in that, The height h2 of the lower shell portion satisfies: 2.3mm≤h2≤4.5mm.

10. The VPX edge computing card module according to claim 1, characterized in that, The PCB board includes: a first sub-PCB board and a second sub-PCB board; the VPX edge computing card module includes: a main control chip, multiple front panel interfaces, an MCU chip, and multiple VPX interfaces; The second sub-PCB board is mounted on the first sub-PCB board via a connector; the first sub-PCB board includes a first sub-section and a second sub-section; the first sub-section carries the MCU chip and multiple front panel interfaces; the second sub-PCB board carries the main control chip; multiple VPX interfaces are provided on the second sub-section; the upper shell covers the lower shell through the first sub-section.

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