Heat dissipation structure and electronic product

Abstract

The utility model discloses a heat dissipation structure and an electronic product, and relates to the field of heat dissipation equipment, and the heat dissipation structure comprises a support which is provided with an avoiding opening; the radiating fin comprises a convex part and a connecting part, the connecting part is connected to one side face of the support in an attached mode, the convex part is arranged on the receding opening and extends to the side, away from the connecting part, of the support, the connecting part exchanges heat with a first heat source, and the convex part exchanges heat with a second heat source. The electronic product comprises the heat dissipation structure.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation equipment technology, and in particular to a heat dissipation structure and electronic product. Background Technology

[0002] With the increasing performance and miniaturization of electronic devices, the power density of their internal components has increased dramatically, making heat dissipation a key factor restricting equipment reliability and lifespan. All electronic products on the market require heat dissipation design, especially for devices with high heat source temperatures where space constraints often prevent optimal heat dissipation performance. Currently, some heat dissipation structures in electronic products are space-consuming, complex to assemble, and have low heat dissipation efficiency. Utility Model Content

[0003] The main purpose of this invention is to provide a heat dissipation structure that solves the technical problems of complex heat dissipation structures and low heat dissipation efficiency in current electronic devices.

[0004] To achieve the above objectives, the heat dissipation structure proposed in this utility model includes:

[0005] Supports, and openings for clearance; and

[0006] The heat sink includes a protrusion and a connecting portion. The connecting portion is attached to one side of the bracket. The protrusion is located in the clearance opening and extends to the side of the bracket away from the connecting portion. The connecting portion exchanges heat with a first heat source, and the protrusion exchanges heat with a second heat source.

[0007] This utility model also proposes an electronic product, including the heat dissipation structure as described above. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0009] Figure 1 A schematic diagram of an embodiment of the heat dissipation structure provided by this utility model;

[0010] Figure 2 An exploded view of one embodiment of the heat dissipation structure provided by this utility model;

[0011] Figure 3 An exploded view of another embodiment of the heat dissipation structure provided by this utility model;

[0012] Figure 4 A cross-sectional view of an embodiment of the heat dissipation structure provided by this utility model;

[0013] Figure 5 An exploded structural diagram of an electronic product embodiment provided by this utility model;

[0014] Figure 6 An exploded structural diagram of an embodiment of the electronic product provided by this utility model.

[0015] Explanation of icon numbers:

[0016] 100, bracket; 110, clearance opening; 120, connecting groove; 130, grid;

[0017] 200, Heat sink; 210, Protrusion; 220, Connecting part; 230, Groove;

[0018] 300. Additional film;

[0019] 10. Screen components;

[0020] 20. Motherboard; 21. Chipset;

[0021] 30. Thermal conductive components;

[0022] 40. Outer shell; 41. Cavity;

[0023] 50. Locking components.

[0024] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] In existing technologies, with the development of high-performance and miniaturized electronic devices, the power density of their internal components has increased dramatically, making heat dissipation a key factor restricting equipment reliability and lifespan. All electronic products on the market require heat dissipation design, especially for devices with high heat source temperatures where space constraints often prevent ideal heat dissipation performance. Currently, some heat dissipation structures in electronic products occupy large spaces, are complex to assemble, and have low heat dissipation efficiency.

[0029] This utility model proposes a heat dissipation structure.

[0030] Please see Figures 1 to 4 In one embodiment of the present invention, the heat dissipation structure includes a bracket 100 and a heat sink 200. The bracket 100 has an opening 110. The heat sink 200 includes a protrusion 210 and a connecting portion 220. The connecting portion 220 is attached to one side of the bracket 100. The protrusion 210 is located in the opening 110 and extends to the side of the bracket 100 away from the connecting portion 220. The connecting portion 220 exchanges heat with a first heat source, and the protrusion 210 exchanges heat with a second heat source.

[0031] It should be noted that the heat dissipation structure is installed inside the product and is used to dissipate heat from the internal heat source. The bracket 100 connects to other components of the product and serves as a mechanical support, reducing the number of product components, improving product space utilization, and simplifying product assembly processes. In specific implementation, the bracket 100 can be made of a suitable material according to product requirements. The heat sink 200 serves to conduct and dissipate heat and is made of a metal material with good thermal conductivity. The heat sink 200 is fixed to the bracket 100, and the two can be secured by screws or other connectors, or by snap-fit ​​or interference fit, etc., which are not limited in this embodiment.

[0032] In this embodiment, the heat sink 200 has a sheet-like structure. The protrusion 210 extends to the other side of the bracket 100 through the clearance opening 110 and corresponds to the position of the first heat source of the product, exchanging heat with the first heat source. The sidewall of the protrusion 210 adapts to the sidewall of the clearance opening 110, improving the connection strength between the heat sink 200 and the bracket 100. The connecting part 220 is connected to the protrusion 210 and is attached to the surface of the bracket 100, exchanging heat with the second heat source of the product. The first and second heat sources are located on opposite sides of the bracket 100. It is understood that the protrusion 210 protrudes from the plane of the connecting part 220 to facilitate contact with the first heat source. It is also understood that some heat from the heat sink 200 is transferred to the bracket 100, and the bracket 100 can also play a partial heat dissipation role. In specific implementation, without affecting other components, the connecting part 220 expands outwards to increase the heat dissipation area and improve the heat dissipation effect.

[0033] This utility model's technical solution combines a heat sink 200 mounted on a bracket 100, reducing the number of components and space occupancy. Furthermore, this heat dissipation structure can be directly installed into the corresponding product, simplifying assembly. The bracket 100 itself has a simple structure and can accommodate components of different specifications. The connecting portion 220 of the heat sink 200 is attached to one side of the bracket 100, providing a large heat dissipation area and sufficient coverage. Specifically, the heat sink 200 includes a protrusion 210 and a connecting portion 220. The bracket 100 has a clearance opening 110, allowing the protrusion 210 and connecting portion 220 to be located on opposite sides of the bracket 100. The protrusion 210 exchanges heat with a first heat source on one side of the bracket 100, while the connecting portion 220 exchanges heat with a second heat source on the other side of the bracket 100. This ensures that the heat sink 200 can fully contact the heat dissipation source, improving heat dissipation efficiency.

[0034] In one embodiment, the heat sink 200 is integrally formed. In specific implementation, the heat sink 200 is made of a metal material with good thermal conductivity and can be formed by die casting or stamping.

[0035] In one embodiment, the heat sink 200 and the bracket 100 are injection molded together. In a specific implementation, the bracket 100 is made of plastic and is injection molded. During the injection molding process, the bracket 100 is placed in the injection mold and double injection molding is used. Thus, while the bracket 100 is being injection molded, the bracket 100 and the heat sink 200 can be connected and fixed together.

[0036] refer to Figure 2 As shown, in one embodiment, the protrusion 210 is provided with a groove 230, the groove opening of which is located on the surface of the protrusion 210 facing the first heat source. The heat dissipation structure also includes an additional piece 300, which is disposed in the groove 230.

[0037] In practical implementation, when the heat sink 200 is die-cast or stamped, the groove 230 and the protrusion 210 are formed simultaneously. For example, during stamping, the stamped part presses the heat sink 200 so that the side facing away from the stamping surface protrudes outward to form the protrusion 210, while simultaneously, a groove 230 is formed on one side of the stamping surface. It is understandable that the groove 230 and the protrusion 210 are correspondingly arranged. During the injection molding of the bracket 100, an additional piece 300 is injection-molded into the groove 230, filling the groove 230 to keep one side of the heat dissipation structure flat. Additionally, this also reduces the influence between the two heat sources to some extent.

[0038] refer to Figure 2 As shown, in one embodiment, the bracket 100 is provided with a connecting groove 120, and the connecting portion 220 is disposed within the connecting groove 120. In this embodiment, the connecting groove 120 is formed by a recess on one side of the bracket 100, and the connecting portion 220 is adapted to the connecting groove 120. The surface of the connecting portion 220 facing the protrusion 210 is attached to the bottom surface of the connecting groove 120, and the sidewall of the connecting portion 220 cooperates with the sidewall of the connecting groove 120. Furthermore, the protrusion 210 cooperates with the inner wall of the clearance opening 110, thereby improving the tightness of the connection between the heat sink 200 and the bracket 100 and increasing the connection strength between the two.

[0039] refer to Figures 5 to 6 As shown, this utility model also proposes an electronic product, which includes a heat dissipation structure. The specific structure of the heat dissipation structure is as described in the above embodiments. Since this electronic product adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0040] In one embodiment, the electronic product further includes a screen assembly 10, which is fixedly connected to a support 100 of a heat dissipation structure and exchanges heat with a heat sink 200 of the heat dissipation structure. The screen assembly 10 is configured as a first heat source.

[0041] It should be noted that the heat dissipation structure bracket 100 serves as a mechanical support for the electronic product. To improve the strength of the bracket 100, a grid 130 is also provided on one side of the bracket 100, and the grid 130 is integrally formed with the bracket 100. The screen assembly 10 can be a display screen that functions as a display, and it is fixedly mounted on the bracket 100 with adhesive backing. One side of the bracket 100 is adapted to the screen assembly 10 and is provided with a platform for adhesive backing and a cavity for accommodating the screen assembly 10, which facilitates the installation of the screen assembly 10. In this embodiment, it can be understood that the screen assembly 10 will generate heat and act as a first heat source. The connecting part 220 of the heat sink 200 is located in the cavity and exchanges heat with the screen assembly 10, and further exchanges heat with the external air, thereby achieving heat dissipation of the screen assembly 10.

[0042] In one embodiment, the electronic product further includes a motherboard 20, which is disposed on a bracket 100 and located on the side of the bracket 100 away from the screen assembly 10. The motherboard 20 is provided with a chip 21, which exchanges heat with a heat sink 200 and is configured as a second heat source.

[0043] In this embodiment, the motherboard 20 is fixedly mounted on the side of the bracket 100 opposite to the screen assembly 10. Specifically, the motherboard 20 can be fixed to the bracket 100 by screws or other connectors. The bracket 100 is provided with connecting posts to connect screws and other connectors. The chip 21 of the motherboard 20 is the primary heat source and also serves as a secondary heat source. The protrusion 210 of the heat sink 200 exchanges heat with the chip 21 to dissipate heat from the chip 21. Furthermore, the chip 21 is connected to a thermally conductive component 30, which contacts the protrusion 210 of the heat sink 200. The thermally conductive component 30 can be thermally conductive silicone to improve the efficiency of heat transfer. In this way, the heat from the chip 21 is transferred to the protrusion 210 through the thermally conductive silicone and then exchanges heat with the external air through the heat sink 200, thereby achieving heat dissipation from the chip 21.

[0044] In one embodiment, the electronic product further includes a housing 40 and a locking member 50. The housing 40 is connected to the bracket 100 and locked by the locking member 50. The housing 40 and the bracket 100 form a cavity 41, and the motherboard 20 is disposed in the cavity 41.

[0045] Specifically, the outer casing 40 serves as the housing of the electronic product, and is fixedly connected to the bracket 100, which provides mechanical support, via locking components 50, thereby completing the assembly of the electronic product. The outer casing 40 and the bracket 100 are connected to form a cavity 41 that accommodates the motherboard 20 and other components, such as batteries. The outer casing 40 has multiple pillars, and the bracket 100 has corresponding multiple connection holes. The locking components 50 pass through the connection holes and are locked onto the pillars, thus achieving the fixed assembly of the outer casing 40 and the bracket 100. The locking components 50 can be screws or other locking devices. The bracket 100 of the heat dissipation structure and the heat sink 200 are injection molded together as a whole. Furthermore, using the heat dissipation structure bracket 100 as the mechanical support of the electronic product reduces the number of components, simplifies the assembly process, and reduces the overall assembly time. Compared with traditional heat dissipation mechanisms for electronic products, the heat dissipation structure in this technical solution can achieve and improve the heat dissipation effect of the electronic product while simplifying the assembly process and saving overall assembly time.

[0046] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the inventive concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipating structure, characterized by comprising: include: Support frame, with clearance opening; and The heat sink includes a protrusion and a connecting portion. The connecting portion is attached to one side of the bracket. The protrusion is located in the clearance opening and extends to the side of the bracket away from the connecting portion. The connecting portion exchanges heat with a first heat source, and the protrusion exchanges heat with a second heat source.

2. The heat dissipating structure according to claim 1, wherein The heat sink is integrally molded.

3. The heat dissipating structure according to claim 1, wherein The protrusion is provided with a groove, and the groove opening is located on the surface of the protrusion facing the first heat source. The heat dissipation structure also includes an additional plate, which is located in the groove.

4. The heat dissipating structure according to claim 1, wherein The bracket is provided with a connecting groove, and the connecting part is located in the connecting groove.

5. The heat dissipating structure according to any one of claims 1 to 4, wherein The heat sink is injection molded to the bracket.

6. An electronic product, characterized by comprising: Including the heat dissipation structure described in any one of 1-5.

7. The electronic product as described in claim 6, characterized in that, The electronic product also includes a screen assembly, which is fixedly connected to the bracket of the heat dissipation structure and exchanges heat with the heat sink of the heat dissipation structure. The screen assembly is configured as a first heat source.

8. The electronic product of claim 7, wherein, The electronic product also includes a motherboard, which is mounted on the bracket and located on the side of the bracket away from the screen assembly. The motherboard has a chip that exchanges heat with the heat sink and is configured as a second heat source.

9. The electronic product of claim 8, wherein, The chip is connected to a heat-conducting component, which contacts the protrusion of the heat sink.

10. The electronic product of claim 8, wherein, The electronic product also includes a housing and a locking element. The housing is connected to the bracket and locked by the locking element. The housing and the bracket form a cavity, and the motherboard is disposed in the cavity.

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