Packaging device of semiconductor device

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a packaging device of a semiconductor device, which comprises a packaging body and an upper cover seat arranged at the upper end of the packaging body and provided with a glue injection port in the middle, the upper end of the packaging body is fixedly connected with a lifting assembly, and the upper surface of the upper cover seat is connected with a transposition mechanism. The output end of the transposition mechanism is connected with an opening and closing assembly and a lifting assembly, the opening and closing assembly is aligned with the glue injection opening, one end of the opening and closing assembly is connected with a moving mechanism, the output end of the moving mechanism is connected with two heating mechanisms, and the two heating mechanisms are located on the two sides of the lifting assembly. According to the packaging device of the semiconductor device, when one part of the packaging body breaks down, the opening and closing assembly can be controlled to rotate through the transposition mechanism, so that the lifting assembly is sealed, and waste of packaging glue can be avoided; besides, the heating mechanism can be controlled to get close through the moving mechanism so as to heat the lifting assembly, and therefore the packaging glue located in the lifting assembly is prevented from being solidified.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a packaging device for semiconductor devices. Background Technology

[0002] Semiconductor devices are electronic components made using the electrical properties of semiconductor materials (such as silicon and germanium). To protect the fragile internal structure of semiconductor devices, provide electrical connections, and ensure good thermal management and mechanical stability, semiconductor devices are often packaged using packaging devices.

[0003] Patent CN221747166U discloses a packaging device for semiconductor devices, comprising: a base plate, a support leg fixedly connected to the lower part of the base plate, a support plate fixedly connected to the upper part of the base plate, a horizontal plate fixedly connected to the support plate, a connecting plate fixedly connected to the horizontal plate, a lifting cylinder fixedly mounted on the connecting plate, a top cover fixedly connected to the output end of the lifting cylinder, and a packaging base fixedly connected to the base plate. A semiconductor device body is disposed inside the packaging base, and pin slots are provided on the sidewalls of the packaging base. The pusher plate and pusher cylinder automatically push out the packaged product, avoiding damage to the pins and reducing the product defect rate. The top cover, packaging base, and pin slots prevent adhesive from adhering to the outside of the pins and effectively restrict the pins, improving packaging quality.

[0004] However, the above-mentioned packaging device still has the following problems in actual use:

[0005] During the semiconductor device packaging process, production lines sometimes need to be paused due to component failures or other reasons. Although the external adhesive reservoir may be equipped with valves or heating elements to prevent the encapsulating adhesive inside from solidifying, residual encapsulating adhesive in the dispensing tube often cannot be discharged in time and is likely to solidify during maintenance. This not only affects subsequent packaging operations but also leads to waste of encapsulating adhesive. However, existing packaging equipment lacks the function to prevent encapsulating adhesive from solidifying during downtime, which causes operational inconvenience. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a packaging device for semiconductor devices that can ensure that the encapsulating adhesive inside the raised component does not solidify during downtime.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor device packaging device, comprising a packaging body and an upper cover mounted on the upper end of the packaging body and having a glue injection port in the middle, a lifting component fixedly connected to the upper end of the packaging body, a shifting mechanism connected to the upper surface of the upper cover, an opening and closing component connected to the output end of the shifting mechanism, the lifting component, the opening and closing component and the glue injection port being aligned, a moving mechanism connected to one end of the opening and closing component, and two heating mechanisms connected to the output end of the moving mechanism, the two heating mechanisms being located on both sides of the lifting component.

[0008] Furthermore, the lifting component includes a U-shaped frame and a dispensing tube. Both ends of the U-shaped frame are fixedly connected to the support of the encapsulation body, and the middle part of the U-shaped frame is fixedly connected to the upper end of the dispensing tube. The U-shaped frame, the dispensing tube, and the opening and closing component are aligned and connected.

[0009] Furthermore, the shifting mechanism includes an L-shaped frame and a shifting motor. One end of the L-shaped frame is fixedly connected to the upper surface of the upper cover, and the other end of the L-shaped frame is fixedly connected to the outer wall of the shifting motor. The output end of the shifting motor is connected to the opening and closing assembly.

[0010] Furthermore, the opening and closing assembly includes an extension plate and a sealing plate. One end of the extension plate is fixedly connected to the output shaft of the shift motor, and the other end of the extension plate is fixedly connected to one side of the middle of the sealing plate. An alignment port is provided through the upper surface of one end of the sealing plate. The glue injection tube, the alignment port, and the glue injection port are aligned. One end of the sealing plate is connected to a moving mechanism.

[0011] Furthermore, the moving mechanism includes a bidirectional lead screw, a moving motor, and a support bar. One side of the middle of the support bar is fixedly connected to one end of the sealing plate, and one end of the support bar is fixedly connected to the outer wall of the moving motor. The output shaft of the moving motor is fixedly connected to one end of the bidirectional lead screw. Moving ports are opened through the upper surfaces of both ends of the support bar. The other end of the bidirectional lead screw passes through two moving ports and two heating mechanisms. The same end of the two heating mechanisms is located in the two moving ports respectively.

[0012] Furthermore, the heating mechanism includes a semi-circular heating cover, a connecting block, and a moving block. The lower end of the moving block is located inside the moving port, and the inner wall of the lower end of the moving block is threadedly connected to the outer wall of the bidirectional lead screw. The outer wall of the lower end of the moving block is slidably connected to the inner wall of the moving port. The outer wall of the upper end of the moving block is fixedly connected to the inner wall of one end of the connecting block. The other end of the connecting block is fixedly connected to the outer wall of the lower end of the semi-circular heating cover. The inner wall dimension of the semi-circular heating cover is the same as the outer wall dimension of the glue injection tube. A heating wire is embedded in the inner wall of the semi-circular heating cover.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The packaging device for this semiconductor device includes a transposition mechanism, an opening and closing component, a moving mechanism, a heating mechanism, and a lifting component located above the glue injection port on the upper cover. When a component of the packaging body malfunctions, the transposition mechanism can control the opening and closing component to rotate, thereby sealing the lifting component and preventing waste of encapsulant. In addition, the moving mechanism can control the heating mechanism to move closer to heat the lifting component, thereby preventing the encapsulant inside the lifting component from solidifying. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall appearance of the present utility model;

[0016] Figure 2 This is an exploded view of the components of this utility model, including the upper cover, the shifting mechanism, and the lifting assembly.

[0017] Figure 3 This is a detailed connection diagram of the components of this utility model, including the switching mechanism, opening and closing assembly, and moving mechanism.

[0018] Figure 4 This utility model Figure 3 Explosion diagrams of various components.

[0019] In the diagram: 1. Encapsulation body; 2. Top cover; 3. U-shaped frame; 4. Injection tube; 5. L-shaped frame; 6. Positioning motor; 7. Extension plate; 8. Sealing plate; 9. Bidirectional lead screw; 10. Moving motor; 11. Semi-circular heating cover; 12. Connecting block; 13. Moving block; 14. Support bar; 201. Injection port; 801. Alignment port; 1401. Moving port. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figures 1-4 A semiconductor device packaging apparatus includes a packaging body 1 and an upper cover 2 mounted on the upper end of the packaging body 1 and having a glue injection port 201 in the middle. A lifting component is fixedly connected to the upper end of the packaging body 1, and a shifting mechanism is connected to the upper surface of the upper cover 2. An opening and closing component is connected to the output end of the shifting mechanism. The lifting component, the opening and closing component and the glue injection port 201 are aligned. A moving mechanism is connected to one end of the opening and closing component. Two heating mechanisms are connected to the output end of the moving mechanism. The two heating mechanisms are located on both sides of the lifting component.

[0022] like Figures 1 to 4As shown, when the semiconductor device packaging device of this utility model is in use, the dispensing end of the external glue storage tank is first connected to the lifting component to ensure internal communication. Then, during the normal use of the packaging body 1, if one of the components of the packaging body 1 fails, it will not be possible to empty the packaging glue inside the glue storage tank inside the lifting component in time. In order to avoid solidification and waste, a switching mechanism controlled by another control system can be used. After the switching mechanism is started, it will rotate the opening and closing component. The rotation of the opening and closing component will seal and block the gap between the lifting component and the upper cover 2, so that the packaging glue inside the glue storage tank and the lifting component will not continue to flow out, thereby reducing waste.

[0023] To prevent the encapsulating adhesive inside the raised component from solidifying, the moving mechanism and heating mechanism can be activated again through the control system of the non-encapsulated body 1. After the moving mechanism is activated, it will push the two heating mechanisms closer to the center, thereby wrapping the raised component in the middle from both sides and continuously providing heat to the raised component, thus ensuring that the encapsulating adhesive inside the raised component solidifies.

[0024] It is important to note here that:

[0025] The packaging body 1 is the prior art inside the "Patent No. CN221747166U discloses a packaging device for semiconductor devices". In addition to the upper cover 2 and the injection port 201, it also includes support legs, base plate, support plate, pins and pin slots, etc. The principle of these components will not be described in detail here. It should be noted that in this utility model, only the structure of the disclosed patent is partially improved. The above-mentioned structures not mentioned in the disclosed patent, such as support legs, base plate, support plate, pins and pin slots, are not modified in any way and retain their original functions and effects.

[0026] As a preferred embodiment of this utility model, the lifting component includes a U-shaped frame 3 and a glue injection tube 4. Both ends of the U-shaped frame 3 are fixedly connected to the support of the encapsulation body 1, and the middle part of the U-shaped frame 3 is fixedly connected to the upper end of the glue injection tube 4. The U-shaped frame 3, the glue injection tube 4 and the opening and closing component are aligned and connected.

[0027] More specifically, by setting up the U-shaped frame 3, the dispensing tube 4 and the external glue storage tank installed on the dispensing tube 4 can be prevented from falling off; by setting up the dispensing tube 4, the encapsulating glue inside the external glue storage tank can be delivered more accurately to the opening and closing components and the dispensing port 201.

[0028] As a preferred embodiment of this utility model, the shifting mechanism includes an L-shaped frame 5 and a shifting motor 6. One end of the L-shaped frame 5 is fixedly connected to the upper surface of the upper cover 2, and the other end of the L-shaped frame 5 is fixedly connected to the outer wall of the shifting motor 6. The output end of the shifting motor 6 is connected to the opening and closing assembly.

[0029] More specifically, when it is necessary to change the position of the opening and closing component to open and close the glue injection port 201, simply start the shift motor 6, and the output shaft of the shift motor 6 will rotate the opening and closing component.

[0030] As a preferred embodiment of this utility model, the opening and closing assembly includes an extension plate 7 and a sealing plate 8. One end of the extension plate 7 is fixedly connected to the output shaft of the shift motor 6, and the other end of the extension plate 7 is fixedly connected to one side of the middle part of the sealing plate 8. An alignment port 801 is provided through the upper surface of one end of the sealing plate 8. The glue injection tube 4, the alignment port 801 and the glue injection port 201 are aligned. One end of the sealing plate 8 is connected to a moving mechanism.

[0031] More specifically, when the shifting motor 6 starts, the output shaft of the shifting motor 6 can rotate the extension plate 7, and then the extension plate 7 rotates the sealing plate 8, so as to align and misalign the alignment port 801 and the glue injection port 201, thereby realizing opening and closing.

[0032] As a preferred embodiment of this utility model, the moving mechanism includes a bidirectional lead screw 9, a moving motor 10, and a support bar 14. One side of the middle part of the support bar 14 is fixedly connected to one end of the sealing plate 8, and one end of the support bar 14 is fixedly connected to the outer wall of the moving motor 10. The output shaft of the moving motor 10 is fixedly connected to one end of the bidirectional lead screw 9. The upper surfaces of both ends of the support bar 14 are provided with moving ports 1401. The other end of the bidirectional lead screw 9 passes through two moving ports 1401 and two heating mechanisms. The same end of the two heating mechanisms is located in the two moving ports 1401 respectively.

[0033] More specifically, when the sealing plate 8 rotates, the support bar 14 connected to the sealing plate 8 can rotate together, which in turn causes the bidirectional lead screw 9, the moving motor 10 and the heating mechanism connected to the support bar 14 to rotate together.

[0034] In addition, when it is necessary to control the movement of the heating mechanism to heat the dispensing tube 4, simply turn on the moving motor 10. The output shaft of the moving motor 10 will rotate the bidirectional lead screw 9. Then, the two heating mechanisms connected to both ends of the bidirectional lead screw 9 can move towards the middle at the same time, so that the encapsulating glue inside the dispensing tube 4 can be heated from the outside of the dispensing tube 4.

[0035] As a preferred embodiment of this utility model, the heating mechanism includes a semi-circular heating cover 11, a connecting block 12, and a moving block 13. The lower end of the moving block 13 is located inside the moving port 1401, and the inner wall of the lower end of the moving block 13 is threadedly connected to the outer wall of the bidirectional lead screw 9. The outer wall of the lower end of the moving block 13 is slidably connected to the inner wall of the moving port 1401. The outer wall of the upper end of the moving block 13 is fixedly connected to the inner wall of one end of the connecting block 12. The other end of the connecting block 12 is fixedly connected to the outer wall of the lower end of the semi-circular heating cover 11. The inner wall dimension of the semi-circular heating cover 11 is the same as the outer wall dimension of the glue injection tube 4. A heating wire is embedded in the inner wall of the semi-circular heating cover 11.

[0036] More specifically, when the bidirectional lead screw 9 rotates, the movable block 13 connected to the bidirectional lead screw 9 can move within the movable port 1401. During the movement of the movable block 13, it can also move together with the semi-circular heating cover 11 and the connecting block 12, thereby clamping the glue injection tube 4 from the outside through the semi-circular heating cover 11.

[0037] In addition, when the semi-circular heating cover 11 clamps the dispensing tube 4, the heating wire inside the semi-circular heating cover 11 will continuously emit heat, which can heat the encapsulating adhesive inside the dispensing tube 4 and prevent it from solidifying.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging apparatus for a semiconductor device, comprising a packaging body (1) and a top cover (2) mounted on the upper end of the packaging body (1) and having a glue injection port (201) in the middle, characterized in that: The upper end of the encapsulation body (1) is fixedly connected to a lifting component, and the upper surface of the upper cover (2) is connected to a shifting mechanism. The output end of the shifting mechanism is connected to an opening and closing component. The lifting component, the opening and closing component and the glue injection port (201) are aligned. One end of the opening and closing component is connected to a moving mechanism. The output end of the moving mechanism is connected to two heating mechanisms, which are located on both sides of the lifting component.

2. The semiconductor device packaging apparatus according to claim 1, characterized in that: The lifting assembly includes a U-shaped frame (3) and a glue injection tube (4). Both ends of the U-shaped frame (3) are fixedly connected to the support of the encapsulation body (1). The middle part of the U-shaped frame (3) is fixedly connected to the upper end of the glue injection tube (4). The U-shaped frame (3), the glue injection tube (4), and the opening and closing assembly are aligned and connected.

3. The semiconductor device packaging apparatus according to claim 2, characterized in that: The shifting mechanism includes an L-shaped frame (5) and a shifting motor (6). One end of the L-shaped frame (5) is fixedly connected to the upper surface of the upper cover seat (2), and the other end of the L-shaped frame (5) is fixedly connected to the outer wall of the shifting motor (6). The output end of the shifting motor (6) is connected to the opening and closing assembly.

4. The semiconductor device packaging apparatus according to claim 3, characterized in that: The opening and closing assembly includes an extension plate (7) and a sealing plate (8). One end of the extension plate (7) is fixedly connected to the output shaft of the shift motor (6), and the other end of the extension plate (7) is fixedly connected to one side of the middle part of the sealing plate (8). An alignment port (801) is provided through the upper surface of one end of the sealing plate (8). The glue injection tube (4), the alignment port (801) and the glue injection port (201) are aligned. One end of the sealing plate (8) is connected to a moving mechanism.

5. The semiconductor device packaging apparatus according to claim 4, characterized in that: The moving mechanism includes a bidirectional lead screw (9), a moving motor (10), and a support bar (14). One side of the middle part of the support bar (14) is fixedly connected to one end of the sealing plate (8). One end of the support bar (14) is fixedly connected to the outer wall of the moving motor (10). The output shaft of the moving motor (10) is fixedly connected to one end of the bidirectional lead screw (9). The upper surfaces of both ends of the support bar (14) are provided with moving ports (1401). The other end of the bidirectional lead screw (9) passes through two moving ports (1401) and two heating mechanisms. The same end of the two heating mechanisms is located in the two moving ports (1401) respectively.

6. The semiconductor device packaging apparatus according to claim 5, characterized in that: The heating mechanism includes a semi-circular heating cover (11), a connecting block (12), and a moving block (13). The lower end of the moving block (13) is located inside the moving port (1401), and the inner wall of the lower end of the moving block (13) is threadedly connected to the outer wall of the bidirectional lead screw (9). The outer wall of the lower end of the moving block (13) is slidably connected to the inner wall of the moving port (1401). The outer wall of the upper end of the moving block (13) is fixedly connected to the inner wall of one end of the connecting block (12). The other end of the connecting block (12) is fixedly connected to the outer wall of the lower end of the semi-circular heating cover (11). The inner wall size of the semi-circular heating cover (11) is the same as the outer wall size of the glue injection tube (4). The inner wall of the semi-circular heating cover (11) is embedded with heating wires.

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