Wafer storage device

Abstract

The utility model provides a wafer storage device, and relates to the technical field of wafer storage devices. The wafer storage device comprises an object placing part which is provided with a plurality of slots used for placing wafers; the water tank is internally provided with an inner water tank and an outer water tank, the wafer is placed in the inner water tank, and the depth of the inner water tank is larger than the diameter of the wafer; wherein a water outlet is formed in the bottom of the inner water tank, a water inlet is formed in the outer water tank, the water inlet is connected with the water outlet through a first pipeline, and a first pumping device is arranged on the first pipeline so that liquid can flow to the water outlet from the water inlet. The inner water tank is provided with the water outlet, the outer water tank is provided with the water inlet, and liquid in the outer water tank enters the bottom of the inner water tank through the water inlet and then overflows to the outer water tank through the top of the inner water tank, so that flowing water is formed in the inner water tank, wafers are prevented from being exposed in external environments such as air, and the wafers are convenient to store.

Description

Technical Field

[0001] This utility model relates to the field of wafer storage device technology, and specifically to a wafer storage device. Background Technology

[0002] During wafer processing, if the machine stops unexpectedly and cannot eject the wafer, it needs to be transferred to a water-rich area and rinsed with a water spray device or manually using a water gun to reduce wafer defects. However, with existing water spray devices or manual water gun rinsing, the wafer is still exposed to air and dust, increasing the risk of wafer defects and scrap. Therefore, there is a need for a wafer storage device to temporarily store wafers during machine shutdowns, reducing the risk of wafer defects and scrap. Utility Model Content

[0003] In view of the shortcomings of the prior art, the present invention provides a wafer storage device to improve the technical problem that when the existing machine is shut down, there is no suitable storage device for the wafers, and the wafers still have a great risk of being scrapped when they are rinsed by a water spray device or a manual water gun.

[0004] To achieve the above and other related objectives, this utility model provides a wafer storage device, comprising: a storage section having a plurality of slots for placing wafers; a water tank having an inner water tank and an outer water tank, wherein the wafers are placed in the inner water tank and the depth of the inner water tank is greater than the diameter of the wafers; wherein the bottom of the inner water tank has a water outlet and the outer water tank has a water inlet, the water inlet and the water outlet are connected by a first pipeline, and a first pumping device is provided on the first pipeline to allow liquid to flow from the water inlet to the water outlet.

[0005] In an exemplary embodiment of this application, the inner water tank includes an outlet area and an overflow area, the outlet is disposed in the outlet area, and the depth of the liquid contained in the outlet area is greater than the depth of the liquid contained in the overflow area.

[0006] In an exemplary embodiment of this application, the storage unit is disposed inside the water tank, and the area enclosed by the storage unit is an inner water trough.

[0007] In an exemplary embodiment of this application, the inner water tank includes a water outlet area and an overflow area, the water outlet is disposed in the water outlet area, the water outlet area is disposed in the middle of the storage part, and the overflow area is located on both sides of the water outlet area.

[0008] In an exemplary embodiment of this application, a groove is provided on the top of the sidewall of the overflow area, and liquid in the inner water tank overflows from the groove.

[0009] In an exemplary embodiment of this application, the groove is disposed on a sidewall parallel to the wafer.

[0010] In an exemplary embodiment of this application, a plurality of water outlets are included, and the plurality of water outlets are arranged along the wafer discharge direction at the bottom of the inner water tank.

[0011] In an exemplary embodiment of this application, the bottom of the inner water tank is provided with a protrusion, which is provided on both sides of the water outlet to form a water channel at the bottom of the inner water tank that allows liquid to flow along the wafer discharge direction.

[0012] In an exemplary embodiment of this application, a support portion is included, which is disposed at the bottom of the water tank; the bottom of the support portion is provided with rollers.

[0013] In an exemplary embodiment of this application, the support portion and the water tank form a receiving space, and the first pipeline and the first pumping device are disposed in the receiving space.

[0014] In combination with existing technologies, the beneficial effects of this utility model are as follows:

[0015] In existing systems, when equipment malfunctions, wafers can only be rinsed with a spray system or a manual water gun, which carries a significant risk of wafer defects. This application addresses this issue by incorporating slots in the storage section to hold the wafers. By placing the wafers in an inner water tank, the depth of which is greater than the wafer's diameter, the liquid (such as water) in the inner tank can completely submerge the wafers, preventing them from being exposed to air or other external environmental factors and reducing the risk of wafer defects. An outlet is located at the bottom of the inner water tank, while an inlet is located in the outer water tank. Liquid from the outer tank enters the bottom of the inner tank through the inlet and then overflows from the top of the inner tank to the outer tank, creating flowing water within the inner tank. This further reduces the risk of wafer defects caused by temporary wafer storage and facilitates wafer storage. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of an exemplary wafer storage device according to this application;

[0018] Figure 2 This is a schematic diagram of an exemplary wafer storage device of this application after the cover plate has been removed;

[0019] Figure 3 This is a perspective view of an exemplary wafer storage device of this application after removing the cover plate;

[0020] Figure 4 This is a top view of a partial structure of an exemplary wafer storage device according to this application.

[0021] Component designation explanation:

[0022] 100. Storage compartment; 110. Slot; 120. Groove; 130. Protrusion; 140. Water baffle;

[0023] 200. Water tank; 210. Inner water tank; 211. Water outlet area; 212. Overflow area; 220. Outer water tank; 230. Water outlet; 240. Water inlet;

[0024] 300. Support section; 310. Support leg; 320. Support plate;

[0025] 400. Rollers;

[0026] 500. Cart handle;

[0027] 600. Operation panel;

[0028] 700, cover plate. Detailed Implementation

[0029] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. It should also be understood that the terminology used in the embodiments of this utility model is for describing specific implementation schemes and not for limiting the scope of protection of this utility model. Test methods in the following embodiments that do not specify specific conditions are generally performed under conventional conditions or according to the conditions recommended by the respective manufacturers.

[0030] When numerical ranges are given in the embodiments, it should be understood that, unless otherwise stated in this invention, both endpoints of each numerical range and any value between the two endpoints may be selected. Unless otherwise defined, all technical and scientific terms used in this invention, as well as the prior art known to those skilled in the art and the description of this invention, may be implemented using any prior art methods, devices, and materials similar to or equivalent to those described, used, or made of materials in the embodiments of this invention.

[0031] It should be noted that the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as within the scope of implementation of this utility model.

[0032] Wafers are the core material in semiconductor processing. During wafer processing, when the equipment malfunctions, the wafer needs to be moved to a spray station for spraying or manually sprayed with a water gun. However, during the spraying process, the wafer is still exposed to air or dust, which increases the risk of wafer defects. In view of this, this application provides a wafer storage device to facilitate the storage of wafers when the equipment malfunctions or other situations require temporary storage, thereby reducing the risk of wafer defects and minimizing the risk of wafer scrap.

[0033] Please see Figures 1 to 4 The wafer storage device includes a storage section 100 and a water tank 200. The storage section 100 has several slots 110 for placing wafers. The slots 110 are arranged in an array to facilitate wafer placement while creating gaps between the wafers to prevent damage from stacking. The water tank 200 has an inner water tank 210 and an outer water tank 220. The wafers are placed in the inner water tank 210, and the depth of the inner water tank 210 is greater than the diameter of the wafer. For example, the inner water tank 210 can be a separate space within the water tank 200 or a space enclosed by the storage section 100 for placing wafers. When the inner water tank 210 is filled with liquid, because the depth of the inner water tank 210 is greater than the diameter of the wafer, the liquid can submerge the wafer, preventing it from being exposed to air or dust. The inner water tank 210 has an outlet 230 at its bottom, and the outer water tank 220 has an inlet 240. The inlet 240 and the outlet 230 are connected by a first pipeline. A first pumping device is installed on the first pipeline so that the liquid flows from the inlet 240 to the outlet 230. The first pumping device drives the liquid from the outer water tank 220 to the bottom of the inner water tank 210, and then overflows from the top of the inner water tank 210. The liquid flows in the inner water tank 210, thereby rinsing the surface of the wafer and further reducing the risk of wafer defects. This application facilitates the storage of wafers, especially for temporary storage of wafers when the machine fails, reducing the risk of wafer defects or even wafer scrap and improving the yield.

[0034] Please see Figure 4In one embodiment, the storage unit 100 is disposed inside the water tank 200, and the storage unit 100 forms an inner water tank 210. The storage unit 100 directly separates the inner water tank 210 and the outer water tank 220 within the water tank 200, thereby reducing the number of components in the wafer storage device, facilitating the production of the wafer storage device, and reducing the cost of the device.

[0035] Please see Figure 3 and Figure 4 In one embodiment, the storage unit 100 is fixed inside the water tank 200. The storage unit 100 includes a baffle plate 140, which is fixed to the bottom plate of the water tank 200. The baffle plate 140 is fixed to the water tank 200 by means including but not limited to welding. The baffle plate 140 forms an inner water tank 210, which is preferably square in shape to facilitate wafer placement. At least one pair of baffle plates 140 on each side are provided with a plurality of slots 110. The slots 110 are located on opposite sides of the two baffle plates 140. When in use, wafers are inserted into the slots 110 in sequence to limit their placement and create gaps between the wafers, facilitating the flow of liquid between the wafers and rinsing them. Furthermore, the slots 110 are arranged in a linear array along the length of the baffle plate 140 to facilitate the orderly arrangement of wafers inside the storage unit 100.

[0036] In another embodiment, the storage unit 100 is placed inside the water tank 200 or detachably fixed inside the water tank 200 to facilitate the use and cleaning of the water tank 200 and the storage unit 100. The storage unit 100 includes at least a baffle plate 140 forming an inner water tank 210. The baffle plate 140 forms a square structure, which is placed inside the water tank 200, dividing the water tank 200 into an inner water tank 210 and an outer water tank 220. At least one pair of baffle plates 140 on each side are provided with a plurality of slots 110. The slots 110 are located on opposite sides of the two baffle plates 140. A wafer is inserted into the slot 110, and the bottom plate of the water tank 200 cooperates with the slot 110 to support the wafer. For example, the storage unit 100 may also include a storage base plate, which is fixed to the surrounding water baffles 140. The storage base plate and the slots 110 on the water baffles 140 cooperate to support the wafer. By setting the storage base plate, it is convenient to take out or put into the water tank 200 simultaneously with the storage unit 100 and the wafer inside the storage unit 100, making it more convenient for use in multiple scenarios.

[0037] In one embodiment, a coding area is provided on the water baffle 140 with slot 110, and a code is provided in the coding area. The code corresponds to the slot 110 to facilitate the counting of the number of wafers or to facilitate the handling of wafers.

[0038] In another embodiment, the water tank 200 has an inner water tank 210, and a storage unit 100 is disposed within the inner water tank 210. The storage unit 100 can be disposed in different ways, such as being fixed within the inner water tank 210, detachably fixed within the inner water tank 210, or directly placed within the inner water tank 210. The storage unit 100 can be a frame structure with slots 110, or a plate structure with slots 110 at the bottom and support rods with slots 110 on the sides, etc. The inner water tank 210 includes a water outlet area 211 and an overflow area 212. The water outlet 230 is disposed in the water outlet area 211. The depth of the liquid contained in the water outlet area 211 is greater than the depth of the liquid contained in the overflow area 212, thereby allowing the liquid to flow from the water outlet area 211 to the overflow area 212, ensuring the flow of liquid within the inner water tank 210.

[0039] Please see Figure 4 In one embodiment, the inner water tank 210 includes an outlet area 211 and an overflow area 212. The outlet 230 is located in the outlet area 211. The overflow area 212 can hold a lower liquid level than the outlet area 211, allowing liquid to overflow from the overflow area 212 into the outer water tank 220. The outlet 230 is located in the outlet area 211, allowing liquid to flow from the outlet area 211 to the overflow area 212, promoting liquid flow, increasing the range of liquid flow, and improving the range of liquid rinsing of the wafer. The outlet area 211 is located in the middle of the storage section 100, and the overflow areas 212 are located on both sides of the outlet area 211. Liquid flows from the middle of the storage section 100 to both sides of the storage section 100, reducing the liquid flow distance and improving the rinsing effect on the wafer.

[0040] Please see Figure 3 and Figure 4 In one embodiment, a groove 120 is provided on the top of the side wall of the overflow area 212, and the liquid in the inner water tank 210 flows out from the groove 120. By setting the groove 120, the liquid is guided to overflow from the groove 120, which facilitates the control of the liquid flow path, controls the scouring effect on the wafer, and improves the coverage of the liquid flowing over the wafer surface.

[0041] Please see Figure 3 and Figure 4In one embodiment, the groove 120 is disposed on a sidewall parallel to the wafer. In other words, the groove 120 is disposed on a baffle plate 140 without a slot 110, and the baffle plate 140 with the groove 120 is parallel to the placed wafer. When liquid flows from the outlet 230 to the top of the inner water tank 210, the liquid flows along the gap between the wafers. By disposing of the groove 120 on the top of the baffle plate 140 parallel to the wafer, the liquid flows in a direction perpendicular to the wafer, thereby preventing the liquid from flowing directly from the outlet 230 along the gap between the wafers to outside the inner water tank 210. This increases the flow range of the liquid, increases the coverage of the flowing liquid on the wafer surface, and improves the scouring effect on the wafer surface.

[0042] Please see Figure 3 and Figure 4 In one embodiment, the bottom of the inner water tank 210 is provided with a protrusion 130, which is disposed on both sides of the outlet 230 to form a water channel at the bottom of the inner water tank 210, allowing liquid to flow along the wafer discharge direction. The protrusion 130 is disposed along the wafer discharge direction, that is, the length direction of the protrusion 130 is perpendicular to the wafer. The protrusions 130 on both sides of the outlet 230 form a water channel, which is perpendicular to the wafer, thereby allowing the liquid to flow in a direction perpendicular to the wafer. This reduces the occurrence of liquid flowing only along the gap between wafers at the edge of the outlet 230 after flowing out of the outlet 230, increasing the liquid flow range and improving the coverage of the flowing liquid on the wafer. It should be noted that...

[0043] Please see Figure 4 Furthermore, a slot 110 is also provided on the top of the protrusion 130. The slot 110 on the top of the protrusion 130 corresponds to the slot 110 at the baffle plate 140. The wafer is inserted through the slot 110 at the baffle plate 140 until the bottom of the wafer is inserted into the slot 110 of the protrusion 130, reducing wafer shaking caused by liquid flow and improving the stability of wafer placement.

[0044] In one embodiment, the bottom of the inner water tank 210 is provided with a plurality of water outlets 230, which are arranged along the wafer discharge direction at the bottom of the inner water tank 210. By providing a plurality of water outlets 230, the speed and range of liquid flow are increased, which facilitates the preservation of the wafer.

[0045] Please see Figure 1 In one embodiment, the wafer storage device includes a support 300 disposed at the bottom of the water tank 200. The support 300 includes a support leg 310 fixed to the bottom of the water tank 200, thereby increasing the height of the water tank 200 and facilitating the placement of wafers into the water tank 200, thus saving the workload of the staff.

[0046] Please see Figure 1 Furthermore, the support part 300 also includes a support plate 320, which is disposed at the bottom of the support leg 310, thereby forming a receiving space between the support plate 320 and the water tank 200 to facilitate the placement of the first pipeline and the first pumping device, etc.

[0047] Furthermore, the top of the support plate 320 is provided with a receiving groove, which can be used to place items and to collect liquid in case of leakage from the water tank 200 or the first pipeline, so as to prevent liquid from leaking to the ground.

[0048] Please see Figure 1 Furthermore, the wafer storage device also includes an operation panel 600, which is located within the accommodating space to save space and facilitate operation.

[0049] Please see Figure 1 In one embodiment, the bottom of the support portion 300 is provided with rollers 400, such as four rollers 400 on the bottom of the support plate 320, thereby facilitating the movement of the wafer storage device. This allows the wafer storage device to be moved to the faulty machine for temporary storage of the wafers in the event of a machine failure. Preferably, the rollers 400 are casters, which further facilitates the movement of the wafer storage device.

[0050] Please see Figure 1 In one embodiment, a cover plate 700 is rotatably connected to the top of the water tank 200 to seal the water tank 200, thereby reducing the amount of impurities falling into the water tank 200 and reducing the contamination of the liquid inside the water tank 200.

[0051] Please see Figure 1 In one embodiment, the wafer storage device includes a trolley handle 500, which is fixed to a water tank 200 to facilitate the pushing of the device by staff.

[0052] In one embodiment, in order to facilitate the replenishment of liquid into the water tank 200, the wafer storage device is provided with a second pipeline and a second pumping device. The second pipeline connects the water tank 200 to the external liquid to replenish the water tank 200, and at the same time, the liquid can be discharged from the water tank 200 after use.

[0053] When needed, first check if there is enough liquid in the water tank 200. Taking water as an example, if the water level in the water tank 200 is low, first fill the inner water tank 210 with water, allowing the water to overflow from the inner water tank 210 to the outer water tank 220. Insert the second pipe into the inlet 240, open the valve on the second pipe, and turn on the second pumping device to fill the first pipe with water. Then, turn off the second pumping device, close the valve on the second pipe, and pull the second pipe out of the inlet 240.

[0054] When there is enough water in the water tank 200 and water in the first pipe, the first pumping device is turned on, so that the water flows from the inlet 240 to the outlet 230 and overflows from the top of the inner water tank 210 to the outer water tank 220.

[0055] When the water needs to be drained after use, insert the second pipe into the inner water tank 210, open the valve on the second pipe, and turn on the second pumping device. The water in the inner water tank 210 will be drained through the second pipe until the water tank 200 is completely drained. Then, close the second pumping device and the valve on the second pipe, and retract the second pipe for the next use.

[0056] This utility model relates to a wafer storage device. Wafers are placed in a storage section 100 with slots 110. A water flow is created between the inner water tank 210 and the outer water tank 220 through inlet 240 and outlet 230, ensuring a constant flow of water on the wafer surface. This facilitates wafer storage in case of machine malfunction, reducing the risk of wafer defects and scrap. Therefore, this utility model effectively overcomes some practical problems in the prior art, thus possessing high utilization value and practical significance.

[0057] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer storage device, characterized in that, include: The storage section is provided with several slots for placing wafers; A water tank, wherein the water tank is provided with an inner water tank and an outer water tank, the wafer is placed in the inner water tank, and the depth of the inner water tank is greater than the diameter of the wafer; The inner water tank has an outlet at the bottom and an inlet in the outer water tank. The inlet and outlet are connected by a first pipeline, and a first pumping device is installed on the first pipeline to allow liquid to flow from the inlet to the outlet. The inner water tank includes a water outlet area and an overflow area. The water outlet is located in the water outlet area, and the depth of the liquid contained in the water outlet area is greater than the depth of the liquid contained in the overflow area. The water outlet area is located in the middle of the storage part, and the overflow area is located on both sides of the water outlet area.

2. The wafer storage device according to claim 1, characterized in that, The storage compartment is located inside the water tank, and the area enclosed by the storage compartment is an inner water trough.

3. The wafer storage device according to claim 1, characterized in that, The top of the side wall of the overflow area is provided with a groove, and the liquid in the inner water tank overflows from the groove.

4. The wafer storage device according to claim 3, characterized in that, The groove is disposed on a sidewall parallel to the wafer.

5. The wafer storage device according to claim 1, characterized in that, It includes multiple water outlets, which are arranged along the wafer discharge direction at the bottom of the inner water tank.

6. The wafer storage device according to claim 1, characterized in that, The bottom of the inner water tank is provided with a protrusion, which is located on both sides of the water outlet to form a water channel at the bottom of the inner water tank that allows the liquid to flow along the wafer discharge direction.

7. The wafer storage device according to claim 1, characterized in that, It includes a support part, which is disposed at the bottom of the water tank; the bottom of the support part is provided with rollers.

8. The wafer storage device according to claim 7, characterized in that, The support and the water tank form a receiving space, and the first pipeline and the first pumping device are disposed in the receiving space.

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