Die bonding clamp of LED die bonder

Abstract

The utility model discloses an LED die bonder die bonding clamp, and relates to the technical field of die bonders, the LED die bonder die bonding clamp comprises a clamp main body, a mounting plate and a fixing block, and the upper side of the clamp main body is provided with a placing groove; the mounting plates are symmetrically mounted above the clamp main body, upward elastic mechanisms are mounted between the bottoms of the two groups of mounting plates and the upper side of the clamp main body, sliding grooves are formed in the outer parts of the mounting plates, sliding blocks are slidably connected into the sliding grooves, a connecting plate is fixedly connected between the upper sides of the two groups of sliding blocks, and a mounting rod is fixedly connected between the lower sides of the two groups of sliding blocks; a pressing mechanism is mounted at the bottom of the mounting rod; and a pull-down mechanism is mounted in the clamp main body. According to the device, the distance between the positioning strips is adjusted through manual sliding to adapt to the size of a chip, a motor is matched with a winding pull rope to drive the symmetrical mounting plates to press downwards, pressure is rapidly released through elastic reset of springs, one-key clamping and loosening are achieved, the repeated adjusting step of a traditional clamp is simplified, and the positioning efficiency and stability of the chips of multiple sizes are improved.

Description

Technical Field

[0001] This utility model relates to the field of die bonder technology, and more specifically, to a die bonder fixture for an LED die bonder. Background Technology

[0002] Existing LED die bonder fixtures mostly employ fixed positioning structures or manual adjustment devices, making it difficult to adapt to the clamping requirements of chips of different sizes. Traditional fixtures require repeated disassembly and replacement of positioning components or manual adjustment of screws to achieve spacing adjustment, which is cumbersome and inefficient. Human error can easily lead to positioning deviations, affecting die bonding accuracy. Furthermore, conventional elastic reset structures are prone to fatigue deformation during frequent clamping, resulting in uneven pressure and making it difficult to guarantee the stability and yield of chip clamping, especially in the processing of microchips.

[0003] While some improved fixtures currently incorporate automated drive structures, they often rely on complex cylinder or hydraulic systems, resulting in large sizes and high maintenance costs, making them difficult to integrate into compact die bonding equipment. Their adjustment processes still suffer from response delays and incomplete resets, and they cannot simultaneously achieve the flexibility of manual fine-tuning and automated drive. Therefore, to address these technical issues, this paper proposes a die bonding fixture for LED die bonding machines. Utility Model Content

[0004] The purpose of this invention is to provide a die-bonding fixture for an LED die bonder. By manually sliding and adjusting the spacing of the positioning bars to adapt to the chip size, and with the motor winding the pull rope to drive the symmetrical mounting plate to press down, the pressure is quickly released by the elastic reset of the spring, realizing one-click clamping and detachment. This simplifies the repeated adjustment steps of traditional fixtures and improves the positioning efficiency and stability of multi-size chips.

[0005] This utility model is achieved through the following technical solution:

[0006] A die bonding fixture for an LED die bonding machine, comprising:

[0007] The fixture body has a placement slot on its upper side;

[0008] Mounting plates are symmetrically mounted on top of the fixture body. A spring mechanism is installed between the bottom of the two sets of mounting plates and the upper side of the fixture body. A sliding groove is provided on the outside of the mounting plate. A slider is slidably connected inside the sliding groove. A connecting plate is fixedly connected between the upper sides of the two sets of sliders. A mounting rod is fixedly connected between the lower sides of the two sets of sliders. A pressing mechanism is installed at the bottom of the mounting rod.

[0009] A fixing block is fixedly connected to the outside of the mounting plate, and a pull-down mechanism is installed inside the fixture body.

[0010] Preferably, the spring-loaded mechanism includes a telescopic rod and a spring, both of which are fixedly connected between the mounting plate and the clamp body.

[0011] Preferably, the telescopic rod and the spring are in two sets and arranged symmetrically, and the spring is sleeved on the outside of the telescopic rod.

[0012] Preferably, the pressing mechanism includes a connecting rod and a positioning strip. The connecting rod is fixedly connected to the bottom of the mounting rod, and the positioning strip is fixedly connected to the bottom of the connecting rod, and the positioning strip matches the placement groove.

[0013] Preferably, the pull-down mechanism includes a drive motor, a rotating rod, and a connecting rope. The drive motor is fixedly connected to the inside of the clamp body, the rotating rod is fixedly connected to the lower side of the drive motor, and the rotating rod and the clamp body are rotatably connected. The connecting rope is fixedly connected to both sides of the rotating rod.

[0014] Preferably, a guide cylinder is fixedly connected inside the clamp body, and the connecting rope passes through the guide cylinder and through the upper side of the clamp body to be fixedly connected to the bottom of the fixing block.

[0015] Preferably, a connecting plate is fixedly connected to the lower side of the fixture body, and the connecting plate has mounting holes on its exterior.

[0016] The technical solution of this utility model has at least the following beneficial effects:

[0017] This LED die bonder fixture allows for manual adjustment of the positioning bar spacing, quickly adapting to chips of different sizes. This avoids the tedious operation of repeated disassembly or tool adjustment, significantly shortening clamping preparation time. Simultaneously, a motor-driven pull rope pulls down the symmetrical mounting plate, combined with spring elastic reset, achieving one-click clamping and detachment. This reduces human intervention errors and improves positioning accuracy and consistency. The synergistic action of elastic elements and telescopic rods ensures uniform and stable pressure, preventing chip misalignment or damage. It is particularly suitable for high-precision die bonding of microchips. Furthermore, the pull-down transmission path is optimized with a guide cylinder, reducing friction loss and extending service life. The overall structure is compact and highly compatible, allowing seamless integration into existing equipment, reducing maintenance costs and energy consumption. This effectively solves the technical challenges of low efficiency and poor stability in multi-size chip processing. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 for Figure 1 Enlarged view of A in the middle;

[0020] Figure 3 for Figure 1 Enlarged view of B in the middle;

[0021] Figure 4 This is a partial side sectional view of the present invention;

[0022] Figure 5 for Figure 4 Enlarged view of C;

[0023] Figure 6 for Figure 4 Enlarged view of D;

[0024] Icons: 1. Fixture body; 2. Placement slot; 3. Mounting plate; 4. Telescopic rod; 5. Spring; 6. Slide groove; 7. Slider; 8. Connecting plate; 9. Mounting rod; 10. Connecting rod; 11. Positioning strip; 12. Drive motor; 13. Rotating rod; 14. Connecting rope; 15. Fixing block; 16. Guide cylinder; 17. Connecting plate; 18. Mounting hole. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] Example

[0027] This application discloses a die-bonding fixture for an LED die-bonding machine, comprising a fixture body 1, mounting plates 3, and fixing blocks 15. The fixture body 1 has a placement groove 2 on its upper side for holding the chip to be bonded and providing initial positioning. The mounting plates 3 are symmetrically mounted above the fixture body 1, and a spring-loaded mechanism is installed between the bottom of the two sets of mounting plates 3 and the upper side of the fixture body 1. Figures 1-2 As shown, the spring mechanism includes a telescopic rod 4 and a spring 5. The telescopic rod 4 is used to limit the vertical movement trajectory of the mounting plate 3 and prevent deviation. The spring 5 provides elastic restoring force to realize the automatic rebound of the mounting plate 3. The telescopic rod 4 and the spring 5 are both fixedly connected between the mounting plate 3 and the clamp body 1, and there are two sets of them arranged symmetrically. The spring 5 is sleeved on the outside of the telescopic rod 4 to form a composite structure to enhance the stability of movement.

[0028] The mounting plate 3 has a groove 6 on its exterior, and a slider 7 is slidably connected inside the groove 6. The groove 6 provides guidance for the lateral sliding of the slider 7. A connecting plate 8 is fixedly connected between the upper sides of the two sets of sliders 7. The connecting plate 8 is used to synchronize the sliding displacement of the sliders 7 on both sides. A mounting rod 9 is fixedly connected between the lower sides of the two sets of sliders 7. The mounting rod 9 serves as a connecting carrier to support the pressing mechanism below. The pressing mechanism is installed at the bottom of the mounting rod 9. Figure 1 , Figure 3 as well as Figure 4 As shown, the pressing mechanism includes a connecting rod 10 and a positioning strip 11. The connecting rod 10 is fixedly connected to the bottom of the mounting rod 9 and is used to transmit vertical pressure. The positioning strip 11 is fixedly connected to the bottom of the connecting rod 10 and is matched with the placement groove 2. The spacing of the positioning strip 11 is adjusted laterally to adapt to the chip width and clamps the chip edge when pressed down.

[0029] The fixing block 15 is fixedly connected to the outside of the mounting plate 3, serving as the force-bearing connection point of the pull-down mechanism. The pull-down mechanism is installed inside the fixture body 1, such as... Figure 4 as well as Figure 6 As shown, the pull-down mechanism includes a drive motor 12, a rotating rod 13, and a connecting rope 14. The drive motor 12 is fixedly connected inside the clamp body 1 to provide power output. The rotating rod 13 is fixedly connected to the lower side of the drive motor 12, and the rotating rod 13 and the clamp body 1 are rotatably connected to each other to convert the rotation of the motor into the winding action of the connecting rope 14. The connecting rope 14 is fixedly connected to both sides of the rotating rod 13. By winding and contracting, it pulls the fixed block 15 down. A guide cylinder 16 is fixedly connected inside the clamp body 1 to constrain the movement path of the connecting rope 14 and reduce friction loss. The connecting rope 14 passes through the guide cylinder 16 and through the upper side of the clamp body 1 to be fixedly connected to the bottom of the fixed block 15, forming a symmetrical pull-down transmission link.

[0030] like Figures 1-2 As shown, a connecting plate 17 is fixedly connected to the lower side of the fixture body 1. The connecting plate 17 has mounting holes 18 on its outside, which are used to fix it to external equipment by bolts or buckles to ensure the overall installation stability of the fixture.

[0031] The working principle of the LED die bonding machine die bonding fixture based on the embodiment is as follows: When bonding chips, the chip is first placed in the placement slot 2 of the fixture body 1. Then, the distance between the two sets of positioning strips 11 is manually adjusted according to the chip size. By pushing the connecting plate 8, the slider 7 is driven to slide along the slide groove 6 of the mounting plate 3, so that the connecting rod 10 and the positioning strip 11 move laterally to the appropriate position. After the adjustment is completed, the drive motor 12 is started to drive the rotating rod 13 to rotate, and the connecting ropes 14 on both sides are wound. After the connecting ropes 14 are guided by the guide cylinder 16, they pull the fixing block 15 down, forcing the symmetrically arranged mounting plates 3 to move down synchronously. At this time, the spring 5 between the mounting plate 3 and the fixture body 1 is compressed, and the telescopic rod 4 retracts accordingly. The positioning strip 11 at the bottom of the mounting rod 9 is pressed by pressure to tighten the chip, thus completing the stable clamping.

[0032] When a chip of a different size needs to be replaced, the drive motor 12 reverses to release the connecting rope 14. The spring 5, due to its elastic reset, pushes the mounting plate 3 upward, causing the positioning strip 11 to detach from the chip surface. At this time, the distance between the slider 7 and the positioning strip 11 can be readjusted to adapt to the new chip size. Then, it is pulled down again to fix it, forming a fast and adjustable clamping cycle. This structure combines the power drive of the pull-down mechanism with the elastic reset of the spring mechanism to achieve automated control and high-precision adaptability of chip positioning.

[0033] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED die bonder die bonder fixture, characterized in that, include: The fixture body (1) has a placement slot (2) on its upper side; Mounting plates (3) are symmetrically mounted on the upper part of the clamp body (1). A spring mechanism is installed between the bottom of the two sets of mounting plates (3) and the upper side of the clamp body (1). A sliding groove (6) is provided on the outside of the mounting plate (3). A slider (7) is slidably connected inside the sliding groove (6). A connecting plate (8) is fixedly connected between the upper sides of the two sets of sliders (7). A mounting rod (9) is fixedly connected between the lower sides of the two sets of sliders (7). A pressing mechanism is installed at the bottom of the mounting rod (9). A fixing block (15) is fixedly connected to the outside of the mounting plate (3), and a pull-down mechanism is installed inside the clamp body (1).

2. The LED die bonder die bonder fixture of claim 1, wherein: The spring mechanism includes a telescopic rod (4) and a spring (5), both of which are fixedly connected between the mounting plate (3) and the clamp body (1).

3. The LED die bonder die bonder fixture of claim 2, wherein: The telescopic rod (4) and the spring (5) are in two sets and arranged symmetrically, and the spring (5) is sleeved on the outside of the telescopic rod (4).

4. The LED die bonder die bonder fixture of claim 1, wherein: The pressing mechanism includes a connecting rod (10) and a positioning strip (11). The connecting rod (10) is fixedly connected to the bottom of the mounting rod (9), and the positioning strip (11) is fixedly connected to the bottom of the connecting rod (10). The positioning strip (11) matches the placement groove (2).

5. The LED die bonder die bonder fixture of claim 1, wherein: The pull-down mechanism includes a drive motor (12), a rotating rod (13), and a connecting rope (14). The drive motor (12) is fixedly connected to the inside of the clamp body (1). The rotating rod (13) is fixedly connected to the lower side of the drive motor (12), and the rotating rod (13) is rotatably connected to the clamp body (1). The connecting rope (14) is fixedly connected to both sides of the rotating rod (13).

6. The LED die bonder bonder chuck of claim 5, wherein: The clamp body (1) is fixedly connected to the inside of a guide cylinder (16), and the connecting rope (14) passes through the guide cylinder (16) and through the upper side of the clamp body (1) and is fixedly connected to the bottom of the fixing block (15).

7. The LED die bonder bonder chuck of claim 1, wherein: A connecting plate (17) is fixedly connected to the lower side of the fixture body (1), and the connecting plate (17) has mounting holes (18) on its exterior.

Images