Hot press forming die for diode silica gel piece

Abstract

The utility model discloses a hot press forming die for a diode silica gel piece, which comprises an upper die, a lower die and a middle plate, and the middle plate is arranged between the upper die and the lower die. A forming groove is formed in the lower surface of the upper die, a forming protruding block is arranged on the upper surface of the middle plate, the forming protruding block is matched with the forming groove, and the forming protruding block is slightly smaller than the forming groove. A waste discharge hole is further formed in the middle plate, the waste discharge hole penetrates through the middle plate and extends to the surface of the forming convex block, and a positioning groove is formed in the lower surface of the middle plate; the lower die is provided with a positioning boss, the positioning boss is matched with the positioning groove, and the lower portion of the waste discharge hole extends to the upper surface of the positioning boss. Through the design of the upper die, the lower die and the middle plate, hot-press forming of the diode silica gel piece is achieved, meanwhile, due to the design of the waste discharge holes, waste materials and products are not bonded, meanwhile, the waste materials in the waste discharge holes can be easily removed after hot-press forming, and the machining efficiency is improved while the hot-press forming quality is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of hot pressing mold technology, and specifically relates to a hot pressing mold for diode silicone parts. Background Technology

[0002] Common methods for molding diode silicone components include thermoforming, injection molding, and extrusion molding. Thermoforming of diode silicone components (such as silicone encapsulation shells, insulating gaskets, and buffer sealing rings) utilizes the thermosetting properties of silicone material, achieving precise molding through mold pressing. Currently, common thermoforming molds consist of an upper mold and a lower mold, which work together to form a molding cavity for thermoforming. However, during thermoforming, there will inevitably be excess material, making waste removal difficult. Furthermore, waste may adhere to the mold after demolding, requiring dedicated mold cleaning after use. If waste adheres to the product, it may damage the product during demolding, reducing the yield. Utility Model Content

[0003] Purpose of the utility model: In order to overcome the above shortcomings, the purpose of this utility model is to provide a hot pressing mold for diode silicone parts, which ensures effective waste removal and improves product quality.

[0004] Technical solution: To achieve the above objectives, this utility model provides a thermoforming mold for diode silicone parts, comprising:

[0005] The upper mold, the lower mold, and the middle plate are provided, wherein the middle plate is disposed between the upper mold and the lower mold;

[0006] The lower surface of the upper mold is provided with a forming groove, and the upper surface of the middle plate is provided with a forming protrusion. The forming protrusion matches the forming groove and is slightly smaller than the forming groove. The middle plate is also provided with a waste discharge hole, which penetrates the middle plate and extends to the surface of the forming protrusion. The lower surface of the middle plate is provided with a positioning groove. The forming groove and the forming protrusion cooperate to form a cavity. The material is hot-pressed in the cavity to form a product. Excess material will automatically flow into the waste discharge hole and be isolated from the product.

[0007] The lower mold is provided with a positioning boss, which fits into a positioning groove. The lower part of the waste discharge hole extends to the upper surface of the positioning boss. The middle plate and the lower mold are positioned by the positioning boss and positioning groove.

[0008] Furthermore, the forming groove includes a forming cavity, and a frustum forming part is provided in the forming cavity. The frustum forming part is concentrically arranged with the waste discharge hole, and the frustum forming part is a recessed circular groove.

[0009] Furthermore, the center of the frustum forming part has an inverted conical frustum, and the side of the frustum is connected to the frustum forming part by a smooth curve transition.

[0010] Furthermore, one side of the molding cavity along its length is provided with an arc-shaped surface, and the other side is provided with a flat surface. The two sides of the molding cavity along its width are respectively provided with a first arc-shaped groove and a second arc-shaped groove. The arc of the first arc-shaped groove is greater than that of the second arc-shaped groove. The first arc-shaped groove and the second arc-shaped groove are located on both sides of a frustum.

[0011] Furthermore, one side of the forming protrusion along its length is provided with an arc-shaped facade that mates with an arc-shaped surface, and the other side is provided with a flat facade that mates with a plane. The side of the forming protrusion closest to the arc-shaped facade is provided with a stepped forming groove.

[0012] Furthermore, the side of the formed protrusion in the width direction is provided with an arc-shaped protrusion, which is concentric with the first arc-shaped groove.

[0013] Furthermore, the waste discharge hole includes an upper circular hole and a lower conical hole, and the diameter of the bottom of the frustum is equal to the diameter of the top of the waste discharge hole.

[0014] As can be seen from the above technical solution, this utility model has the following beneficial effects:

[0015] This utility model discloses a thermoforming mold for diode silicone parts. Through the design of the upper mold, lower mold and middle plate, the thermoforming of diode silicone parts is realized. At the same time, the design of the waste discharge hole prevents the waste material from sticking to the product. In addition, the waste material in the waste discharge hole can be easily removed after thermoforming, which ensures the quality of thermoforming and improves the processing efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a thermoforming mold for diode silicone parts according to the present invention;

[0017] Figure 2 This is a cross-sectional view of a thermoforming mold for diode silicone parts according to the present invention.

[0018] Figure 3 This is a schematic diagram of the molding groove described in this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the molded protrusion described in this utility model;

[0020] Figure 5 This is a top perspective view of a thermoforming mold for diode silicone parts according to the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the diode silicone component described in this utility model.

[0022] In the picture:

[0023] 1-Upper mold, 11-Forming groove, 111-Forming cavity, 112-Frustum forming part, 113-Frustum, 114-Arc surface, 115-Plane, 116-First arc groove, 117-Second arc groove;

[0024] 2-Lower mold, 21-Positioning boss;

[0025] 3-Middle plate, 31-Forming protrusion, 311-Curved facade, 312-Flat facade, 313-Step forming groove, 314-Curved protrusion, 32-Waste discharge hole. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. Example

[0027] In this embodiment, as Figures 1 to 6 This utility model discloses a hot pressing mold for diode silicone parts, comprising:

[0028] The upper mold 1, the lower mold 2, and the middle plate 3 are provided between the upper mold 1 and the lower mold 2;

[0029] The lower surface of the upper mold 1 is provided with a forming groove 11, and the upper surface of the middle plate 3 is provided with a forming protrusion 31. The forming protrusion 31 matches the forming groove 11 and is slightly smaller than the forming groove 11. The middle plate 3 is also provided with a waste discharge hole 32, which penetrates the middle plate 3 and extends to the surface of the forming protrusion 31. The lower surface of the middle plate 3 is provided with a positioning groove 33.

[0030] The lower mold 2 is provided with a positioning boss 21, which fits into the positioning groove 33, and the lower part of the waste discharge hole 32 extends to the upper surface of the positioning boss 21.

[0031] The molding groove 11 includes a molding cavity 111, within which a frustum molding part 112 is provided. The frustum molding part 112 is concentrically arranged with the waste discharge hole 32, and the frustum molding part 112 is an inwardly recessed circular groove. The frustum molding part 112 cooperates with the molding protrusion 31 on the middle plate 3 to form the frustum of the diode silicone part.

[0032] Specifically, the frustum forming part 112 has a raised, inverted conical frustum 113 at its center, and the side of the frustum 113 is connected to the frustum forming part 112 by a smooth curve transition. After the diode silicone part is formed, a tapered hole is formed at the center of the frustum 113.

[0033] Specifically, the molding cavity 111 has an arc-shaped surface 114 on one side along its length and a flat surface 115 on the other side. The molding cavity 111 has a first arc-shaped groove 116 and a second arc-shaped groove 117 on both sides along its width. The arc of the first arc-shaped groove 116 is greater than that of the second arc-shaped groove 117. The first arc-shaped groove 116 and the second arc-shaped groove 117 are located on both sides of the frustum 113.

[0034] The molding protrusion 31 has an arc-shaped vertical surface 311 on one side along its length, which mates with an arc-shaped surface 114. The other side has a flat vertical surface 312, which mates with a plane 115. A stepped molding groove 313 is provided on the side of the molding protrusion 31 closest to the arc-shaped vertical surface 311. The arc-shaped surface 114 and the arc-shaped vertical surface 311 mate to form an arc-shaped opening on the side of the diode silicone component. The flat vertical surface 312 and the plane 113 mate to form a flat opening on the other side of the diode silicone component. A first arc-shaped groove 116 and a second arc-shaped groove 117 form two arc-shaped grooves of different sizes on the inner side of the diode silicone component. The stepped molding groove 313 forms a step on the diode silicone component.

[0035] Specifically, the side of the molded protrusion 31 in the width direction is provided with an arc-shaped protrusion 314, which is concentric with the first arc-shaped groove 116. The arc-shaped protrusion 314 forms an arc-shaped groove on the outside of the diode silicone component.

[0036] Specifically, the waste discharge hole 32 includes an upper circular hole and a lower conical hole, and the bottom diameter of the frustum 113 is equal to the top diameter of the waste discharge hole 32. During hot pressing, the material changes from a solid to a liquid state, and excess material flows into the waste discharge hole 32.

[0037] Furthermore, in this embodiment, such as Figure 5 As shown, multiple forming protrusions 31 are arranged on the middle plate 3, and the same number of forming grooves 11 are provided on the upper mold 1. Multiple workpieces can be formed in one hot pressing, which is beneficial to improving processing efficiency.

[0038] In addition, in this embodiment, the side of the middle plate 3 is provided with a positioning arc-shaped groove, and the inner side of the lower mold 2 is provided with a positioning arc-shaped protrusion that cooperates with the positioning arc-shaped groove. The two work together to achieve the positioning and guiding of the middle plate 3 and the lower mold 2.

[0039] The working principle of the above embodiments is as follows:

[0040] This utility model discloses a hot-press molding die for diode silicone parts. In use, the cut silicone raw material is placed into the molding cavity 31; the middle plate 3 is connected and installed with the lower mold 2; the upper mold 1 is pressed down, and the molding groove 11 is connected with the molding protrusion 31. The silicone material is transformed into a fluid in the mold. When the upper mold 1 is pressed down, the excess material will flow into the waste discharge hole 32. As the upper mold 1 is pressed down to the end, the frustum 113 in the molding groove 11 seals the top of the waste discharge hole 32, thereby achieving isolation between waste and product; after the product is formed, the mold is opened, and the waste is left separately in the waste discharge hole 32. It is only necessary to tear off the cooled waste from the lower part of the larger diameter waste discharge hole 32.

[0041] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements can be made without departing from the principle of the present utility model, and these improvements should also be considered within the protection scope of the present utility model.

Claims

1. A thermoforming mold for diode silicone parts, characterized in that: include: The upper mold (1), the lower mold (2) and the middle plate (3) are provided between the upper mold (1) and the lower mold (2); The lower surface of the upper mold (1) is provided with a forming groove (11), and the upper surface of the middle plate (3) is provided with a forming protrusion (31). The forming protrusion (31) matches the forming groove (11) and the forming protrusion (31) is slightly smaller than the forming groove (11). The middle plate (3) is also provided with a waste discharge hole (32). The waste discharge hole (32) is provided through the middle plate (3) and extends to the surface of the forming protrusion (31). The lower surface of the middle plate (3) is provided with a positioning groove (33). The lower mold (2) is provided with a positioning boss (21), which fits into the positioning groove (33), and the lower part of the waste discharge hole (32) extends to the upper surface of the positioning boss (21).

2. The hot pressing mold for diode silicone parts according to claim 1, characterized in that: The forming groove (11) includes a forming cavity (111), and a frustum forming part (112) is provided in the forming cavity (111). The frustum forming part (112) is concentrically arranged with the waste discharge hole (32). The frustum forming part (112) is a recessed circular groove.

3. The hot pressing mold for diode silicone parts according to claim 2, characterized in that: The center of the truncated cone-shaped part (112) is raised with an inverted cone-shaped truncated cone (113), and the side of the truncated cone (113) is connected to the truncated cone-shaped part (112) by a smooth curve transition.

4. A hot pressing mold for diode silicone parts according to claim 3, characterized in that: The molding cavity (111) has an arc-shaped surface (114) on one side of its length direction and a plane (115) on the other side. The molding cavity (111) has a first arc-shaped groove (116) and a second arc-shaped groove (117) on both sides of its width direction. The arc of the first arc-shaped groove (116) is greater than that of the second arc-shaped groove (117). The first arc-shaped groove (116) and the second arc-shaped groove (117) are located on both sides of the frustum (113).

5. A hot pressing mold for diode silicone parts according to claim 4, characterized in that: The forming protrusion (31) has an arc-shaped facade (311) on one side along its length, which is in conjunction with the arc-shaped surface (114). The other side has a flat facade (312), which is in conjunction with the plane (115). The forming protrusion (31) has a stepped forming groove (313) on the side of the arc-shaped facade (311) close to the forming protrusion (311).

6. A thermoforming mold for diode silicone parts according to claim 5, characterized in that: The side of the forming protrusion (31) in the width direction is provided with an arc-shaped protrusion (314), and the arc-shaped protrusion (314) is concentric with the first arc-shaped groove (116).

7. A hot pressing mold for diode silicone parts according to claim 6, characterized in that: The waste discharge hole (32) includes an upper circular hole and a lower conical hole, and the bottom diameter of the frustum (113) is equal to the top diameter of the waste discharge hole (32).

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