Phase change heat conduction and heat dissipation adhesive tape

Abstract

The utility model discloses a phase-change heat-conducting heat-dissipating adhesive tape which comprises a first heat-conducting double-faced adhesive tape, a metal foil layer, a second heat-conducting double-faced adhesive tape, a heat-conducting phase-change sheet bonded with one adhesive surface of the first heat-conducting double-faced adhesive tape, and a heat-conducting gasket of which one side is bonded with the other adhesive surface of the first heat-conducting double-faced adhesive tape, one adhesive surface of the second heat-conducting double-faced adhesive tape is adhered to the other side of the heat-conducting gasket, and the metal foil layer is adhered to the other adhesive surface of the second heat-conducting double-faced adhesive tape. The electronic product has the advantages that an efficient heat dissipation path is formed through phase-change heat storage of the heat-conducting phase-change material, low-resistance heat conduction of the first heat-conducting double-faced adhesive tape and the second heat-conducting double-faced adhesive tape, soaking and heat diffusion of the heat-conducting gasket and efficient heat radiation of the metal foil, the temperature of a heating source can be remarkably reduced, and the heat dissipation efficiency of the electronic product is improved. The material layers are tightly attached, the overall structure is compact, and the packaging structure is suitable for electronic products with limited internal spaces and does not occupy too much precious internal spaces of the electronic products.

Description

Technical Field

[0001] This utility model relates to the field of adhesive tape, specifically a phase change thermally conductive and heat-dissipating adhesive tape. Background Technology

[0002] As electronic devices continue to strive for thinner and lighter designs, their internal spaces are becoming increasingly compact, highlighting the drawbacks of traditional heat dissipation methods. Take mobile phones as an example: their internal space is already limited, and using large heat dissipation devices would not only occupy valuable space but also increase the device's weight. However, existing small thermal tapes often use a combination of graphite layers, metal foil layers, and thermally conductive silicone for heat dissipation. Without an additional heat source, this not only fails to efficiently dissipate heat but also presents the following problems: After prolonged contact with the product, traditional silicone tape may experience a pumping effect due to prolonged heating, increasing interfacial thermal resistance and reducing heat dissipation efficiency; even after the tape is bonded to the product, air bubbles or gaps may remain between the tape and the product, causing fluctuations in thermal resistance and affecting heat dissipation.

[0003] Therefore, it is necessary to provide a phase change thermal conductive heat dissipation tape. Summary of the Invention

[0004] This utility model provides a phase change thermal conductive heat dissipation tape, which effectively solves the problem of poor heat dissipation performance of existing tapes.

[0005] The technical solution adopted in this utility model is:

[0006] A phase change thermally conductive and heat dissipating tape includes a first thermally conductive double-sided adhesive, a metal foil layer, a second thermally conductive double-sided adhesive, a thermally conductive phase change sheet bonded to one side of the first thermally conductive double-sided adhesive, and a thermally conductive pad bonded to the other side of the first thermally conductive double-sided adhesive on one side. One side of the second thermally conductive double-sided adhesive is bonded to the other side of the thermally conductive pad, and the metal foil layer is bonded to the other side of the second thermally conductive double-sided adhesive.

[0007] Furthermore, both the No. 1 and No. 2 thermally conductive double-sided adhesives are acrylic thermally conductive double-sided adhesives.

[0008] Furthermore, the thermally conductive pad is an insulating graphene pad.

[0009] Furthermore, the thermally conductive pad is an organosilicon rubber pad.

[0010] Furthermore, the metal foil layer is copper foil.

[0011] The beneficial effects of this utility model are as follows: By utilizing the phase change heat storage of the thermally conductive phase change material, the low-resistance thermal conduction of the first thermally conductive double-sided adhesive and the second thermally conductive material, the heat dissipation and expansion of the thermally conductive pad, and the efficient thermal radiation of the metal foil, a highly efficient heat dissipation path is formed, which can significantly reduce the temperature of the heat source and improve the heat dissipation efficiency of electronic products. Furthermore, the material layers are tightly bonded, resulting in a compact overall structure, suitable for electronic products with limited internal space, without excessively occupying valuable internal space. Attached Figure Description

[0012] Figure 1 This is an overall schematic diagram of the phase change thermal conductive heat dissipation tape provided in an embodiment of this application.

[0013] The markings in the diagram are: 1. Thermally conductive double-sided adhesive tape No. 1; 2. Thermally conductive double-sided adhesive tape No. 2; 3. Thermally conductive phase change sheet; 4. Thermally conductive pad; 5. Metal foil layer; Detailed Implementation

[0014] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0015] like Figure 1 As shown, the embodiment provided in this application is a phase change thermally conductive and heat dissipating tape, the structure of which includes a first thermally conductive double-sided adhesive 1, a metal foil layer 5, a second thermally conductive double-sided adhesive 2, a thermally conductive phase change sheet 3 bonded to one adhesive side of the first thermally conductive double-sided adhesive 1, and a thermally conductive pad 4 bonded to the other adhesive side of the first thermally conductive double-sided adhesive 1 on one side. One adhesive side of the second thermally conductive double-sided adhesive 2 is bonded to the other side of the thermally conductive pad 4, and the metal foil layer 5 is bonded to the other adhesive side of the second thermally conductive double-sided adhesive 2.

[0016] It should be noted that the parameters of each material, such as the melting point of the thermally conductive phase change material and the thickness of the thermally conductive pad 4, can be flexibly adjusted according to the heating characteristics and usage environment of different electronic products, demonstrating strong adaptability. Thermally conductive phase change material is a known material that changes its form with temperature and can provide latent heat. The process by which a phase change material changes from a solid to a liquid state or from a liquid to a solid state is called a phase change process, during which the phase change material absorbs or releases a large amount of latent heat. The phase change material in this application refers to a material that changes from a solid state to a liquid state upon heating.

[0017] In practical use, the thermally conductive phase change sheet 3 is brought into direct contact with the heat source of the electronic product using its own adhesive properties. The metal foil should be positioned close to the electronic product casing to facilitate heat dissipation without affecting the normal installation and operation of other components. During application, the thermally conductive phase change sheet 3 is tightly adhered to the surface of the heat source, ensuring that the heat generated by the heat source can be quickly transferred to the copper foil through the thermally conductive phase change sheet 3, the first thermally conductive double-sided adhesive 1, the thermally conductive pad 4, and the second double-sided adhesive, and then diffused to the electronic product casing via the copper foil. When the temperature of the heat source rises and reaches the melting point of the thermally conductive phase change material, it undergoes a phase change, changing from a solid to a liquid state, absorbing and storing a large amount of heat, thereby effectively reducing the rate of temperature rise of the heat source. Furthermore, the liquid state can automatically fill the gaps between the tape and the product, maximizing the contact area between the tape and the product and improving the heat dissipation effect. After the heat source temperature decreases, the thermally conductive phase change material changes from liquid to solid, releasing the stored heat. Although the thermally conductive phase change sheet 3 softens, it does not flow excessively (unlike the overflow of silicone grease) and can remain in place even after long-term use. The thermally conductive pad 4 is located between the first thermally conductive double-sided adhesive 1 and the second thermally conductive double-sided adhesive 2, further expanding the heat dissipation area. The thermally conductive pad 4 has high thermal conductivity, which can quickly and evenly disperse the heat from the thermally conductive phase change material, increase the contact area with the copper foil, and improve heat transfer efficiency. The metal foil layer 5, as the outermost layer of the heat dissipation structure, has excellent thermal conductivity and thermal radiation performance. It receives the heat transferred from the thermally conductive pad 4 and transfers the heat to the external environment in the form of thermal radiation. The first thermally conductive double-sided adhesive 1 and the second thermally conductive double-sided adhesive 2 not only provide a strong adhesive effect, ensuring a tight connection between the components, but also have good thermal conductivity, which can efficiently transfer heat and reduce thermal resistance.

[0018] In the above design, a highly efficient heat dissipation path is formed through the phase change heat storage of the thermally conductive phase change material, the low-resistance thermal conduction of the first thermally conductive double-sided adhesive 1 and the second thermally conductive adhesive, the heat dissipation and expansion of the thermally conductive pad 4, and the efficient thermal radiation of the metal foil. This significantly reduces the temperature of the heat source and improves the heat dissipation efficiency of electronic products. Furthermore, the material layers are tightly bonded, resulting in a compact overall structure suitable for electronic products with limited internal space, without excessively occupying valuable internal space.

[0019] Specifically: Both the No. 1 thermally conductive double-sided adhesive 1 and the No. 2 thermally conductive double-sided adhesive 2 are acrylic thermally conductive double-sided adhesives.

[0020] In the above design, the temperature resistance range of the acrylic adhesive is -40 to 120℃. At the same time, the acrylic adhesive has good adhesion. Using acrylic thermally conductive double-sided tape can effectively ensure the thermal conductivity of thermally conductive double-sided tape 1 and thermally conductive double-sided tape 2 as well as the bonding effect on adjacent parts.

[0021] Specifically: the thermally conductive pad 4 is an insulating graphene pad.

[0022] Specifically: the thermally conductive pad 4 is an organosilicon rubber pad.

[0023] Specifically, the metal foil layer 5 is a copper foil.

[0024] In the above design, copper foil is easy to process, possessing both strength and good flexibility, allowing the entire heat dissipation tape of this application to be flexibly laid out inside electronic products.

[0025] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A phase change thermally conductive and heat-dissipating tape, characterized in that: It includes a first thermally conductive double-sided adhesive (1), a metal foil layer (5), a second thermally conductive double-sided adhesive (2), a thermally conductive phase change sheet (3) bonded to one side of the first thermally conductive double-sided adhesive (1), and a thermally conductive pad (4) bonded to the other side of the first thermally conductive double-sided adhesive (1). One side of the second thermally conductive double-sided adhesive (2) is bonded to the other side of the thermally conductive pad (4), and the metal foil layer (5) is bonded to the other side of the second thermally conductive double-sided adhesive (2).

2. The phase change thermally conductive and heat-dissipating tape according to claim 1, characterized in that: Both the No. 1 thermally conductive double-sided adhesive (1) and the No. 2 thermally conductive double-sided adhesive (2) are acrylic thermally conductive double-sided adhesives.

3. The phase change thermally conductive and heat-dissipating tape according to claim 1, characterized in that: The thermally conductive pad (4) is an insulating graphene pad.

4. The phase change thermally conductive and heat-dissipating tape according to claim 1, characterized in that: The thermally conductive pad (4) is an organosilicon rubber pad.

5. The phase change thermally conductive and heat-dissipating tape according to claim 1, characterized in that: The metal foil layer (5) is copper foil.

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