Radiator structure for light source plate

Abstract

The utility model relates to the technical field of radiators, in particular to a radiator structure for a light source plate, which comprises a mainboard. One side of the main board is connected with a light source board, and the other side of the main board is provided with radiating fins; each heat dissipation fin comprises a supporting column structure; the light source plate is mounted on the main board, and a plurality of radiating fins are arranged on the main board; the mainboard and the radiating fins are made of 1060 pure aluminum, so that the heat conductivity coefficient is high, the radiating effect is excellent, and the light source plate can be effectively radiated; the heat dissipation fins comprise supporting column structures, the structural strength of the heat dissipation fins is improved through the supporting column structures, the heat dissipation fins can bear a certain load, and the situation that the heat dissipation fins are prone to bending deformation due to external force is avoided.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for light source modules, specifically, to a heat sink structure for a light source board. Background Technology

[0002] In automotive lighting design, heat dissipation design for high-power LED chips is crucial, as relying solely on the light source board is insufficient to meet heat dissipation requirements. Overheating can reduce luminous efficiency and lifespan, and even cause burning. To address this, a heat sink structure is typically added for auxiliary heat dissipation. The heat generated by the light source is transferred from the light source board to the heat sink, which then transfers the heat to the air. Heat sinks are generally made of aluminum, but the material selection varies depending on the molding process. Commonly used materials include ADC (Aluminum Die Casting Alloy) 12, 6063, and 1060. Among these, 1060 aluminum has the highest thermal conductivity and best heat dissipation performance. 1060 aluminum heat sinks are made of pure aluminum with a hardness of approximately 26HB, making them relatively soft. In practical applications, during storage, transportation, and assembly, the vertical or wavy heat sink fins are prone to deformation due to their thin walls. Deformation reduces heat dissipation efficiency and makes the shape uncontrollable, leading to customer complaints.

[0003] The applicant discovered through a search that Chinese patent document with application number 202221035317.5 disclosed a module heat sink structure for improving heat dissipation efficiency on August 5, 2022. The structure includes a heat-conducting plate and several heat dissipation fins vertically disposed on the heat-conducting plate. The heat dissipation fins are arranged at intervals in a direction perpendicular to the airflow. Each heat dissipation fin contains several fins, and the fins are arranged at intervals in the direction of the airflow. The fins are plate structures with an S-shaped cross-section. This device also fails to solve the aforementioned technical problem.

[0004] Therefore, in order to improve or solve at least one of the above problems, it is necessary to provide a heat sink structure for a light source board that can strengthen the structure of the heat dissipation fins and prevent them from being easily deformed by stress. Utility Model Content

[0005] The purpose of this utility model is to provide a heat sink structure for a light source board that can strengthen the structure of the heat sink fins and prevent them from being easily deformed by stress.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a heat sink structure for a light source board, including a main board; a light source board is connected to one side of the main board, and heat dissipation fins are provided on the other side of the main board; the heat dissipation fins include a support column structure.

[0007] The support column structure includes a support column; the support column is connected to the side of the motherboard.

[0008] The heat dissipation fins include a first heat dissipation fin; the first heat dissipation fins include a first support column; the first support column is provided with an upper fin and a lower fin.

[0009] Both the upper and lower fins have arc-shaped cross sections; the upper fin, lower fin, and first support column are an integral structure; the upper and lower fins are arranged in a 180° rotational symmetry with respect to the central axis of the first support column.

[0010] The heat dissipation fins include a second heat dissipation fin; the second heat dissipation fins include a second support column; an auxiliary rib is provided on one side of the second support column; the second support column and the auxiliary rib are an integral structure.

[0011] The motherboard includes an outer edge; the second heat dissipation fin is disposed along the outer edge.

[0012] The motherboard has a positioning post and a screw hole on the side near the light source board; the light source board has a positioning hole, and the positioning post is located in the positioning hole; a screw is connected to the light source board; the screw is connected to the screw hole.

[0013] The motherboard is made of 1060 pure aluminum plate; the heat sink is made of 1060 pure aluminum heat sink.

[0014] The beneficial effects of this utility model are as follows:

[0015] In this invention, the light source board is mounted on the main board, which has multiple heat dissipation fins. Both the main board and the heat dissipation fins are made of 1060 pure aluminum, which has a high thermal conductivity and excellent heat dissipation effect, effectively dissipating heat from the light source board. The heat dissipation fins include a support column structure, which improves the structural strength of the heat dissipation fins, enabling them to withstand a certain load and preventing the heat dissipation fins from easily bending and deforming under external forces.

[0016] The heat dissipation fins include a first heat dissipation fin, which is a spiral heat dissipation fin with a large contact area with the air. Under the same weight, it has a larger heat dissipation volume and better heat dissipation effect compared with the existing cylindrical heat dissipation fins. At the same time, the first heat dissipation fin includes a first support column, an upper fin, and a lower fin. The first support column effectively improves the overall structural strength of the first heat dissipation fin. Combined with the spiral bending characteristics of the upper and lower fins, it ensures support in all directions. Compared with the existing ribbed heat dissipation fins, wave-shaped heat dissipation fins, and cylindrical heat dissipation fins, the strength is improved and it is not easy to bend and deform under external forces.

[0017] The heat dissipation fins include second heat dissipation fins. Multiple second heat dissipation fins are located on the outer ring of the radiator in areas easily touched by hands. The second heat dissipation fins include second support columns and auxiliary ribs, which can solve the problems of scratching and pricking hands while ensuring the overall structural strength of the second heat dissipation fins. Attached Figure Description

[0018] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein:

[0019] Figure 1 This is a schematic diagram of the working state of this utility model.

[0020] Figure 2 This is a schematic diagram of the motherboard structure of this utility model.

[0021] Figure 3 This is a schematic diagram of the heat dissipation fins of this utility model.

[0022] Figure 4 This is a schematic diagram of the structure of the first heat dissipation fin of this utility model.

[0023] The markings in the above figures are all:

[0024] The diagram is marked as follows:

[0025] 1. Motherboard

[0026] 2. Light source board,

[0027] 3. Heat dissipation fins

[0028] 4. Support columns,

[0029] 5. Outer edge,

[0030] 6. First heat dissipation fin; 601. First support column; 602. Upper fin; 603. Lower fin.

[0031] 7. Second heat dissipation fin; 701. Second support column; 702. Auxiliary rib;

[0032] 8. Positioning pin; 801. Positioning hole.

[0033] 9. Screw hole; 901. Screw. Detailed Implementation

[0034] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of this utility model, and to facilitate its implementation.

[0035] Figure 1-4The heat sink structure for the light source board shown includes a main board 1; a light source board 2 is connected to one side of the main board 1, and a heat sink 3 is provided on the other side of the main board 1; the heat sink 3 includes a support column structure.

[0036] The light source board 2 is mounted on the motherboard 1, which has multiple heat dissipation fins 3. Both the motherboard 1 and the heat dissipation fins 3 are made of 1060 pure aluminum, which has a high thermal conductivity and excellent heat dissipation effect, and can effectively dissipate heat from the light source board 2. The heat dissipation fins 3 include a support column structure, which improves the structural strength of the heat dissipation fins 3, enabling them to withstand a certain load and preventing the heat dissipation fins 3 from being easily bent and deformed by external forces.

[0037] The support column structure includes support column 4; support column 4 is connected to the side of motherboard 1.

[0038] The motherboard 1 is a cold-forged flat plate; the motherboard 1 has a high degree of flatness; the wall thickness of the motherboard 1 is greater than or equal to 4.3mm; multiple heat dissipation fins 3 are provided on the motherboard 1, and the heat dissipation fins 3 and the motherboard 1 are an integral structure; the support column 4 is a cylindrical structure and is an integral structure with the motherboard 1.

[0039] The heat dissipation fin 3 includes a first heat dissipation fin 6; the first heat dissipation fin 6 includes a first support column 601; the first support column 601 is provided with an upper fin 602 and a lower fin 603.

[0040] The first heat dissipation fin 6 is a spiral-shaped heat dissipation fin; the first support column 601, the upper fin 602 and the lower fin 603 are an integral structure, and the first support column 601, the upper fin 602 and the lower fin 603 are all integral structures with the main board 1; the main board 1 is provided with multiple first heat dissipation fins 6.

[0041] Both the upper fin 602 and the lower fin 603 have arc-shaped cross sections; the upper fin 602, the lower fin 603 and the first support column 601 are an integral structure; the upper fin 602 and the lower fin 603 are arranged in a 180° rotational symmetry with the central axis of the first support column 601 as the center.

[0042] Both the upper fin 602 and the lower fin 603 are thin sheets with a circular arc cross-section; the wall thickness of the upper fin 602 and the lower fin 603 is 1mm; the upper fin 602 and the lower fin 603, together with the first support column 601, form a complete fin. This shape has bends in all directions, which can better bear external forces in all directions, ensuring strength, while increasing the contact area with air and ensuring heat dissipation.

[0043] The heat dissipation fin 3 includes a second heat dissipation fin 7; the second heat dissipation fin 7 includes a second support column 701; an auxiliary rib 702 is provided on one side of the second support column 701; the second support column 701 and the auxiliary rib 702 are an integral structure.

[0044] The second support column 701 is a cylindrical structure, and the auxiliary rib 702 is a reinforcing rib with an arc-shaped cross section; the second support column 701 and the auxiliary rib 702 are an integral structure; the second support column 701 and the auxiliary rib 702 are both integral structures with the main board 1; the main board 1 is provided with multiple second heat dissipation fins 7.

[0045] The motherboard 1 includes an outer edge 5; the second heat sink 7 is arranged along the outer edge 5.

[0046] The outer ring fins of the radiator are easily touched by hands during assembly. The second heat dissipation fin 7 dissipates heat through the second support column 701. When the second support column 701 is cut, the cut is flat and there are no sharp corners, which can improve the problem of pricking or scratching hands. At the same time, the second support column 701, which is located on the outer ring of the radiator, is easily deformed by the external normal force. In the direction of force on the inner side of the second support column 701, an auxiliary rib 702 is designed to strengthen the structural strength of the second support column 701.

[0047] The main board 1 has a positioning post 8 and a screw hole 9 on the side near the light source board 2; the light source board 2 has a positioning hole 801, and the positioning post 8 is located in the positioning hole 801; a screw 901 is connected to the light source board 2; the screw 901 is connected to the screw hole 9.

[0048] At least two positioning pins 8 are fixedly connected to the side of the motherboard 1. The positioning pins 8 are inserted into the positioning holes 801 on the light source board 2, which can realize the positioning operation of the light source board 2 on the motherboard 1. The screw hole 9 is a threaded hole, and the screw 901 is threaded, so the screw 901 fixes the light source board 2 to the motherboard 1, realizing a stable connection between the light source board 2 and the motherboard 1.

[0049] Mainboard 1 is made of 1060 pure aluminum plate; heat sink 3 is made of 1060 pure aluminum heat sink.

[0050] 1060 pure aluminum plate has a high thermal conductivity and excellent heat dissipation effect.

[0051] The specific workflow of this utility model is as follows:

[0052] The positioning pin 8 on the motherboard 1 is inserted into the positioning hole 801 on the light source board 2 to achieve the positioning of the motherboard 1. The light source board 2 is fixedly connected to the motherboard 1 by screws 901. The heat of the light source board 2 is transferred to the motherboard 1, and the motherboard 1 dissipates heat through multiple first heat dissipation fins 6 and second heat dissipation fins 7.

[0053] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A heat sink structure for a light source board, characterized in that: It includes a motherboard (1); a light source board (2) is connected to one side of the motherboard (1), and a heat dissipation fin (3) is provided on the other side of the motherboard (1); the heat dissipation fin (3) includes a support column structure.

2. The heat sink structure for a light source board according to claim 1, characterized in that: The support column structure includes a support column (4); the support column (4) is connected to the side of the main board (1).

3. A heat sink structure for a light source board according to claim 2, characterized in that: The heat dissipation fin (3) includes a first heat dissipation fin (6); the first heat dissipation fin (6) includes a first support column (601); the first support column (601) is provided with an upper fin (602) and a lower fin (603).

4. A heat sink structure for a light source board according to claim 3, characterized in that: The cross-sections of the upper fin (602) and the lower fin (603) are both arc-shaped; the upper fin (602), the lower fin (603) and the first support column (601) are an integral structure; the upper fin (602) and the lower fin (603) are arranged in a 180° rotational symmetry with the central axis of the first support column (601) as the center.

5. A heat sink structure for a light source board according to any one of claims 3-4, characterized in that: The heat dissipation fin (3) includes a second heat dissipation fin (7); the second heat dissipation fin (7) includes a second support column (701); an auxiliary rib (702) is provided on one side of the second support column (701); the second support column (701) and the auxiliary rib (702) are an integral structure.

6. A heat sink structure for a light source board according to claim 5, characterized in that: The motherboard (1) includes an outer edge (5); the second heat dissipation fin (7) is disposed along the outer edge (5).

7. A heat sink structure for a light source board according to claim 6, characterized in that: The main board (1) is provided with a positioning post (8) and a screw hole (9) on the side near the light source board (2); the light source board (2) is provided with a positioning hole (801), and the positioning post (8) is located in the positioning hole (801); a screw (901) is connected to the light source board (2); the screw (901) is connected to the screw hole (9).

8. A heat sink structure for a light source board according to any one of claims 6-7, characterized in that: The motherboard (1) is a 1060 pure aluminum plate; the heat dissipation fins (3) are 1060 pure aluminum heat dissipation fins.

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