Flexible circuit board sensitivity testing device
By designing a sensitivity testing device for flexible circuit boards, and utilizing the lifting and lowering movements of the top plate assembly, carrier plate assembly, and top assembly, the problem of inflexibility in existing testing equipment is solved, achieving efficient and low-cost sensitivity testing of flexible circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- OAT (HANGZHOU) INTELLIGENT MFG CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-04-28
AI Technical Summary
Existing technologies lack flexible and targeted equipment for testing the sensitivity of flexible circuit boards, resulting in low testing efficiency, inconvenient equipment switching, and increased testing costs.
A sensitivity testing device for flexible circuit boards was designed, including a top plate assembly, a carrier plate assembly, and an upper top assembly. The flexible positioning and testing of the flexible circuit board are achieved through the mutual lifting and lowering movement of these components. The test module and the carrier plate assembly are set separately for quick replacement and adjustment.
It achieves flexibility and specificity in sensitivity testing of flexible circuit boards, improves testing efficiency, reduces costs, and has a simple structure.
Smart Images
Figure CN224176686U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a flexible circuit board sensitivity testing device. Background Technology
[0002] The demand for testing flexible printed circuit boards (FPCs) is increasing rapidly, with numerous testing types and environments, particularly in 5G communications, computers, mobile phones, and wearable electronic devices. As these fields increasingly require high-precision, miniaturized testing technologies, traditional large-module designs are showing their limitations in terms of cost, space utilization, and flexibility. Especially in semiconductor manufacturing, new energy battery testing, and high-precision electronic component testing, achieving efficient and accurate testing at the microscale has become crucial for technological breakthroughs.
[0003] For sensitivity testing of flexible circuit boards, if traditional large-module equipment is used, it will lead to low testing efficiency, inflexibility, and inconvenient equipment switching. This is because large-module equipment can not only test sensitivity but also includes many other testing function modules to realize various CIT / FCT test items. However, if a small number of individual items need to be tested, such as testing the sensitivity of flexible circuit boards alone, using large-module equipment will lead to low testing efficiency, inflexibility, and inconvenient equipment switching. It will also occupy the use of large-module equipment and reduce the original working time and efficiency of large-module equipment.
[0004] Therefore, there is a lack of equipment in the current technology that can be used to test the sensitivity of flexible circuit boards in a targeted and flexible manner. Summary of the Invention
[0005] To address the aforementioned problems, the present invention aims to provide a flexible circuit board sensitivity testing device, which can solve the problem of the lack of targeted and flexible equipment for testing the sensitivity of flexible circuit boards in the prior art.
[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:
[0007] A flexible circuit board sensitivity testing device, comprising:
[0008] The roof assembly includes a roof and a positioning and clamping block disposed on the roof;
[0009] A carrier assembly, the carrier assembly including a carrier plate, the carrier plate being used to support and place a flexible circuit board to be tested;
[0010] The top-mounting assembly includes a mounting frame, a top-mounting mechanism, a testing module, and a horn device. The testing module and the top-mounting mechanism are mounted on the mounting frame, and the horn device is mounted on the top-mounting mechanism.
[0011] The top plate assembly is fixedly installed, the top mounting assembly is movable and height-adjustable below the top plate assembly, and the carrier plate assembly is movable and height-adjustable between the top plate assembly and the top mounting assembly. The top mounting assembly can be pushed upward to contact and engage with the carrier plate assembly, and drive the carrier plate assembly upward together to contact and engage with the top plate assembly, so that the positioning and clamping block presses the flexible circuit board to be tested on the carrier plate. The top mounting mechanism can also be pushed upward to make the sound-emitting end of the speaker device contact and adhere to the flexible circuit board to be tested. The test module can rise with the top mounting assembly and be electrically connected to the flexible circuit board to be tested placed on the carrier plate.
[0012] In one feasible embodiment, the test module includes a mounting base, a first driving member, and a spring pin module. The mounting base is fixedly mounted on the mounting frame. One end of the first driving member is fixedly mounted on the mounting base, and the other end is provided with the spring pin module. The first driving member can drive the spring pin module to move up and down to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate.
[0013] In one feasible embodiment, the carrier plate assembly is provided with at least one first guide hole, and the spring pin module is provided with at least one first guide shaft corresponding to the first guide hole. The first guide shaft is inserted into the first guide hole to form a positioning when the spring pin module rises.
[0014] In one feasible embodiment, the carrier plate assembly is further provided with at least one second guide hole, and the spring pin module is provided with at least one second guide shaft corresponding to the second guide hole. The second guide shaft is inserted into the second guide hole to form a positioning when the spring pin module rises. The second guide hole is different from the first guide hole in terms of position and diameter, and the second guide shaft is different from the first guide shaft in terms of position and diameter.
[0015] In one feasible embodiment, the carrier assembly further includes a positioning block disposed on the carrier, the positioning block having a positioning structure for positioning the flexible circuit board to be tested, the positioning block having a first guide hole and a second guide hole, and the positioning block having a through hole for the probe of the spring pin module to pass through.
[0016] In one possible embodiment, the top panel assembly further includes a first buffer member disposed on the top panel and oriented toward the carrier assembly.
[0017] In one feasible embodiment, the carrier plate is provided with at least one third guide hole, and the upper push assembly is provided with at least one third guide shaft corresponding to the third guide hole. When the upper push assembly is pushed up, the third guide shaft is inserted into the third guide hole to form a positioning.
[0018] In one feasible embodiment, the carrier plate is provided with at least one fourth guide hole, and the top plate is provided with at least one fourth guide shaft corresponding to the fourth guide hole. The fourth guide shaft is inserted into the fourth guide hole to form a positioning when the top assembly and the carrier plate assembly are pushed up.
[0019] In one feasible embodiment, the top-mounting mechanism includes a second driving member, a first support plate, a second support plate, and a second buffer member. The second driving member is fixedly mounted on the mounting frame. The first support plate is mounted at the output end of the second driving member. The second support plate is connected to the first support plate via a guide rod. The second buffer member is disposed between the first support plate and the second support plate. The horn device is disposed on the second support plate.
[0020] In one feasible embodiment, a pressure sensor is disposed between the horn device and the second support plate.
[0021] By adopting the above technical solution, this utility model has at least the following beneficial effects:
[0022] The flexible circuit board sensitivity testing device provided by this utility model features a three-part structure consisting of a top plate assembly, a carrier plate assembly, and an upper top assembly, which move relative to each other in a lifting and lowering motion. This allows for flexible loading and unloading of the flexible circuit board to be tested and the testing process itself. The carrier plate assembly holds the flexible circuit board to be tested, while the upper top assembly houses a speaker device simulating the testing environment and a testing module providing testing functions. Each major component is designed to be easily interchangeable and adjustable for different products, such as by switching between different carrier plate assemblies for different products, resulting in a flexible layout. Furthermore, this testing device can meet the specific needs of flexible circuit board sensitivity testing, and its simple structure and low cost make it suitable for such applications. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the flexible circuit board sensitivity testing device provided in this embodiment of the utility model;
[0024] Figure 2 This is a schematic diagram of the structure of the test module provided in this embodiment of the utility model;
[0025] Figure 3 This is a schematic diagram of the structure of the test module and the positioning block in cooperation according to an embodiment of the present invention.
[0026] Figure 4 This is a schematic diagram of the carrier plate assembly provided in an embodiment of the present invention;
[0027] Figure 5 This is a schematic diagram of the structure of the top assembly provided in this embodiment of the utility model;
[0028] Figure 6 This is a structural schematic diagram of the ceiling assembly provided in this embodiment of the utility model;
[0029] Figure 7 This is a partial structural schematic diagram of the upper lifting mechanism provided in an embodiment of this utility model.
[0030] In the attached diagram, 1. Top plate assembly; 11. Top plate; 12. Positioning and clamping block; 13. First buffer; 14. Fourth guide shaft; 2. Carrier plate assembly; 21. Carrier plate; 22. First guide hole; 23. Second guide hole; 24. Positioning block; 241. Through hole; 25. Third guide hole; 26. Fourth guide hole; 3. Top assembly; 31. Mounting bracket; 32. Top mechanism; 321. Second drive component; 322. First support plate; 323. Second support plate; 324. Second buffer; 325. Guide rod; 326. Pressure sensor; 327. Fifth guide shaft; 33. Test module; 331. Mounting fixture; 332. First drive component; 333. Spring pin module; 3331. Probe; 3332. Base; 334. First guide shaft; 335. Second guide shaft; 34. Horn device; 35. Horn drive module; 36. Third guide shaft. Detailed Implementation
[0031] The technical solution of this utility model patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0032] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0034] See Figure 1 , Figure 1 This is a schematic diagram of the flexible circuit board sensitivity testing device provided in this embodiment. The flexible circuit board sensitivity testing device provided in this embodiment includes:
[0035] Top panel assembly 1, the top panel assembly 1 includes a top panel 11 and a positioning and clamping block 12 disposed on the top panel 11;
[0036] Carrier assembly 2, the carrier assembly 2 includes a carrier 21, the carrier 21 is used to support and place the flexible circuit board to be tested;
[0037] The top assembly 3 includes a mounting frame 31, a top mechanism 32, a test module 33, and a speaker device 34. The test module 33 and the top mechanism 32 are mounted on the mounting frame 31, and the speaker device 34 is mounted on the top mechanism 32.
[0038] The top plate assembly 1 is fixedly installed, the upper top assembly 3 is movable and height-adjustable below the top plate assembly 1, and the carrier plate assembly 2 is movable and height-adjustable between the top plate assembly 1 and the upper top assembly 3. The upper top assembly 3 can push upward to contact and cooperate with the carrier plate assembly 2, and drive the carrier plate assembly 2 to rise together to contact and cooperate with the top plate assembly 1, so that the positioning and clamping block 12 presses the flexible circuit board to be tested on the carrier plate 21, and the upper top mechanism 32 can push upward to make the sound-emitting end of the speaker device 34 contact and adhere to the flexible circuit board to be tested. The test module 33 can rise with the upper top assembly 3 and be electrically connected to the flexible circuit board to be tested placed on the carrier plate 21.
[0039] Understandably, using traditional large-module equipment for airtightness testing of flexible circuit boards leads to low testing efficiency, inflexibility, and inconvenient equipment switching, further reducing the original working time and efficiency of the large-module equipment. The flexible circuit board airtightness testing device provided by this invention features a three-part structure—a top plate assembly 1, a carrier plate assembly 2, and an upper top assembly 3—that moves relative to each other. This allows for rapid replacement and adjustment of each part according to different test products, offering flexible layout and enabling targeted airtightness testing of flexible circuit boards. It also boasts a simple structure and low cost.
[0040] Furthermore, traditional testing equipment typically integrates the testing function and product positioning components, with each component used in a one-to-one manner. The flexible circuit board is placed and fixed, and the probes of the testing function directly contact the board before power-on testing. However, this approach presents several problems. Because the testing function and product positioning components are fixed in a one-to-one configuration, different integrated testing equipment needs to be customized for different flexible circuit boards, leading to increased testing costs and inflexible equipment use. The flexible circuit board airtightness testing device provided by this invention separates the testing module 33 responsible for the testing function from the carrier board assembly 2 responsible for product positioning. This allows for rapid response in the overall testing process and facilitates switching of the carrier board assembly 3 according to different test products, significantly improving the flexibility and adaptability of the testing.
[0041] It is understood that the sensitivity test mentioned in this embodiment is the sensitivity test. The sensitivity test aims to evaluate the stability of the flexible printed circuit board (FPC) in transmitting electrical signals under specific conditions (such as mechanical deformation, environmental changes, etc.) and its sensitivity to speaker recognition in specific frequency bands and frequencies, ensuring reliable performance in dynamic usage scenarios. It is a commonly used test for flexible printed circuit boards in mobile phones, headphones, tablets, computers, etc., and will not be further described here. In this embodiment, the sensitivity of the flexible printed circuit board is tested by detecting whether its output is affected after the speaker device emits sound.
[0042] It is understood that in this embodiment, the flexible circuit board sensitivity testing device can be used in conjunction with other equipment, such as a frame structure for the overall equipment. The top plate assembly 1 can be fixedly connected to the frame structure at the top, the carrier plate assembly 2 can be jacked up and down on the frame structure via a guide rod, and the top assembly 3 can be jacked up and down at the bottom of the frame structure via a lifting mechanism such as a telescopic rod or a cylinder. In general, the main purpose is to achieve the fixed setting of the top plate assembly 1, the jacking up and down setting of the top assembly 3 below the top plate assembly 1, and the jacking up and down setting of the carrier plate assembly 2 between the top plate assembly 1 and the top assembly 3. The top assembly 3 can push up and contact the carrier plate assembly 2, and drive the carrier plate assembly 2 up together to contact the top plate assembly 1. In addition to the above examples, those skilled in the art can also implement more forms according to actual needs and in combination with existing technology and conventional knowledge, which will not be further described here.
[0043] It is understandable that, such as Figure 1 As shown, the mounting frame 31 can be a frame consisting of multi-layer boards combined with columns, etc., mainly to facilitate the overall lifting and lowering movement of the top component 3 and the installation and fixing of various parts, which will not be described further here.
[0044] It is understandable that the speaker device 34 mainly refers to a device or component capable of emitting sound. Its primary function is to emit sound to simulate a test environment, so as to act on the flexible circuit board through sound waves and detect whether the signal or function of the flexible circuit board connected to the external output via the test module 33 is affected. The specific speaker device 34 can be selected according to actual needs, and will not be further described here. Furthermore, such as... Figure 1 As shown, it may also include a speaker driver module 35, which may be mounted on the upper component 3. Its main function is to provide sound-producing conditions for the speaker device 34 and drive the speaker device 34 to produce sound. It may be a power supply or a control device, which will not be described further here.
[0045] Understandably, the main function of the test module 33 is to form an electrical connection with the flexible circuit board in order to connect the circuit of the flexible circuit board. The test module 33 can be a simple electrical connection component, which is only responsible for connecting the flexible circuit board to the external test circuit or external test equipment. It can also be a test device that integrates connection and test functions. In specific tests, it can receive the signal output of the flexible circuit board so as to detect whether the output of the flexible circuit board is affected by the sound emitted by the speaker device 34, thereby demonstrating the sensitivity of the flexible circuit board.
[0046] In this embodiment, as Figure 2 As shown,Figure 2 This is a schematic diagram of the test module provided in this embodiment. The test module 33 includes a mounting base 331, a first driving member 332, and a spring pin module 333. The mounting base 331 is fixedly mounted on the mounting frame 31. One end of the first driving member 332 is fixedly mounted on the mounting base 331, and the other end is provided with the spring pin module 333. The first driving member 332 can drive the spring pin module 333 to rise and fall to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate 21.
[0047] It is understandable that, such as Figure 2 As shown, the spring pin module 333 mainly includes a probe 3331 and a base 3332 for mounting the probe 3331. The probe 3331 is mainly used to make contact with the flexible circuit board under test to form an electrical connection. The specific structural design of the probe 3331 and the base 3332 will not be described in detail here. Generally speaking, the probe 3331 can form a circuit loop between the connection point of the circuit board under test and the external test equipment, so as to test the influence of the circuit board under test in the sound-emitting environment of the speaker device 34. The first driving component 332 mainly realizes the driving of the spring pin module 333. It can be a telescopic cylinder or a conventional telescopic mechanical mechanism, which will not be described in detail here.
[0048] In this embodiment, as Figures 3-4 As shown, Figure 3 This is a schematic diagram showing the cooperation between the test module and the positioning block provided in an embodiment of this utility model. Figure 4 This is a schematic diagram of the carrier plate assembly provided in this embodiment. The carrier plate assembly 2 is provided with at least one first guide hole 22, combined with... Figure 2 As shown, the spring needle module 333 is provided with at least one first guide shaft 334 corresponding to the first guide hole 22. The first guide shaft 334 is inserted into the first guide hole 22 to form a positioning when the spring needle module 333 rises.
[0049] In this embodiment, the carrier plate assembly 2 is further provided with at least one second guide hole 23, and the spring pin module 333 is provided with at least one second guide shaft 335 corresponding to the second guide hole 23. The second guide shaft 335 is inserted into the second guide hole 23 to form a positioning when the spring pin module 333 rises. The second guide hole 23 is different from the first guide hole 22 in terms of position and diameter, and the second guide shaft 335 is different from the first guide shaft 334 in terms of position and diameter.
[0050] It is understandable that, such as Figure 2As shown, the first guide shaft 334 and the second guide shaft 335 can both be mounted on the base 3332 of the spring pin module 333. However, mounting them in other locations is not excluded; this is merely illustrative and not a strict limitation. Multiple first guide shafts 334 and second guide shafts 335 can be provided. In this embodiment, two are used as an example. The first guide shafts 334 and second guide shafts 335 are staggered around the probe 3331, thus forming a multi-level guiding constraint. This further improves the positioning accuracy between the test module 33 and the circuit board under test, ensuring effective electrical connection and avoiding interference with test results due to poor contact. It is understood that the first guide shaft 334 and the first guide hole 22, and the second guide shaft 335 and the second guide hole 23, are clearance fits or transition fits to facilitate repeated insertion and connection.
[0051] In this embodiment, as Figure 4 As shown, the carrier board assembly 2 further includes a positioning block 24, which is disposed on the carrier board 21. The positioning block 24 is provided with a positioning structure for positioning and placing the flexible circuit board to be tested. The positioning block 24 is provided with a first guide hole 22 and a second guide hole 23, and the positioning block 24 is provided with a through hole 241 for the probe 3331 of the spring pin module 333 to pass through.
[0052] It is understandable that the positioning structure on the positioning block 24 can be a conventional structure such as a positioning groove or a positioning protrusion. Its main purpose is to achieve preliminary positioning and restriction of the flexible circuit board to be tested, so that the flexible circuit board to be tested will not shift during the operation of the testing device.
[0053] Furthermore, this embodiment uses the example of the first guide hole 22 and the second guide hole 23 being disposed on the positioning block 24. This arrangement allows the positioning block 24, which directly positions the flexible circuit board to be tested, and the test module 33 to directly cooperate through the first guide hole 22, the first guide shaft 334, the second guide hole 23, and the second guide shaft 335, reducing intermediate connecting parts and thus better ensuring accuracy. Of course, positioning can also be achieved by disposing of the first guide hole 22 and the second guide hole 23 on the carrier plate 21. Those skilled in the art can choose the appropriate setting based on actual needs, and this will not be described further here.
[0054] Furthermore, since the positioning block 24 is located above the test module 33, a through hole 241 is provided to facilitate the probe 3331 of the test module 33 to pass through the through hole 241 and make contact with the circuit board under test to form an electrical connection when the test module 33 rises. Additionally, the through hole 241 mainly provides space for the probe 3331 of the spring pin module 333 to pass through and contact the flexible circuit board under test; its structure is not strictly designed, such as...Figure 3 , Figure 4 The diagram may show a notch structure. As for the location and size of the perforation 241, those skilled in the art can adjust the design according to the actual situation, and it will not be described further here.
[0055] In this embodiment, as Figure 4 as well as Figure 5 As shown, Figure 5 This is a schematic diagram of the upper push assembly structure provided in this embodiment. The carrier plate 21 is provided with at least one third guide hole 25, and the upper push assembly 3 is provided with at least one third guide shaft 36 corresponding to the third guide hole 25. When the upper push assembly 3 is pushed up, the third guide shaft 36 is inserted into the third guide hole 25 to form a positioning.
[0056] It is understandable that the fit between the third guide hole 25 and the third guide shaft 36 can be understood by referring to the fit between the first guide hole 22 and the first guide shaft 334 mentioned above. It mainly realizes the guiding and positioning function to ensure the accuracy of the fit between the carrier plate assembly 2 and the upper top assembly 3. More details will not be described further here.
[0057] In this embodiment, as Figure 4 as well as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of the top plate assembly provided in this embodiment. The carrier plate 21 is provided with at least one fourth guide hole 26, and the top plate 11 is provided with at least one fourth guide shaft 14 corresponding to the fourth guide hole 26. When the top mechanism 32 and the carrier plate assembly 2 are pushed up, the fourth guide shaft 14 is inserted into the fourth guide hole 26 to form a positioning.
[0058] Similarly, the fit between the fourth guide hole 26 and the fourth guide shaft 14 can be understood by referring to the fit between the first guide hole 22 and the first guide shaft 334 mentioned above. It mainly realizes the guiding and positioning function to ensure the accuracy of the fit between the carrier plate assembly 2 and the top plate assembly 1. More details will not be described further here.
[0059] In this embodiment, the top plate assembly 1 further includes a first buffer member 13, which is disposed on the top plate 11 and faces the carrier plate assembly 2. It is understood that the main function of the first buffer member 13 is to prevent excessive collision and damage when the carrier plate assembly 2 rises with the upper lifting mechanism 32 and comes into contact with the top plate assembly 1. The first buffer member 13 can be a pin with a spring sleeved on it, with one end of the pin fixed to the top plate 11 and the other end facing the carrier plate 21. When necessary, the carrier plate 21 may have corresponding holes to engage with the pin. When the two work together, the compression of the spring achieves shock absorption and cushioning. Further details are not described here; those skilled in the art can choose from common cushioning methods in the prior art according to actual needs.
[0060] In this embodiment, as Figure 7 As shown, Figure 7 This is a partial structural diagram of the upper lifting mechanism provided in this embodiment, combined with... Figure 5 The upper lifting mechanism 32 includes a second driving member 321, a first support plate 322, a second support plate 323, and a second buffer member 324. The second driving member 321 is fixedly mounted on the mounting bracket 31. The first support plate 322 is mounted on the output end of the second driving member 321. The second support plate 323 is connected to the first support plate 322 via a guide rod 325. The second buffer member 324 is disposed between the first support plate 322 and the second support plate 323. The horn device 34 is disposed on the second support plate 323.
[0061] It is understood that the second buffer 324 can be a spring, sleeved on the guide rod 325, located between the first support plate 322 and the second support plate 323; the second buffer 324 can also be understood and implemented with reference to the first buffer 13, which will not be described further here. The second buffer 324 mainly provides buffering for the horn device 34 to rise, avoiding excessive impact contact between the horn device 34 and the flexible circuit board under test when the rising mechanism 32 drives the horn device 34 to rise; the second drive 321 mainly realizes the lifting drive of the horn device 34, which can be a telescopic cylinder or a conventional telescopic mechanical mechanism, which will not be described further here.
[0062] It is understandable that the upper lifting mechanism 32 and the test module 33 are mounted on the mounting frame 31, and the speaker device 34 is mounted on the upper lifting mechanism 32, thereby realizing a two-stage lifting motion. First, the upper lifting mechanism 32 can be lifted and lowered as a whole with the upper lifting component 3 to achieve contact and cooperation between the upper lifting component 3 and the carrier plate component 2. Then, the upper lifting component 3 continues to rise to push the carrier plate component 2 to achieve contact and cooperation with the top plate component 1. Then, the speaker device 34 can be driven by the upper lifting mechanism 32 to contact and cooperate with the flexible circuit board to be tested. After the carrier plate component 2 and the top plate component 1 are in contact and cooperation, the spring pin module 333 can be driven by the first driving component 332 to contact and cooperate with the flexible circuit board to be tested, thereby completing the environmental preparation and circuit connection before testing.
[0063] In this embodiment, as Figure 7 As shown, a pressure sensor 326 is disposed between the horn device 34 and the second support plate 323. It can be understood that the pressure sensor 326 can be directly disposed at the bottom of the horn device 34 and the upper part of the second support plate 323, essentially connecting the horn device 34 and the second support plate 323 directly through the pressure sensor 326. The installation position can also be easily adjusted and necessary auxiliary connection structures can be set according to actual needs; further details are not elaborated here. The pressure sensor 326 can monitor the pressure change in real time after the horn device 34 comes into contact with the flexible circuit board under test, preventing excessive pressure from damaging the flexible circuit board.
[0064] In this embodiment, as Figure 7 As shown, a fifth guide shaft 327 is also provided on the second support plate 323, and a corresponding fifth guide hole (not shown) is provided on the corresponding carrier plate assembly 2. The fifth guide shaft 327 and the fifth guide hole mainly serve to guide and ensure docking accuracy when the upper lifting mechanism 32 drives the horn device 34 to push up and contact the flexible circuit board to be tested. The principle and further explanation can be understood by referring to the cooperation of the first guide hole 22, the first guide shaft 334, etc., which will not be further described here.
[0065] The working process and principle of the flexible circuit board sensitivity testing device of this utility model:
[0066] When the sensitivity of a flexible circuit board needs to be tested, the flexible circuit board to be tested is loaded onto the carrier assembly 2 using automated equipment and placed on the positioning block 24 for precise positioning. Then, the upper lifting assembly 3 (which can be a telescopic module, cylinder, motor, or other actuator) is driven to lift and raise the carrier assembly 2. The third guide hole 25 on the carrier 21 and the third guide shaft 36 on the upper lifting assembly 3 are inserted and guided, supporting the carrier assembly 2 and continuing to move upward. This allows the fourth guide hole 26 of the carrier assembly 2 to engage with the fourth guide shaft 14 of the top plate assembly 1 for positioning and fitting, thus meeting the requirements for testing. Then, the second drive member 321 of the upper lifting mechanism 32 lifts the speaker device 34. Under the guidance of the fifth guide shaft 327 and the fifth guide hole, precise vertical movement is achieved, allowing the sound-emitting end of the speaker device 34 to make contact with the flexible circuit board to be tested. During the lifting process of the second drive member 321, the pressure sensor 326 provides feedback to control the contact of the product, preventing damage to the flexible circuit board to be tested. Simultaneously, the test module 33, driven by the first driving component 332, performs an upward operation. The first guide shaft 334 is inserted into the first guide hole 22 for guidance, and the second guide shaft 335 is inserted into the second guide hole 23 for guidance, completing two-stage guidance and positioning. Then, the probe 3331 of the spring pin module 333 contacts the flexible circuit board to be tested on the carrier plate 21 and completes the pinning action, connecting the relevant signals of the circuit board to the test system. Based on the sound emitted by the speaker device 34, the sensitivity test of the product is performed to verify whether the product's sound reception meets the sensitivity expectations.
[0067] Due to the adoption of the above technical solution, this utility model has the following beneficial effects:
[0068] The flexible circuit board sensitivity testing device provided in this embodiment uses a three-part structure consisting of a top plate assembly 1, a carrier plate assembly 2, and an upper top assembly 3, which move relative to each other in a lifting and lowering motion. This allows for flexible loading and unloading of the flexible circuit board to be tested and for testing to be performed flexibly. The carrier plate assembly 2 is equipped with a carrier plate 21 for placing the flexible circuit board to be tested, and the upper top assembly 3 is equipped with a speaker device 34 that simulates the testing environment and a testing module 33 that provides testing functions. Each of the main parts is set separately, allowing for quick replacement and adjustment of each part according to different testing products, resulting in a flexible layout. In addition, this testing device can meet the operational needs of targeted flexible circuit board sensitivity testing, and has a simple structure and low cost.
[0069] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.
Claims
1. A sensitivity testing device for flexible circuit boards, characterized in that, include: The roof assembly includes a roof and a positioning and clamping block disposed on the roof; A carrier assembly, the carrier assembly including a carrier plate, the carrier plate being used to support and place a flexible circuit board to be tested; The top-mounting assembly includes a mounting frame, a top-mounting mechanism, a testing module, and a horn device. The testing module and the top-mounting mechanism are mounted on the mounting frame, and the horn device is mounted on the top-mounting mechanism. The top plate assembly is fixedly installed, the top mounting assembly is movable and height-adjustable below the top plate assembly, and the carrier plate assembly is movable and height-adjustable between the top plate assembly and the top mounting assembly. The top mounting assembly can be pushed upward to contact and engage with the carrier plate assembly, and drive the carrier plate assembly upward together to contact and engage with the top plate assembly, so that the positioning and clamping block presses the flexible circuit board to be tested on the carrier plate. The top mounting mechanism can also be pushed upward to make the sound-emitting end of the speaker device contact and adhere to the flexible circuit board to be tested. The test module can rise with the top mounting assembly and be electrically connected to the flexible circuit board to be tested placed on the carrier plate.
2. The flexible circuit board sensitivity testing device according to claim 1, characterized in that, The test module includes a mounting base, a first driving component, and a spring pin module. The mounting base is fixedly mounted on the mounting frame. One end of the first driving component is fixedly mounted on the mounting base, and the other end is provided with the spring pin module. The first driving component can drive the spring pin module to move up and down to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate.
3. The flexible circuit board sensitivity testing device according to claim 2, characterized in that, The carrier plate assembly is provided with at least one first guide hole, and the spring pin module is provided with at least one first guide shaft corresponding to the first guide hole. When the spring pin module rises, the first guide shaft is inserted into the first guide hole to form a positioning.
4. The flexible circuit board sensitivity testing device according to claim 3, characterized in that, The carrier plate assembly is also provided with at least one second guide hole, and the spring pin module is provided with at least one second guide shaft corresponding to the second guide hole. The second guide shaft is inserted into the second guide hole to form a positioning when the spring pin module rises. The second guide hole and the first guide hole are different in position and diameter, and the second guide shaft and the first shaft are different in position and diameter.
5. The flexible circuit board sensitivity testing device according to claim 4, characterized in that, The carrier assembly further includes a positioning block disposed on the carrier. The positioning block is provided with a positioning structure for positioning and placing the flexible circuit board to be tested. The positioning block is provided with a first guide hole and a second guide hole, and the positioning block is provided with a through hole for the probe of the spring pin module to pass through.
6. The flexible circuit board sensitivity testing device according to claim 1, characterized in that, The top panel assembly further includes a first buffer member, which is disposed on the top panel and oriented toward the carrier assembly.
7. The flexible circuit board sensitivity testing device according to claim 1, characterized in that, The carrier plate is provided with at least one third guide hole, and the upper push assembly is provided with at least one third guide shaft corresponding to the third guide hole. When the upper push assembly is pushed up, the third guide shaft is inserted into the third guide hole to form a positioning.
8. The flexible circuit board sensitivity testing device according to claim 1, characterized in that, The carrier plate is provided with at least one fourth guide hole, and the top plate is provided with at least one fourth guide shaft corresponding to the fourth guide hole. When the top assembly and the carrier plate assembly are pushed up, the fourth guide shaft is inserted into the fourth guide hole to form a positioning.
9. The flexible circuit board sensitivity testing device according to claim 1, characterized in that, The upper lifting mechanism includes a second driving component, a first support plate, a second support plate, and a second buffer component. The second driving component is fixedly mounted on the mounting frame. The first support plate is mounted on the output end of the second driving component. The second support plate is connected to the first support plate via a guide rod. The second buffer component is disposed between the first support plate and the second support plate. The horn device is disposed on the second support plate.
10. The flexible circuit board sensitivity testing device according to claim 9, characterized in that, A pressure sensor is provided between the horn device and the second support plate.