Dustproof heat dissipation device for notebook computer circuit board

Abstract

The utility model relates to the technical field of dust prevention and heat dissipation of notebook computer circuit boards, in particular to a dust prevention and heat dissipation device of a notebook computer circuit board, which comprises a heat dissipation assembly and an angle adjusting assembly. An angle adjusting assembly is arranged at the lower end of the heat dissipation assembly. And an electrostatic dust adsorption grid is arranged on the upper end face of the heat dissipation fan plate. According to the utility model, the electrostatic dust adsorption grating is used for carrying out electrostatic dust adsorption on airflow blown out by the heat dissipation fan plate, so that the dustproof effect is realized, the air outlet quantity is not influenced, the air cooling heat dissipation efficiency is improved, and the notebook computer support block is horizontally moved and adjusted along the interior of the sliding groove; the notebook computer placed above the electrostatic dust adsorption grid can be better supported, and the adaptability to notebook computers of different sizes is better.

Description

Technical Field

[0001] This utility model relates to the field of dust prevention and heat dissipation technology for laptop circuit boards, and more particularly to a dust prevention and heat dissipation device for laptop circuit boards. Background Technology

[0002] As laptop performance continues to improve, the heat generated by core components such as the CPU and GPU on their internal circuit boards increases significantly during operation. If this high heat cannot be dissipated in time, it will lead to a decline in computer performance, accelerated aging of hardware, or even damage. Therefore, an efficient heat dissipation device is crucial.

[0003] Fans use forced convection to quickly remove heat from the heatsink fins; heat pipes and vapor chambers utilize the phase change of the internal working fluid to efficiently conduct heat. However, when attempting to increase airflow to improve cooling performance, problems arise. To prevent dust from entering the laptop and affecting the performance of electronic components, air filters are typically installed at the air inlet. But as airflow increases, the air filter's obstruction of airflow becomes more pronounced. On one hand, while overly fine filters effectively block dust, they drastically reduce airflow speed, significantly reducing cooling efficiency and failing to meet the cooling demands of high-performance operation. On the other hand, using sparser filters to ensure airflow speed makes it difficult to effectively filter dust. A large amount of dust entering the computer accumulates on the heatsink fins, fans, and other components, also affecting cooling performance and potentially causing fan malfunctions. Utility Model Content

[0004] In order to overcome the problem that existing heat dissipation devices for laptop circuit boards cannot simultaneously achieve both heat dissipation and dust prevention due to the significant impact of air filtration on airflow speed after the increase of heat dissipation air volume, this utility model provides a dust prevention and heat dissipation device for laptop circuit boards.

[0005] The technical solution is as follows: A dustproof and heat dissipation device for a laptop circuit board includes a heat dissipation component and an angle adjustment component; the lower end of the heat dissipation component is provided with the angle adjustment component; the heat dissipation component includes a heat dissipation fan plate, an electrostatic dust adsorption grille, a sliding groove, a laptop support block, a support rod, a USB interface, and a fan speed regulator; the angle adjustment component includes a base and a limiting groove; the upper surface of the heat dissipation fan plate is provided with an electrostatic dust adsorption grille, and the electrostatic dust adsorption grille is fixedly connected to the heat dissipation fan plate.

[0006] Furthermore, a sliding groove is provided in front of the electrostatic dust adsorption grille, and the sliding groove is integrally formed with the housing of the heat dissipation fan plate.

[0007] Furthermore, a laptop support block is provided inside the sliding groove, and the laptop support block is slidably connected along the sliding groove.

[0008] Furthermore, a USB interface is provided on the rear end face of the sliding groove, and the USB interface is electrically connected to the cooling fan board; a fan speed regulator is provided on one side of the USB interface, and the fan speed regulator is electrically connected to the cooling fan board.

[0009] Furthermore, a base is provided at the lower end of the cooling fan plate, and the base is rotatably connected to the rear end of the cooling fan plate.

[0010] Furthermore, a support rod is provided between the cooling fan plate and the base, and the support rod is rotatably connected to the cooling fan plate.

[0011] Furthermore, a limiting groove is provided on the upper surface of the base, and the limiting groove is integrally formed with the base, and the support rod is placed inside the limiting groove.

[0012] The beneficial effects are as follows: After the heat dissipation fan plate of this utility model is started, the built-in fan runs at high speed, which accelerates the air and blows it out to form a strong airflow for cooling the laptop. When this airflow carrying dust particles flows through the electrostatic dust adsorption grille, the grille continuously releases static electricity through the electrostatic generator, forming a stable electrostatic field on its surface and around the pores. The dust particles are charged due to friction and other reasons during the flow. When they enter the electrostatic field area of ​​the grille, they are subjected to the electric field force and are firmly adsorbed on the surface of the grille and the edge of the pores. Since the electrostatic adsorption only acts on the dust particles and does not block the physical structure of the grille, the airflow can still penetrate the grille without obstruction, maintaining the original airflow speed and volume, ensuring the efficient operation of the air cooling system and effectively maintaining the working temperature of the laptop. The laptop support block and the sliding groove form a flexible adjustment structure. The sliding groove is designed with precise guide rails and positioning slots. The bottom of the laptop support block is equipped with a slider that matches the guide rails and can move horizontally smoothly along the sliding groove. When using the laptop, the user can manually push the support block to slide in the sliding groove according to the actual length and width of the laptop.

[0013] By setting up the angle adjustment component and the support rod, the support rod is placed in the limiting groove to support the heat dissipation fan plate. Placing the support rod in different limiting grooves enables the tilt angle adjustment function of the heat dissipation fan plate. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall rear-view three-dimensional structure of this utility model;

[0016] Figure 3 This is a side view of the overall three-dimensional structure of the present invention;

[0017] Figure 4 This is a rear-view three-dimensional structural diagram of the heat dissipation component of this utility model;

[0018] Figure 5 This is a three-dimensional structural diagram of the angle adjustment component of this utility model.

[0019] In the attached diagram, the following are the reference numerals: 1. Heat dissipation component; 2. Angle adjustment component; 101. Heat dissipation fan plate; 102. Electrostatic dust adsorption grille; 103. Sliding groove; 104. Laptop support block; 105. Support rod; 106. USB interface; 107. Fan speed regulator; 201. Base; 202. Limiting groove. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0021] Example 1

[0022] like Figures 1-5 As shown, a dustproof and heat dissipation device for a laptop circuit board includes a heat dissipation component 1 and an angle adjustment component 2. The angle adjustment component 2 is provided at the lower end of the heat dissipation component 1. The heat dissipation component 1 includes a heat dissipation fan plate 101, an electrostatic dust adsorption grille 102, a sliding groove 103, a laptop support block 104, a support rod 105, a USB interface 106, and a fan speed regulator 107. The angle adjustment component 2 includes a base 201 and a limiting groove 202. An electrostatic dust adsorption grille 102 is provided on the upper surface of the heat dissipation fan plate 101, and the electrostatic dust adsorption grille 102 is fixedly connected to the heat dissipation fan plate 101.

[0023] A sliding groove 103 is provided in front of the electrostatic dust adsorption grille 102, and the sliding groove 103 is integrally formed with the housing of the heat dissipation fan plate 101.

[0024] The sliding groove 103 is provided with a laptop support block 104 inside, and the laptop support block 104 is slidably connected along the sliding groove 103.

[0025] A USB interface 106 is provided on the rear end face of the sliding groove 103, and the USB interface 106 is electrically connected to the heat dissipation fan plate 101; a fan speed regulator 107 is provided on one side of the USB interface 106, and the fan speed regulator 107 is electrically connected to the heat dissipation fan plate 101.

[0026] After the cooling fan plate 101 is activated, the built-in fan operates at high speed, accelerating the airflow to form a strong airflow for cooling the laptop. When this airflow carrying dust particles flows through the electrostatic dust adsorption grille 102, the grille continuously releases static electricity through an electrostatic generator, forming a stable electrostatic field on its surface and around its pores. Dust particles become charged due to friction during flow, and when they enter the electrostatic field area of ​​the grille, they are subjected to the electric field force and firmly adsorbed onto the grille surface and the edges of the pores. Since electrostatic adsorption only acts on dust particles, it does not clog the physical structure of the grille. The airflow can still pass through the grille without obstruction, maintaining the original airflow speed and volume, ensuring the efficient operation of the air-cooling system and effectively maintaining the working temperature of the laptop. The laptop support block 104 and the sliding groove 103 form a flexible adjustment structure. The sliding groove 103 is designed with precise guide rails and positioning slots. The bottom of the laptop support block 104 is equipped with a slider that matches the guide rail, which can move smoothly horizontally along the sliding groove 103. When using the laptop, the user can manually push the support block 104 to slide within the sliding groove 103 according to the actual length and width of the laptop.

[0027] Example 2

[0028] Based on Example 1, such as Figures 1-5 As shown, a base 201 is provided at the lower end of the heat dissipation fan plate 101, and the base 201 is rotatably connected to the rear end of the heat dissipation fan plate 101.

[0029] A support rod 105 is provided between the heat dissipation fan plate 101 and the base 201, and the support rod 105 is rotatably connected to the heat dissipation fan plate 101.

[0030] The upper end face of the base 201 is provided with a limiting groove 202, and the limiting groove 202 is integrally formed with the base 201, and the support rod 105 is placed inside the limiting groove 202.

[0031] By setting the angle adjustment component 2 and the support rod 105, the support rod 105 is placed in the limiting groove 202 to support the heat dissipation fan plate 101. The support rod 105 is placed in different limiting grooves 202 to achieve the function of adjusting the elevation angle of the heat dissipation fan plate 101.

Claims

1. A dustproof and heat dissipation device for a laptop circuit board, comprising a heat dissipation component (1), characterized in that: It also includes an angle adjustment component (2); the lower end of the heat dissipation component (1) is provided with an angle adjustment component (2); the heat dissipation component (1) includes a heat dissipation fan plate (101), an electrostatic dust adsorption grille (102), a sliding groove (103), a laptop support block (104), a support rod (105), a USB interface (106), and a fan speed regulator (107); the angle adjustment component (2) includes a base (201) and a limiting groove (202); the upper surface of the heat dissipation fan plate (101) is provided with an electrostatic dust adsorption grille (102), and the electrostatic dust adsorption grille (102) is fixedly connected to the heat dissipation fan plate (101).

2. The dustproof and heat dissipation device for a laptop circuit board according to claim 1, characterized in that: A sliding groove (103) is provided in front of the electrostatic dust adsorption grille (102), and the sliding groove (103) is integrally formed with the housing of the heat dissipation fan plate (101).

3. The dustproof and heat dissipation device for a laptop circuit board according to claim 2, characterized in that: The sliding groove (103) is provided with a laptop support block (104), and the laptop support block (104) is slidably connected along the sliding groove (103).

4. The dustproof and heat dissipation device for a laptop circuit board according to claim 2, characterized in that: A USB interface (106) is provided on the rear end face of the sliding groove (103), and the USB interface (106) is electrically connected to the heat dissipation fan plate (101); a wind speed regulator (107) is provided on one side of the USB interface (106), and the wind speed regulator (107) is electrically connected to the heat dissipation fan plate (101).

5. The dustproof and heat dissipation device for a laptop circuit board according to claim 1, characterized in that: A base (201) is provided at the lower end of the heat dissipation fan plate (101), and the base (201) is rotatably connected to the rear end of the heat dissipation fan plate (101).

6. The dustproof and heat dissipation device for a laptop circuit board according to claim 5, characterized in that: A support rod (105) is provided between the heat dissipation fan plate (101) and the base (201), and the support rod (105) is rotatably connected to the heat dissipation fan plate (101).

7. The dustproof and heat dissipation device for a laptop circuit board according to claim 5, characterized in that: The upper end face of the base (201) is provided with a limiting groove (202), and the limiting groove (202) is integrally formed with the base (201), and the support rod (105) is placed inside the limiting groove (202).

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