Sine wave filter with bottom-mounted capacitor

Abstract

The utility model discloses a sine wave filter with a capacitor installed at the bottom, which relates to the technical field of power electronic filtering and comprises a shell, a driving device arranged on the outer wall of the shell and a capacitor installed at the bottom of the shell, through cooperation of the driving device and the heat dissipation device, the capacitor is directly fixed to the bottom of the filter shell through bolts, the situation that traditional top installation and side installation occupy large space is changed, the filter structure is more compact, more efficient layout can be achieved in a limited space, and the bottom face of the capacitor makes contact with the bottom of the shell; by means of good thermal conductivity of metal materials of the shell, heat generated when the capacitor works can be rapidly conducted to the shell, the surface of the capacitor is coated with heat conduction silica gel, tiny gaps of a contact interface of the capacitor and the shell are effectively filled, thermal resistance is reduced, and the capacitor is connected with an internal circuit through a quick release interface. The purpose of dismounting and replacing the capacitor can be achieved only by loosening the bottom bolt.

Description

Technical Field

[0001] This utility model relates to the field of power electronic filtering technology, specifically a capacitor bottom-mounted sine wave filter. Background Technology

[0002] This utility model relates to the field of power electronic filtering technology and is applicable to harmonic control and waveform optimization of equipment such as frequency converters and inverters.

[0003] Traditional sine wave filters typically use top or side mounting of the filter capacitor. This mounting method has significant space occupation issues, as top or side mounting requires additional three-dimensional space for the capacitor, resulting in a larger overall filter size. This makes it difficult to meet the miniaturization and compact design requirements of modern electronic devices. During operation, the capacitor generates heat due to high-frequency charging and discharging. In traditional mounting methods, the heat conduction path between the capacitor and the filter casing is relatively long. For example, top-mounted capacitors need to transfer heat to the casing through air convection or additional heat-conducting components, resulting in low heat dissipation efficiency. High-temperature environments can accelerate the drying of the electrolyte inside the capacitor, leading to capacitance decay, shortened lifespan, and even equipment failure. At the same time, the traditional structure lacks sufficient coordination between heat dissipation components and capacitors, failing to form an efficient heat conduction network. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a capacitor-bottom mounted sine wave filter, which solves the problems of large space occupation, poor heat dissipation, and inconvenient maintenance associated with traditional filters where capacitors are mounted on the top and sides.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a bottom-mounted capacitor sine wave filter, comprising: a housing, a driving device provided on the outer wall of the housing, the driving device being quick-release via a threaded connection, a heat dissipation device fixedly connected to the outer wall of the housing, the driving device including a capacitor, the capacitor surface coated with thermally conductive silicone, the inner wall of the capacitor being fixedly connected to the inner wall of the housing via bolts, and the filter capacitor being directly fixed to the bottom of the filter housing via bolts. This changes the traditional top and side mounting method, which occupies a large space, making the filter structure more compact and providing strong support for the miniaturization of equipment. It allows for a more efficient layout within a limited space, meeting the compact design requirements of modern electronic devices. The thermally conductive silicone coating on the capacitor surface effectively fills the tiny gaps at the interface between the capacitor and the housing, reducing thermal resistance, significantly enhancing heat conduction efficiency, ensuring that the capacitor maintains a low temperature during operation, extending its service life, and avoiding problems such as accelerated electrolyte drying due to high temperatures.

[0008] Preferably, the outer wall of the housing has lead wire through holes, which provide a reasonable path for the capacitor leads and make the lead wire layout more orderly. At the same time, the capacitor leads are fixedly connected to the heat dissipation device through the lead wire through holes, which further enhances the overall integrity of the structure and helps to dissipate heat in a timely manner while realizing electrical connection.

[0009] Preferably, the capacitor is fixedly connected to the heat dissipation device via leads.

[0010] Preferably, the heat dissipation device includes a resistive element, the outer wall of which is covered with an insulated wire.

[0011] Preferably, the inner wall of the resistive element is threadedly connected to the inner wall of the outer casing via bolts, and the resistive elements are arranged in a linear array along the outer wall of the outer casing. Similarly, the resistive elements in the heat dissipation device are also arranged in a linear array along the outer wall of the outer casing. This layout not only makes efficient use of the outer casing space but also helps to reduce the overall temperature inside the casing through the heat dissipation effect of the resistive elements. The threaded connection between the inner wall of the resistive element and the inner wall of the outer casing via bolts ensures a secure installation.

[0012] Preferably, the inner wall of the housing is fixedly connected with heat dissipation fins by bolts. The heat dissipation fins are located at the upper and lower ends of the resistive element. The heat dissipation fins fixedly connected to the inner wall of the housing are located at the upper and lower ends of the resistive element, which further expands the heat dissipation area, optimizes the heat dissipation path, and enables the heat generated by the resistive element to be dissipated more effectively, thereby improving the heat dissipation performance of the entire filter.

[0013] Beneficial effects

[0014] This invention provides a capacitor-mounted bottom-mounted sine wave filter. It has the following advantages:

[0015] This utility model, through the combination of a drive device and a heat dissipation device, allows the capacitor to be directly fixed to the bottom of the filter housing with bolts. This changes the traditional top and side mounting methods, which occupy a lot of space, making the filter structure more compact and enabling a more efficient layout in a limited space. The bottom surface of the capacitor contacts the bottom of the housing, and thanks to the good thermal conductivity of the metal housing, the heat generated by the capacitor during operation can be quickly conducted to the housing. The surface of the capacitor is coated with thermally conductive silicone, which effectively fills the tiny gaps at the interface between the capacitor and the housing, reducing thermal resistance. The capacitor is connected to the internal circuit through a quick-release interface. When the capacitor is damaged and requires maintenance, it can be removed and replaced simply by loosening the bottom bolts, without disassembling the entire structure, which greatly reduces the difficulty and cost of maintenance. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0018] In the diagram: 1. Housing; 2. Drive unit; 20. Capacitor; 21. Bolt; 22. Lead wire through hole; 3. Heat dissipation device; 30. Resistor element; 31. Insulated wire; 32. Heat dissipation fins. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example

[0021] Please see Figure 1-2 This utility model provides a technical solution: a capacitor-bottom-mounted sine wave filter, comprising:

[0022] The outer casing 1 has a drive device 2 on its outer wall. The drive device 2 is quick-released by means of a threaded connection. A heat dissipation device 3 is fixedly connected to the outer wall of the outer casing 1. The drive device 2 is fixed to the outer casing 1 by bolts 21 and is cooled by the heat dissipation device 3.

[0023] The drive unit 2 includes a capacitor 20. The surface of the capacitor is coated with thermally conductive silicone. The inner wall of the capacitor 20 is fixedly connected to the inner wall of the outer shell 1 by bolts 21. The capacitor is directly fixed to the bottom inner wall of the outer shell 1 by bolts 21. The bottom surface of the capacitor is in close contact with the metal material of the outer shell 1 to ensure the stability of the mechanical connection. At the same time, the capacitor lead 20 passes through the lead through hole 22 at the bottom of the outer shell 1 and is electrically connected to the internal reactor, resistor element 30, etc. through circuit contacts to form a complete filtering path. The drive unit 2 adopts a quick-release design with threaded connection. When the capacitor needs to be replaced, the capacitor can be removed from the bottom of the outer shell 1 by simply loosening the bottom bolt 21 without disassembling the entire structure, which greatly shortens the maintenance time.

[0024] The outer wall of the housing 1 has lead wire through holes 22. The capacitor 20 is fixedly connected to the heat dissipation device 3 through the lead wires. The lead wire through holes 22 on the outer wall of the housing 1 provide a fixed wire passage for the capacitor lead wires 20, making the lead wire layout neat and avoiding the wires from getting tangled and affecting the filtering performance. At the same time, the capacitor lead wires 20 are fixedly connected to the resistor element 30 in the heat dissipation device 3 through the lead wire through holes 22. While realizing the electrical connection, the heat dissipation path of the capacitor and the resistor element 30 is integrated by the metal structure of the housing 1 to form a synergistic heat dissipation effect and further improve the overall heat dissipation efficiency.

[0025] The heat dissipation device 3 includes a resistor element 30, the outer wall of which is covered with an insulated wire 31, and the inner wall of the resistor element 30 is threadedly connected to the inner wall of the outer casing 1 by bolts 21. The resistor elements 30 are arranged in a linear array along the outer wall of the outer casing 1.

[0026] Heat dissipation fins 32 are fixedly connected to the inner wall of the outer casing 1 by bolts 21. The heat dissipation fins 32 are located at the upper and lower ends of the resistive element 30. The resistive element 30 is arranged in a linear array along the outer wall of the outer casing 1. The heat generated during its operation is conducted to the inner wall of the outer casing 1 through the bolts 21, and then diffused to the upper and lower ends through the heat dissipation fins 32 fixed to the inner wall. The insulated wires 31 covering the outer wall of the resistive element 30 ensure electrical insulation while not affecting the heat transfer to the outer casing 1. The heat dissipation fins 32 increase the heat dissipation area and quickly dissipate the heat to the surrounding air.

[0027] In use, the drive unit 2 is fixed to the housing 1 by bolts 21 and is cooled by the heat dissipation device 3;

[0028] The capacitor is directly fixed to the bottom inner wall of the housing 1 by bolts 21. The bottom surface of the capacitor is in close contact with the metal material of the housing 1 to ensure the stability of the mechanical connection. At the same time, the capacitor lead 20 passes through the lead through hole 22 at the bottom of the housing 1 and is electrically connected to the internal reactor, resistor element 30 and other components through circuit contacts to form a complete filtering path. The drive device 2 adopts a quick-release design with threaded connection. When the capacitor needs to be replaced, simply loosen the bottom bolt 21 to remove the capacitor from the bottom of the housing 1 without disassembling the entire structure, which greatly shortens the maintenance time.

[0029] The heat generated by the capacitor during operation is directly conducted to the bottom metal material of the outer casing 1 through the bottom surface. At the same time, the thermally conductive silicone coating on the capacitor surface fills the interface gaps, reduces thermal resistance, and improves heat conduction efficiency.

[0030] The lead wire through-hole 22 on the outer wall of the housing 1 provides a fixed wire passage for the capacitor lead wire 20, making the lead wire layout neat and avoiding the wire tangling from affecting the filtering performance. At the same time, the capacitor lead wire 20 is fixedly connected to the resistor element 30 in the heat dissipation device 3 through the lead wire through-hole 22. While realizing the electrical connection, the heat dissipation path of the capacitor and the resistor element 30 is integrated by the metal structure of the housing 1 to form a synergistic heat dissipation effect and further improve the overall heat dissipation efficiency.

[0031] The resistor element 30 is arranged in a linear array along the outer wall of the housing 1. The heat generated during its operation is conducted to the inner wall of the housing 1 through the bolt 21, and then diffused to the upper and lower ends through the heat dissipation fins 32 fixed on the inner wall. The insulated wire 31 covering the outer wall of the resistor element 30 ensures electrical insulation without affecting the heat transfer to the housing 1. The heat dissipation fins 32 increase the heat dissipation area and quickly dissipate the heat to the surrounding air.

[0032] If the outer casing 1 is in contact with the equipment mounting surface, heat can also be conducted to the main body of the equipment through the mounting surface, further enhancing heat dissipation.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A capacitor-bottom-mounted sine wave filter, comprising: The outer shell (1) is characterized by: The outer wall of the outer shell (1) is provided with a driving device (2), which is quick-released by means of threaded connection, and a heat dissipation device (3) is fixedly connected to the outer wall of the outer shell (1); The driving device (2) includes a capacitor (20), the surface of which is coated with thermally conductive silicone, and the inner wall of the capacitor (20) is fixedly connected to the inner wall of the outer shell (1) by bolts (21).

2. A capacitor-bottom-mounted sine wave filter according to claim 1, characterized in that: The outer wall of the outer casing (1) is provided with a lead wire through hole (22).

3. A capacitor-bottom-mounted sine wave filter according to claim 2, characterized in that: The capacitor (20) is fixedly connected to the heat dissipation device (3) via leads.

4. A capacitor-bottom-mounted sine wave filter according to claim 1, characterized in that: The heat dissipation device (3) includes a resistive element (30), the outer wall of which is covered with an insulated wire (31).

5. A capacitor-bottom-mounted sine wave filter according to claim 4, characterized in that: The inner wall of the resistor element (30) is threadedly connected to the inner wall of the outer shell (1) by bolts (21), and the resistor element (30) is arranged in a linear array along the outer wall of the outer shell (1).

6. A capacitor-bottom-mounted sine wave filter according to claim 5, characterized in that: The inner wall of the outer casing (1) is fixedly connected to heat dissipation fins (32) by bolts (21), and the heat dissipation fins (32) are located at the upper and lower ends of the resistive element (30).

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