Imaging device
By employing a stacked structure of heat-conducting components and heat conductors in the camera device, the problem of insufficient heat dissipation in multi-layer circuit boards is solved, achieving effective heat transfer and maintenance of image clarity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHICONY ELECTRONICS CO LTD
- Filing Date
- 2025-02-06
- Publication Date
- 2026-04-28
AI Technical Summary
Insufficient heat dissipation in the multi-layer circuit board design of the camera device leads to overheating of the circuit board, affecting image clarity.
The design employs a first circuit board, a second circuit board, a first heat conductor, and a second heat conductor. Through the stacked structure of the heat-conducting components and heat conductors, the heat generated by the photosensitive element is rapidly transferred to the heat sink in the vertical direction, achieving effective heat dissipation.
It effectively prevents the circuit board from overheating, maintains the image clarity of the photosensitive element, and improves the heat dissipation efficiency of the camera device.
Smart Images
Figure CN224178227U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an optical device, and more particularly to a camera device. Background Technology
[0002] With the development of technology, camera devices are being used more and more widely in fields such as personal electronics, automobiles, and medicine. For example, personal computers can be equipped with camera devices to support functions such as photography, online video, or facial recognition.
[0003] As the performance requirements of photographic devices increase, some devices employ a design where multiple layers of circuit boards are stacked and fixed together to accommodate a sufficient number of electronic components within a limited space. However, during operation, the electronic components on each circuit board generate heat. Therefore, using multiple circuit boards can easily lead to insufficient heat dissipation space, causing each circuit board to overheat and affecting the clarity of the acquired images. Utility Model Content
[0004] In view of the above, in one embodiment, a camera device is provided, including a first circuit board, a second circuit board, a first thermal conductor, and a second thermal conductor. The first circuit board has a first thermally conductive element and opposing photosensitive surfaces and a back surface. A photosensitive element is located on the photosensitive surface. The first thermally conductive element is located between the photosensitive surface and the back surface and contacts the photosensitive element. The second circuit board is spaced apart from the first circuit board. The second circuit board has a second thermally conductive element and opposing first and second surfaces. The first surface faces the back surface of the first circuit board, and the second thermally conductive element is located between the first and second surfaces. The first thermal conductor is located between the back surface of the first circuit board and the first surface of the second circuit board and contacts the first and second thermally conductive elements. The second thermal conductor is disposed on the second surface of the second circuit board and contacts the second thermally conductive element and a heat sink.
[0005] In summary, according to the camera device of the present invention, the heat generated by the operation of the photosensitive element of the first circuit board can be transferred to the heat sink in sequence through the first heat conductor, the first heat conductor, the second heat conductor and the second heat conductor to achieve a good heat dissipation effect, avoid overheating of each circuit board and the photosensitive element and maintain the clarity of the image acquired by the photosensitive element. Attached Figure Description
[0006] Figure 1 This is a perspective view of one embodiment of the camera device of this utility model.
[0007] Figure 2 This is an exploded perspective view of one embodiment of the camera device of this utility model.
[0008] Figure 3This is a cross-sectional view of one embodiment of the camera device of this utility model.
[0009] Figure 4 This is a stacked schematic diagram of one embodiment of the first circuit board and the second circuit board of the camera device of this utility model.
[0010] Figure 5 This is an exploded perspective view of another embodiment of the camera device of this utility model.
[0011] Explanation of reference numerals in the attached figures:
[0012] 1: Camera device
[0013] 10: Outer shell
[0014] 101: First Shell
[0015] 102: Second shell
[0016] 103: Light-transmitting section
[0017] 11: Heat sink
[0018] 20: Lens
[0019] 25: Base
[0020] 30: First circuit board
[0021] 301: First layer board
[0022] 31: Photosensitive surface
[0023] 32: Back
[0024] 33: Photosensitive element
[0025] 34: Heating element
[0026] 35: First metal sheet
[0027] 36: First heat-conducting component
[0028] 361: First metal layer
[0029] 365: First thermally conductive connector
[0030] 37: First heat-conducting component
[0031] 40: Second circuit board
[0032] 401: Second layer board
[0033] 41: First Surface
[0034] 42: Second surface
[0035] 45: Second metal sheet
[0036] 46: Second heat-conducting component
[0037] 461: Second metal layer
[0038] 465: Second thermally conductive connector
[0039] 47: Second heat-conducting component
[0040] 50: First heat conductor
[0041] 51: First thermally conductive connector
[0042] 55: First Sub-Heat Conductor
[0043] 60: Second heat conductor
[0044] 61: Second thermally conductive connector
[0045] 65: Second Sub-Conductor Detailed Implementation
[0046] It should be noted that in the descriptions of the various embodiments, the terms "first" and "second" are used to describe different elements, and these elements are not limited by such predicates. Furthermore, for ease of explanation and clarity, the thickness or dimensions of the elements in the drawings are exaggerated, omitted, or approximated for the understanding and reading of those skilled in the art. The dimensions of each element are not exactly their actual dimensions and are not intended to limit the implementation of this utility model; therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model. The same reference numerals will be used to denote the same or similar elements in all drawings.
[0047] Figure 1 This is a perspective view of one embodiment of the camera device of this utility model. Figure 2 This is an exploded perspective view of one embodiment of the camera device of this utility model. Figure 3 This is a cross-sectional view of one embodiment of the camera device of this utility model. Figures 1 to 3 As shown, the camera device 1 in this embodiment includes a housing 10, a lens 20, a first circuit board 30, a second circuit board 40, a first heat conductor 50, and a second heat conductor 60. In some embodiments, the camera device 1 can be applied to various electronic products to acquire images of the surroundings of the electronic product. For example, the camera device 1 can be applied to automotive products (such as dashcams, reversing cameras, or surround view systems), mobile devices (such as smartphones, tablets, or laptops), or cameras and other electronic products.
[0048] like Figures 1 to 3As shown, in this embodiment, the outer casing 10 includes a first casing 101 and a second casing 102, which are assembled together. For example, the first casing 101 and the second casing 102 can be assembled and fixed together by means of adhesive, snap-fit, or locking to form a hollow outer casing 10, but this is not a limitation. In other embodiments, the outer casing 10 can also be the casing of other electronic products (such as laptops or mobile phones). In addition, in this embodiment, one side of the outer casing 10 has a light-transmitting portion 103, for example, the light-transmitting portion 103 can be a transparent cover (such as...). Figure 3 (as shown) or through holes, allowing external light to pass through the light-transmitting part 103 and enter the interior of the housing 10.
[0049] like Figures 1 to 3 As shown, the first circuit board 30 is disposed inside the housing 10. For example, the first circuit board 30 can be fixed inside the housing 10 by means of adhesive, snap-fit, or locking. The first circuit board 30 has a photosensitive surface 31 and a back surface 32 facing each other. The photosensitive surface 31 faces the light-transmitting part 103, and the back surface 32 faces away from the light-transmitting part 103. A photosensitive element 33 is provided on the photosensitive surface 31. In some embodiments, the photosensitive element 33 may specifically be a charge-coupled device (CCD), a complementary metal-oxide-semiconductor (CMOS), or a CMOS active pixel sensor.
[0050] like Figures 1 to 3 As shown, the lens 20 is disposed inside the housing 10 and located between the light-transmitting portion 103 and the photosensitive element 33, so that after external light enters through the light-transmitting portion 103, it can be transmitted to the photosensitive element 33 through the lens 20, enabling the photosensitive element 33 to sense and acquire an image. In this embodiment, the lens 20 is assembled on the base 25, and the lens 20 is fixed to the photosensitive surface 31 of the first circuit board 30 via the base 25, so that the position of the photosensitive element 33 corresponds to the position of the lens 20, and a distance is maintained between the lens 20 and the photosensitive element 33.
[0051] like Figures 1 to 3 As shown, the first circuit board 30 also has a first heat-conducting element 36, which is located between the photosensitive surface 31 and the back surface 32. The first heat-conducting element 36 can directly or indirectly contact the photosensitive element 33, so that the heat generated by the photosensitive element 33 during operation can be transferred to the first heat-conducting element 36. In this embodiment, the photosensitive element 33 and the first heat-conducting element 36 are stacked along a direction perpendicular to the first circuit board 30.
[0052] In some embodiments, the first thermally conductive element 36 may be made of a material with a high thermal conductivity coefficient to provide good thermal conductivity, and the first thermally conductive element 36 may be a single component or composed of multiple components. For example, the first thermally conductive element 36 may be a metal component (e.g., a sheet or block made of materials such as copper, iron, aluminum or steel), the first thermally conductive element 36 may be located in a through hole of the first circuit board 30, and a partial area of the first thermally conductive element 36 may be exposed to the photosensitive surface 31 and the back surface 32 to contact the photosensitive element 33 on the photosensitive surface 31.
[0053] like Figures 1 to 3 As shown, the second circuit board 40 is disposed inside the housing 10 and maintains a distance from the first circuit board 30. For example, the second circuit board 40 can be fixed inside the housing 10 by means of adhesive, snap-fit, or locking. In this embodiment, the first circuit board 30 is located between the second circuit board 40 and the lens 20. The second circuit board 40 has a first surface 41 and a second surface 42 facing each other. The first surface 41 faces the back surface 32 of the first circuit board 30, while the second surface 42 faces away from the first circuit board 30.
[0054] like Figures 1 to 3 As shown, the second circuit board 40 also has a second heat-conducting element 46, which is located between the first surface 41 and the second surface 42, and the position of the second heat-conducting element 46 corresponds to the position of the first heat-conducting element 36 of the first circuit board 30. In some embodiments, the second heat-conducting element 46 may also be made of a material with a high thermal conductivity coefficient to provide good heat conduction, and the second heat-conducting element 46 may be a single component or composed of multiple components. For example, the second heat-conducting element 46 may be a metal component (e.g., a block made of materials such as copper, iron, aluminum, or steel), and the second heat-conducting element 46 may be located within a through hole of the second circuit board 40, with a partial area of the second heat-conducting element 46 exposed above the first surface 41 and the second surface 42.
[0055] like Figures 1 to 3As shown, the first heat conductor 50 is located between the back surface 32 of the first circuit board 30 and the first surface 41 of the second circuit board 40, and the first heat conductor 50 contacts the first heat-conducting element 36 and the second heat-conducting element 46, so that the heat of the first heat-conducting element 36 can be transferred to the second heat-conducting element 46 via the first heat conductor 50. In some embodiments, the first heat conductor 50 may be made of a material with a high thermal conductivity coefficient to provide good thermal conductivity, and the first heat conductor 50 may be a single component or composed of multiple components. For example, the first heat conductor 50 may be a metal component (e.g., a sheet or block made of materials such as iron, aluminum, or steel). Alternatively, the first heat conductor 50 can also be an elastic heat conductor with both high thermal conductivity and elasticity. For example, the first heat conductor 50 can be made of an elastic material with a high thermal conductivity coefficient (e.g., a thermal conductivity coefficient greater than 1 W / mK) (e.g., silicone rubber). In this way, when the first circuit board 30 and the second circuit board 40 are slightly misaligned due to assembly tolerances or heat, each of the first heat conductors 50 can still continue to contact the first heat conductor 36 and the second heat conductor 46 based on its elastic properties, thereby maintaining a good heat conduction effect.
[0056] like Figures 1 to 3 As shown, the second heat conductor 60 is disposed on the second surface 42 of the second circuit board 40, and the second heat conductor 60 contacts the second heat-conducting element 46 and the heat sink 11. In this embodiment, the heat sink 11 is a partial area of the outer casing 10, but the present invention is not limited thereto. The heat sink 11 can also be a heat dissipation fin, a metal plate, or other heat dissipation structure. That is to say, the heat sink 11 may not be part of the outer casing 10. In this way, the heat generated when the photosensitive element 33 operates can be sequentially transferred to the heat sink 11 through the first heat-conducting element 36 of the first circuit board 30, the first heat conductor 50, the second heat-conducting element 46 of the second circuit board 40, and the second heat conductor 60, so that the multilayer circuit board structure can also achieve a good heat dissipation effect, thereby avoiding overheating and deformation of the first circuit board 30 and the second circuit board 40, and the photosensitive element 33 is not prone to overheating and affecting the clarity of the acquired image.
[0057] In some embodiments, the first circuit board 30 and the second circuit board 40 may be made of materials with good heat resistance and low coefficient of thermal expansion to prevent deformation due to heat. The second heat conductor 60 may also be made of a material with high thermal conductivity to provide good thermal conductivity, and the second heat conductor 60 may be a single component or composed of multiple components. For example, the second heat conductor 60 may be a metal component (e.g., a sheet or block made of materials such as iron, aluminum, or steel). Alternatively, the second heat conductor 60 may be an elastic heat conductor with both high thermal conductivity and elasticity. For example, the second heat conductor 60 may be made of an elastic material with a high thermal conductivity (e.g., a thermal conductivity greater than 1 W / mK) (e.g., silicone rubber). When the second circuit board 40 and the heat sink 11 experience slight misalignment due to assembly tolerances or heat, each of the second heat conductors 60 can still maintain contact with the second heat conductor 46 and the heat sink 11 based on its elastic properties, thereby maintaining good thermal conductivity.
[0058] In addition, such as Figure 3 As shown, in this embodiment, the first heat-conducting element 36 and the first heat conductor 50 of the first circuit board 30, the second heat-conducting element 46 and the second heat conductor 60 of the second circuit board 40 are stacked together along a direction perpendicular to the first circuit board 30, so that the heat of the photosensitive element 33 can be quickly transferred to the heat sink 11 along the shortest path perpendicular to the first circuit board 30, thus having a better heat dissipation effect.
[0059] For example Figure 3 As shown, in this embodiment, the cross-sectional areas of the first heat-conducting element 36, the first heat conductor 50, the second heat-conducting element 46, and the second heat conductor 60 in the direction parallel to the first circuit board 30 can be the same. For example, as... Figure 2 and Figure 3 As shown, when the first heat-conducting element 36, the first heat conductor 50, the second heat-conducting element 46, and the second heat conductor 60 are all cuboids, their lengths and widths can be the same, while their heights can be the same or different to prevent heat from being transferred in a direction parallel to the first circuit board 30, thus affecting the heat dissipation effect. Alternatively, when the first heat-conducting element 36, the first heat conductor 50, the second heat conductor 46, and the second heat conductor 60 are all cylinders, their diameters can be the same, similarly achieving the effect of preventing heat from being transferred in a direction parallel to the first circuit board 30, thus affecting the heat dissipation effect.
[0060] Figure 4 This is a stacked schematic diagram of the first and second circuit boards of the camera device of this utility model, wherein... Figure 4 The thickness and dimensions of the first circuit board 30 and the second circuit board 40 in the image are exaggerated to clearly show the structure of each layer of the first circuit board 30 and the second circuit board 40, not their actual dimensions. This is stated for the sake of clarity. Figure 4 As shown, in this embodiment, the first circuit board 30 includes a plurality of first layer boards 301 stacked on top of each other, wherein the first layer boards 301 may be made of insulating material. The first heat-conducting element 36 includes a plurality of first metal layers 361, which are stacked between the plurality of first layer boards 301, and the positions of the plurality of first metal layers 361 correspond to each other and are in indirect contact. In addition, the two first metal layers 361 closest to the photosensitive surface 31 and the back surface 32 of the plurality of first metal layers 361 are exposed on the photosensitive surface 31 and the back surface 32, respectively, and the two first metal layers 361 closest to the photosensitive surface 31 and the back surface 32 are in contact with the photosensitive element 33 and the first heat conductor 50, respectively, so that the heat generated when the photosensitive element 33 is operating can be transferred to the first heat conductor 50 through the plurality of first metal layers 361.
[0061] like Figure 4 As shown, the second circuit board 40 may also include a plurality of second layer boards 401 stacked on top of each other, wherein the second layer boards 401 may be made of insulating material, and the second heat-conducting element 46 includes a plurality of second metal layers 461, which are stacked between the plurality of second layer boards 401 and are in indirect contact with each other. In addition, the two second metal layers 461 that are closest to the first surface 41 and the second surface 42 are exposed on the first surface 41 and the second surface 42 respectively, and the two second metal layers 461 that are closest to the first surface 41 and the second surface 42 are in contact with the first heat conductor 50 and the second heat conductor 60 respectively, so that the heat of the first heat conductor 50 can be transferred to the second heat conductor 60 through the plurality of second metal layers 461.
[0062] like Figure 4 As shown, in this embodiment, first metal sheets 35 are stacked between multiple first layer boards 301 of the first circuit board 30. The first metal sheets 35 serve as conduits in the first circuit board 30 for transmitting electrical signals between electronic components and for power supply, and have good heat dissipation capabilities. Second metal sheets 45 are stacked between multiple second layer boards 401 of the second circuit board 40. The second metal sheets 45 serve as conduits in the second circuit board 40 for transmitting electrical signals between electronic components and for power supply, and also have good heat dissipation capabilities.
[0063] In some embodiments, each first metal layer 361 may be a local area of each first metal sheet 35. For example, during the manufacturing process, a local area of each first metal sheet 35 may be removed to form a circuit and the aforementioned first metal layer 361. Similarly, each second metal layer 461 may be a local area of each second metal sheet 45. For example, during the manufacturing process, a local area of each second metal sheet 45 may be removed to form a circuit and the aforementioned second metal layer 461. In other words, the first metal layer 361 and the second metal layer 461 are local areas of the first metal sheet 35 and the second metal sheet 45 originally used to form circuits, thereby significantly reducing manufacturing costs by eliminating the need for additional heat dissipation components in the imaging device 1.
[0064] Figure 5 This is an exploded perspective view of another embodiment of the camera device of this utility model. Figure 5 As shown, this embodiment is similar to the one described above. Figure 2 The difference in the embodiments is at least that, in addition to the photosensitive element 33, the photosensitive surface 301 of the first circuit board 30 in this embodiment also has one or more heating elements 34 (two heating elements 34 in this case). For example, each heating element 34 can be an electronic component such as a microprocessor, memory, resistor, or capacitor. The first circuit board 30 has a first sub-heat conductor 37, the position and number of which correspond to the position and number of the heating elements 34. The first sub-heat conductor 37 is located between the photosensitive surface 31 and the back surface 32 of the first circuit board 30, and each first sub-heat conductor 37 contacts each heating element 34, so that the heat generated by each heating element 34 during operation can be transferred to each first sub-heat conductor 37. In some embodiments, the structure and material of the first sub-heat conductor 37 may be the same as or similar to the first heat conductor 36 described above, and will not be repeated here.
[0065] like Figure 5As shown, in this embodiment, the camera device 1 includes a first sub-heat conductor 55 and a second sub-heat conductor 65. The second circuit board 40 has a second sub-heat conductor 47, which is located between the first surface 41 and the second surface 42 of the second circuit board 40. The number of first sub-heat conductors 55, the number of second sub-heat conductors 47, and the number of second sub-heat conductors 65 can correspond to the number of heating elements 34 (there are two heating elements 34 in this case). Each first sub-heat conductor 55 is located between the back surface 32 of the first circuit board 30 and the first surface 41 of the second circuit board 40, and each first sub-heat conductor 55 contacts each first sub-heat conductor 37 of the first circuit board 30 and each second sub-heat conductor 47 of the second circuit board 40. Each second sub-heat conductor 65 contacts each second sub-heat conductor 47 and the heat sink 11. In this way, through the design of vertically concentrated heat conduction, the heat generated by each heat-generating component 34 during operation can be sequentially transferred to the heat sink 11 via each of the first sub-heat-conducting components 37 and each of the first sub-heat-conducting components 55 of the first circuit board 30, and each of the second sub-heat-conducting components 47 and each of the second sub-heat-conducting components 65 of the second circuit board 40, thereby preventing the first circuit board 30 and the second circuit board 40 from overheating and deforming, and also preventing each heat-generating component 34 from overheating and affecting performance.
[0066] In some embodiments, the structure and material of the first sub-heat conductor 55 may be the same as or similar to that of the first heat conductor 50, the structure and material of the second sub-heat conductor 47 of the second circuit board 40 may be the same as or similar to that of the second heat conductor 46, and the structure and material of the second sub-heat conductor 65 may be the same as or similar to that of the second heat conductor 60, so as to provide good heat conduction effect, which will not be repeated here.
[0067] like Figure 5 As shown, in this embodiment, the first heat-conducting element 36 and each of the first sub-heat-conducting elements 37 of the first circuit board 30 can be connected through a first heat-conducting connector 365, so that heat can be transferred between the first heat-conducting element 36 and each of the first sub-heat-conducting elements 37 to jointly dissipate heat from the photosensitive element 33 and the second heat-generating element 34, thereby improving heat dissipation efficiency. The first heat-conducting connector 365 can be located between the photosensitive surface 31 and the back surface 32 and is made of a material with a high thermal conductivity coefficient. Similarly, the second heat-conducting element 46 and each of the second sub-heat-conducting elements 47 of the second circuit board 40 can be connected through a second heat-conducting connector 465, so that heat can be transferred between the second heat-conducting element 46 and each of the second sub-heat-conducting elements 47. The second heat-conducting connector 465 can be located between the first surface 41 and the second surface 42 and is made of a material with a high thermal conductivity coefficient.
[0068] Preferably, the circuits formed by the first sub-heat-conducting elements 37 and the first heat-conducting connectors 365 of the first circuit board 30 and the first metal sheets 35 can be staggered to avoid affecting the original circuit configuration. Similarly, the circuits formed by the second sub-heat-conducting elements 47 and the second heat-conducting connectors 465 of the second circuit board 40 and the second metal sheets 45 can also be staggered to avoid affecting the original circuit configuration.
[0069] like Figure 5 As shown, in this embodiment, the first heat conductor 50 and each of the first sub-heat conductors 55 can also be connected via the first thermally conductive connector 51. Here, the first heat conductor 50, each of the first thermally conductive connectors 51, and each of the first sub-heat conductors 55 are integrally formed, allowing heat transfer between the first heat conductor 50 and each of the first sub-heat conductors 55. The second heat conductor 60 and each of the second sub-heat conductors 65 can also be connected via the second thermally conductive connector 61. Here, the second heat conductor 60, each of the second thermally conductive connectors 61, and each of the second sub-heat conductors 65 are integrally formed, allowing heat transfer between the second heat conductor 60 and each of the second sub-heat conductors 65. Furthermore, each of the first thermally conductive connectors 51 contacts each of the first thermally conductive connectors 365 of the first circuit board 30 and each of the second thermally conductive connectors 465 of the second circuit board 40, and each of the second thermally conductive connectors 61 contacts each of the second thermally conductive connectors 465 of the second circuit board 40 and the aforementioned heat sink 11, thereby further improving the heat dissipation efficiency of the photosensitive element 33 and the two heating elements 34.
[0070] Continuing from the above, through the arrangement of the first thermally conductive connectors 365, the first thermally conductive connectors 51, the second thermally conductive connectors 465, and the second thermally conductive connectors 61, the heat generated by the photosensitive element 33 and the heating element 34 during operation can be conducted not only along the direction perpendicular to the first circuit board 30, but also along the direction parallel to the first circuit board 30, so that the heat can be transferred to the heat sink 11 more quickly and the heat dissipation efficiency can be improved.
[0071] Although the technical content of this utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit this utility model. Any modifications and refinements made by those skilled in the art without departing from the spirit of this utility model should be included within the scope of this utility model. Therefore, the scope of protection of this utility model shall be determined by the scope defined in the appended claims.
Claims
1. A camera device, characterized in that, include: A first circuit board has a first thermal conductive element and opposing photosensitive surfaces and back surfaces. A photosensitive element is provided on the photosensitive surface. The first thermal conductive element is located between the photosensitive surface and the back surface, and the first thermal conductive element contacts the photosensitive element. A second circuit board is spaced apart from the first circuit board. The second circuit board has a second heat-conducting element and opposing first and second surfaces. The first surface faces the back side of the first circuit board, and the second heat-conducting element is located between the first and second surfaces. A first thermal conductor is located between the back side of the first circuit board and the first surface of the second circuit board, and the first thermal conductor is in contact with the first thermal conductive element of the first circuit board and the second thermal conductive element of the second circuit board; as well as A second heat conductor is disposed on the second surface of the second circuit board, and the second heat conductor is in contact with the second heat-conducting element and the heat sink.
2. The camera device as described in claim 1, characterized in that, At least one of the first heat conductor and the second heat conductor is an elastic heat conductor.
3. The camera device as described in claim 1, characterized in that, The first circuit board includes multiple first layer boards stacked on top of each other. The first heat-conducting component includes multiple first metal layers stacked between the multiple first layer boards, and the positions of the multiple first metal layers correspond to each other.
4. The camera device as described in claim 1, characterized in that, The second circuit board includes multiple second-layer boards stacked on top of each other. The second heat-conducting component includes multiple second metal layers stacked between the multiple second-layer boards, and the positions of the multiple second metal layers correspond to each other.
5. The camera device as described in claim 1, characterized in that, The first circuit board has a heat-generating element on its photosensitive surface and a first sub-thermal conductive element located between the photosensitive surface and the back surface, and the first sub-thermal conductive element is in contact with the heat-generating element.
6. The camera device as described in claim 5, characterized in that, The first heat-conducting component and the first sub-heat-conducting component are connected by a first heat-conducting connector.
7. The camera device as claimed in claim 6, characterized in that, It also includes a first sub-thermal conductor, which is located between the back side of the first circuit board and the first surface of the second circuit board, and the first sub-thermal conductor is in contact with the first sub-thermal conductive element.
8. The camera device as claimed in claim 7, characterized in that, The first thermal conductor and the first sub-thermal conductor are connected by a first thermally conductive connector.
9. The camera device as claimed in claim 8, characterized in that, The first thermally conductive connector is in contact with the first thermally conductive connector.
10. The camera device as claimed in claim 7, characterized in that, It also includes a second sub-thermal conductor, the second circuit board having a second sub-thermal conductive element, the second sub-thermal conductive element being located between the first surface and the second surface, the first sub-thermal conductor contacting the first sub-thermal conductor and the second sub-thermal conductor, and the second sub-thermal conductor contacting the second sub-thermal conductor and the heat sink.