Circuit board structure with optical positioning points

Abstract

The utility model discloses a circuit board structure with an optical positioning point, which comprises the optical positioning point, the optical positioning point comprises a central circular identification area and a solder mask area surrounding the central circular identification area, the solder mask area is arranged on the periphery of the central circular identification area, and a fool-proof identification structure is arranged on the solder mask area. The fool-proof identification structure is arranged on the periphery of the central circular identification area. According to the utility model, the fool-proof identification structure is additionally arranged outside the central circular identification area, and the central circular identification area and the fool-proof identification structure form'core-auxiliary 'dual visual guidance, so that an optical positioning point can be effectively distinguished from similar structures such as an adjacent bonding pad, a via hole and the like, and the optical positioning point can be quickly identified; the central circular identification area is subjected to resistance welding avoiding processing, green oil can cover the edge of the central circular identification area, the risk that the copper sheet of the central circular identification area falls off can be effectively prevented, the copper sheet at the fool-proof identification structure is subjected to resistance welding processing, and the central circular identification area can be protected.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and more specifically, to a circuit board structure with optical positioning points. Background Technology

[0002] Printed circuit boards (PCBs), also known as printed circuit boards, are essential components for the physical support and signal transmission of electronic products. As electronic products continue to evolve towards miniaturization and precision, with increasing integration, optical positioning points have a growing impact on PCB design. Optical positioning points, also called mark points, are auxiliary points in PCB design that ensure the alignment of components with the PCB during processes such as cutting, drilling, surface mounting, and soldering, thereby improving the accuracy of product manufacturing.

[0003] Traditional optical positioning points typically consist of exposed circular copper foil, with optical recognition achieved through solder mask windows (i.e., avoiding the green solder mask treatment). However, existing designs have the following drawbacks:

[0004] 1. Insufficient recognition accuracy:

[0005] Conventional Mark points lack differentiated identification and rely solely on a single circular outline. In complex PCB layouts or high-density component environments, they are easily confused with features such as adjacent pads and vias, leading to misjudgment or positioning delays by optical equipment.

[0006] If the positioning point recognition is unclear when the equipment such as the pick and place machine is operating at high speed, it may cause problems such as component misalignment and angle tilt. Such errors can lead to a decrease in pick and place efficiency and significantly increase rework costs.

[0007] 2. Risk of central copper foil detachment:

[0008] After the solder mask layer is removed, the central copper layer is directly exposed to the external environment. During subsequent cutting, drilling, or multiple reflow soldering processes, the copper edge is prone to micro-cracks or even complete peeling due to thermal stress, mechanical impact, or chemical corrosion. The high probability of Mark point copper detachment without protective measures will seriously affect the long-term reliability of the PCB. Utility Model Content

[0009] To overcome the problems of low recognition accuracy and easy detachment of the central copper foil in existing optical positioning points, this utility model provides a circuit board structure with optical positioning points.

[0010] The technical solution of this utility model is as follows:

[0011] A circuit board structure with optical positioning points includes optical positioning points, each comprising a central circular recognition area and a solder mask area surrounding the central circular recognition area. The solder mask area is located outside the central circular recognition area to avoid the central circular recognition area. The solder mask area is provided with a foolproof marking structure, which is located outside the central circular recognition area to assist optical positioning recognition.

[0012] According to the present invention based on the above scheme, the optical positioning point further includes a prohibited area, which is located outside the solder resist area.

[0013] According to the above-described scheme of this utility model, the error-proof marking structure is a cross-shaped copper sheet, which includes a first copper sheet and a second copper sheet, and the first copper sheet and the second copper sheet intersect perpendicularly to form a cross-shaped copper sheet.

[0014] According to the above-described scheme of this utility model, the length of the first copper sheet and the second copper sheet are both 1 mm, and the width of the first copper sheet and the second copper sheet are both 0.3 mm.

[0015] According to the above-described scheme of this utility model, the diameter of the central circular identification area is not less than 0.4 mm.

[0016] According to the above-described scheme of this utility model, the outer edge of the solder resist area is offset outward by an amount of not less than 0.1 mm relative to the anti-foolproof marking structure.

[0017] According to the above-described scheme of this utility model, the outer edge of the prohibited area is offset outward by an amount of not less than 0.1 mm relative to the outer edge of the solder resist area.

[0018] According to the above-described scheme of this utility model, the error-proof marking structure is a star-shaped copper sheet.

[0019] According to the above-described solution, the beneficial effects of this utility model are as follows: the circuit board structure with optical positioning points of this utility model adds a foolproof marking structure outside the central circular recognition area. The central circular recognition area and the foolproof marking structure form a "core-auxiliary" dual visual guidance, which can effectively distinguish the optical positioning point from similar structures such as adjacent pads and vias, and can quickly identify the optical positioning point. The central circular recognition area is treated with solder mask avoidance, and the green solder mask will cover the edge of the central circular recognition area, which can effectively prevent or reduce the risk of copper peeling off the central circular recognition area. The copper peel at the foolproof marking structure is treated with solder mask, which can not only protect the central circular recognition area, but also play a foolproof role. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a partial structural schematic diagram of the present invention.

[0022] In the figure, the various attached figures are labeled as follows:

[0023] 10. Optical positioning point; 11. Central circular recognition area; 12. Solder mask area; 13. Mistake-proof marking structure; 131. First copper sheet; 132. Second copper sheet; 14. Prohibited area. Detailed Implementation

[0024] To make the technical problems, technical solutions and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] It should be noted that traditional optical positioning points are typically composed of exposed circular copper foil, with optical recognition achieved through solder mask windows (i.e., avoiding the green solder mask treatment). However, existing designs have the following drawbacks:

[0026] 1. Insufficient recognition accuracy:

[0027] Conventional Mark points lack differentiated identification and rely solely on a single circular outline. In complex PCB layouts or high-density component environments, they are easily confused with features such as adjacent pads and vias, leading to misjudgment or positioning delays by optical equipment.

[0028] If the positioning point recognition is unclear when the equipment such as the pick and place machine is operating at high speed, it may cause problems such as component misalignment and angle tilt. Such errors can lead to a decrease in pick and place efficiency and significantly increase rework costs.

[0029] 2. Risk of central copper foil detachment:

[0030] After the solder mask layer is removed, the central copper layer is directly exposed to the external environment. During subsequent cutting, drilling, or multiple reflow soldering processes, the copper edge is prone to micro-cracks or even complete peeling due to thermal stress, mechanical impact, or chemical corrosion. The high probability of Mark point copper detachment without protective measures will seriously affect the long-term reliability of the PCB.

[0031] like Figures 1-2As shown, this embodiment provides a circuit board structure with optical positioning points. A foolproof marking structure 13 is added outside the central circular recognition area 11. The central circular recognition area 11 and the foolproof marking structure 13 form a "core-auxiliary" dual visual guidance, which can effectively distinguish the optical positioning point 10 from similar structures such as adjacent pads and vias, and can quickly identify the optical positioning point 10. The central circular recognition area 11 is treated with solder mask avoidance, and the green solder mask will cover the edge of the central circular recognition area 11, which can effectively prevent or reduce the risk of copper peeling off the central circular recognition area 11. The copper peel of the foolproof marking structure 13 is treated with solder mask, which can not only protect the central circular recognition area 11, but also play a foolproof role.

[0032] More specifically, the circuit board structure with optical positioning points includes optical positioning points 10, which include a central circular recognition area 11 and a solder mask area 12 surrounding the central circular recognition area 11. The solder mask area 12 is located around the central circular recognition area 11 to avoid the central circular recognition area 11. The solder mask area 12 is provided with a foolproof marking structure 13, which is located around the central circular recognition area 11 to assist optical positioning recognition.

[0033] In one embodiment, the optical positioning point 10 further includes a blocking region 14 located outside the solder mask region 12. The blocking region 14 is used to isolate the optical positioning point 10 from the traces and copper foil within the circuit board, preventing interference from other devices.

[0034] In one embodiment, the error-proof marking structure 13 is a cross-shaped copper sheet, which includes a first copper sheet 131 and a second copper sheet 132, which intersect perpendicularly to form a cross-shaped copper sheet.

[0035] Specifically, the length of the first copper sheet 131 and the second copper sheet 132 is 1 mm, and the width of the first copper sheet 131 and the second copper sheet is 0.3 mm.

[0036] The error-proof marking structure 13 is formed by the perpendicular intersection of the first copper sheet 131 and the second copper sheet 132, creating a cross shape. Its unique geometric features significantly enhance the feature capture capability of the optical device. The cross-shaped copper sheet can effectively distinguish the optical positioning point 10 from similar structures such as adjacent pads and vias, effectively reducing the misjudgment rate.

[0037] In other alternative embodiments, the foolproof marking structure 13 is a star-shaped copper foil. The star-shaped copper foil, through its polygonal geometric features (such as a pentagon or hexagon), significantly enhances the feature-capturing capability of the optical device. The multiple sharp corners and edges of the star-shaped structure provide more visual feature points. The complex geometric shape of the star-shaped copper foil effectively distinguishes the optical positioning point 10 from adjacent pads, vias, and other similar structures, reducing the misjudgment rate. It is particularly suitable for high-density, multi-component circuit board designs.

[0038] In one embodiment, the diameter of the central circular recognition area 11 is not less than 0.4 mm, ensuring that the optical device can clearly capture the contour features of the recognition point.

[0039] The outer edge of the solder resist area 12 is offset outward relative to the foolproof marking structure 13 by no less than 0.1 mm. This outward offset of the outer edge of the solder resist area 12 relative to the foolproof marking structure 13 forms an effective physical isolation zone, blocking the transmission path of mechanical stress from cutting, drilling, etc. The outward offset of the solder resist area 12 forms a physical protective layer, blocking the direct effect of external stress on the copper foil.

[0040] The outer edge of the forbidden area 14 is offset outward relative to the outer edge of the solder mask area 12 by an amount not less than 0.1 mm. The design of the forbidden area 14 ensures that the minimum distance between the optical positioning point 10 and the adjacent trace is 0.1 mm, effectively preventing signal interference and improving the electrical performance of the circuit board.

[0041] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0044] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] In this disclosure, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] Although embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the scope of protection of the present disclosure.

Claims

1. A circuit board structure with optical positioning points, characterized in that, The system includes an optical positioning point, which includes a central circular recognition area and a solder resist area surrounding the central circular recognition area. The solder resist area is located outside the central circular recognition area, avoiding the central circular recognition area. The solder resist area is provided with a foolproof marking structure, which is located outside the central circular recognition area to assist optical positioning and recognition.

2. The circuit board structure with optical positioning points according to claim 1, characterized in that, The optical positioning point also includes a prohibited area, which is located outside the solder mask area.

3. A circuit board structure with optical positioning points according to claim 1 or 2, characterized in that, The error-proof marking structure is a cross-shaped copper sheet, which includes a first copper sheet and a second copper sheet, and the first copper sheet and the second copper sheet intersect perpendicularly to form a cross-shaped copper sheet.

4. A circuit board structure with optical positioning points according to claim 3, characterized in that, The length of the first copper sheet and the second copper sheet is 1 mm, and the width of the first copper sheet and the second copper sheet is 0.3 mm.

5. A circuit board structure with optical positioning points according to claim 1 or 4, characterized in that, The diameter of the central circular recognition area is not less than 0.4 mm.

6. A circuit board structure with optical positioning points according to claim 1, characterized in that, The outer edge of the solder resist area is offset outward by no less than 0.1 mm relative to the anti-foolproof marking structure.

7. A circuit board structure with optical positioning points according to claim 2, characterized in that, The outer edge of the prohibited area is offset outward relative to the outer edge of the solder mask area by a dimension of not less than 0.1 mm.

8. A circuit board structure with optical positioning points according to claim 1, characterized in that, The error-proof marking structure is a star-shaped copper sheet.

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